CN116313958B - Semi-automatic feeding mechanism for wafer vacuum photoresist removal - Google Patents
Semi-automatic feeding mechanism for wafer vacuum photoresist removal Download PDFInfo
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- CN116313958B CN116313958B CN202310204601.3A CN202310204601A CN116313958B CN 116313958 B CN116313958 B CN 116313958B CN 202310204601 A CN202310204601 A CN 202310204601A CN 116313958 B CN116313958 B CN 116313958B
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- 229920002120 photoresistant polymer Polymers 0.000 title claims abstract description 30
- 230000007246 mechanism Effects 0.000 title claims abstract description 12
- 235000012431 wafers Nutrition 0.000 claims abstract description 55
- 238000007599 discharging Methods 0.000 claims abstract description 27
- 238000000034 method Methods 0.000 claims abstract description 13
- 230000008569 process Effects 0.000 claims abstract description 11
- 238000007789 sealing Methods 0.000 claims description 41
- 239000000919 ceramic Substances 0.000 claims description 9
- 239000000428 dust Substances 0.000 claims description 9
- 210000001503 joint Anatomy 0.000 claims description 6
- 230000008878 coupling Effects 0.000 claims description 5
- 238000010168 coupling process Methods 0.000 claims description 5
- 238000005859 coupling reaction Methods 0.000 claims description 5
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 claims description 4
- 239000000463 material Substances 0.000 abstract description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 230000003749 cleanliness Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 238000009792 diffusion process Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 238000005468 ion implantation Methods 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 238000009825 accumulation Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000002360 explosive Substances 0.000 description 1
- 238000011010 flushing procedure Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32733—Means for moving the material to be treated
- H01J37/32743—Means for moving the material to be treated for introducing the material into processing chamber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32733—Means for moving the material to be treated
- H01J37/32788—Means for moving the material to be treated for extracting the material from the process chamber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67069—Apparatus for fluid treatment for etching for drying etching
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Robotics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention discloses a semi-automatic feeding mechanism for wafer vacuum photoresist stripping, which is used for controlling a wafer to enter and exit a vacuum cavity in the wafer plasma photoresist stripping process and comprises a base seat, wherein a supporting plate positioned at the lower side of a vacuum cavity feeding hole is arranged on the base seat; the support plate is provided with a cylinder driving assembly, and the cylinder driving assembly drives a sliding connecting block connected with the cylinder driving assembly to approach or be far away from a feeding port of the vacuum cavity along the feeding and discharging direction; the cantilever plate is fixedly arranged on the sliding connecting block, and one end of the cantilever plate is connected in a hanging state along the feeding and discharging direction and the horizontal direction; the free end of the cantilever plate is fixedly provided with a wafer supporting plate which is connected in a hanging state along the feeding and discharging direction and is used for supporting wafers to enter and exit the vacuum cavity; the wafer is placed on the wafer supporting plate through a manual mode or a feeding mechanism, and is directly fed into the vacuum cavity under the drive of the cylinder driving assembly, and then reversely moves to take out the material to be discharged.
Description
[ field of technology ]
The invention relates to a precision machining technology, in particular to a semi-automatic feeding mechanism for wafer vacuum photoresist removal.
[ background Art ]
The semiconductor IC process is developed mainly based on four basic processes (ion implantation, diffusion, epitaxial growth and photolithography) invented after the 50 th century of the 20 th year, and since each element and connection line in the integrated circuit are very fine, during the manufacturing process, if the integrated circuit is polluted by dust particles and metals, the functions of the circuits in the wafer are easily damaged, short circuits or circuit breaks are formed, and the failure of the integrated circuit is caused and the formation of geometric characteristics is affected. Therefore, in the manufacturing process, except for removing external pollution sources, wet photoresist removal or dry photoresist removal is required in the integrated circuit manufacturing steps such as high-temperature diffusion, ion implantation and the like. The dry and wet photoresist stripping works are to effectively remove the dust, metal ions and organic impurities remained on the wafer by using chemical solution or gas without damaging the surface characteristics and electrical characteristics of the wafer.
