CN212413501U

CN212413501U - Anti-corrosion circuit board connected in surface mounting mode

Info

Publication number: CN212413501U
Application number: CN202020887286.0U
Authority: CN
Inventors: 张涛
Original assignee: Digital Printed Circuit Board Co Ltd
Current assignee: Digital Printed Circuit Board Co Ltd
Priority date: 2020-05-22
Filing date: 2020-05-22
Publication date: 2021-01-26
Anticipated expiration: 2030-05-22

Abstract

The utility model provides a chip-type connected anti-corrosion circuit board, which comprises a board main body, wherein the board main body comprises an insulating substrate, a first conductive circuit layer, an insulating layer, a second conductive circuit layer and a welding-proof layer, a welding hole is arranged in the board main body, and a first insulating piece or a second insulating piece is arranged in the welding hole; the first insulating part comprises a first partition plate, a first support and a first sleeve are formed above and below the first partition plate, a first yielding hole is formed in the first partition plate, the first partition plate is located between the second conducting circuit layer and the insulating layer, and first soldering tin blocks are filled on two sides of the first partition plate; the second insulating part comprises a second partition plate, a second sleeve and a second support column are formed on the second partition plate in an up-down mode, a second yielding hole is formed in the second partition plate, the second partition plate is located between the first conducting circuit layer and the insulating layer, and second soldering tin blocks are filled on two sides of the second partition plate. The utility model discloses can effectively hide the soldering tin piece, insulating part structure in the weld hole can completely cut off the circuit that corresponds.

Description

Anti-corrosion circuit board connected in surface mounting mode

Technical Field

The utility model relates to a circuit board field specifically discloses an anticorrosion circuit board that SMD is connected.

Background

Circuit boards are used to provide mounting, assembly and mechanical support for various electronic components such as integrated circuits, to provide wiring and electrical connections or electrical isolation between various electronic components such as integrated circuits, and to provide desired electrical characteristics.

The circuit board mainly includes insulating substrate and conducting wire layer, and during the use, through tin cream with electronic component's pin welding on the conducting wire layer, under adverse circumstances such as humidity, high temperature, the welded structure who exposes between circuit board and the electronic component pin is the oxidation corrosion easily, and the welded structure after the oxidation leads to the circuit failure easily, influences the performance of circuit board.

SUMMERY OF THE UTILITY MODEL

Therefore, it is necessary to provide a surface mount type connected anti-corrosion circuit board, which can effectively hide a welding structure between the circuit board and a component pin, so as to effectively ensure reliable performance of the circuit board.

In order to solve the prior art problem, the utility model discloses an anticorrosion circuit board that SMD connects, including the board main part, the board main part includes from the lower supreme insulating substrate who sets gradually, first conducting wire layer, the insulating layer, second conducting wire layer and anti-welding layer, the thickness of insulating substrate, first conducting wire layer, the insulating layer, second conducting wire layer and anti-welding layer is D1, D2, D3, D4, D5 respectively, be equipped with the welding hole in the board main part, be equipped with insulating seal rubber ring on the anti-welding layer, the one end and the insulating seal rubber ring in welding hole are connected, be equipped with first insulator or second insulator in the welding hole;

the first insulating part comprises a first partition plate, a first support column and a first sleeve are integrally formed on the upper portion and the lower portion of the first partition plate respectively, the outer wall of the first sleeve is connected with the inner wall of the welding hole in a clinging mode, a plurality of first abdicating holes are formed in the first partition plate, the first partition plate is located between the second conductive circuit layer and the insulating layer, the length of the first support column is L1, L1 is D4+ D5, the length of the first sleeve is L2, L2 is D1+ D2+ D3, first soldering tin blocks are filled on two sides of the first partition plate, and the first soldering tin blocks are connected with the second conductive circuit layer;

the second insulating part comprises a second partition plate, the upper part and the lower part of the second partition plate are respectively provided with a second sleeve and a second support column in an integrated manner, the outer wall of the second sleeve is tightly attached to the inner wall of the welding hole, a plurality of second yielding holes are formed in the second partition plate, the second partition plate is located between the first conductive circuit layer and the insulating layer, the length of the second sleeve is L3, L3 is D3+ D4+ D5, the length of the second support column is L4, L4 is D1+ D2, the two sides of the second partition plate are filled with second soldering tin blocks, and the second soldering tin blocks are connected with the first conductive circuit layer.

Furthermore, the insulating sealing rubber ring is a heat-conducting silica gel ring.

Furthermore, a supporting groove is arranged on the insulating sealing rubber ring.

Furthermore, one end of the first soldering tin block insulation sealing rubber ring is covered with a first insulation sealing layer, and one end of the second soldering tin block, which is far away from the insulation sealing rubber ring, is covered with a second insulation sealing layer.

