CN212463614U - High-precision impedance circuit board - Google Patents
High-precision impedance circuit board Download PDFInfo
- Publication number
- CN212463614U CN212463614U CN202021159715.9U CN202021159715U CN212463614U CN 212463614 U CN212463614 U CN 212463614U CN 202021159715 U CN202021159715 U CN 202021159715U CN 212463614 U CN212463614 U CN 212463614U
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- Prior art keywords
- circuit board
- waterproof
- layer
- water
- coating
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- Expired - Fee Related
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- 239000011248 coating agent Substances 0.000 claims abstract description 16
- 238000000576 coating method Methods 0.000 claims abstract description 16
- 239000000758 substrate Substances 0.000 claims abstract description 10
- 239000012528 membrane Substances 0.000 claims abstract description 9
- 239000000463 material Substances 0.000 claims description 7
- 239000000853 adhesive Substances 0.000 claims description 3
- 230000001070 adhesive effect Effects 0.000 claims description 3
- 210000004177 elastic tissue Anatomy 0.000 claims description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 18
- 238000000034 method Methods 0.000 abstract description 5
- 230000007797 corrosion Effects 0.000 abstract description 4
- 238000005260 corrosion Methods 0.000 abstract description 4
- 238000009501 film coating Methods 0.000 abstract description 4
- 239000007888 film coating Substances 0.000 abstract description 3
- 238000005507 spraying Methods 0.000 abstract description 3
- 238000009413 insulation Methods 0.000 abstract 2
- 239000010410 layer Substances 0.000 description 28
- 230000006835 compression Effects 0.000 description 9
- 238000007906 compression Methods 0.000 description 9
- 239000012792 core layer Substances 0.000 description 7
- 239000002184 metal Substances 0.000 description 4
- 238000003466 welding Methods 0.000 description 4
- 238000005452 bending Methods 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 238000002788 crimping Methods 0.000 description 1
- 238000012938 design process Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 238000010297 mechanical methods and process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000002120 nanofilm Substances 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
The utility model discloses a high-accuracy impedance circuit board, which comprises a substrate, the top bonding of base plate is connected with the core plate layer, the water proof membrane has been laid at the top of core plate layer, the top coating of water proof membrane has nanometer waterproof coating, the core plate layer includes the first insulation layer, the bottom bonding on first insulation layer is connected with the compressive layer. The utility model discloses a dry behind the surface spraying nanometer waterproof coating of circuit board, can reach and normally form transparent colourless molecule water-resistant film chain one on the protection component in aqueous, make the unable contact of water by the protection component, and the water proof membrane of bottom is waterproof not only, simultaneously can also be anti acid-base, corrosion-resistant, in addition, owing to adopted stealthy molecule film coating technique, its coating thickness reaches the nanometer level, can not influence the use of circuit board yet, solved simultaneously owing to do not have waterproof performance, in case meet the water and can produce the problem of short circuit or damage immediately in the use.
Description
Technical Field
The utility model relates to a circuit board technical field specifically is a high-accuracy impedance circuit board.
Background
In conventional printed circuit board designs, the impedance is typically formed by an inductance, a capacitance, and a resistance formed in the printed circuit board, wherein the inductance depends primarily on the thickness of the metal layer and the length of the lines; the capacitance depends mainly on the width of the line, the thickness of the dielectric layer and the dielectric constant; the resistance mainly depends on the length of the line, the width of the line, the thickness of the metal layer and the resistance parameter of the metal layer, in order to make the actual impedance value of the product reach the theoretical optimal value, in the design process of the printed circuit board, besides the line length, the line width and the thickness of the metal layer of the impedance test module need to be strictly controlled, various impedance line signal shielding problems need to be processed according to the actual impedance design requirements, and the circuit board in the prior art has no waterproof performance, and can generate short circuit or damage immediately when meeting water in the use process, thereby influencing the use effect.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a high-accuracy impedance circuit board possesses waterproof advantage, has solved because do not have waterproof performance, in case meet the water can produce short circuit or the problem of damage immediately in the use.
In order to achieve the above object, the utility model provides a following technical scheme: the high-precision impedance circuit board comprises a substrate, wherein a core board layer is connected to the top of the substrate in an adhesive mode, a waterproof film is laid on the top of the core board layer, and a nanometer waterproof coating is coated on the top of the waterproof film.
Preferably, the core layer includes a first insulating layer, a pressure-resistant layer is adhesively connected to the bottom of the first insulating layer, and a second insulating layer is adhesively connected to the bottom of the pressure-resistant layer.
Preferably, the two sides of the back surface of the substrate are fixedly provided with positioning plates, and the front surface of each positioning plate is provided with a positioning hole.
Preferably, the compression-resistant layer is made of rubber elastic fibers.
Preferably, the waterproof membrane is made of a double-layer structure and is made of a nano waterproof material.
Compared with the prior art, the beneficial effects of the utility model are as follows:
1. the utility model discloses a dry behind the surface spraying nanometer waterproof coating of circuit board, can reach and normally form transparent colourless molecule water-resistant film chain one on the protection component in aqueous, make the unable contact of water by the protection component, and the water proof membrane of bottom is waterproof not only, simultaneously can also be anti acid-base, corrosion-resistant, in addition, owing to adopted stealthy molecule film coating technique, its coating thickness reaches the nanometer level, can not influence the use of circuit board yet, solved simultaneously owing to do not have waterproof performance, in case meet the water and can produce the problem of short circuit or damage immediately in the use.