At present, the effective method for removing various stains on the surface of a silicon wafer in a semiconductor mostly adopts a multi-groove treatment type photoresist removing system in a wet chemical photoresist removing method, and the system comprises a group of wet chemical photoresist removing grooves and corresponding water grooves and is additionally provided with a spin-drying device; when the device works, a silicon wafer is placed in a special photoresist removing flower basket, placed in a chemical tank for a specified period of time, taken out and placed in a corresponding water tank for flushing, and then dried; the whole system has complex structure and low processing efficiency; the photoresist removing process and photoresist removing equipment for the silicon wafer in the existing semiconductor are improved.
[ invention ]
The embodiment of the invention provides a semi-automatic feeding mechanism for wafer vacuum photoresist stripping, which aims at a vacuum cavity adopting dry photoresist stripping, and directly feeds a silicon wafer into a plasma photoresist stripping cavity through semi-automatic control, so that the processing quality and the processing efficiency are effectively improved.
The technical scheme adopted by at least one embodiment of the invention is as follows:
a semi-automatic feeding mechanism for wafer vacuum photoresist stripping is used for semi-automatically controlling a wafer to enter and exit a vacuum cavity in a wafer plasma photoresist stripping process and comprises a base seat;
a supporting plate positioned at the lower side of the vacuum cavity feeding port is arranged on the base frame along the feeding and discharging direction;
the support plate is provided with a cylinder driving assembly, and the cylinder driving assembly drives a sliding connecting block connected with the cylinder driving assembly to approach or be far away from a feeding port of the vacuum cavity along a feeding and discharging direction;
the cantilever plate is fixedly arranged on the sliding connecting block, and one end of the cantilever plate is connected in a hanging state along the horizontal direction along the feeding and discharging direction;
the free end of the cantilever plate is fixedly provided with a wafer supporting plate which is connected in a hanging state along the feeding and discharging direction and is used for supporting wafers to enter and exit the vacuum cavity.
Preferably, the cylinder driving assembly adopts a magnetic coupling type rodless cylinder driving mode with guide rails, and comprises a hollow piston rod, two guide rail rods and a magnetic sliding block, wherein the guide rail rods and the magnetic sliding block are symmetrically distributed on two sides of the hollow piston rod, and the hollow piston rod and the two guide rail rods are fixedly arranged on the supporting plate along the feeding and discharging direction through air source connecting blocks arranged at two ends;
the magnetic sliding block is sleeved on the hollow piston rod and driven by air sources at two ends of the hollow piston rod to reciprocate along a feeding and discharging direction under the guidance of the two guide rail rods;
the sliding connecting block is fixedly arranged on the magnetic sliding block.
Further, two stepped edge sealing plates which are symmetrically arranged on two sides of the cylinder driving assembly and used for sealing and protecting the surfaces of the hollow piston rod and the guide rail rod from accumulating dust or rusting are also arranged on the supporting plate, and two corresponding end sealing plates for sealing air source connecting block sealing covers at two ends of the cylinder driving assembly are respectively arranged at two ends of the corresponding stepped edge sealing plates.
Further, a top sealing plate which is sleeved on the sliding connecting block in a sliding manner along the feeding and discharging direction and used for sealing the top sides of the hollow piston rod and the guide rail rod is further arranged between the two symmetrically arranged step-shaped edge sealing plates, and the top sealing plate is connected to the top end of one end sealing plate in a hanging state.
Further, the sliding connection block consists of a groove block and a raised head block which are in butt joint up and down, a yielding hole used for the top sealing plate to pass through is formed between the butt joint groove block and the raised head block, the groove block is fixedly connected to the magnetic sliding block, and the top end of the raised head block is fixedly connected with the cantilever plate.
