CN102157677B - Rigid-flexible combined piezoelectric interlayer with insulating property - Google Patents
Rigid-flexible combined piezoelectric interlayer with insulating property Download PDFInfo
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- CN102157677B CN102157677B CN201110044459A CN201110044459A CN102157677B CN 102157677 B CN102157677 B CN 102157677B CN 201110044459 A CN201110044459 A CN 201110044459A CN 201110044459 A CN201110044459 A CN 201110044459A CN 102157677 B CN102157677 B CN 102157677B
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- printed circuit
- circuit board
- flexible printed
- interlayer
- rigid plate
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- 239000011229 interlayer Substances 0.000 title claims abstract description 34
- 238000005538 encapsulation Methods 0.000 claims abstract description 5
- 239000010410 layer Substances 0.000 claims description 19
- 238000009413 insulation Methods 0.000 claims description 18
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 10
- 239000011248 coating agent Substances 0.000 claims description 10
- 238000000576 coating method Methods 0.000 claims description 10
- 239000000463 material Substances 0.000 claims description 7
- 238000007747 plating Methods 0.000 claims description 7
- 239000000377 silicon dioxide Substances 0.000 claims description 5
- 238000003475 lamination Methods 0.000 claims description 4
- 235000012239 silicon dioxide Nutrition 0.000 claims description 4
- 238000001755 magnetron sputter deposition Methods 0.000 claims description 3
- 238000005507 spraying Methods 0.000 claims description 3
- 238000001771 vacuum deposition Methods 0.000 claims description 3
- 230000036541 health Effects 0.000 abstract description 7
- 238000012544 monitoring process Methods 0.000 abstract description 7
- 230000001737 promoting effect Effects 0.000 abstract 1
- 238000000034 method Methods 0.000 description 10
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 5
- 229910052782 aluminium Inorganic materials 0.000 description 5
- 239000004411 aluminium Substances 0.000 description 5
- 238000012545 processing Methods 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 230000004888 barrier function Effects 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 235000019687 Lamb Nutrition 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000012631 diagnostic technique Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 230000003862 health status Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 239000013307 optical fiber Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 235000020004 porter Nutrition 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 239000005871 repellent Substances 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 239000002210 silicon-based material Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000002463 transducing effect Effects 0.000 description 1
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Abstract
The invention discloses a rigid-flexible combined piezoelectric interlayer with insulating property, and the rigid-flexible combined piezoelectric interlayer provided by the invention comprises a flexible printed circuit board, a bottom rigid board, a top rigid board and an SMA joint, wherein the upper surface and lower surface of one end of the flexible printed circuit board are respectively laminated on the bottom rigid board and the top rigid board; a plurality of through holes communicated with the flexible printed circuit board are arranged on the top rigid board, and a bonding pad is arranged on the top rigid board, the through holes and the bonding pad form an SMA encapsulation together with the SMA joint; and a piezoelectric sensor is welded on the bottom of the other end of the flexible printed circuit board. The stability, reliability and consistency in the use of the piezoelectric sensor are improved; meanwhile, a noise interference problem caused by the conduction of the piezoelectric sensor and the structure is solved without influencing a signal; and the rigid-flexible combined piezoelectric interlayer with insulating property can be used for promoting the piezoelectric interlayer to be widely applied in the structural health monitoring.
Description
Technical field
The present invention relates to a kind of hard and soft combination piezoelectricity interlayer of tape insulation performance, belong to the structural health monitoring technology field.