2. The utility model discloses an increased double-deck insulating layer and added the resistance to compression material in inside on core layer, can prevent that the circuit board from being punctured by the electric current, and inside resistance to compression material can effectively strengthen the whole crushing resistance and the bending resistance ability of circuit board, is difficult for producing deformation.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a cross-sectional view of the core slab structure of the present invention;
fig. 3 is a top view of the substrate of the present invention.
In the figure: 1. a substrate; 2. a core layer; 201. a first insulating layer; 202. a pressure resistant layer; 203. a second insulating layer; 3. a water-resistant film; 4. a nano waterproof coating; 5. positioning a plate; 6. and (7) positioning the holes.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
In the description herein, it is to be understood that the terms "center," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in the orientations and positional relationships indicated in the drawings to facilitate the description of the patent and to simplify the description, but do not indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and thus are not to be considered limiting of the patent. In the description of the present application, it should be noted that unless otherwise explicitly stated or limited, the terms "mounted," "connected," and "disposed" are to be construed broadly and can, for example, be fixedly connected, disposed, detachably connected, disposed, or integrally connected and disposed. The specific meaning of the above terms in this patent may be understood by those of ordinary skill in the art as appropriate.
Referring to fig. 1-3, a high-precision impedance circuit board includes a substrate 1, positioning plates 5 are fixedly mounted on both sides of the back surface of the substrate 1, positioning holes 6 are formed on the front surface of the positioning plates 5, a core layer 2 is adhesively connected to the top surface of the substrate 1, the core layer 2 includes a first insulating layer 201, a compression resistant layer 202 is adhesively connected to the bottom of the first insulating layer 201, a second insulating layer 203 is adhesively connected to the bottom of the compression resistant layer 202, the compression resistant layer 202 is made of rubber elastic fiber, a waterproof film 3 is made of a double-layer structure, the waterproof film 3 is made of a nano waterproof material, the circuit board can be prevented from being broken down by current by adding the double-layer insulating layer in the core layer 2 and adding the compression resistant material in the core layer, the internal compression resistant material can effectively enhance the overall compression resistant performance and bending resistant performance of the circuit board, and is not easy to deform, the, the top coating of waterproof membrane 3 has nanometer waterproof coating 4, through drying after spraying nanometer waterproof coating 4 on the surface of circuit board, can reach and normally form a transparent colourless molecule water-resistant film chain on the protection component in aqueous, make water unable contact by the protection component, and the waterproof membrane 3 of bottom is not only waterproof, simultaneously can also be acid-base resistant, corrosion-resistant, in addition, owing to adopted stealthy molecule film coating technique, its coating thickness reaches the nanometer level, also can not influence the use of circuit board, solved simultaneously because do not have waterproof performance, in case meet water in the use can produce the short circuit immediately or the problem of damage.
The standard parts used in this document are commercially available, all the components in this document are customized according to the description of the specification and the drawings, and the connection relationship and specific structure between the layers in this document are all performed by the prior art, such as by mechanical methods, by adhesives, by various welding methods such as thermal welding, ultrasonic welding, flux, welding, and fusion crimping, and no specific description is made here.
When the waterproof coating is used, the surface of the circuit board is sprayed with the nano waterproof coating 4 and then dried, so that a transparent colorless molecular waterproof film chain is normally formed on the protective component in water, water cannot contact the protected component, the waterproof film 3 at the bottom is waterproof, acid-base resistant and corrosion resistant, and in addition, due to the adoption of the invisible molecular film coating technology, the coating thickness reaches the nano level, and the use of the circuit board cannot be influenced.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (5)
1. A high-precision impedance circuit board comprises a substrate (1), and is characterized in that: the waterproof board is characterized in that a core board layer (2) is connected to the top of the base board (1) in an adhesive mode, a waterproof film (3) is laid on the top of the core board layer (2), and a nanometer waterproof coating (4) is coated on the top of the waterproof film (3).
2. A high precision impedance circuit board according to claim 1, wherein: the core plate layer (2) comprises a first insulating layer (201), a pressure-resistant layer (202) is bonded and connected to the bottom of the first insulating layer (201), and a second insulating layer (203) is bonded and connected to the bottom of the pressure-resistant layer (202).
3. A high precision impedance circuit board according to claim 1, wherein: the positioning plate is characterized in that positioning plates (5) are fixedly mounted on two sides of the back surface of the base plate (1), and positioning holes (6) are formed in the front surface of each positioning plate (5).
4. A high precision impedance circuit board according to claim 2, wherein: the pressure-resistant layer (202) is made of rubber elastic fibers.
5. A high precision impedance circuit board according to claim 1, wherein: the waterproof membrane (3) is made of a double-layer structure, and the waterproof membrane (3) is made of a nano waterproof material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021159715.9U CN212463614U (en) | 2020-06-22 | 2020-06-22 | High-precision impedance circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021159715.9U CN212463614U (en) | 2020-06-22 | 2020-06-22 | High-precision impedance circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212463614U true CN212463614U (en) | 2021-02-02 |
Family
ID=74470996
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021159715.9U Expired - Fee Related CN212463614U (en) | 2020-06-22 | 2020-06-22 | High-precision impedance circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212463614U (en) |
-
2020
- 2020-06-22 CN CN202021159715.9U patent/CN212463614U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20210202 |