Preferably, a groove-shaped locking block used for locking and fixing the end part of the wafer supporting plate to the free end of the cantilever plate through a screw is arranged at the joint of the cantilever plate and the wafer supporting plate.
Preferably, the wafer support plate is a fan-fork-shaped ceramic plate, the front end and the middle part of the fan-fork-shaped ceramic plate are respectively provided with an arc step surface for hanging the middle part of the wafer, and the front end of the fan-fork-shaped ceramic plate is also provided with a discharging notch which is convenient for the wafer to enter the vacuum cavity from the upper and lower parts of the plate body.
Preferably, the underframe seat is a rectangular frame formed by butting a plurality of square profiles.
The beneficial effects of the invention are as follows:
according to the invention, a pneumatic driving control mode is adopted for the vacuum cavity for dry photoresist stripping, so that the cleanliness of the feeding and discharging processes is effectively ensured, the control is simple and convenient, the wafer can be directly fed into the plasma photoresist stripping cavity, and the processing quality and the processing efficiency are effectively improved.
Moreover, the cylinder driving assembly adopts a magnetic coupling type rodless cylinder driving mode with a guide rail, and adopts compressed air to move a load along a linear path, so that the cylinder driving assembly has the advantages of small overall installation size, small axial space and the same stroke length in a smaller space.
In addition, cylinder drive assembly circumference periphery is the cover respectively has step shape limit shrouding, end shrouding and the top seal board that protect hollow piston rod and guide rail pole, effectively prevents that hollow piston rod and guide rail pole surface from piling up dust or rust, and the friction dust leakage that the slip process produced, reduces the maintenance of equipment, improves the reliability and the security of wafer processing.
[ description of the drawings ]
FIG. 1 is a schematic diagram of an explosive structure in an embodiment of the invention;
FIG. 2 is a schematic perspective view of an embodiment of the present invention;
FIG. 3 is a schematic front perspective view of an embodiment of the present invention with parts removed;
FIG. 4 is a schematic side perspective view of an embodiment of the present invention with parts removed;
FIG. 5 is a schematic perspective view of the embodiment of the invention assembled on a vacuum chamber with parts removed;
fig. 6 is a schematic perspective view of the embodiment of the present invention assembled on a vacuum chamber.
Reference numerals:
1. a vacuum chamber; 2. a chassis base; 3. a support plate; 4. a cylinder driving assembly; 40. a hollow piston rod; 41. a guide rail rod; 42. a magnetic slider; 43. an air source connecting block; 5. a sliding connection block; 50. a groove block; 51. a nose block; 6. cantilever plate; 7. a wafer pallet; 70. arc step surface; 71. a blanking notch; 8. groove-shaped locking blocks; 9. a step-shaped edge sealing plate; 10. an end sealing plate; 11. a top sealing plate; .
[ detailed description ] of the invention
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
The embodiment provides a semi-automatic feeding mechanism for wafer vacuum photoresist stripping, which is used for semi-automatically controlling a wafer to enter and exit a vacuum cavity 1 in a wafer plasma photoresist stripping process, and comprises a base frame 2, wherein the base frame 2 is a rectangular frame formed by butting a plurality of square sectional materials, as shown in fig. 1 to 6; a supporting plate 3 positioned at the lower side of the feed inlet of the vacuum cavity 1 is arranged on the underframe seat 2 along the feed and discharge direction, a cylinder driving component 4 is arranged on the supporting plate 3, and a sliding connecting block 5 connected with the cylinder driving component 4 in a driving way is close to or far away from the feed inlet of the vacuum cavity 1 along the feed and discharge direction; a cantilever plate 6 which is connected with one end in a hanging state along the feeding and discharging direction and the horizontal direction is fixedly arranged on the sliding connecting block 5; the free end of the cantilever plate 6 is fixedly provided with a wafer supporting plate 7 which is connected in a hanging state along the feeding and discharging direction and is used for supporting wafers to enter and exit the vacuum cavity; the connection part of the cantilever plate 6 and the wafer supporting plate 7 is provided with a groove-shaped locking block 8 used for locking and fixing the end part of the wafer supporting plate 7 at the free end of the cantilever plate 6 through screws, the wafer supporting plate 7 is a fan-shaped fork-shaped ceramic plate, the front end and the middle part of the fan-shaped fork-shaped ceramic plate are respectively provided with an arc step surface 70 used for suspending the middle part of a wafer, and the front end of the fan-shaped fork-shaped ceramic plate is also provided with a discharging notch 71 which is convenient for the wafer to enter the vacuum cavity from the plate body in a discharging mode.