Furthermore, the first insulating sealing layer and the second insulating sealing layer are both heat conduction silica gel layers.

The utility model has the advantages that: the utility model discloses an anticorrosion circuit board that SMD is connected is provided with special welding hole structure, can effectively hide and the component pin between the soldering tin piece, avoid soldering tin piece by corrosive substance erosion in the external environment to effectively ensure the dependable performance of circuit board, in addition, be provided with special insulating part structure in the welding hole, can effectively completely cut off the conducting wire layer and the soldering tin piece that correspond, line connection is controllable reliable, and overall structure is stable firm.

Drawings

Fig. 1 is a schematic structural diagram of the present invention.

Fig. 2 is a schematic structural view of the first insulating member of the present invention.

Fig. 3 is a schematic structural view of the second insulating member of the present invention.

The reference signs are: the solder mask comprises a board main body 10, an insulating substrate 11, a first conductive circuit layer 12, an insulating layer 13, a second conductive circuit layer 14, a solder mask layer 15, a soldering hole 16, an insulating sealing rubber ring 20, a support bracket 21, a first insulating part 30, a first partition plate 31, a first abdicating hole 311, a first pillar 32, a first sleeve 33, a first solder block 34, a first insulating sealing layer 35, a second insulating part 40, a second partition plate 41, a second abdicating hole 411, a second sleeve 42, a second pillar 43, a second solder block 44, a second insulating sealing layer 45 and a component pin 50.

Detailed Description

For further understanding of the features and technical means of the present invention, as well as the specific objects and functions attained by the present invention, the present invention will be described in further detail with reference to the accompanying drawings and detailed description.

Refer to fig. 1 to 3.

The embodiment of the utility model discloses anti-corrosion circuit board that SMD connects, including board main part 10, board main part 10 includes from supreme insulating substrate 11 that sets gradually down, first conducting wire layer 12, insulating layer 13, second conducting wire layer 14 and solder mask layer 15 down, insulating substrate 11, first conducting wire layer 12, insulating layer 13, the thickness of second conducting wire layer 14 and solder mask layer 15 is D1 respectively, D2, D3, D4, D5, be equipped with a plurality of welding holes 16 in board main part 10, be equipped with on the solder mask layer 15 with welding hole 16 equivalent insulating seal rubber ring 20, the one end and the insulating seal rubber ring 20 of welding hole 16 are connected, be equipped with first insulator 30 or second insulator 40 in the welding hole 16;

the first insulating member 30 includes a first partition plate 31, a first pillar 32 and a first sleeve 33 are respectively integrally formed above and below the first partition plate 31, the first pillar 32 and the first sleeve 33 are all of an insulating structure, the outer wall of the first sleeve 33 is in close contact with the inner wall of the soldering hole 16, a plurality of first abdicating holes 311 through which solder paste passes are formed in the first partition plate 31, the first partition plate 31 is located between the second conductive circuit layer 14 and the insulating layer 13, the length of the first pillar 32 is L1, L1 is D4+ D5, the length of the first sleeve 33 is L2, L2 is D1+ D2+ D3, the first conductive circuit layer 12 can be effectively blocked by the first sleeve 33, first solder blocks 34 are filled on both sides of the first partition plate 31, and the first solder blocks 34 are connected with the second conductive circuit layer 14;

the second insulating member 40 includes a second partition plate 41, a second sleeve 42 and a second pillar 43 are respectively integrally formed above and below the second partition plate 41, the second pillar 43 and the second sleeve 42 are both insulating structures, an outer wall of the second sleeve 42 is in close contact with an inner wall of the soldering hole 16, a plurality of second abdicating holes 411 through which solder paste passes are formed in the second partition plate 41, the second partition plate 41 is located between the first conductive circuit layer 12 and the insulating layer 13, the length of the second sleeve 42 is L3, L3 is D3+ D4+ D5, the second sleeve 42 can effectively block the second conductive circuit layer 14, the length of the second pillar 43 is L4, L4 is D1+ D2, second solder blocks 44 are filled on two sides of the second partition plate 41, and the second solder blocks 44 are connected with the first conductive circuit layer 12.

When the solder paste is applied, after the element pin 50 is inserted into the insulating sealing rubber ring 20, the plate body 10 is inverted, solder paste is injected into the solder hole, and the solder paste can be connected with the element pin 50 through the first abdicating hole 311 or the second abdicating hole 411; the first sleeve 33 can effectively isolate the first solder block 34 from the first conductive trace layer 12, so that the first solder block 34 only connects the second conductive trace layer 14 and the corresponding component pin 50; the second sleeve 42 effectively isolates the second solder bump 44 from the second conductive trace layer 14, so that the second solder bump 44 only connects the first conductive trace layer 12 and the corresponding component pin 50. First soldering tin piece 34 and second soldering tin piece 44 all hold in welding hole 16, can effectively avoid being corroded by corrosive substance in the air, and insulating sealant ring 20 can effectively seal the connected position between component pin 50 and first soldering tin piece 34 or second soldering tin piece 44, can further realize surrounding protection to welded structure.