Background technology
At present, the monitoring structural health conditions method based on piezoelectric transducer and Lan Mu (Lamb) ripple active diagnostic techniques is a kind of method of typical, effective recognition structure health status.The structural health supervisory control system adopts manual mode that piezoelectric transducer is pasted structurally in research process mostly, and this method is difficult to guarantee the consistency of reliability of structure and performance, and transducer is provided with inconvenience when using in batches.The proposition of " smart layer " notion has well solved this problem; Require design sensing network line according to planform and monitoring; And it is prefabricated in flexible printed circuit board; Through a standard interface output signal, piezoelectric transducer is packaged in forms the piezoelectricity interlayer on the flexible printed circuit board at last.The interlayer of processing by this method can directly be arranged structurally; Convenient in application can guarantee the consistency of production technology to the piezoelectric transducer performance impact, and circuit is little to structure influence; Piezoelectricity interlayer interlayer can be directed against different application objects, carries out three dimensional design.
But in practical engineering application, because piezoelectricity interlayer main body is a flexible printed circuit board, the signal output interface place of fragile structure, especially circuit board receives unexpected the pulling easily and causes destroying; Secondly, because the piezoelectric transducer surface on the piezoelectricity interlayer is silver-plated electrode, when structure was electric conducting material, piezoelectric transducer directly contacted with structure and can cause electric charge to flow away, and was prone to introduce construct noise simultaneously, increased the difficulty of signal processing.
Summary of the invention
The objective of the invention is to receive external force easily and cause breakage and piezoelectric transducer and conductive structure conducting to cause the big defective of signal noise in order to overcome existing piezoelectricity interlayer signal output interface; The present invention provides a kind of hard and soft combination piezoelectricity interlayer of tape insulation performance; Can improve the reliability of interlayer interface and signal transmssion line interconnection, realization piezoelectric transducer and structure insulate and transducing signal are not impacted.
The present invention adopts following technical scheme for realizing above-mentioned purpose:
The hard and soft combination piezoelectricity interlayer of tape insulation performance of the present invention; Comprise flexible printed circuit board, bottom rigid plate, top layer rigid plate, sub-miniature A connector; The upper and lower surfaces of flexible printed circuit board one end is lamination bottom and top layer rigid plate respectively; A plurality of through holes are set until flexible printed circuit board on the top layer rigid plate, and on the top layer rigid plate, pad are set, said through hole and pad and sub-miniature A connector form the SMA encapsulation; Piezoelectric transducer is welded on the bottom of the other end of flexible printed circuit board.
Vacuum coating or magnetron sputtering plating spraying plating coating are adopted in the lower surface of said piezoelectric transducer and side.
Said coating material is a silicon dioxide.
Said bottom and top layer rigid plate are the FR-4 material.
The present invention has following advantage: the reliability of joint force part has been improved in (1), even holding wire receives unexpected the pulling, also can not cause interlayer to damage; (2) through forming insulating barrier at piezoelectric transducer and structure interface plated film, the electric charge that makes piezoelectric transducer induce can not be lost to structure and get on, and has reduced noise jamming, reduces the difficulty of signal processing; (3) but silicon dioxide plated film temperature limit is wide, have good moistureproof moisture-proof characteristic simultaneously, to piezoelectric transducer layer of protecting is provided; (4) range of application of piezoelectricity interlayer is more extensive, uses more reliable.
Description of drawings
Fig. 1 is the hard and soft combination piezoelectricity interlayer front view and the vertical view of tape insulation performance;
Fig. 2 is the hard and soft combination blank area cutaway view of the hard and soft combination piezoelectricity interlayer of tape insulation performance;
Fig. 3 is the tape insulation performance piezoelectric transducer part of the hard and soft combination piezoelectricity interlayer of tape insulation performance;
Fig. 4 is that the hard and soft combination piezoelectricity interlayer application of tape insulation performance is in the aluminium sheet monitoring structural health conditions;
Fig. 5 is hard and soft combination piezoelectricity interlayer application piezoelectric transducer part detail view in the aluminium sheet monitoring structural health conditions of tape insulation performance.
101 is flexible printed circuit board among the figure; 102,103 is rigid plate; 104 is pad; 201 is piezoelectric transducer; 202 is coating; 401 is the aluminium sheet structure; 402 is sub-miniature A connector; 501 is glue-line.