In the embodiment, the pneumatic driving control mode is adopted for the vacuum cavity for dry photoresist stripping, so that the cleanliness of the feeding and discharging process can be effectively ensured, the control is simple and convenient, the wafer can be directly fed into the plasma photoresist stripping cavity, and the processing quality and the processing efficiency are effectively improved.
As further shown in fig. 1 to 6, the cylinder driving assembly 4 adopts a magnetic coupling type rodless cylinder driving mode with guide rails, the cylinder driving assembly 4 comprises a hollow piston rod 40, two guide rail rods 41 and magnetic sliding blocks 42 which are symmetrically distributed on two sides of the hollow piston rod 40, and the hollow piston rod 40 and the two guide rail rods 41 are fixedly arranged on the supporting plate 3 along the feeding and discharging direction through air source connecting blocks 43 arranged on two ends; the magnetic sliding block 42 is sleeved on the hollow piston rod 40 and driven by air sources at two ends of the hollow piston rod 40 to reciprocate along the feeding and discharging direction under the guidance of the two guide rail rods 41; wherein the sliding connection block 5 is fixedly mounted on the magnetic slider 42.
As shown in fig. 1, 2, 4 and 6, two stepped edge sealing plates 9 symmetrically installed at two sides of the cylinder driving assembly 4 and used for sealing and protecting surfaces of the hollow piston rod 40 and the guide rail rod 41 from accumulating dust or rust are further arranged on the supporting plate 3, and two ends of the corresponding two stepped edge sealing plates 9 are respectively provided with an end sealing plate 10 for sealing the air source connecting blocks 43 at two ends of the cylinder driving assembly 4; and a top sealing plate 11 which is sleeved on the sliding connection block 5 in a sliding manner along the feeding and discharging direction and is used for sealing the top sides of the hollow piston rod 40 and the guide rail rod 41 is also arranged between the two symmetrically arranged step-shaped edge sealing plates 9, the top sealing plate 11 is connected to the top end of the end sealing plate 10 at the rear side in a hanging state, the sliding connection block 5 consists of a groove block 50 and a raised head block 51 which are in butt joint up and down, a yielding hole 12 for the top sealing plate 11 to pass through is formed between the butt joint groove block 50 and the raised head block 51, the groove block 50 is fixedly connected to the magnetic sliding block 42, and the top end of the raised head block 51 is fixedly connected with the cantilever plate 6.
In the embodiment, as the cylinder driving assembly 4 adopts a magnetic coupling type rodless cylinder driving mode with a guide rail and adopts compressed air to move the load along a linear path, the advantages of small overall installation size and the same stroke length in a smaller space are achieved; moreover, the cylinder driving assembly 4 is respectively provided with a stepped edge sealing plate 9, an end sealing plate and a top sealing plate which are used for protecting the hollow piston rod 40 and the guide rail rod 41 in a sealing manner in the circumferential periphery, so that dust accumulation or rust on the surfaces of the hollow piston rod 40 and the guide rail rod 41 is effectively prevented, meanwhile, friction dust leakage generated in the sliding process is prevented, the maintenance of equipment is effectively reduced, and the cleanliness of the wafer processing environment is improved.
In the description of the present invention, it should be noted that, the azimuth or positional relationship indicated by the terms "front", "rear", etc. are based on the azimuth or positional relationship shown in the drawings, or the azimuth or positional relationship in which the inventive product is conventionally put in use, are merely for convenience of describing the present invention and simplifying the description, and are not indicative or implying that the apparatus or element to be referred to must have a specific azimuth, be configured and operated in a specific azimuth, and therefore, should not be construed as limiting the present invention.
The above embodiments are merely preferred embodiments of the present invention, and are not intended to limit the scope of the present invention, but all equivalent changes according to the shape, construction and principle of the present invention are intended to be included in the scope of the present invention.
Claims (4)
1. The semi-automatic feeding mechanism for wafer vacuum photoresist stripping is used for semi-automatically controlling a wafer to enter and exit a vacuum cavity in the wafer plasma photoresist stripping process and is characterized by comprising a base seat;
a supporting plate positioned at the lower side of the vacuum cavity feeding port is arranged on the base frame along the feeding and discharging direction;
the support plate is provided with a cylinder driving assembly, and the cylinder driving assembly drives a sliding connecting block connected with the cylinder driving assembly to approach or be far away from a feeding port of the vacuum cavity along a feeding and discharging direction;
the cantilever plate is fixedly arranged on the sliding connecting block, and one end of the cantilever plate is connected in a hanging state along the horizontal direction along the feeding and discharging direction;
the free end of the cantilever plate is fixedly provided with a wafer supporting plate which is connected in a hanging state along the feeding and discharging direction and is used for supporting wafers to enter and exit the vacuum cavity;
the cylinder driving assembly adopts a magnetic coupling type rodless cylinder driving mode with guide rails, and comprises a hollow piston rod, two guide rail rods and magnetic sliding blocks, wherein the guide rail rods and the magnetic sliding blocks are symmetrically distributed on two sides of the hollow piston rod, and the hollow piston rod and the two guide rail rods are fixedly arranged on the supporting plate along the feeding and discharging direction through air source connecting blocks arranged at two ends;
the magnetic sliding block is sleeved on the hollow piston rod and driven by air sources at two ends of the hollow piston rod to reciprocate along a feeding and discharging direction under the guidance of the two guide rail rods;
the sliding connecting block is fixedly arranged on the magnetic sliding block;
the support plate is also provided with two step-shaped edge sealing plates which are symmetrically arranged at two sides of the cylinder driving assembly and are used for sealing and protecting the surfaces of the hollow piston rod and the guide rail rod from accumulating dust or rust, and two ends of the corresponding two step-shaped edge sealing plates are respectively provided with an end sealing plate for sealing air source connecting block covers at two ends of the cylinder driving assembly;
a top sealing plate which is sleeved on the sliding connecting block in a sliding way along the feeding and discharging direction and is used for sealing the top sides of the hollow piston rod and the guide rail rod is also arranged between the two symmetrically arranged step-shaped edge sealing plates, and the top sealing plates are connected to the top ends of the end sealing plates at one side in a hanging state;
the sliding connection block consists of a groove block and a raised head block which are in butt joint up and down, a yielding hole used for the top sealing plate to pass through is formed between the butt joint groove block and the raised head block, the groove block is fixedly connected to the magnetic sliding block, and the top end of the raised head block is fixedly connected with the cantilever plate.
2. The semiautomatic feeding mechanism for vacuum photoresist stripping of wafers according to claim 1, wherein a groove-shaped locking block for locking and fixing the end of the wafer supporting plate to the free end of the cantilever plate by screws is arranged at the joint of the cantilever plate and the wafer supporting plate.
3. The semi-automatic feeding mechanism for vacuum photoresist removal of wafers according to claim 1 or 2, wherein the wafer supporting plate is a fan-fork-shaped ceramic plate, the front end and the middle part of the fan-fork-shaped ceramic plate are respectively provided with an arc step surface for suspending the middle part of the wafer, and the front end of the fan-fork-shaped ceramic plate is also provided with a blanking notch which is convenient for the wafers to enter the vacuum cavity from the plate body in a blanking manner.
4. The semiautomatic feeding mechanism for vacuum photoresist stripping of wafers according to claim 1, wherein the underframe seat is a rectangular frame formed by butting a plurality of square profiles.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310204601.3A CN116313958B (en) | 2023-03-03 | 2023-03-03 | Semi-automatic feeding mechanism for wafer vacuum photoresist removal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310204601.3A CN116313958B (en) | 2023-03-03 | 2023-03-03 | Semi-automatic feeding mechanism for wafer vacuum photoresist removal |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN116313958A CN116313958A (en) | 2023-06-23 |
| CN116313958B true CN116313958B (en) | 2023-12-05 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310204601.3A Active CN116313958B (en) | 2023-03-03 | 2023-03-03 | Semi-automatic feeding mechanism for wafer vacuum photoresist removal |
Country Status (1)
| Country | Link |
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| CN (1) | CN116313958B (en) |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10184608A (en) * | 1996-12-26 | 1998-07-14 | Ckd Corp | Magnet rodless cylinder |
| JPH10196608A (en) * | 1996-11-18 | 1998-07-31 | Ckd Corp | Rodless cylinder |
| JP2001187906A (en) * | 1999-10-18 | 2001-07-10 | Smc Corp | Transferring device |
| CN1728356A (en) * | 2004-07-28 | 2006-02-01 | 大日本网目版制造株式会社 | Substrate processor |
| CN203717643U (en) * | 2014-01-21 | 2014-07-16 | 深圳威洛博机器人有限公司 | Dustless overloaded high-precision guide track device |
| CN111540703A (en) * | 2020-07-13 | 2020-08-14 | 山东元旭光电股份有限公司 | Automatic wafer sorting machine |
| CN212485287U (en) * | 2020-05-22 | 2021-02-05 | 长园半导体设备(珠海)有限公司 | Material structure is got to wafer |
| CN212717475U (en) * | 2020-07-21 | 2021-03-16 | 东莞市启英机械设备有限公司 | Rodless cylinder capable of increasing bearing capacity |
| CN217388501U (en) * | 2021-12-28 | 2022-09-06 | 深圳线马科技有限公司 | Totally-enclosed dustproof linear motor module |
| CN218160323U (en) * | 2022-08-04 | 2022-12-27 | 合肥欣奕华智能机器股份有限公司 | Vacuum conveying device |
-
2023
- 2023-03-03 CN CN202310204601.3A patent/CN116313958B/en active Active
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10196608A (en) * | 1996-11-18 | 1998-07-31 | Ckd Corp | Rodless cylinder |
| JPH10184608A (en) * | 1996-12-26 | 1998-07-14 | Ckd Corp | Magnet rodless cylinder |
| JP2001187906A (en) * | 1999-10-18 | 2001-07-10 | Smc Corp | Transferring device |
| CN1728356A (en) * | 2004-07-28 | 2006-02-01 | 大日本网目版制造株式会社 | Substrate processor |
| CN203717643U (en) * | 2014-01-21 | 2014-07-16 | 深圳威洛博机器人有限公司 | Dustless overloaded high-precision guide track device |
| CN212485287U (en) * | 2020-05-22 | 2021-02-05 | 长园半导体设备(珠海)有限公司 | Material structure is got to wafer |
| CN111540703A (en) * | 2020-07-13 | 2020-08-14 | 山东元旭光电股份有限公司 | Automatic wafer sorting machine |
| CN212717475U (en) * | 2020-07-21 | 2021-03-16 | 东莞市启英机械设备有限公司 | Rodless cylinder capable of increasing bearing capacity |
| CN217388501U (en) * | 2021-12-28 | 2022-09-06 | 深圳线马科技有限公司 | Totally-enclosed dustproof linear motor module |
| CN218160323U (en) * | 2022-08-04 | 2022-12-27 | 合肥欣奕华智能机器股份有限公司 | Vacuum conveying device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN116313958A (en) | 2023-06-23 |
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