CN108231506B - Small fuse and manufacturing method thereof - Google Patents
Small fuse and manufacturing method thereof Download PDFInfo
- Publication number
- CN108231506B CN108231506B CN201710005339.4A CN201710005339A CN108231506B CN 108231506 B CN108231506 B CN 108231506B CN 201710005339 A CN201710005339 A CN 201710005339A CN 108231506 B CN108231506 B CN 108231506B
- Authority
- CN
- China
- Prior art keywords
- bottom layer
- unit body
- fuse
- protective cover
- fusible
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
- H01H85/02—Details
- H01H85/04—Fuses, i.e. expendable parts of the protective device, e.g. cartridges
- H01H85/041—Fuses, i.e. expendable parts of the protective device, e.g. cartridges characterised by the type
- H01H85/0411—Miniature fuses
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
- H01H85/02—Details
- H01H85/22—Intermediate or auxiliary parts for carrying, holding, or retaining fuse, co-operating with base or fixed holder, and removable therefrom for renewing the fuse
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H69/00—Apparatus or processes for the manufacture of emergency protective devices
- H01H69/02—Manufacture of fuses
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
- H01H85/02—Details
- H01H85/04—Fuses, i.e. expendable parts of the protective device, e.g. cartridges
- H01H85/041—Fuses, i.e. expendable parts of the protective device, e.g. cartridges characterised by the type
- H01H85/0411—Miniature fuses
- H01H2085/0414—Surface mounted fuses
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H2229/00—Manufacturing
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Fuses (AREA)
Abstract
The present invention relates to a small fuse which has excellent fuse characteristics, can be efficiently and economically manufactured in large quantities without any defects, and can ensure high insulation even after being fused, thereby preventing damage to an installation device, and a method for manufacturing the same. According to the present invention, there is provided a small fuse comprising: a fuse member in which a fusible material of a conductive material is formed on one surface of a base layer; a protective cover for receiving and fixing the fuse component; and a pair of pad members, one end of each of which is in contact with the fusible body of the fuse member and the other end of each of which is exposed to the outside of the protective cover.
Description
Technical Field
The present invention relates to a small fuse and a method for manufacturing the same, and more particularly, to a small fuse which has excellent fusing characteristics, can be efficiently and economically manufactured in large quantities without any defects, and can secure high insulation even after fusing, thereby preventing damage to an installation device, and a method for manufacturing the same.
Background
Generally, electronic products using electricity always have a possibility of accidents due to overcurrent and overheat, and in order to prevent this, fuses made of a material that melts by heat when reaching a predetermined temperature are used.
The fuse is an overcurrent protection device for preventing such an accident, and when an overcurrent equal to or higher than a rated current is supplied to a device, the fuse interrupts power supply. When a fuse is arranged between a power supply source and a component of a device and an overcurrent is abnormally supplied, the fuse is disconnected, thereby preventing the component of the device, an internal circuit, and the like from being damaged.
In other words, the fuse has a fusible body with a low melting point, and functions to protect electronic components and circuits by breaking the circuit by fusing the fusible body when an overcurrent flows.
In a case where an inrush current due to lightning is caused to flow through a communication device in contact with a telephone line or the like or the telephone line is in contact with an electric wire, a current much higher than usual may be applied to the communication device. Therefore, a fuse for communication equipment needs to have a high blocking capability characteristic of safely blocking a current that causes a failure of the communication equipment and a strong Time Lag (Time Lag) characteristic of not being blown by a rush current due to lightning down.
With the recent trend toward miniaturization of devices, small fuses are also required to have such high blocking capability characteristics and strong delay characteristics.
As shown in fig. 1, a general small fuse includes: a base 1 having a pair of fastening holes 1 a; a pair of lead wires 2 provided on the base 1 so as to penetrate the fastening holes 1 a; a fuse device 3 connecting and contacting end portions of the respective lead wires 2 on the upper side of the base 1; and a case 4 combined with the base 1 in such a manner as to cover the fuse device 3 engaged between the lead wires 2.