In this embodiment, the insulating sealing rubber ring 20 is a heat conducting silica gel ring, and the heat conducting silica gel has good insulation, elasticity and heat conducting property, so that not only can the sealing property be ensured, but also the heat dissipation performance of the whole structure after the electronic component is welded can be effectively improved.

In this embodiment, the insulating sealing rubber ring 20 is provided with the supporting slot 21, the central axis of the supporting slot 21 is collinear with the central axis of the insulating sealing rubber ring 20, when an electronic component is soldered, the component pin 50 is sunk into the supporting slot 21 and attached to the inner wall thereof, the first solder block 34 or the second solder block 44 is filled into the insulating sealing rubber ring 20, and the sealing performance is good.

In this embodiment, one end of the insulating sealant ring 20 of the first solder block 34 is covered with the first insulating sealant 35, and one end of the second solder block 44 away from the insulating sealant ring 20 is covered with the second insulating sealant 45, so that the solder blocks can be effectively protected by the first insulating sealant 35 and the second insulating sealant 45, and corrosion of corrosive substances in air can be further avoided.

Based on the above embodiment, the first insulating and sealing layer 35 and the second insulating and sealing layer 45 are both heat-conducting silica gel layers, and the heat-conducting silica gel has good mechanical resistance and chemical resistance, so that the solder blocks can be effectively protected, and meanwhile, the heat dissipation performance of the whole circuit board can be effectively improved.

The above-mentioned embodiments only represent some embodiments of the present invention, and the description thereof is specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.

Claims

1. An anti-corrosion circuit board connected in a surface mount manner is characterized by comprising a board main body (10), the plate main body (10) comprises an insulating substrate (11), a first conductive circuit layer (12), an insulating layer (13), a second conductive circuit layer (14) and a solder mask layer (15) which are sequentially arranged from bottom to top, the thicknesses of the insulating substrate (11), the first conductive circuit layer (12), the insulating layer (13), the second conductive circuit layer (14) and the solder mask layer (15) are respectively D1, D2, D3, D4 and D5, a welding hole (16) is arranged in the plate main body (10), an insulating sealing rubber ring (20) is arranged on the solder mask layer (15), one end of the welding hole (16) is connected with the insulating sealing rubber ring (20), a first insulating piece (30) or a second insulating piece (40) is arranged in the welding hole (16);

the first insulating piece (30) comprises a first partition plate (31), a first support column (32) and a first sleeve (33) are integrally formed on the upper portion and the lower portion of the first partition plate (31), the outer wall of the first sleeve (33) is in close fit connection with the inner wall of the welding hole (16), a plurality of first abdicating holes (311) are formed in the first partition plate (31), the first partition plate (31) is located between the second conductive circuit layer (14) and the insulating layer (13), the length of the first support column (32) is L1, the length of the first support column is L1 ═ D4+ D5, the length of the first sleeve (33) is L2, the length of the first sleeve (33) is L2 ═ D1+ D2+ D3, first soldering blocks (34) are filled on two sides of the first partition plate (31), and the first soldering blocks (34) are connected with the second conductive circuit layer (14);

the second insulating member (40) comprises a second partition plate (41), a second sleeve (42) and a second support column (43) are integrally formed on the upper portion and the lower portion of the second partition plate (41), the outer wall of the second sleeve (42) is in close contact with the inner wall of the welding hole (16), a plurality of second yielding holes (411) are formed in the second partition plate (41), the second partition plate (41) is located between the first conductive circuit layer (12) and the insulating layer (13), the length of the second sleeve (42) is L3, L3 is D3+ D4+ D5, the length of the second support column (43) is L4, L4 is D1+ D2, second soldering tin blocks (44) are filled on two sides of the second partition plate (41), and the second soldering tin blocks (44) are connected with the first conductive circuit layer (12).

2. The corrosion protection circuit board of claim 1, wherein the insulating sealant ring (20) is a thermally conductive silicone ring.

3. The bonded connection anti-corrosion circuit board according to claim 1 or 2, wherein the insulating sealant ring (20) is provided with a supporting groove (21).

4. The corrosion-resistant circuit board for chip bonding according to claim 1, wherein one end of the insulating sealant ring (20) of the first solder block (34) is covered with a first insulating sealant layer (35), and one end of the second solder block (44) away from the insulating sealant ring (20) is covered with a second insulating sealant layer (45).

5. The corrosion protection circuit board of claim 4, wherein the first insulating sealant layer (35) and the second insulating sealant layer (45) are both thermally conductive silicone layers.