Embodiment
Be elaborated below in conjunction with the technical scheme of accompanying drawing to invention:
Shown in Figure 1 is the hard and soft combination piezoelectricity interlayer front view and the vertical view of tape insulation performance, and for for simplicity, it is that example describes that a piezoelectric transducer only is set.Flexible printed circuit board 101 left ends are hard and soft combination joint area, and joint is selected SMA for use, in front view, faces up; Right-hand member is piezoelectric transducer 201 encapsulation positions; In front view, be positioned at flexible printed circuit board 101 bottom surfaces, piezoelectric transducer 201 is cylindrical, diameter 8mm; Thickness 0.48mm; The surface is silver-plated electrode, upper surface electrode directly with flexible printed circuit board 101 on corresponding pad link, lower surface electrode through cylindrical side cause in the upper surface part island zone again with printed circuit board (PCB) 101 on corresponding pad binding.
The inventive method is following: hard and soft combined process is adopted at (1) signal output interface position on piezoelectricity interlayer flexible printed circuit board, makes that this subregion obtains reinforcing.Hard and soft integrated structure is a kind of multilayer P C B, is made up of rigid layer and flexible layer.Rigid layer is the FR-4 material, and hardness is big, no conductivity; Flexible layer is the polyimide material of flexible printed circuit board.Prefabricated junction block payment to a porter road, signal output interface place on flexible printed circuit board; Mode through lamination combines two faces of two-layer rigid course and flexible printed circuit board; In processing step subsequently, rigid plate is holed and overlay coating processing formation and flexible printed circuit board top connection pin corresponding bonding pad, thereby form complete hard and soft combined with intelligent interlayer.(2) adopt the mode of plated film that the exposed part (side and and the glued negative electricity pole-face of structure) outside of piezoelectric transducer on the piezoelectricity interlayer is covered with layer of silicon dioxide coating protection cuticula.The coating protection cuticula is very thin components and parts protective layer; It can strengthen the anti-moisture and soil-repellent ability of components and parts and prevent that conductor from suffering erosion; Also can play the effect that prevents line short; In addition, the coating protection cuticula also helps the wear-resisting wiping and the solvent resistance of components and parts, and can release temperature the pressure that caused of cyclic variation.Earth silicon material is widely used in the optical fiber grating structure, has splendid protection against the tide, resist chemical and dielectric barrier properties.
In hard and soft combination blank area cutaway view shown in Figure 2, flexible printed circuit board 101 is inner through the good sensing network circuit of etching method cloth, and causes joint area; Cover glue at this zone upper and lower surfaces, cover the rigid plate 102,103 of prefabricated size, material generally adopts FR-4, and the mode through lamination is combined into one them; On top layer rigid plate 103, do through hole, system pad 104 etc. form the SMA encapsulation that communicates with flexible printed circuit board 101; The bottom rigid plate need not extra process, and it plays the effect of insulating protection when improving the joint area rigidity.
Shown in Figure 3 is tape insulation performance piezoelectric transducer part, and piezoelectric transducer 201 is welded on the flexible printed circuit board 101, and the even spraying plating silica membrane 202 in its lower surface and side forms one deck coating protection film.Method of spray plating can be selected vacuum coating, magnetron sputtering plating etc. for use according to physical condition.
Fig. 4 be the hard and soft combination piezoelectricity interlayer application of tape insulation performance in front view, the vertical view of 401 health monitorings of aluminium sheet structure, wherein the hard and soft combination piezoelectricity interlayer of tape insulation performance is bonded on the aluminium sheet structure; Shown in Figure 5 is right side piezoelectric transducer part, and 501 is adhesive.
Claims (4)
1. the hard and soft combination piezoelectricity interlayer of a tape insulation performance; It is characterized in that comprising flexible printed circuit board (101), bottom rigid plate (102), top layer rigid plate (103), sub-miniature A connector (401); The upper and lower surfaces of flexible printed circuit board (101) one ends is lamination bottom rigid plate (102) and top layer rigid plate (103) respectively; A plurality of through holes are set until flexible printed circuit board (101) on top layer rigid plate (103); And pad (104) is set on top layer rigid plate (103), said through hole and pad (104) form the SMA encapsulation with sub-miniature A connector (401); Piezoelectric transducer (201) is welded on the bottom of the other end of flexible printed circuit board (101).
2. the hard and soft combination piezoelectricity interlayer of tape insulation performance according to claim 1 is characterized in that vacuum coating or magnetron sputtering plating spraying plating coating (202) are adopted in lower surface and the side of said piezoelectric transducer (201).
3. the hard and soft combination piezoelectricity interlayer of tape insulation performance according to claim 2 is characterized in that said coating (202) material is a silicon dioxide.
4. the hard and soft combination piezoelectricity interlayer of tape insulation performance according to claim 1 is characterized in that said bottom rigid plate (102) and top layer rigid plate (103) are the FR-4 material.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110044459A CN102157677B (en) | 2011-02-24 | 2011-02-24 | Rigid-flexible combined piezoelectric interlayer with insulating property |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110044459A CN102157677B (en) | 2011-02-24 | 2011-02-24 | Rigid-flexible combined piezoelectric interlayer with insulating property |
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| Publication Number | Publication Date |
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| CN102157677A CN102157677A (en) | 2011-08-17 |
| CN102157677B true CN102157677B (en) | 2012-08-29 |
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| CN201110044459A Active CN102157677B (en) | 2011-02-24 | 2011-02-24 | Rigid-flexible combined piezoelectric interlayer with insulating property |
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Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102419183B (en) * | 2011-08-18 | 2013-10-23 | 中国飞机强度研究所 | Piezoelectric sensor and processing method thereof |
| CN102307428A (en) * | 2011-08-18 | 2012-01-04 | 南京航空航天大学 | Anti-electromagnetic interference piezoelectric interlayer |
| CN102636573B (en) * | 2012-04-23 | 2013-12-25 | 南京邮电大学 | Method for manufacturing piezoelectric interlinings |
| CN103438910A (en) * | 2013-08-14 | 2013-12-11 | 南京航空航天大学 | Novel electromagnetic shielding piezoelectric interlayer |
| CN109712937B (en) * | 2019-01-02 | 2020-12-18 | 北京振兴计量测试研究所 | Eutectic carrier and microwave device |
| CN110057391B (en) * | 2019-05-20 | 2021-07-20 | 中南大学 | Device and method for testing sensing performance of shear type piezoelectric sensor |
| CN116840350A (en) * | 2023-05-12 | 2023-10-03 | 南通大学 | Flexible array for monitoring circumferential crack acoustic emission of pipeline girth weld and preparation method |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1223446A (en) * | 1997-08-19 | 1999-07-21 | 株式会社东金 | Piezoelectric transformer and power supply including the same |
| CN1551379A (en) * | 1998-06-05 | 2004-12-01 | Nec������ʽ���� | Mounting structure of piezoelectric transformer and method of mounting piezoelectric transformer |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080218026A1 (en) * | 2007-02-27 | 2008-09-11 | Iptrade, Inc. | Piezoelectric package with enlarged conductive layers |
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2011
- 2011-02-24 CN CN201110044459A patent/CN102157677B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1223446A (en) * | 1997-08-19 | 1999-07-21 | 株式会社东金 | Piezoelectric transformer and power supply including the same |
| CN1551379A (en) * | 1998-06-05 | 2004-12-01 | Nec������ʽ���� | Mounting structure of piezoelectric transformer and method of mounting piezoelectric transformer |
Non-Patent Citations (1)
| Title |
|---|
| 石晓玲，袁慎芳，邱雷.压电智能夹层抗电磁干扰设计.《测控技术》.2010,第29卷351-354，358. * |
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