After the fusible body is wound around the support body 5 made of ordinary glass fiber, the fuse element 3 is inserted into a ring-shaped fixing portion 2a formed at the upper end of the lead wire 2 in a state of being cut by a predetermined length together with the support body 5, and then joined to the fixing portion 2a by a soldering operation.
However, in the conventional small fuse, when the fuse element 3 is joined, not only is the overall structure complicated by the use of the support 5, but also the soldering work of the fuse element 3 is difficult, which causes a problem of a decrease in productivity.
When soldering the fuse element 3 and the lead wire 2, a part of the melted solder 6 flows into the fuse element 3 along the support body 5, and there is a possibility that a short circuit may occur between the coils of the fuse element 3, and if this occurs, the overall length of the fuse element 3 is eventually shortened, and the inherent resistance is changed, which may result in a defective product.
Documents of the prior art
Patent document
Document 1: korean granted patent No. 10-0929822
Document 2: korean granted patent No. 10-1017119
Disclosure of Invention
Accordingly, the present invention has been made to solve the above-mentioned problems occurring in the prior art, and an object of the present invention is to provide a small fuse which has excellent fusing characteristics, can be efficiently and economically manufactured in large quantities without defects, and can ensure high insulation even after fusing, thereby preventing damage to the installed device, and a method for manufacturing the same.
According to an embodiment of the present invention, there is provided a small fuse including: a fuse member in which a fusible material of a conductive material is formed on one surface of a base layer; a protective cover for receiving and fixing the fuse component; and a pair of pad members, one end of each of which is in contact with the fusible body of the fuse member and the other end of each of which is exposed to the outside of the protective cover.
According to another embodiment of the present invention, there is provided a method of manufacturing a small fuse, the method including: a unit body bottom layer forming step of forming a unit body bottom layer on a plate-shaped large-area bottom layer; a pin fixing hole forming step of forming a pair of pin fixing holes in the bottom layer of the unit body through punching; a fusible body forming step of forming fusible bodies of conductive materials on the bottom layers of the unit bodies respectively; cutting the bottom layer of the unit body, wherein the bottom layer of the unit body with the meltable body is separated from the large-area bottom layer by cutting; a pin connection step of inserting a pin into a soldering land hole of the bottom layer of the cut unit body and connecting the pin by soldering; and a protective cover fixing step, wherein the bottom layer of the unit body connected with the pins is accommodated and fixed in the protective cover.
The small fuse and the method for manufacturing the same according to the present invention have the advantages of excellent fusing characteristics, being capable of efficiently and economically mass-producing the fuse without any defect, and ensuring high insulation even after fusing, thereby preventing damage to the installation device.
Drawings
Fig. 1 is a diagram showing a general small fuse.
Fig. 2 is a perspective view showing a small fuse of the present invention.
Fig. 3 is a sectional view showing a small fuse of the present invention.
Fig. 4 is a perspective view showing a fuse part and a pad part constituting the small fuse of the present invention.
Fig. 5 is a perspective view showing a protective cover constituting the small fuse of the present invention.
Parts (a) to (c) of fig. 6 are diagrams showing embodiments of fusible parts constituting the small fuse of the present invention.
Fig. 7 is a flowchart showing a method of manufacturing a small fuse of the present invention.
Fig. 8 is a diagram showing an example of a case where a cell body underlayer and a fusible body are formed on a large-area underlayer in the method for manufacturing a small fuse according to the present invention.
Detailed Description
Additional objects, features and advantages of the present invention will become more apparent in the light of the following detailed description and accompanying drawings.
While the present invention is susceptible to various modifications and alternative forms, specific embodiments thereof are shown by way of example in the drawings and will herein be described in detail with reference to the accompanying drawings.
Hereinafter, a small fuse and a method for manufacturing the same according to a preferred embodiment of the present invention will be described with reference to the accompanying drawings.
First, the small fuse of the present invention will be described in detail with reference to fig. 2 to 6. Fig. 2 is a perspective view showing a small fuse of the present invention, fig. 3 is a sectional view showing the small fuse of the present invention, and fig. 4 is a perspective view showing a fuse part and a pad part constituting the small fuse of the present invention. Fig. 5 is a perspective view showing a protective cover constituting the small fuse of the present invention, and parts (a) to (c) of fig. 6 are views showing embodiments of fusible bodies of fuse components constituting the small fuse of the present invention.
As shown in fig. 2 to 6, the compact fuse according to the present invention includes: a fuse component 100 in which a fusible body 120 made of a conductive material is formed on one surface of a base layer 110; a protective cover 200 for receiving and fixing the fuse component 100; and a pair of pad members 300, one end of each of which is in contact with the fusible element 120 of the fuse member 100 and the other end of each of which is exposed to the outside of the protective cover 200.
The base layer 110 of the fuse component 100 has a plate shape and can be formed of a material such as glass, ceramic, microcrystalline ceramic, epoxy glass, or an insulating film, but is not limited thereto, and any material may be used as long as it can form a substrate.
The fusible element 120 of the fuse member 100 may be formed of an electrically conductive material such as copper foil, silver paste (Ag paste), or silver alloy paste (alloy paste). The fusible body 120 includes a fusing part 121 connecting the soldering land part 122 and the soldering land part 122.
One end of a pad member 300 to be described later is inserted into a hole of the soldering pad 122, and soldering is performed with solder, and when an overcurrent flows in, the fuse 121 is fused to interrupt the current.
As shown in fig. 6 (a) to (c) as an example, the fuse 121 may be formed in a pattern having at least one of a different width, thickness, and length, and may be manufactured so that the magnitude of the rated fusing current flowing through the fuse 121 is different.
The fusible body 120 of the fuse component 100 may be formed by one of die cutting of a thin metal plate, chemical etching, printing of a metal paste, sputtering of a metal substance, or gold plating.
The protective cover 200 is formed such that the other surface than the one surface is airtight, that is, the other surface than the surface to which the fuse component 100 is joined is airtight, and after the fuse component 100 is assembled inside the protective cover 200, the one surface side is airtight sealed by the fuse component 100.
Specifically, the protective cover 200 has a stepped portion 210 formed on the inner surface thereof for engaging the edge of the upper surface of the base layer 110 of the fuse element 100, and a flange portion 220 provided on the edge of the open surface of the protective cover 200 so as to be inwardly bendable, and the flange portion 220 is bent toward the edge of the lower surface of the fuse element 100 and firmly sealed and fixed by thermal fusion bonding in a state where the fuse element 100 is disposed in the protective cover 200.
The space 101 formed between the protective cover 200 and the upper surface of the fuse component 100 is further provided with a cushioning filler 130. The buffering filler may be composed of silica powder or ceramic powder.
Further, a space between the fuse component 100 and the protective cover 200 and/or a space for absorbing fragments of the fusible body 120 when the fuse portion 121 of the fusible body 120 is fused by the filler can be secured, and the fusible body 120 and the like can be prevented from being scattered to the outside by preventing the protective cover 200 from being broken, damaged, and the like. With such spaces and/or fillers, a greater rated barrier capacity is possible, and the range of applications can be expanded.
One end portion of the pad member 300 is electrically connected to the soldering pad portion 122 by a soldering process, and the other end portion extends to the outside of the protective cover 200 to be connected to a device where a fuse is to be installed.
Next, the method for manufacturing the small fuse of the present invention will be described in detail with reference to fig. 7 and 8. Fig. 7 is a flowchart showing a method of manufacturing a small fuse according to the present invention, and fig. 8 is an exemplary diagram showing an example of a case where a cell body underlayer and a fusible body are formed on a large-area underlayer in the method of manufacturing a small fuse according to the present invention.
As shown in fig. 7, the method for manufacturing a small fuse according to the present invention includes: a unit body bottom layer forming step S100 of forming a unit body bottom layer on a plate-shaped large-area bottom layer; a pin fixing hole forming step S200 of forming a pair of pin fixing holes in the bottom layer of the unit body through punching; a fusible body forming step S300 of forming fusible bodies of conductive materials on the bottom layers of the unit bodies respectively; a unit body bottom layer cutting step S400, wherein the unit body bottom layer formed with the meltable body is separated from the large-area bottom layer respectively through cutting; a pin connection step S500 of inserting a pin into a soldering land hole of the bottom layer of the cut unit body and connecting the pin by soldering; and a protective cover fixing step S600, wherein the bottom layer of the unit body connected with the pins is accommodated and fixed in the protective cover.
The large-area underlayer prepared in the unit underlayer forming step S100 is made of a material such as glass, ceramic, microcrystalline ceramic, epoxy glass, or an insulating film, but is not limited thereto.
In the pin fixing hole forming step S200, holes for fixing one end portions of the pins (described later) are formed (see fig. 6).
Next, in the fusible member forming step S300, pad portions 122 that are brought into contact with one end portions of the leads by solder or the like are formed around the lead fixing holes, and fuse portions 121 for connecting the pad portions 122 are formed.
In the fusible body forming step S300, the fusible body may be formed by one of die cutting of a thin metal plate, chemical etching, printing of metal paste, sputtering of metal substance, or gold plating. As another example, the fusible body may be formed by printing an electrically conductive material such as silver paste (Ag paste) or silver alloy paste (Ag alloy paste). The fusing part 121 constitutes a circuit for passing a current, and when an overcurrent flows, the fusing part 121 is fused to interrupt the current.
In the fusible member forming step S300, the fusible member can be formed so that the magnitude of the rated current to be blown (hereinafter, referred to as "blowing rated current") differs depending on the row or column of the bottom layer of each cell. As described above, when the magnitude of the fusing rated current is different, the fusible part may be formed in a pattern having different lengths, line widths, thicknesses, and the like. Therefore, fuses with different fusing rated currents can be simultaneously and easily produced in large quantities by using a large-area bottom layer.
In the unit body bottom layer cutting step S400, the plurality of unit body bottom layers are separated from the large-area bottom layer by cutting, that is, the unit body bottom layer is separated from the large-area bottom layer shown in fig. 8, and in the pin connecting step S500, one end portion of the pad member 300 is inserted into the hole of the soldering pad part 122 and electrically connected by soldering (see fig. 4).
Next, in a protective cover fixing step S600 of fixing the unit body base layer to the protective cover, after the unit body base layer to which the leads are connected is housed in the protective cover having one open surface, the open surface portion of the protective cover is bent and thermally welded to the other surface edge of the unit body base layer (see fig. 2).
When the bottom layer of the unit body is accommodated in the protective cover, a locking part (or a step part) is formed on the inner side of the protective cover to lock the edge of the upper surface (one surface, i.e., the surface on which the meltable material is formed) of the bottom layer of the unit body in the locking part, so that a space is formed between the upper surface of the bottom layer of the unit body and the protective cover.
In this case, before the unit body bottom layer is housed and fixed in the protective cover, the protective cover may be filled with a buffer filler made of silica powder or ceramic powder and then the unit body bottom layer may be housed and fixed.
As described above, by forming a space between the bottom layer of the unit body in which the fusible body is formed and the protective cover to supply an overcurrent to the fusible body, it is possible to solve the problem that the fusible body, which is broken by a short-circuit impact when the fusible body is fused by the overcurrent, is scattered to the outside to damage peripheral components and the like, and short-circuit occurs.
In other words, since the impact scattering at the time of short circuit can be prevented, there is an advantage that damage to peripheral parts and the like due to the impact scattering at the time of short circuit and short circuit can be prevented.
Further, the present invention has an advantage that it is possible to easily vary the fusing rated current by merely varying the pattern of the fusible part, and mass production is possible.
The embodiments and drawings described in the present specification are only a part of technical ideas included in exemplarily describing the present invention. Therefore, it is obvious that the embodiments disclosed in the present specification are for illustrating the technical idea of the present invention and are not for limiting the present invention, and therefore, the present invention is not limited to such embodiments.
Description of reference numerals
100: fuse component 101: space(s)
110: bottom layer 120: meltable body
121: fusing part 122: soldering pad part for soldering
130: buffer filler 200: protective cover
210: step portion 220: flange part
300: a pad component.
Claims (2)
1. A method of manufacturing a miniature fuse, comprising:
a unit body bottom layer forming step of forming a unit body bottom layer on a plate-shaped large-area bottom layer;
a pin fixing hole forming step of forming a pair of pin fixing holes in the bottom layer of the unit body through punching;
a fusible body forming step of forming a fusible body of a conductive material on the bottom layer of the unit body, forming a pair of pad portions around the pin fixing hole, and forming a fusible body including a fusing portion for connecting between the pad portions and fusing when an overcurrent flows;
cutting the bottom layer of the unit body, wherein the bottom layer of the unit body with the meltable body is separated from the large-area bottom layer by cutting;
a pin connection step of inserting a pin into a soldering land hole of the bottom layer of the cut unit body and connecting the pin by soldering; and
a protective cover fixing step of accommodating and fixing the unit body bottom layer connected with the pins in the protective cover, after accommodating the unit body bottom layer connected with the pins in the protective cover with one surface opened, bending and thermally welding the edge opened with one surface of the protective cover on the edge of the other surface of the unit body bottom layer,
wherein the content of the first and second substances,
the large-area bottom layer prepared in the unit body bottom layer forming step is prepared in the form of a plate made of an insulating material,
the fusing part is formed in a pattern with at least one of different width, thickness and length,
and the number of the first and second electrodes,
in the protective cover fixing step, when the unit body base layer is accommodated and fixed in the protective cover, a space is formed between the protective cover and a surface of the unit body base layer on which the meltable material is formed, and the unit body base layer is fixed after the space is filled with the cushioning filler.
2. A method of manufacturing a miniature fuse as set forth in claim 1, comprising:
in the above-mentioned fusible body forming step, the above-mentioned fusible body is formed by one of die cutting of a metal thin plate, chemical etching, printing of a metal paste, sputtering of a metal substance, or gold plating,
in the fusible body forming step, the fusible bodies have different fusing rated currents according to the rows or columns of the bottom layers of the unit bodies.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2016-0167353 | 2016-12-09 | ||
| KR1020160167353A KR101742215B1 (en) | 2016-12-09 | 2016-12-09 | Micro sub-miniature fuse manufacturing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108231506A CN108231506A (en) | 2018-06-29 |
| CN108231506B true CN108231506B (en) | 2020-06-09 |
Family
ID=59052299
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710005339.4A Active CN108231506B (en) | 2016-12-09 | 2017-01-04 | Small fuse and manufacturing method thereof |
Country Status (2)
| Country | Link |
|---|---|
| KR (1) | KR101742215B1 (en) |
| CN (1) | CN108231506B (en) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58141545U (en) * | 1982-03-19 | 1983-09-24 | 三王株式会社 | Ultra-compact fuse with lead |
| US4928384A (en) * | 1987-03-24 | 1990-05-29 | Cooper Industries, Inc. | Method of making a wire bonded microfuse |
| JP2000251610A (en) * | 1999-02-26 | 2000-09-14 | Sanchu Fusetech:Kk | Micro-fuse inserted in substrate and manufacture thereof |
| CN101484962A (en) * | 2006-06-16 | 2009-07-15 | 斯玛特电子公司 | Small-sized surface-mounted fuse and method of manufacturing the same |
| KR20110037374A (en) * | 2009-10-06 | 2011-04-13 | 울산대학교 산학협력단 | Micro fuse and manufacturing method thereof |
| CN102468091A (en) * | 2010-11-16 | 2012-05-23 | 邱鸿智 | Fuse |
| KR20140000664U (en) * | 2012-07-20 | 2014-02-03 | 홍공희 | A Thermal Fuse Resistor for Electronic high Watt-Hour Meter |
| CN104616940A (en) * | 2015-02-14 | 2015-05-13 | 南京萨特科技发展有限公司 | Chip type protection element and a manufacturing method thereof |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR200180702Y1 (en) * | 1999-11-23 | 2000-05-15 | 애니원산업개발주식회사 | Micro fuse |
| US6542063B2 (en) * | 2001-01-31 | 2003-04-01 | Nippon Seisne Cable, Ltd. | Electric fuse |
| CN101593644B (en) * | 2008-05-30 | 2011-03-23 | 南京萨特科技发展有限公司 | Miniature surface-adhered type fuse |
-
2016
- 2016-12-09 KR KR1020160167353A patent/KR101742215B1/en active IP Right Grant
-
2017
- 2017-01-04 CN CN201710005339.4A patent/CN108231506B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58141545U (en) * | 1982-03-19 | 1983-09-24 | 三王株式会社 | Ultra-compact fuse with lead |
| US4928384A (en) * | 1987-03-24 | 1990-05-29 | Cooper Industries, Inc. | Method of making a wire bonded microfuse |
| JP2000251610A (en) * | 1999-02-26 | 2000-09-14 | Sanchu Fusetech:Kk | Micro-fuse inserted in substrate and manufacture thereof |
| CN101484962A (en) * | 2006-06-16 | 2009-07-15 | 斯玛特电子公司 | Small-sized surface-mounted fuse and method of manufacturing the same |
| KR20110037374A (en) * | 2009-10-06 | 2011-04-13 | 울산대학교 산학협력단 | Micro fuse and manufacturing method thereof |
| CN102468091A (en) * | 2010-11-16 | 2012-05-23 | 邱鸿智 | Fuse |
| KR20140000664U (en) * | 2012-07-20 | 2014-02-03 | 홍공희 | A Thermal Fuse Resistor for Electronic high Watt-Hour Meter |
| CN104616940A (en) * | 2015-02-14 | 2015-05-13 | 南京萨特科技发展有限公司 | Chip type protection element and a manufacturing method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| KR101742215B1 (en) | 2017-05-31 |
| CN108231506A (en) | 2018-06-29 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US7508295B2 (en) | Protection circuit | |
| US7106165B2 (en) | Fuse, battery pack using the fuse, and method of manufacturing the fuse | |
| KR102213303B1 (en) | Fuse element and fuse device | |
| US7554432B2 (en) | Fuse element with trigger assistance | |
| US7504925B2 (en) | Electric component with a protected current feeding terminal | |
| TWI697023B (en) | Fuse unit, fuse element and heating element are equipped with fuse element | |
| US7489229B2 (en) | Fuse component | |
| US7569907B2 (en) | Hybrid chip fuse assembly having wire leads and fabrication method therefor | |
| US8081057B2 (en) | Current protection device and the method for forming the same | |
| JP6437262B2 (en) | Mounting body manufacturing method, thermal fuse element mounting method, and thermal fuse element | |
| WO2014171515A1 (en) | Protective device | |
| TWI726074B (en) | Breaking protective element | |
| WO2016009988A1 (en) | Chip fuse and fuse element | |
| JP2001524735A (en) | Semiconductor structural element having defined properties in the event of a failure and a method for producing such a semiconductor structural element | |
| CN115705983A (en) | Surface mount fuse with solder connection and tin shrink substrate | |
| KR20180108791A (en) | Protective element | |
| CN111446230B (en) | Semiconductor device with a semiconductor device having a plurality of semiconductor chips | |
| CN108231506B (en) | Small fuse and manufacturing method thereof | |
| JP3848350B2 (en) | Semiconductor device | |
| JP2005235680A (en) | Chip type fuse and its manufacturing method | |
| JP7154090B2 (en) | protective element | |
| US20070200194A1 (en) | Apparatus And Method For Temperature-Interrupting Protection Of An Electric Device | |
| JP7149886B2 (en) | semiconductor equipment | |
| TWI569399B (en) | Chip fuse element with pre-cut substrate and method for making the same | |
| CN106816428B (en) | Wafer fuse element and its preparation method with precut substrate |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |