CN110211852B

CN110211852B - High-current fuse with high-heat-conduction substrate and manufacturing method thereof

Info

Publication number: CN110211852B
Application number: CN201910500581.8A
Authority: CN
Inventors: 俞东
Original assignee: Individual
Current assignee: Individual
Priority date: 2019-06-10
Filing date: 2019-06-10
Publication date: 2021-04-06
Anticipated expiration: 2039-06-10
Also published as: CN110211852A

Abstract

The invention relates to a high-current fuse with a high-heat-conduction substrate and a manufacturing method thereof, wherein the method comprises the following steps: a heat conductive layer; the metal layer is arranged on the surface of the heat conduction layer and is connected with the heat conduction layer through a direct bonding process, the metal layer is etched to form a connection area positioned at two end sides and a conduction area positioned inside and connected with the two connection areas, and the thickness of the metal layer is 0.1 mm-0.3 mm; the tin metal layer is arranged at the conduction region and is connected with the conduction region; and a dielectric covering layer which covers the conducting area and covers the tin metal layer. The thickness of the metal layer is designed to be centimeter level, so that the fuse can meet the use requirement of large current, and the heat generated at the metal layer can be dissipated outwards through the heat conducting layer by matching with the arrangement of the heat conducting layer, thereby avoiding the influence on the connection position caused by overhigh temperature and ensuring that the fuse can be suitable for the circuit protection of large current.

Description

High-current fuse with high-heat-conduction substrate and manufacturing method thereof

Technical Field

The invention relates to the technical field of fuses, in particular to a high-current fuse with a high-heat-conduction substrate and a manufacturing method thereof.

Background

A fuse, also called a fuse, is an overcurrent protection device, which uses heat generated during overcurrent to fuse a conductive part to cut off current and protect the safety of an electrical appliance.

The existing fuse comprises a ceramic chip sheet molding compound fuse, a thin film paster fuse based on a printed circuit board, a fuse based on the printed circuit board and a ceramic body paster fuse. The fuse wire is used as a conducting circuit inside, and the conducting circuit is fused to cut off the current when the current exceeds a set value. However, since the thickness of the fuse is generally designed to be micron level, the current setting value is small, and the use requirement of large current cannot be met. When the thickness of the fuse wire is designed to be larger, the whole fuse wire is overheated, so that the soldering tin connection between the fuse wire and the circuit board is easy to fall off, and the use requirement of large current cannot be met.

Disclosure of Invention

The invention aims to overcome the defects of the prior art, provides a high-current fuse with a high-heat-conduction substrate and a manufacturing method thereof, and solves the problem that the conventional fuse cannot meet the use requirement of high current due to small fuse thickness and overheating of the fuse.

The technical scheme for realizing the purpose is as follows:

the invention provides a high-current fuse with a high-heat-conduction substrate, which comprises:

a heat conductive layer;

the metal layer is arranged on the surface of the heat conduction layer and is connected with the heat conduction layer through a direct bonding process, the metal layer is etched to form a connection area positioned at two end sides and a conduction area positioned inside and connected with the two connection areas, and the thickness of the metal layer is 0.1 mm-0.3 mm;

the tin metal layer is arranged at the conduction region and is connected with the conduction region; and

and the dielectric covering layer is covered on the conducting area and covers the tin metal layer.

The fuse has the heat conducting layer with high heat conducting performance, after the thickness of the metal layer is designed to be centimeter level, the fuse can meet the use requirement of large current, and the heat generated at the metal layer can be dissipated outwards through the heat conducting layer by matching with the arrangement of the heat conducting layer, so that excessive heat cannot be transferred to the joint between the metal layer and the circuit board, the influence on the joint due to overhigh temperature is avoided, and the fuse is ensured to be suitable for the circuit protection of large current.

The invention further improves the high-current fuse with the high-heat-conduction substrate, and the high-current fuse also comprises a metal bonding layer arranged on the other surface of the heat conduction layer and a first conducting layer covered on the end face of the metal bonding layer, the end face of the heat conduction layer and the end face of the metal layer;

the metal bonding layer is etched to form fixing regions at both end sides, and the first conductive layer electrically connects the fixing regions and the corresponding connection regions.

The invention has the further improvement that the high-current fuse with the high-heat-conducting substrate is characterized in that the heat-conducting layer is provided with a through hole corresponding to the conduction area;

the tin metal layer is arranged in the through hole, and the dielectric covering layer is also arranged in the through hole and fills the through hole.

The high-current fuse with the high-heat-conduction substrate is further improved in that the high-current fuse further comprises another heat conduction layer which is connected with the other surface of the metal layer through a direct bonding process, and the another heat conduction layer is arranged opposite to the heat conduction layer;

the other heat conduction layer is provided with a communication hole corresponding to the conduction area;

the surface of the conduction region corresponding to the communication hole is connected with another tin metal layer, and the another tin metal layer is arranged in the communication hole;

and a protective layer is embedded in the communication hole and covers the other tin metal layer.

The invention also provides a manufacturing method of the high-current fuse with the high-heat-conduction substrate, which comprises the following steps of:

providing a heat conduction layer;

providing a metal layer, wherein the thickness of the metal layer is between 0.1mm and 0.3mm, and connecting the metal layer with the surface of the heat conduction layer through a direct bonding process;

etching the surface of the metal layer far away from the heat conduction layer to form connection areas positioned at two end sides and a conduction area positioned inside and connecting the two connection areas;

connecting a tin metal layer on the surface of the conduction region far away from the heat conduction layer; and

and covering a dielectric covering layer on the surface of the conduction region far away from the heat conduction layer, wherein the dielectric covering layer covers the tin metal layer.

The manufacturing method of the invention is further improved in that the method further comprises the following steps: and coating a first conductive layer on the connecting area, wherein the thickness of the first conductive layer is the same as that of the dielectric covering layer.

The manufacturing method of the invention is further improved in that the method further comprises the following steps:

coating a second conducting layer on the connecting area, extending the second conducting layer to the heat conducting layer, coating the end face of the heat conducting layer and bending and coating the part of the other surface of the heat conducting layer;

and covering a first conductive layer on the outer side of the second conductive layer, wherein the first conductive layer and the second conductive layer are made of different materials.

connecting a metal bonding layer on the other surface of the heat conduction layer through a direct bonding process;

etching the metallic bonding layer to form fixing regions at both end sides;

and covering a first conducting layer on the end face of the fixed area, the end face of the heat conducting layer and the end face of the metal layer, and electrically connecting the fixed area and the connecting area through the first conducting layer.

The invention also provides a manufacturing method of the high-current fuse with the high-heat-conduction substrate, which comprises the following steps:

providing a heat conduction layer, and arranging a through hole on the heat conduction layer;

providing a metal layer, wherein the thickness of the metal layer is between 0.1mm and 0.3mm, and performing in-and-out stamping on the metal layer to form a connecting area positioned at two end sides and a conducting area positioned in the metal layer and connecting the two connecting areas;

connecting the metal layer with the surface of the heat conduction layer through a direct bonding process;

connecting a tin metal layer on the conducting area in the through hole; and

and embedding a dielectric covering layer into the through hole, and covering the tin metal layer through the dielectric covering layer.

providing another heat conduction layer, and forming a through hole in the another heat conduction layer;

connecting the other heat conducting layer and the other surface of the metal layer together through a direct bonding process;

connecting another tin metal layer to the conducting region in the communicating hole;

and embedding and filling a protective layer into the communication hole, and covering the other tin metal layer through the protective layer.

Drawings

Fig. 1 is a cross-sectional view of a first embodiment of a high current fuse of the present invention having a highly thermally conductive substrate.

Fig. 2 is a cross-sectional view of a thermally conductive layer coupled to a metal layer in a first embodiment of a high current fuse having a highly thermally conductive substrate in accordance with the present invention.

Fig. 3 is a bottom view of the structure shown in fig. 2.

Fig. 4 to 6 are schematic diagrams illustrating the decomposition steps of the metal layer and the heat conductive layer by using the direct bonding process.

Fig. 7 is a top view of a metal layer at the time of a first embodiment of a high current fuse having a highly thermally conductive substrate in accordance with the present invention.

Fig. 8 is a cross-sectional view of a high current fuse having a highly thermally conductive substrate according to a first embodiment of the present invention after disposing a tin metal layer.

Fig. 9 is a top view of the structure shown in fig. 8.

Fig. 10 is a top view of the structure shown in fig. 1.

Fig. 11 is a cross-sectional view of a first embodiment of a high current fuse of the present invention having a highly thermally conductive substrate mounted on a circuit board.

Fig. 12 is a schematic structural view of a circuit board with heat dissipation openings on the structure shown in fig. 11.

Fig. 13 is a cross-sectional view of a second embodiment of a high current fuse of the present invention having a highly thermally conductive substrate.

Fig. 14 is a cross-sectional view of the structure shown in fig. 13 mounted on a circuit board.

Fig. 15 is a schematic structural view of a circuit board with a heat dissipation opening on the structure shown in fig. 14.

Fig. 16 is a cross-sectional view of a high current fuse having a highly thermally conductive substrate according to a third embodiment of the present invention, provided with a second conductive layer.

Fig. 17 is a cross-sectional view of a third embodiment of a high current fuse of the present invention having a highly thermally conductive substrate.

Fig. 18 is a cross-sectional view of the structure shown in fig. 17 mounted on a circuit board.

Fig. 19 is a schematic structural view of a circuit board with a heat dissipation opening on the structure shown in fig. 18.

Fig. 20 is a cross-sectional view of a thermally conductive layer attached to two metal layers in a fourth embodiment of a high current fuse of the present invention having a highly thermally conductive substrate.

Fig. 21 is a cross-sectional view of a thermally conductive layer being connected to two metal layers using a direct bonding process.

Fig. 22 is a cross-sectional view of a fourth embodiment of a high current fuse of the present invention having a highly thermally conductive substrate.

Fig. 23 is a cross-sectional view of the structure shown in fig. 22 mounted on a circuit board.

Fig. 24 is a cross-sectional view of a metal layer of a fifth embodiment of a high current fuse of the present invention having a highly thermally conductive substrate.

Fig. 25 is a bottom view of fig. 24.

Fig. 26 is a cross-sectional view of the metal layer shown in fig. 24, both above and below the metal layer, being oxidized to form a metal oxide layer.

Fig. 27 is a schematic view of the structure of fig. 26 after stamping.

Fig. 28 is a top view of a thermally conductive layer of a fifth embodiment of a high current fuse of the present invention having a highly thermally conductive substrate.

Fig. 29 is a cross-sectional view of two thermally conductive layers connected to a metal layer in a fifth embodiment of a high current fuse of the present invention having a highly thermally conductive substrate.

Fig. 30 and 31 are schematic diagrams of exploded steps of connecting the metal layer to the two thermally conductive layers using a direct bonding process.

Fig. 32 is a schematic structural view illustrating a fifth embodiment of a high current fuse according to the present invention, wherein two tin metal layers are disposed on the high current fuse.

Fig. 33 is a cross-sectional view of a fifth embodiment of a high current fuse of the present invention having a highly thermally conductive substrate.

Fig. 34 is a cross-sectional view of a sixth embodiment of a high current fuse of the present invention having a highly thermally conductive substrate.

Detailed Description

The invention is further described with reference to the following figures and specific examples.

Referring to fig. 1, the invention provides a high-current fuse with a high thermal conductive substrate and a manufacturing method thereof, which are used for solving the problem that the current carried by the existing fuse is small, and also for solving the problem that when the current carried by the existing fuse is increased by increasing the thickness of a fuse wire, the tin soldering connection between the fuse wire and a circuit board is easily melted due to overhigh temperature, so that the high-current fuse cannot meet the requirement of high flow. The fuse disclosed by the invention is combined with the metal layer by utilizing the heat conduction layer, and the heat generated by introducing large current into the metal layer is dissipated through the heat conduction layer, so that the influence of the heat on the connection part between the metal layer and the circuit board is reduced, the connection between the fuse and the circuit board is firm and reliable, and the circuit is effectively protected. The fuse has the characteristics of high current, high voltage and high temperature resistance. The following describes the high current fuse with a high thermal conductivity substrate and the manufacturing method thereof according to the present invention with reference to the accompanying drawings.

Referring to fig. 1, a cross-sectional view of a first embodiment of a high current fuse of the present invention having a highly thermally conductive substrate is shown. The high current fuse having a high thermal conductive substrate according to the present invention will be described with reference to fig. 1.

As shown in fig. 1, the high current fuse with a high thermal conductive substrate of the present invention includes a thermal conductive layer 20, a metal layer 30, a tin metal layer 40, and a dielectric cover layer 50; the heat conductive layer 20 has an upper surface, a lower surface and four end surfaces, and as shown in fig. 2 and 3, the metal layer 30 is provided on the upper surface or the lower surface of the heat conductive layer 20, and the metal layer 30 is connected to the upper surface or the lower surface of the heat conductive layer 20 by a direct bonding process. As shown in fig. 7, after the metal layer 30 is connected to the heat conductive layer 20, the connection regions 31 located at both ends and the conduction regions 32 located inside and connecting the two connection regions 31 are formed by etching, a part of the structure of the metal layer 30 located at the other two ends is etched during etching, so that the cross section of the metal layer 30 is H-shaped, the connection regions 31 at both ends serve as surface end electrodes for connecting with circuits on a circuit board, the conduction regions 32 are provided with structures having a lower melting point, and the conduction regions 32 are formed to be fused when a set current value is reached, so that the connection of the circuits is cut off. The thickness of the metal layer 30 is 0.1mm to 0.3mm, so that it can carry current of 40A to 150A. Referring to fig. 8 and 9, the tin metal layer 40 is disposed at the conducting region 32 and connected to the conducting region 32, and has a lower melting point, so as to fuse the conducting region 32 when the current is too large, thereby disconnecting the two surface terminal electrodes, and preferably, the width of the tin metal layer 40 is the same as the width of the conducting region 32. As shown in fig. 10, a dielectric cover layer 50 covers the conductive region 32 and covers the tin metal layer 40, and the dielectric cover layer 50 plays a role in protection.

Preferably, as shown in fig. 4 to 6, the process of connecting the metal layer 30 and the heat conductive layer 20 by the direct bonding process is as follows: one surface of the metal layer 30 is covered with a protective film 12, then the other surface of the metal layer 30 is chemically oxidized to form a metal oxide layer 301 on the other surface, and then the protective film 12 is removed. The metal oxide layer 301 of the metal layer 30 is attached to the heat conductive layer 20, and the metal oxide layer 301 and the heat conductive layer 20 are connected through a sintering process. Thereby achieving the connection of the metal layer 30 and the heat conductive layer 20. The above process is a single-side bonding process, i.e., the connection with the corresponding heat conductive layer 20 is performed through one surface of the metal layer 30.

Preferably, the metal layer 30 is a copper layer, the heat conductive layer 20 is a ceramic layer or an epoxy layer, and the dielectric cover layer 50 is a glass frit.

Further, the tin metal layer 40 may be provided on the via regions 32 by an ink-jet printing process, and may be connected on the via regions 32 by screen printing a solder paste. The dielectric cap layer 50 is applied to the conductive region 32 of the metal layer 30 by screen printing.

In the first embodiment, referring to fig. 1, the upper surface of the metal layer 30 is connected to the heat conducting layer 20, the lower surface of the metal layer 30 is connected to the tin metal layer 40 and the dielectric covering layer 20, and the connection regions 31 at both end sides of the lower surface of the metal layer 30 are exposed as surface terminal electrodes.

In one embodiment, as shown in fig. 1, 10 and 11, the connection of the fuse to the wiring board 10 is made through the exposed connection area 31 of the metal layer 30 to the corresponding lead 101 of the wiring board 10. The wiring board 10 is provided with leads 101, and the connection regions 31 on the metal layer 30 are electrically connected to the corresponding leads 101, preferably by soldering the connection regions 31 to the leads 101 via solder joints 11. As shown in fig. 9, the two wires 101 are connected to form a path through the two connection regions 31 and the conduction region 32, and when the current at the conduction region 32 is too large, the tin metal layer 40 fuses the conduction region 32, so that the connection between the two wires 101 is broken, and the circuit is protected. In this embodiment, the heat conducting layer 20 is located on the upper surface of the metal layer 30, the metal layer 30 is connected to the circuit board 10 through the solder joint 11, and the lower surface of the metal layer 30 is provided with the dielectric covering layer 50, when the current introduced into the metal layer 30 is large, the temperature of the metal layer 30 will rise, and most of the heat of the metal layer 30 will be taken away by the heat conducting layer 20, and the heat conducting layer 20 has the characteristic of high electric heating and non-electric conduction, and can cool the metal layer 30, thereby avoiding the influence of high temperature on the solder joint 11.

In one embodiment, as shown in fig. 12, in order to improve the heat dissipation performance, a heat dissipation opening 102 is formed on the circuit board 10 corresponding to the bottom of the metal layer 30, and as shown in fig. 9, the size of the heat dissipation opening 102 is consistent with the size of the conduction region 32, and the heat dissipation opening 102 is used to dissipate heat at the conduction region 32 in the metal layer 30.

In the second embodiment, as shown in fig. 13 and 9, a conductive layer is provided on the basis of the first embodiment. Specifically, the fuse further includes a first conductive layer 60 covering the connection region 31, the first conductive layer 60 having the same thickness as the dielectric cap layer 50. The lower surface and three end surfaces of the connection region 31 of the metal layer 30 are exposed, and the first conductive layer 60 is provided on the lower surface and three end surfaces of the connection region 31 so as to cover the connection region 31. Through setting up first conducting layer 60, make things convenient for being connected of fuse and circuit board, and first conducting layer 60 can also play further heat conduction radiating effect.

Preferably, the first conductive layer 60 is a nickel/tin plating layer.

In one embodiment, as shown in fig. 14, when the second embodiment is mounted on the wiring board 10, the first conductive layer 60 is placed on the lead 101 on the wiring board 10, and the first conductive layer 60 and the corresponding lead 101 are electrically connected by the solder joint 11. And then realize leading-in through first conducting layer 60, connection area 31 and conduction area 32 between two wires 101, the setting of first conducting layer 60 makes the fuse better weld on the circuit board, has improved the convenience of operation.

In one embodiment, as shown in fig. 15, in order to improve the heat dissipation performance, a heat dissipation opening 102 is formed on the circuit board 10 corresponding to the bottom of the metal layer 30, and as shown in fig. 9, the size of the heat dissipation opening 102 is consistent with the size of the conduction region 32, and the heat dissipation opening 102 is used to dissipate heat at the conduction region 32 in the metal layer 30.

In the third embodiment, as shown in fig. 9, 16 and 17, two conductive layers are provided on the basis of the first embodiment. Specifically, the fuse further includes a second conductive layer 70 covering the connection region 31, the second conductive layer 70 extending to cover an end surface of the heat conductive layer 20 and being bent to cover a portion of the other surface of the heat conductive layer 20, the second conductive layer 70 being disposed to cover a lower surface and an end surface of the connection region 31 and extending upward to cover an end surface of the heat conductive layer 20 and being bent to cover an upper surface of the heat conductive layer 20, and covering a portion of the upper surface of the heat conductive layer 20, the upper surface of the heat conductive layer 20 still having a partially exposed surface. The fuse also includes a first conductive layer 60 overlaying the outside of a second conductive layer 70, the first conductive layer 60 being of a different material than the second conductive layer 70. And the lower surface of the first conductive layer 60 is flush with the lower surface of the corresponding dielectric capping layer 50.

Preferably, the first conductive layer 60 is a nickel/tin plating layer and the second conductive layer 70 is a silver layer.

In one embodiment, as shown in fig. 18, when the third embodiment is mounted on the wiring board 10, the first conductive layer 60 is placed on the lead 101 on the wiring board 10, and the first conductive layer 60 and the corresponding lead 101 are electrically connected by the solder joint 11. And then the two wires 101 are conducted through the first conducting layer 60, the second conducting layer 70, the connecting area 31 and the conducting area 32, and the fuse is better welded on the circuit board due to the arrangement of the first conducting layer 60 and the second conducting layer 70, so that the convenience of operation is improved.

In the fourth embodiment, as shown in fig. 20 and 22, the fourth embodiment is different from the first embodiment in that the fourth embodiment employs a double-sided bonding process to connect metal layers to both the upper surface and the lower surface of the thermally conductive layer 20, and specifically, the fuse further includes a metal bonding layer 30a provided on the other surface of the thermally conductive layer 20 and a first electrically conductive layer 60 overlaying the end surfaces of the metal bonding layer 30a, the end surfaces of the thermally conductive layer 20, and the end surfaces of the metal layer 30; the metal bonding layer 30a is etched to form fixing regions 31a at both end sides, the two fixing regions 31a are spaced apart from each other to achieve an insulating effect, and the first conductive layer electrically connects the fixing regions 31a and the corresponding connection regions 31. The material of the metal bonding layer 30a is the same as that of the metal layer 30, and the metal bonding layer 30a is also connected with the heat conductive layer 20 by a direct bonding process.

The double-sided bonding process comprises the following steps: as shown in fig. 4, 5 and 21, the metal layer 30 and the metal bonding layer 30a are bonded to the heat conductive layer 20 by sintering after the

metal oxide layers

301, 301a are formed on the metal layer 30 and the metal bonding layer 30a by chemical oxidation on one surfaces thereof, respectively, and then the metal oxide layer 301 of the metal layer 30 is attached to the upper surface of the heat conductive layer 20 and the metal oxide layer 301a of the metal bonding layer 30a is attached to the lower surface of the heat conductive layer 20.

The method of etching the upper surface of the metal layer 30 to form the connection region and the conduction region, and then disposing the tin metal layer 40 and the dielectric cap layer 50 in the fourth embodiment is the same as that in the first embodiment, and the structure formed is the same, so that the description is omitted. The difference is that the dielectric cap layer 50 in the fourth embodiment completely covers the upper surface of the metal layer 30, leaving the upper surface of the connection region 31 unexposed. The end face of the connection region 31 is exposed, and the connection region 31 is electrically connected to the corresponding fixing region 31a through the first conductive layer 60.

In one embodiment, as shown in fig. 23, when the fourth embodiment is mounted on the wiring board 10, the first conductive layer 60 and the fixing area 31a are placed on the corresponding lead 101 on the wiring board 10, and the first conductive layer 60 and the fixing area 31a are electrically connected to the corresponding lead 101 through the solder joint 11. As shown in fig. 9, the two wires 101 are electrically connected to each other through the first conductive layer 60, the fixed region 31a, the connection region 31, and the conduction region 32. The double-layer metal layer is arranged, so that the distance between the conduction region 32 and the soldering joint 11 is relatively long, the influence of heat generated by the conduction region 32 on the soldering joint 11 can be reduced to a great extent, and the stability of fuse connection is ensured.

Further, a heat radiation port is opened in a portion of the wiring board 10 corresponding to between the two fixing regions 31 a.

In the sixth embodiment, as shown in fig. 34, the sixth embodiment is different from the first embodiment in that the tin metal layer 40 and the dielectric cover layer 50 are both disposed on the side of the conduction region 32 of the metal layer 30 close to the heat conduction layer 20. Specifically, the heat conductive layer 20 is provided with through holes corresponding to the conduction regions 32; a tin metal layer 40 is disposed within the through hole and a dielectric cap layer 50 is disposed within and fills the through hole.

In one embodiment, the fuse of the sixth embodiment can be connected to the leads on the circuit board through the surface terminal electrodes on the metal layer 30, i.e., the connection regions 31, to complete the mounting of the fuse.

In the fifth embodiment, as shown in fig. 33, the fifth embodiment is different from the sixth embodiment in that the fifth embodiment has a structure in which two heat conductive layers are provided on the upper surface and the lower surface of the metal layer 30, and specifically, as shown in fig. 24 to 26, the upper surface and the lower surface of the metal layer 30 are chemically oxidized so that the metal oxide layer 301 is formed on both the upper surface and the lower surface. Then, portions of the metal layer 30 on both opposite end sides are removed by punching, so as to form an H-shape, where both end sides of the H-shaped metal layer 30 serve as terminal electrodes and a middle portion serves as a conductive region. As shown in fig. 2 and 29, the heat conductive layer 20 has a through hole 21 in the middle, the other heat conductive layer 21a has a through hole 21a in the middle, the heat conductive layer 20 and the other heat conductive layer 21a are respectively disposed on the upper surface and the lower surface of the metal layer 30, the heat conductive layer 20 is attached to the metal oxide layer 301 on the upper surface of the metal layer 30, and the heat conductive layer 20 and the upper surface of the metal layer 30 are connected together by sintering; the other heat conducting layer 20a is attached to the metal oxide layer 301 on the lower surface of the metal layer 30, and the other heat conducting layer 21a and the lower surface of the metal layer 30 are connected together by sintering.

As shown in fig. 30 and fig. 31, the process of double-sided bonding two heat conduction layers and one metal layer is shown, specifically: the upper and lower surfaces of the metal layer are chemically oxidized to form metal oxide layers 301, one heat conduction layer 20 is attached to the metal oxide layer 301 on the upper surface, the other heat conduction layer 20a is attached to the metal oxide layer 301 on the lower surface, and then the two heat conduction layers and the metal layer are connected together through sintering.

Next, as shown in fig. 32 and 33, a tin metal layer 40 is provided on the surface of the through hole 21 corresponding to the conduction region, and another tin metal layer 40a is provided on the surface of the through hole 21a corresponding to the conduction region, wherein the tin metal layer 40 is provided in the through hole 21 and the other tin metal layer 40a is provided in the through hole 21 a. Then, embedding a dielectric covering layer 50 in the through hole 21, wherein the dielectric covering layer 50 fills the through hole 21 and covers the dielectric covering layer 50; the communicating hole 21a is filled with a protective layer 50a, the protective layer 50a covers the other tin metal layer 40a, and the communicating hole 21a is filled with the protective layer 50 a.

The method for manufacturing the high-current fuse having high thermal conductivity according to the present invention is described below.

The invention relates to a method for manufacturing a high-current fuse with a high-heat-conduction substrate, which comprises the following steps of:

as shown in fig. 2 and 3, a thermally conductive layer 20 is provided;

providing a metal layer 30, wherein the thickness of the metal layer 30 is between 0.1mm and 0.3mm, and connecting the metal layer 30 with the surface of the heat conduction layer 20 through a direct bonding process;

as shown in fig. 7, the surface of the metal layer 30 away from the heat conductive layer 20 is etched to form connection regions 31 on both end sides and conduction regions 32 inside and connecting the two connection regions 31;

as shown in fig. 8 and 9, a tin metal layer 40 is connected to the surface of the conduction region 32 away from the heat conductive layer 20; and

as shown in fig. 10 and fig. 1, a dielectric cover layer 50 covers the surface of the conduction region 32 away from the heat conductive layer 20, and the dielectric cover layer 50 covers the tin metal layer 40.

Preferably, the metal layer 30 is a copper layer, the heat conducting layer 20 is a ceramic layer or an epoxy layer, and the dielectric covering layer 50 is a glass frit. The tin metal layer 40 may be provided on the via regions 32 by an ink jet printing process and may be connected on the via regions 32 by screen printing a solder paste. The dielectric cap layer 50 is applied to the conductive region 32 of the metal layer 30 by screen printing.

In a specific embodiment, the method further comprises the following steps:

as shown in fig. 11, a circuit board 10 is provided, and a surface of the circuit board 10 is laid with a lead 101;

placing the connection regions of the metal layer 30 on the corresponding conductive lines 10 and electrically connecting with the corresponding conductive lines 101;

referring to fig. 12, a heat dissipation opening 102 is formed on the circuit board 10 corresponding to the conductive region 32.

The connection region of the metal layer 30 and the lead wire 101 are electrically connected by the solder joint 11. As shown in fig. 9, the two wires 101 are connected to form a path through the two connection regions 31 and the conduction region 32, and when the current at the conduction region 32 is too large, the tin metal layer 40 fuses the conduction region 32, so that the connection between the two wires 101 is broken, and the circuit is protected. In this embodiment, the heat conducting layer 20 is located on the upper surface of the metal layer 30, the metal layer 30 is connected to the circuit board 10 through the solder joint 11, and the lower surface of the metal layer 30 is provided with the dielectric covering layer 50, when the current introduced into the metal layer 30 is large, the temperature of the metal layer 30 will rise, and most of the heat of the metal layer 30 will be taken away by the heat conducting layer 20, and the heat conducting layer 20 has the characteristic of high electric heating and non-electric conduction, and can cool the metal layer 30, thereby avoiding the influence of high temperature on the solder joint 11. Preferably, the size of the heat dissipation opening 102 is consistent with the size of the conduction region 32, and the heat dissipation opening 102 is used for dissipating heat at the conduction region 32 in the metal layer 30.

In the second embodiment, as shown in fig. 13, a conductive layer is provided in addition to the first embodiment. Specifically, the method further comprises the following steps: a first conductive layer 60 is coated on the connection region, and the thickness of the first conductive layer 60 is the same as that of the dielectric cap layer 50. First conducting layer 60 covers the lower surface and the three terminal surface of establishing at the connection region, through setting up first conducting layer 60, makes things convenient for being connected of fuse and circuit board, and first conducting layer 60 can also play further heat conduction radiating effect.

Preferably, the first conductive layer 60 is a nickel/tin plating layer.

In one embodiment, as shown in fig. 14, the method further includes: providing a circuit board 10, wherein a lead 101 is laid on the surface of the circuit board 10;

placing the first conductive layer 60 on the corresponding conductive line 10 and electrically connecting with the corresponding conductive line 101;

referring to fig. 15, a heat dissipation opening 102 is formed on the circuit board 10 corresponding to the conductive region 32.

In the third embodiment, as shown in fig. 9, 16 and 17, two conductive layers are provided on the basis of the first embodiment. Specifically, the method further comprises the following steps:

coating a second conductive layer 70 on the connection region, extending the second conductive layer 70 to the heat conductive layer 20, coating the end face of the heat conductive layer 20, and bending and coating the other surface of the heat conductive layer 20;

the first conductive layer 60 is disposed outside the second conductive layer 70, and the first conductive layer 60 and the second conductive layer 70 are made of different materials.

In one embodiment, as shown in fig. 18, the method further includes:

providing a circuit board 10, wherein a lead 101 is laid on the surface of the circuit board 10;

placing the first conductive layer 60 on the corresponding conductive line 101 and electrically connecting with the corresponding conductive line 101;

referring to fig. 19, a heat dissipation opening 102 is formed in the circuit board 10 corresponding to the conductive area.

In a fourth embodiment, as shown in fig. 20 and 22, the fourth embodiment is different from the first embodiment in that the fourth embodiment adopts a double-sided bonding process, and connects metal layers to both the upper surface and the lower surface of the heat conductive layer 20, and specifically, the fourth embodiment further includes:

connecting a metal bonding layer 30a to the other surface of the heat conduction layer 20 by a direct bonding process;

etching the metallic bonding layer 30a to form fixing regions 31a located at both end sides;

a first conductive layer 60 is provided so as to cover the end surface of the fixed region 31a, the end surface of the heat conductive layer 20, and the end surface of the metal layer 30, and the fixed region 31a and the connection region are electrically connected by the first conductive layer 60. The metal bonding layer 30a is etched to form fixing regions 31a at both end sides, the two fixing regions 31a are spaced apart from each other to achieve an insulating effect, and the first conductive layer electrically connects the fixing regions 31a and the corresponding connection regions 31. The material of the metal bonding layer 30a is the same as that of the metal layer 30, and the metal bonding layer 30a is also connected with the heat conductive layer 20 by a direct bonding process.

In a specific embodiment, the method further comprises the following steps:

as shown in fig. 23, a circuit board 10 is provided, and a surface of the circuit board 10 is laid with a lead 101;

the fixing areas 31a and the first conductive layers 60 are placed on the corresponding wires 101 and electrically connected to the corresponding wires 101, thereby completing the installation of the fuse. Furthermore, in order to improve the heat dissipation effect, a heat dissipation port can be formed in the circuit board corresponding to the portion between the two fixing areas.

In a sixth implementation, as shown in fig. 34, the method of manufacturing the fuse includes the steps of:

providing a heat conduction layer 20, and forming a through hole on the heat conduction layer 20;

providing a metal layer 30, wherein the thickness of the metal layer 30 is between 0.1mm and 0.3mm, and performing in-and-out stamping on the metal layer 30 to form a connecting area positioned at two end sides and a conducting area positioned inside and connecting the two connecting areas;

connecting the metal layer 30 with the surface of the heat conducting layer 20 through a direct bonding process;

connecting a tin metal layer 40 on the inward conduction region of the through hole; and

a dielectric coating layer 50 is filled into the through hole, and the tin metal layer 40 is covered by the dielectric coating layer 50.

In the fifth embodiment, as shown in fig. 33, the fifth embodiment is different from the sixth embodiment in that the fifth embodiment adopts a structure in which two heat conductive layers are provided on the upper surface and the lower surface of the metal layer 30, and specifically, as shown in fig. 24 to 33, the fifth embodiment further includes:

providing another heat conduction layer 20a, and forming a through hole 21a on the other heat conduction layer 20 a;

connecting the other conductive layer 20a and the other surface of the metal layer 30 together by a direct bonding process;

connecting another tin metal layer 40a to the inward conduction region in the via hole 21 a;

a protective layer 50a is embedded in the via hole 21a, and the other tin metal layer 40a is covered by the protective layer 50 a.

While the present invention has been described in detail and with reference to the embodiments thereof as illustrated in the accompanying drawings, it will be apparent to one skilled in the art that various changes and modifications can be made therein. Therefore, certain details of the embodiments are not to be interpreted as limiting, and the scope of the invention is to be determined by the appended claims.

Claims

1. A high current fuse having a highly thermally conductive substrate, comprising:

a heat conductive layer;

a dielectric covering layer which is covered on the conducting area and covers the tin metal layer;

the heat conduction layer is provided with a through hole corresponding to the conduction region;

the tin metal layer is arranged in the through hole, the dielectric covering layer is also arranged in the through hole and fills the through hole, and the surface of the dielectric covering layer is flush with the surface of the heat conduction layer.

2. The high current fuse having a substrate with high thermal conductivity of claim 1, further comprising a metal bonding layer disposed on another surface of said thermally conductive layer and a first electrically conductive layer overlying an end surface of said metal bonding layer, an end surface of said thermally conductive layer and an end surface of said metal layer;

3. The high current fuse having a highly thermally conductive substrate of claim 1, further comprising another thermally conductive layer attached to another surface of said metal layer by a direct bonding process, said another thermally conductive layer being disposed opposite said thermally conductive layer;

4. A method for manufacturing a high-current fuse with a high-heat-conduction substrate is characterized by comprising the following steps:

providing a heat conduction layer;

covering a dielectric covering layer on the surface of the conducting area far away from the heat conducting layer, wherein the dielectric covering layer covers the tin metal layer;

further comprising:

etching the metallic bonding layer to form fixing regions at both end sides;

5. The method of manufacturing of claim 4, further comprising: and coating a first conductive layer on the connecting area, wherein the thickness of the first conductive layer is the same as that of the dielectric covering layer.

6. The method of manufacturing of claim 4, further comprising:

7. A method for manufacturing a high-current fuse with a high-heat-conduction substrate is characterized by comprising the following steps:

connecting a tin metal layer on the conducting area in the through hole; and

8. The method of manufacturing of claim 7, further comprising: