CN213601828U - Protective element - Google Patents

Abstract

The utility model provides a protective element, which comprises a body, an inner connecting layer, an outer connecting layer, a heat-generating layer and a low-melting-point alloy layer; the body is made of a single electric insulation material, the inner connecting layer and the outer connecting layer are respectively formed on two opposite lower surfaces and upper surfaces of the body, and the low-melting-point alloy layer is formed on the upper surface of the body and is electrically connected with the inner connecting layer; the heating layer is embedded in the body and is electrically connected with the low-melting-point alloy layer through the internal connecting layer; the outer connecting layer is electrically connected with the low-melting-point alloy layer and the heating layer; when the external connecting layer of the protection element is welded on the power circuit and the power circuit has overcurrent, the heating layer can generate heat and conduct the heat to the upper low-melting-point alloy layer through the body, so as to accelerate the fusing of the low-melting-point alloy layer and interrupt the overcurrent power circuit.

Description

Protective element

Technical Field

The present invention relates to a protection device, and more particularly to a protection device with a low melting point alloy layer.

Background

The charging circuit is usually provided with a protection element, so that when the charging circuit generates an abnormal condition such as overcurrent or overvoltage, the protection element can cut off the charging loop of the charging circuit to protect the charging circuit.

A protection device as shown in the utility model of chinese publication No. CN103988277B, "protection device, method for manufacturing protection device, and battery module with protection device" is provided, which comprises a concave portion formed on a substrate for accommodating a heating element, and a second substrate or printed insulating member covering the concave portion; forming a heating element electrode, two electrodes and a connecting terminal on the second substrate, and arranging a low melting point alloy on the heating element electrode and the two electrodes; wherein the heating element electrode passes through the second substrate through the through hole to be electrically connected with the heating element, and the heating element electrode is electrically connected with the connecting terminal. When the protection element is welded on the charging circuit and the charging circuit generates overcurrent, larger current flows through the low-melting-point alloy through the two electrodes and also flows through the heating body through the through hole and the connecting terminal, so that the heating body accelerates the fusing of the low-melting-point alloy, the two electrodes are broken, the charging circuit of the charging circuit is cut off, and the charging circuit is protected.

However, the manufacturing process of the protection element disclosed in the above-mentioned chinese utility model is complicated, and particularly, a concave portion is formed in advance on the substrate in order to install the heating element, and then the second substrate or the insulating member is covered; therefore, further improvements are needed.

SUMMERY OF THE UTILITY MODEL

In view of the complicated manufacturing process of the protection device, the present invention is directed to a protection device to solve the above-mentioned problems of the prior art.

In order to achieve the above object, the present invention provides a protection element, comprising: a body made of a single electrically insulating material and including a first surface and a second surface; an inner connection layer formed on the first surface of the body; a low-melting-point alloy layer formed on the first surface of the body and electrically connected with the interconnection layer; a heat-generating layer embedded in the body and coated by the body made of a single electric insulation material, and electrically connected with the low-melting-point alloy layer; and an outer connection layer formed on the second surface of the body and electrically connected with the low-melting-point alloy layer and the heating layer.

In the above protection element, the outer connection layer includes a first electrode, a second electrode and a first heating electrode, wherein the first electrode and the second electrode are respectively formed on two opposite sides of the second surface, and the first heating electrode is formed on the other side of the second surface; the inner connecting layer comprises a third electrode, a fourth electrode and a second heating electrode, wherein the second heating electrode is positioned between the third electrode and the fourth electrode, the third electrode is connected with the first electrode through at least one first conductive through hole, the fourth electrode is connected with the second electrode through at least one second conductive through hole, and the second heating electrode is connected with the heating layer through a first conductive hole; and the heating layer is connected to the first heating electrode through a second conductive hole.

In the above protection element, the first surface of the body further forms a heat conducting electrode corresponding to the first heat generating electrode, and is electrically connected to the heat generating layer through a third conductive hole.

In the above protection element, the second conductive via and the third conductive via are integrally connected.

In the above protection device, the material of the heating layer is a resistor paste.

In the above-mentioned protection element, the material of the body is a low temperature co-fired ceramic material.

In the above protection element, the first electrode, the second electrode, the third electrode, the fourth electrode, the first heat generating electrode, the second heat generating electrode and the heat conducting electrode are made of a metal compatible with a low temperature co-fired ceramic process.

In the above-mentioned protection element, the material of the low melting point alloy layer is a first alloy or a second alloy, wherein: the first alloy is composed of tin, lead, bismuth, copper and silver; and the second alloy is composed of tin, bismuth, copper and silver.

The protection element further includes an upper cover covering the first surface of the body.

The protection element further comprises at least one heat dissipation layer embedded in the body at intervals and covered by the body made of a single electric insulation material, and is located between the heating layer and the outer connecting layer so as to be electrically connected with the inner connecting layer, the heating layer and the outer connecting layer.

The utility model has the advantages that the heating layer is embedded in the body, no additional concave part or insulating layer is needed to be formed, the processing steps of the prior art are effectively reduced, and the processing time is shortened; and when the heating layer generates heat, the heat can be accumulated in the protective element to fuse the low melting point alloy layer.

The present invention will be described in detail with reference to the accompanying drawings and specific embodiments, but the present invention is not limited thereto.

Drawings

FIG. 1A: a perspective view of a first embodiment of the protective element of the present invention.

FIG. 1B: the cross-sectional view of the A-A section line of FIG. 1A.

FIG. 1C: the cross-sectional view of the B-B section line of FIG. 1A.

FIG. 1D: a cross-sectional view of a second embodiment of the protective element of the present invention.

FIG. 2A: the utility model discloses a three-dimensional exploded view of a step in the manufacturing method of protection component.

FIG. 2B: fig. 2A is a top plan view of the second element region.

FIG. 2C: fig. 2A is a top plan view of the third element region.

FIG. 2D: fig. 2A is an overhead plan view of the first element region.

FIG. 3A: the utility model discloses a perspective view of another step in the manufacturing method of protection component.

FIG. 3B: the sectional exploded view of the A-A section line of FIG. 3A.

FIG. 3C: FIG. 3A is a cross-sectional exploded view of an A-A section line in another embodiment.

FIG. 4A: the utility model discloses a perspective view of another step in the manufacturing method of protection component.

FIG. 4B: fig. 4A is a top plan view of the second element area.

FIG. 5: the present invention provides an operation diagram of another step in the manufacturing method of the protection device.

Reference numerals

1. 1a protective element 10 body

10' a body 11 with a first surface

110 inner connection layer 111 third electrode

112, a fourth electrode 113, a second heating electrode

113a, end 114, thermally conductive electrode

12 second surface 120 outer tie layer

120', a heat dissipation layer 121, a first electrode

121', a first heat sink 122, a second electrode

122', a second heat sink 123, a first heat-generating electrode

123', a third heat sink 13, a heat generating layer

131 heating element 131a terminal

132 first body electrode 133 second body electrode

14a first conductive through hole 14a first through hole

14 a' sixth through hole

14b a second through hole 14c a fourth through hole

15 second conductive through hole 15a first through hole

15 a' sixth through hole

15b a second through hole 15c a fourth through hole

16 a first conductive hole 16b and a third through hole

16c a fifth through hole 17a second conductive hole

17a first through hole 17c a fourth through hole

17 a' sixth through hole

18 a third conductive via 18b a second via

191 sidewall recesses 191a first sidewall recesses

191b, a second sidewall recess 191c, a third sidewall recess

192 sidewall recess 192a first sidewall recess

192b, second sidewall recess 192c, third sidewall recess

193 sidewall recess 193a first sidewall recess

193b second sidewall recess 193c third sidewall recess

20 low melting point alloy layer 30 first substrate

30' fourth substrate 31 the first surface

311 first element region 32 second surface

40 second substrate 41 third surface

411 second component area 42 fourth surface

50 third substrate 51 fifth surface

52 sixth surface 511 third element region

60, an upper cover

Detailed Description

The following describes the structural and operational principles of the present invention in detail with reference to the accompanying drawings:

referring to fig. 1A, fig. 1B and fig. 1C, a protection device 1 according to a first embodiment of the present invention includes a main body 10, an inner connection layer 110, an outer connection layer 120, a heat-generating layer 13 and a low-melting-point alloy layer 20.

The main body 10 further includes a first surface 11 and a second surface 12, a plurality of first conductive vias 14, a plurality of second conductive vias 15, a first conductive via 16, a second conductive via 17, and a third conductive via 18; in this embodiment, the first conductive vias 14 and the second conductive vias 15 penetrate through the body 10 and are exposed on the first surface 11 and the second surface 12, the first conductive via 16 and the third conductive via 18 are exposed on the first surface 11 and have a depth shallower than the first conductive vias 14 and the second conductive vias 15, the second conductive via 17 is exposed on the second surface 12 and has a depth shallower than the first conductive vias 14 and the second conductive vias 15, and the second conductive via 17 is aligned with and integrally connected to the third conductive via 18; in this embodiment, the material of the body 10 is a single electrically insulating material; preferably, the body 10 is made of a low temperature co-fired ceramic material and has a rectangular shape including two opposite long sides and two opposite short sides.

The inner connection layer 110 is formed on the first surface 11; in the present embodiment, referring to fig. 1A, fig. 1B and fig. 2B, the interconnection layer 110 includes a third electrode 111, a fourth electrode 112, a second heating electrode 113 and a heat conducting electrode 114; in this embodiment, the third electrode 111 is electrically connected to the first conductive vias 14, the fourth electrode 112 is electrically connected to the second conductive vias 15 and respectively formed on two opposite long sides of the first surface 11, the second heat generating electrode 113 is electrically connected to the first conductive via 16, the heat conducting electrode 114 is electrically connected to the third conductive via 18 and respectively formed on two opposite short sides of the first surface 11, and the second heat generating electrode 113 further extends to a position between the third electrode 111 and the fourth electrode 112; in this embodiment, the material of the third electrode 111, the material of the fourth electrode 112, the material of the second heating electrode 113, and the material of the heat conducting electrode 114 are metals compatible with the low temperature co-fired ceramic process.

The external connection layer 120 is formed on the second surface 12; in the present embodiment, please refer to fig. 1A, fig. 1B and fig. 2D, the outer connection layer 120 includes a first electrode 121, a second electrode 122 and a first heating electrode 123; the first electrode 121 corresponds to the third electrode 111 and is electrically connected to the third electrode 111 through the first conductive via 14, the second electrode 122 corresponds to the fourth electrode 112 and is electrically connected to the fourth electrode 112 through the second conductive via 15, and the first electrode 121 and the second electrode 122 are respectively formed on two opposite long sides of the second surface 12; as shown in fig. 1C, the first heating electrode 123 is formed on a short side of the second surface 12 to correspond to the heat conducting electrode 114, and is electrically connected to the heat conducting electrode 114 through the second and third conductive vias 17 and 18; in this embodiment, the first electrode 121, the second electrode 122 and the first heating electrode 123 are surface-mounted pads of the protection device 1, and are used for being soldered to a charging circuit; in this embodiment, the material of the first electrode 121, the material of the second electrode 122, and the material of the first heating electrode 123 are metals compatible with the low temperature co-fired ceramic process.

The heating layer 13 is embedded in the main body 10, and one end of the heating layer is electrically connected to the first conductive via 16, and the other end is electrically connected to the second conductive via 17 and the third conductive via 18; in the present embodiment, as shown in fig. 1C and fig. 2C, the heat generating layer 13 is composed of a heat generator 131, a first bulk electrode 132 and a second bulk electrode 133; in this embodiment, the first bulk electrode 132 corresponds to the first heating electrode 123 and is electrically connected to the first heating electrode 123 through the second conductive via 17, the second bulk electrode 133 corresponds to the second heating electrode 113 and is electrically connected to the second heating electrode 113 through the first conductive via 16, the heating element 131 is formed between the first bulk electrode 132 and the second bulk electrode 133 and is electrically connected to the first bulk electrode 132 and the second bulk electrode 133, and one end 131a of the heating element 131 is flush with one end 113a of the second heating electrode 113; in this embodiment, the heating element 131 is made of a resistor paste, and the first bulk electrode 132 and the second bulk electrode 133 are made of a metal compatible with a low temperature co-fired ceramic process.

As shown in fig. 1A, fig. 1B and fig. 4B, the low melting point alloy layer 20 is stacked and electrically connected to the third electrode 111, the fourth electrode 112 and the second heat generating electrode 113 on the first surface 11 of the body 10, so that the low melting point alloy layer 20 can be electrically connected to the first electrode 121 through the third electrode 111, and the fourth electrode 112 is electrically connected to the second electrode 122; preferably, the low melting point alloy layer 20 is welded to the third electrode 111, the fourth electrode 112 and the second heat generating electrode 113, but the electrical connection method is not limited thereto; preferably, the material of the low melting point alloy layer 20 is a first alloy or a second alloy, wherein the first alloy is composed of sn, pb, bi, cu and ag, and the second alloy is composed of sn, bi, cu and ag, but not limited thereto.

As can be seen from the above description, when the protection device 1 is applied, the first electrode 121, the second electrode 122 and the first heating electrode 123 are adhered and welded to the charging circuit, when an overcurrent occurs in the charging circuit, a current can flow through the first electrode 121, the first conductive via 14, the third electrode 111, the low-melting-point alloy layer 20, the fourth electrode 112, the second conductive via 15 and the second electrode 122, so as to raise the temperature of the low-melting-point alloy layer 20; in addition, the current also passes through the second heating electrode 113, the first conductive via 16, the heating layer 13, the second conductive via 17 and the first heating electrode 123 from the low melting point alloy layer 20 at the same time, so that the temperature of the heating layer 13 is increased, and heat is accumulated in the main body 10 of the protection device 1, thereby fusing the low melting point alloy layer 20 more rapidly than a common low melting point alloy fused by self-heating.

Referring to fig. 1D, a second embodiment of the protection device 1a of the present invention is substantially the same as the first embodiment, but further includes a heat dissipation layer 120 ', the heat dissipation layer 120' is embedded in the body 10 at intervals, and is covered by the body 10 made of an electrically insulating material, and is located between the heat generation layer 13 and the outer connection layer 120; in the present embodiment, the heat dissipation layer 120' is electrically connected to the inner connection layer 110, the outer connection layer 120 and the heat generating layer 13; the heat dissipation layer 120 'is the same as the outer connection layer 120, and includes a first heat sink 121' corresponding to the first electrode 121, a second heat sink 122 'corresponding to the second electrode 122, and a third heat sink 123' corresponding to the first heat-generating electrode 123; wherein the first conductive via 14 passes through the first heat sink 121 ', the second conductive via 15 passes through the second heat sink 122 ', and the second conductive via 17 also passes through the third heat sink 123 '; therefore, the heat dissipation layer 120' is electrically connected to the interconnection layer 110, the external connection layer 120 and the heat generation layer 13 through the first via 14, the second via 15 and the second and third vias 17 and 18. In addition, a plurality of heat dissipation layers 120' may be stacked at intervals according to the heat dissipation requirement, not limited to one layer.

The above is a structural description of the protection device of the present invention, and the following further describes a detailed manufacturing method for completing the protection device.

Referring to fig. 2A, fig. 3B, fig. 3C, fig. 4A and fig. 5, a first embodiment of a method for manufacturing a protection device according to the present invention includes the following steps (a) to (f).

In step (a), a first substrate 30 and a second substrate 40 are provided, but not limited thereto; in the present embodiment, as shown in fig. 2A, the material of the first substrate 30 and the material of the second substrate 40 are a low temperature co-fired ceramic material; the first surface 31 of the first substrate 30 includes a plurality of first device regions 311, and the third surface 41 of the second substrate 40 includes a plurality of second device regions 411; each of the first device regions 311 corresponds to each of the second device regions 411; in the present embodiment, as shown in fig. 2D, a plurality of first through holes 14a, 15a and 17a and a plurality of first sidewall recesses 191a, 192a and 193a are formed in the first device regions 311 of the first substrate 30; as shown in fig. 2B, a plurality of second through holes 14B, 15B and 18B, a third through hole 16B and a plurality of second sidewall recesses 191B, 192B and 193B are formed in the second device region 411 of the second substrate 40, and a conductive material is filled in the first through hole 14a, the first sidewall recess 191a, the first through hole 15a, the first sidewall recess 192a, the first through hole 17a, the first sidewall recess 193a, the second through hole 14B, the second sidewall recess 191B, the second through hole 15B, the first sidewall recess 192B, the second through hole 18B, the second sidewall recess 193B and the third sidewall recess 16B; in this embodiment, the conductive material is a metal compatible with the low temperature co-fired ceramic process; preferably, the first through holes 14a, 15a, 17a, the second through holes 14b, 15b, 18b and the third through hole 16b are formed by laser punching, and after the boundary between the adjacent first device region 311 and the adjacent second device region 411 is formed by laser punching, the first sidewall recesses 191a, 192a, 193a are formed in each first device region 311, and the second sidewall recesses 191b, 192b, 193b are formed in each second device region 411, but not limited thereto.

In step (b), as shown in fig. 2A to 2D, an outer connection layer 120 is formed on the first component regions 311 of the first surface 31 of the first substrate 30, an inner connection layer 110 is formed on the second component regions 411 of the third surface 41 of the second substrate 40, a plurality of heat generating layers 13 are formed between the first substrate 30 and the second substrate 40, and each heat generating layer 13 corresponds to the first component region 311 and the second component region 411; in the present embodiment, as shown in fig. 2D, a first electrode 121, a second electrode 122 and a first heat-generating electrode 123 are formed on each of the first device areas 311 of the first surface 31 of the first substrate 30 to form the external connection layer 120, wherein the first electrode 121 and the second electrode 122 are respectively located on two opposite long sides of the first device area 311, and the first heat-generating electrode 123 is disposed on one short side of the first device area 311; meanwhile, the first via 14a and the first sidewall recess 191a correspond to the first electrode 121, the first via 15a and the first sidewall recess 192a correspond to the second electrode 122, and the first via 17a and the first sidewall recess 193a correspond to the first heating electrode 123; preferably, the first electrode 121, the second electrode 122 and the first heat-generating electrode 123 are formed by printing.

In the present embodiment, as shown in fig. 2A and 2B, a third electrode 111, a fourth electrode 112, a second heat generating electrode 113 and a heat conducting electrode 114, as shown in fig. 2B, are formed on each of the second element regions 411 on the third surface 41 of the second substrate 40 to form the interconnection layer 110, wherein the third electrode 111 corresponds to the first electrode 121, and the fourth electrode 112 corresponds to the second electrode 122 and is respectively formed on two opposite sides of the second element region 411; the heat conducting electrode 114 corresponds to the first heating electrode 123 and is formed on the other two opposite short sides of the second element area 411 with the second heating electrode 113; meanwhile, the second through hole 14b and the second sidewall recess 191b correspond to the third electrode 111, the second through hole 15b and the first sidewall recess 192b correspond to the fourth electrode 112, the second through hole 18b and the second sidewall recess 193b correspond to the heat conductive electrode 114 and the first heating electrode 123 of the first device region 311, and the third through hole 16b corresponds to the second heating electrode 113; preferably, the third electrode 111, the fourth electrode 112, the second heat generating electrode 113 and the heat conducting electrode 114 are formed by printing.

In step (c), as shown in fig. 2A to 2D, 3A and 3B, the fourth surface 42 of the second substrate 40 is stacked on the second surface 32 of the first substrate 30, such that the first through holes 14a, 15a and 17a of each first device region 311 correspond to the second through holes 14B, 15B and 18B of the second device regions 411, the third through holes 16B of the second device regions 411 correspond to the heat generating layer 13, and the first sidewall recesses 191a, 192A and 193A of each first device region 311 correspond to the second sidewall recesses 191B, 192B and 193B of the second device regions 411, respectively; in addition, the second substrate 40 is cut downward from the third surface 41 of the second substrate 40 to a depth d1, which is d1 less than the thickness of the second substrate 40, in alignment with the boundaries of the second element regions 411 of the second substrate 40.

In step (d), as shown in fig. 4A, the first substrate 30 and the second substrate 40 are sintered to form a body 10 ' made of a single electrically insulating material, and the heat generating layers 13 are embedded in the body 10 ' and are covered by the body 10 '; in the present embodiment, referring to fig. 1A and fig. 2B to fig. 2D, the first through holes 14a and the second through holes 14B form a plurality of first conductive through holes 14 integrally connected to electrically connect the first electrode 121 and the third electrode 111, the first through holes 15a and the second through holes 15B form a plurality of second conductive through holes 15 integrally connected to electrically connect the second electrode 122 and the fourth electrode 112, the first through holes 17a, the second through holes 18B and the conductive material filled therein respectively form a second conductive hole 17 and a third conductive hole 18, as shown in fig. 1C, the second conductive hole 17 is electrically connected to the first heating electrode 123 and the first body electrode 132 of the heating layer 13, the third conductive hole 18 is electrically connected to the first body electrode 132 of the heating layer 13 and the conductive electrode 114, the third through holes 16B and the conductive material filled therein form the first conductive hole 16, a second body electrode 133 electrically connected to the heat generating layer 13; the first sidewall recesses 191a, 192a, 193a and the second sidewall recesses 191b, 192b, 193b form a plurality of sidewall recesses 191, 192, 193, respectively; preferably, the first electrodes 121, the second electrodes 122, the third electrodes 111, the fourth electrodes 112, the first heating electrodes 123, the second heating electrodes 113, the heat conductive electrodes 114, and the sidewall recesses 191, 192, and 193 may be further electroplated, wherein the metal material for electroplating is tin or gold; the sidewall recesses 191 are electrically connected to the first electrode 121 and the third electrode 111, the sidewall recesses 192 are electrically connected to the second electrode 122 and the fourth electrode 112, and the sidewall recesses 193 are electrically connected to the first heat-generating electrode 123 and the heat-conducting electrode 114.

In step (e), as shown in fig. 4A, a plurality of low melting point alloy layers 20 are respectively stacked on the inner connection layer 110 corresponding to the second device region 411, and as shown in fig. 1A, each low melting point alloy layer 20 and the corresponding heat generating layer 13 are electrically connected to the corresponding outer connection layer 120; in the present embodiment, the low melting point alloy layers 20 are directly electrically connected to the third electrode 111, the fourth electrode 112 and the second heat generating electrode 113 of the interconnect layer 110 as shown in fig. 4B; preferably, the low melting point alloy layer 20 is welded to the third electrode 111, the fourth electrode 112 and the second heat generating electrode 113, but not limited thereto.

In step (f), as shown in fig. 1A, 4A and 5, cutting along the boundary of the adjacent second device region 411 to form a plurality of protection devices 1; in the present embodiment, a plurality of caps 60 are respectively covered on the second device regions 411 to form the protection device as shown in fig. 1A. Preferably, since the second substrate 40 has been precut in the step (c), a plurality of protection elements 1 may be formed by applying force to the precut grooves with double rollers.

Referring to fig. 3C, a second embodiment of the method for manufacturing a protection device of the present invention substantially includes steps (a) to (f) as the first embodiment, but the embodiment further provides a fourth substrate 30 ' in step (a), the fourth substrate 30 ' may be the same as the first substrate 30, a seventh surface of the fourth substrate 30 ' includes a plurality of fourth device regions, and the fourth device regions correspond to the first device region 311 and the second device region 411; in this embodiment, a plurality of sixth through holes 14a ', 15 a', 17a 'corresponding to the first through holes 14a, 15a, 17a of the first device region 311 and a plurality of first sidewall recesses (not shown) are formed in the fourth device regions, and the sixth through holes 14 a', 15a ', 17 a' are filled with conductive material; in another embodiment, the fourth element region is formed on an eighth surface of the fourth substrate 30'.

In step (b) of this embodiment, a heat dissipation layer 120' corresponding to the outer connection layer 120 is formed in each fourth element region; in the present embodiment, as shown in fig. 3C, a first heat sink 121 'corresponding to the first electrode 121, a second heat sink 122' corresponding to the second electrode 122, and a third heat sink 123 'corresponding to the first heat-generating electrode 123 are formed in each fourth component region, and the fourth substrate 30' is disposed between the first substrate 30 and the heat-generating layers 13.

In step (C) of this embodiment, as shown in fig. 3C, the fourth substrate 30 ' is stacked between the second surface 32 of the first substrate 30 and the heat generating layer 13, so that the sixth through holes 14a ', 15a ', and 17a ' of the heat dissipating layer 120 ' respectively correspond to the first through holes 14a, 15a, and 17a of the first device region 311 and the second through holes 14b, 15b, and 18b of the second device region 411.

In the step (d) of the present embodiment, the sixth through holes 14a ', the corresponding first through holes 14a and the corresponding second through holes 14b form the first conductive through holes 14 penetrating the body 10 ', the sixth through holes 15a ', the corresponding first through holes 15a and the corresponding second through holes 15b form the second conductive through holes 15 penetrating the body 10 ', and the sixth through holes 17a ', the corresponding first through holes 17a and the corresponding second through holes 18b form the second conductive holes 17 and the third conductive holes 18.

In step (e) of the present embodiment, each of the heat dissipation layers 120' is electrically connected to the inner connection layer 110, the heat generation layer 13 and the outer connection layer 120 through the first conductive vias 14, the second conductive vias 15, the second conductive vias 17 and the third conductive vias 18.

In addition, a plurality of fourth substrates 30' may be stacked between the first substrate 30 and the heat generating layer 13 according to the heat dissipation requirement, not limited to one.

The above is a description of the method for manufacturing the protection device of the present invention, and the following is a detailed description of the method for manufacturing the heat generating layer 13 in the protection device.

In the first embodiment of the method for manufacturing the protection device of the present invention, the method for manufacturing the heat generating layer 13 is that in the step (b), a plurality of heat generating layers 13 are formed on the second surface 32 of the first substrate 30, and the heat generating layers 13 correspond to the first device region 311 and the second device region 411; in this embodiment, the heat generating layer 13 is formed with a heat generating body 131, a first body electrode 132 and a second body electrode 133 on the second surface 32 as shown in fig. 2C, the first body electrode 132 is disposed corresponding to the first heat generating electrode 123 of the first device region 311 and the heat conducting electrode 114 of the second device region 411, the second body electrode 133 is disposed corresponding to the second heat generating electrode 113 of the second device region 411, but not limited thereto; in the second embodiment of the method for manufacturing the protection device of the present invention, the heat generating layer 13 is the same as the first embodiment of the method for manufacturing the protection device of the present invention, but the heat generating layer 13 is formed on the fourth surface 42 of the second substrate 40; in this embodiment, the heating element 131 is made of a resistor paste, and the first bulk electrode 132 and the second bulk electrode 133 are made of a metal compatible with a low temperature co-fired ceramic process; preferably, the heating element 131, the first bulk electrode 132 and the second bulk electrode 133 are formed by printing.

In a third embodiment of the method for manufacturing a protection device of the present invention, as shown in fig. 2A, the method for manufacturing the heat-generating layer 13 further provides a third substrate 50 in the step (a), wherein the fifth surface 51 includes a plurality of third device areas 511, the third device areas 511 correspond to the first device area 311 and the second device area 411, a plurality of fourth through holes 14c, 15c, 17c, a fifth through hole 16c and a plurality of third sidewall recesses 191c, 192c, 193c are formed in each of the third device areas 511, and the fourth through holes 14c, 15c, 17c and the fifth through hole 16c are filled with a conductive material; in the step (b), the third substrate 50 is disposed between the first substrate 30 and the second substrate 40, a plurality of heat-generating layers 13 are respectively formed in the third device regions 511, the forming method of the heat-generating layers 13 is the same as the first embodiment of the method for manufacturing a protection device of the present invention, but the fourth through holes 17c correspond to the first body electrode 132, and the fifth through hole 16c corresponds to the second body electrode 133; in the step (c), the third substrate 50 is stacked between the first substrate 30 and the second substrate 40, wherein the fourth through holes 14c, 15c, 17c of each third device region 511 correspond to the first through holes 14a, 15a, 17a and the second through holes 14b, 15b, 18b, respectively, the fifth through hole 16c corresponds to the third through hole 16b, and the third sidewall recesses 191c, 192c, 193c correspond to the first sidewall recesses 191a, 192a, 193a and the second sidewall recesses 191b, 192b, 193b, respectively; in the step (d), the fourth through holes 14c, the first through holes 14a and the second through holes 14b form the first conductive through holes 14, and electrically connect the first electrode 121 and the third electrode 111, the fourth through holes 15c, the first through holes 15a and the second through holes 15b form the second conductive through holes 15, and electrically connect the second electrode 122 and the fourth electrode 112, the fourth through holes 17c, the first through holes 17a and the second through holes 18b form the second conductive hole 17 and the third conductive hole 18, and electrically connect the first heating electrode 123, the heating layer 13 and the heat conductive electrode 114, the fifth through holes 16c and the third through holes 16b form the first conductive hole 16, and electrically connect the second body electrode 133; in the fourth embodiment of the method for manufacturing a protection device of the present invention, the method for manufacturing the heat generating layer 13 is substantially the same as the third embodiment of the method for manufacturing a protection device of the present invention, but the sixth surface 52 of the third substrate 50 includes a plurality of third device regions 511; in this embodiment, the material of the third substrate 50 is a low temperature co-fired ceramic material.

As can be seen from the above description, the method for manufacturing a protection device of the present invention forms a plurality of outer connection layers 120 on the first substrate 30, forms a plurality of inner connection layers 110 on the second substrate 40, and forms a plurality of heat generating layers 13 between the first substrate 30 and the second substrate 40, so as to shorten the manufacturing time, and effectively solve the problem of complicated manufacturing process in the prior art without forming additional concave portions.

In summary, the protection component of the present invention embeds the heating layer in the body of the protection component, and no additional concave portion or insulating layer is required, thereby effectively reducing the process steps of the prior art and shortening the process time; when the heating layer generates heat, the heat can be accumulated in the protective element to fuse the low melting point alloy layer; just the utility model discloses the manufacturing method of the component of protection can form a plurality of outer articulamentum in this first base plate simultaneously, forms a plurality of interior articulamentum in this second base plate, forms a plurality of layers that generate heat between this first base plate and this second base plate, shortens the processing procedure time, and need not additionally form the concave part, effectively solves the numerous problem of the manufacturing process among the prior art.

Naturally, the present invention can be embodied in many other forms without departing from the spirit or essential attributes thereof, and it should be understood that various changes and modifications can be made by one skilled in the art without departing from the spirit or essential attributes thereof, and it is intended that all such changes and modifications be considered as within the scope of the appended claims.

Claims (9)

1. A protective element, comprising:

a body made of a single electrically insulating material and including a first surface and a second surface;

an inner connection layer formed on the first surface of the body;

a low-melting-point alloy layer formed on the first surface of the body and electrically connected with the interconnection layer;

a heat-generating layer embedded in the body and wrapped by the body made of a single electric insulation material, and electrically connected with the low-melting-point alloy layer; and

an outer connection layer formed on the second surface of the body and electrically connected with the low melting point alloy layer and the heating layer.

2. The protective element of claim 1, wherein:

the outer connecting layer comprises a first electrode, a second electrode and a first heating electrode, wherein the first electrode and the second electrode are respectively formed on two opposite sides of the second surface, and the first heating electrode is formed on the other side of the second surface;

the inner connecting layer comprises a third electrode, a fourth electrode and a second heating electrode, wherein the second heating electrode is positioned between the third electrode and the fourth electrode, the third electrode is connected with the first electrode through at least one first conductive through hole, the fourth electrode is connected with the second electrode through at least one second conductive through hole, and the second heating electrode is connected with the heating layer through a first conductive hole; and

the heating layer is connected to the first heating electrode through a second conductive hole.

3. The protection device as claimed in claim 2, wherein the first surface of the body further forms a heat conductive electrode corresponding to the first heat generating electrode and is electrically connected to the heat generating layer through a third conductive hole.

4. The protection device of claim 3, wherein said second conductive via is integrally connected to said third conductive via.

5. The protection device according to any one of claims 1 to 4, wherein the material of the heat generating layer is a resistive paste.

6. The protective element according to any one of claims 1 to 4, wherein the material of the body is a low temperature co-fired ceramic material.

7. The protection device as claimed in claim 3, wherein the first electrode, the second electrode, the third electrode, the fourth electrode, the first heat generating electrode, the second heat generating electrode and the heat conducting electrode are made of metal compatible with low temperature co-fired ceramic process.

8. The protection device according to any one of claims 1 to 4, further comprising a top cover covering the first surface of the body.

9. The protection device as claimed in any one of claims 1 to 4, further comprising at least one heat dissipation layer embedded at intervals in the body and covered by the body of a single electrically insulating material, and located between the heat generating layer and the outer connection layer to be electrically connected to the inner connection layer, the heat generating layer and the outer connection layer.

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