CN106816428B - Wafer fuse element and its preparation method with precut substrate - Google Patents
Wafer fuse element and its preparation method with precut substrate Download PDFInfo
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- CN106816428B CN106816428B CN201510847489.0A CN201510847489A CN106816428B CN 106816428 B CN106816428 B CN 106816428B CN 201510847489 A CN201510847489 A CN 201510847489A CN 106816428 B CN106816428 B CN 106816428B
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- 239000000758 substrate Substances 0.000 title claims abstract description 81
- 238000002360 preparation method Methods 0.000 title description 6
- 239000010410 layer Substances 0.000 claims abstract description 42
- 230000004888 barrier function Effects 0.000 claims abstract description 24
- 239000011241 protective layer Substances 0.000 claims abstract description 14
- 238000004519 manufacturing process Methods 0.000 claims description 28
- 238000000926 separation method Methods 0.000 claims description 13
- 238000005520 cutting process Methods 0.000 claims description 3
- 230000001681 protective effect Effects 0.000 claims description 2
- 238000005452 bending Methods 0.000 claims 2
- 230000000903 blocking effect Effects 0.000 claims 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 9
- 238000000034 method Methods 0.000 description 8
- 238000010891 electric arc Methods 0.000 description 7
- 239000000741 silica gel Substances 0.000 description 6
- 229910002027 silica gel Inorganic materials 0.000 description 6
- 239000000463 material Substances 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 239000006004 Quartz sand Substances 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- 238000009825 accumulation Methods 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 239000004411 aluminium Substances 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 230000007812 deficiency Effects 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 229910000648 terne Inorganic materials 0.000 description 2
- 235000006508 Nelumbo nucifera Nutrition 0.000 description 1
- 240000002853 Nelumbo nucifera Species 0.000 description 1
- 235000006510 Nelumbo pentapetala Nutrition 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- YCKOAAUKSGOOJH-UHFFFAOYSA-N copper silver Chemical compound [Cu].[Ag].[Ag] YCKOAAUKSGOOJH-UHFFFAOYSA-N 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 238000010079 rubber tapping Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
- 230000008719 thickening Effects 0.000 description 1
- 238000009834 vaporization Methods 0.000 description 1
- 230000008016 vaporization Effects 0.000 description 1
- 238000013316 zoning Methods 0.000 description 1
Abstract
A kind of wafer fuse element with precut substrate, for being surface mounted to circuit board, the wafer fuse element includes: substrate body, with upper surface, lower surface and two ora terminalis for connecting upper surface and lower surface, wherein substrate body is formed with the precut of opposite ends edge at least one of upper and lower surfaces；What a pair was separated from each other connects electrode, connects electrode and respectively includes the weld pad portion for being located at upper surface and the leg portion for extending to lower surface by weld pad portion；One layer be located at upper surface, for closed-loop around circular the barrier layer in weld pad portion, for an accommodating space is collectively formed with substrate body, and circular barrier layer is not covered precut and is exposed to the open air outside；One positioned at accommodating space and both ends are soldered to the fuse ontology in weld pad portion respectively；And the closed protective layer of accommodating space is blocked in one layer of closing.
Description
Technical field
The present invention relates to a kind of wafer fuse element and its preparation method with precut substrate, especially one kind is convenient for
Cut isolated wafer fuse element and its preparation method.
Background technique
Fuse (fuse) be it is a kind of be connected on circuit to the disposable elements for protecting circuit, generally use low resistance
Metal or alloy system filiform or flaky material production, such as terne metal, aluminium, copper, silver, cupromanganese and copper silver
It is defined as fuse (fuse-link) by alloy etc., IEC127 standard, and general insurance silk is made of three components, one is
Melt component is the core of fuse, and when fusing plays the role of cutting off electric current；The second is electrod assembly for connect melt with
Circuit, it is necessary to have good electric conductivity；Last bracket component is to make above-mentioned parts that a rigid structure be collectively formed, and is mentioned
Convenience when rising installation or using fuse.
Apply to the fuse of power circuit or powerful device, then except above three component further includes an arc extinguishing portion
Part, since the operating current of this kind of equipment is big compared with general electronic equipment, the electricity of its both ends accumulation when melt component fuses
Lotus continues to increase, it is possible to generate melt component fusing even vaporization but electric current still maintains to be connected, this is phenomenon of arc discharge
(arcing), arc-extinguishing unit above-mentioned are exactly the material properties by good insulation properties and thermal conductivity, and by high compared with melt component
Electronegativity block phenomenon of arc discharge, the conventional material of this field is quartz sand at present, inhales extra charge via arc-extinguishing unit
It receives, the probability for reducing free of air reaches the situation for preventing electric current from maintaining conducting.
For can mass production, currently used well-known technique, based on Duo Yi great plate substrate, disposably formed it is up to a hundred very
It to the preform of thousands of electrical fuse elements, is finally separated, and a large amount of electrical fuse elements is made.It is common existing to manufacture
Cheng Zhong, as shown in Figure 1, one layer of such as layer of silica gel 80 can be additionally coated on the substrate 8 of a plurality of fuses of preliminary forming
(silicon) the melt component and electrod assembly of fuse are covered.
Due to being the combination for belonging to different material between substrate 8 and layer of silica gel 80, cause mutual combination attachment dynamics bad and
Ductility between the two differs widely, even if can protect the structure of electrod assembly and melt component, can but cover adjacent substrate
In 81 position of defiber provide fragile structure part when separation even if being pre-formed fluted or mark of break in defiber 81,
But due to the presence of layer of silica gel 80, hence it is evident that the separation smoothness of substrate 8 is hindered, once directly apply outer such as tapping or break and break
Power, 8 part of substrate can preferentially disconnect, and layer of silica gel 80 later may disconnect or part is even maintained to connect, and lead to preform
Integrality itself is destroyed.Therefore, above-mentioned existing technologies the separation the step of must by laser or diamond cutter, along point
Offline 81 one by one cutting could separate and form multiple independent electrical fuse elements, production process is slow and can not promote output and imitate
Rate, cost control is also therefore high, undoubtedly causes to perplex to the manufacturer of this field.
In view of above-mentioned problem, the present inventor attempts to provide a kind of wafer fuse with precut substrate
Element can effectively simplify excessively many and diverse production process, reduce cost of manufacture, promote whole output efficiency and manufacturing yield；
And ensure that precut will not be covered by other structures and be exposed outward, the smoothness of separation preform process is promoted, and can
To select further to bend the curved portion elasticity for connecting fuse ontology both ends far from substrate body, so that curved portion is fusing
Afterwards, remain on remainder at the curved portion of both ends can resilient separation each other, reduce the probability that phenomenon of arc discharge occurs, it is ensured that chip
The reliability that electrical fuse element uses, these all can be the focus of the invention to be paid attention to.
Summary of the invention
It is an object of the present invention to provide a kind of wafer fuse members with precut substrate of simplified production process
Part reduces cost of manufacture, promotes whole manufacturing yield.
Another object of the present invention is to provide a kind of wafer fuse element with precut substrate, it is ensured that precut is not
It can be covered by other structures and expose outward, increase the smoothness of separation substrate process.
Yet another object of that present invention is to a kind of manufacturing method of wafer fuse element is provided, fuse ontology will be connected
The curved portion elasticity at both ends is bent far from substrate body, reduces the probability that phenomenon of arc discharge occurs, it is ensured that structure of the invention uses upper
Reliability.
In order to achieve the above object, the present invention provides a kind of wafer fuse element with precut substrate, installed for surface
To circuit board, which includes: substrate body, has upper surface, lower surface and connection upper surface and lower surface
Two ora terminalis, wherein substrate body is formed with the precut of opposite ends edge at least one of upper and lower surfaces；It is a pair of
What is be separated from each other connects electrode, connects electrode and respectively includes being located at the weld pad portion of upper surface and extend to lower surface by weld pad portion
Leg portion；One layer be located at upper surface, for closed-loop around the circular barrier layer in weld pad portion, for an appearance is collectively formed with substrate body
Between emptying, and does not cover precut around barrier layer and expose to the open air outside；One positioned at accommodating space and both ends are soldered respectively
To the fuse ontology in weld pad portion；And the closed protective layer of accommodating space is blocked in one layer of closing.
For making the manufacturing method of the aforementioned wafer fuse element with precut substrate, including the following steps: a)
The a piece of substrate with a upper surface and a lower surface is provided, the aforementioned upper surface of the substrate or lower surface are at least within
One is formed with plural precut, to separate out a plurality of substrate bodies；And the upper surface side of each aforesaid base plate ontology point
Not Ju You one around barrier layer, an appearance is collectively formed in each aforementioned circular barrier layer with corresponding aforesaid base plate ontology respectively
Between emptying, and aforementioned circular barrier layer does not cover aforementioned precut and exposes aforementioned precut to the open air；And respectively on each
State substrate body formed it is a pair of be separated from each other connect electrode, the aforementioned electrode that connects of every a pair respectively includes at least two positioned at upper
It states the weld pad portion of upper surface and extends to the leg portion of above-mentioned lower surface by aforementioned weld pad portion；B) one by one in each above-mentioned appearance
Above-mentioned weld pad portion is respectively welded between emptying, by the both ends of a fuse ontology；And c) one by one setting closing block it is each before
State the closed protective layer of accommodating space, each aforementioned fuse ontology of closed protective.
A kind of disclosed wafer fuse element and its preparation method with precut substrate, can effectively ensure that
Precut will not be covered by other structures and be exposed outward, simplified excessively slowly with expensive separating step whereby, increased separation
The smoothness of substrate process reduces cost of manufacture, promotes whole output efficiency and manufacturing yield；And selectively connection is protected
The curved portion elasticity at the both ends of dangerous silk ontology is bent far from substrate body, so that curved portion after fusing, remains on the arc at both ends
The remainder in shape portion can resilient separation each other, reduce the probability that phenomenon of arc discharge occurs, it is ensured that wafer fuse element use exists
Reliability in the case of high current, and then reach above-mentioned all purposes.
Detailed description of the invention
Fig. 1 is the fuse structure top view of well-known technique.
Fig. 2 is the step flow chart of the first preferred embodiment of the invention, shows the related wafer fuse member of the present invention whereby
The production method of part.
Fig. 3 is that the first preferred embodiment of the invention has the still uncut top view of precut substrate, illustrates adjacent base
Precut is formed between plate ontology.
Fig. 4 be Fig. 3 side view, show circular the barrier layer of the preparatory thermal sintering of substrate and illustrate run through upper surface and under
The perforation on surface.
Fig. 5 is that the accommodating space of the one of substrate body of Fig. 4 substrate welds the side view of fuse ontology.
Fig. 6 be Fig. 5 in fuse ontology fuse schematic diagram, to express remain on both ends curved portion can each other elasticity point
From.
Fig. 7 is the side view of filling closed protective layer in accommodating space.
Fig. 8 is that each piece of substrate body is separated one by one in Fig. 3 substrate with precut, and completes the side view of electrical fuse element
Figure.
Fig. 9 is the step flow chart of the second preferred embodiment of the invention, shows the related wafer fuse of the present invention whereby
Another production method of element.
Figure 10 is that the second preferred embodiment of the invention drills through bowing for substrate body formation perforation in precut with tool
View.
Figure 11 is the side view of Figure 10 substrate body, illustrates to be formed whereby in perforation and connects electrode.
Figure 12 is that the substrate body that Figure 11 is connected after the completion of electrode fabrication is located at upper surface one layer of photoresistance film of setting and light shield
Side view.
Figure 13 surrounds the side view to form an accommodating space for substrate body in Figure 12 and around barrier layer jointly.
Figure 14 is that the side view of one layer of closed protective layer is arranged in the circular barrier layer of Figure 13.
Symbol description
1,1 ' ... substrate body 10,10 ' ... upper surfaces
11,11 ' ... precut 12,12 ' ... accommodating spaces
The perforation of 13 ... lower surfaces 14,14 ' ...
15 ... two ora terminalis 2,2 ' ... are around barrier layer
3,3 ' ... connect electrode 30 ... weld pad portion
31 ... leg portions 4,4 ' ... fuse ontologies
40 ... both ends 41 ... curved portions
5,5 ' ... closed protective layer 50 ... arc extinguishing portions
51 ' ... top cover portion 7 ' ... light shields
70 ' ... photoresistance films
601-608 ... step
Known elements
8 ... substrate 80 ... layer of silica gel
81 ... defibers
Specific embodiment
For the present invention aforementioned and other technology contents, feature and effect, in the preferable of following cooperation Figure of description
In the detailed description of embodiment, it can clearly appear from；In addition, in embodiments, identical element will be with similar label table
Show.
The production process of first preferred embodiment of the invention as shown in the flowchart of figure 2, first such as step 601 and Fig. 3 institute
Show, pluralizes the substrate body 1 being connected to each other in a piece of preparatory zoning of the substrate with ceramic material, substrate adjacent to each other
All there is the precut 11 for being formed in such as chase of upper surface 10 between ontology 1, using can easily apply after production process
External force rapidly separates entire row preform and adjacent row, then again separates entire row preform one by one, and effectively to promote this example
Fluency when wafer fuse element makes, referring to FIG. 4, the upper surface 10 of each piece of substrate body 1 has and substrate sheet
1 same material of body and the in advance circular barrier layer 2 of sinter molding, these circular barrier layers 2 avoid masking on being formed in completely
The precut 11 on surface 10 is promoted to prevent being finally separating the difficulty of each substrate body 1.Certainly, such as those skilled in the art institute
It can know, even if precut above-mentioned changes can similarly separate each piece of substrate body in lower surface forming, having no can not.
In the accommodating space 12 that the substrate body 1 corresponding with each piece of barrier layer 2 is collectively formed, drilled out with tool
Two perforation 14 through upper surface 10 and lower surface 13 in pairs, then form connecting for metal conductive materials in perforation 14
Electrode 3 defines herein to read smoothly, and contacting with upper surface 10 is weld pad portion 30；Lower surface 13 is extended to by weld pad portion 30
Be then leg portion 31, what the two collectively formed this example connects electrode 3.Next as shown in step 602 and Fig. 5, in each appearance
In 12 between emptying by example be interpreted as low resistance terne metal, aluminium, copper, silver fuse ontology 4 both ends 40 wherein one end, in advance
It is soldered to one of weld pad portion 30 with slightly inclined angle, since the length of fuse ontology 4 is greater than two weld pad portions
Distance between 30, therefore such as step 603, when will not be soldered fixed one end in both ends 40 and be soldered to another weld pad portion 30,
The curved portion 41 for connecting both ends 40 elasticity can be bent due to the extension characteristics of metal material, so that curved portion 41 can be far from corresponding
Substrate body 1.It thereby ensures that when such as 15A electric current flows through its fusing of the cause of fuse ontology 4, with reference to Fig. 6, remains in both ends 40
The nubbin of the curved portion 41 at place can each other resilient separation and space out, take precautions against curved portion 41 nubbin can because melting
And the effect of connecting once again, fuse ontology 4 is allowed to lose protection electronic circuit.
As shown in fig. 7, and then step 604, inserts each accommodating space (not for the arc extinguishing portion 50 of closed protective layer 5
Label) in, the arc extinguishing portion 50 of this example is the silica gel likened to doped with quartz sand, and the arc extinguishing portion 50 inserted in accommodating space will
Fuse ontology 4 low relative to 50 electronegativity of arc extinguishing portion in each accommodating space is covered, the arc of fuse ontology 4 is caused
After portion 41 fuses, the meeting uptake and accumulation of arc extinguishing portion 50 charge extra in the both ends of fuse ontology 4 40 prevents fuse ontology 4
The case where ambient gas generates freeization because of high current, and then reduce the probability that phenomenon of arc discharge occurs.Certainly, as being familiar with this technology
Field personage is readily appreciated, even if individually inserting quartz sand powder herein, or even keeps being not filled with anything, equal nothing
Implement for fear of the present invention.
Last such as step 605, mechanical arm oppresses substrate along precut 11, so that each substrate being initially connected to each other
Ontology 1 can be separated swimmingly, therefore such as Fig. 8, and the substrate body 1 after each separation is in the position of corresponding precut (not labeled)
It sets, will form two ora terminalis 15 of connection upper surface 10 and lower surface 13, so far constitute the wafer fuse element in this example.
A kind of disclosed wafer fuse element and its preparation method with precut substrate, can effectively simplify
Excessively many and diverse production process reduces cost of manufacture, promotes whole manufacturing yield；And ensure that precut will not be by other structures
It covers and exposes outward, increase the smoothness of separation substrate process, and the curved portion bullet at the both ends of fuse ontology will be connected
Property bend far from substrate body so that the remainder that curved portion after fusing, remains on the curved portion at both ends can be elastic each other
Separation reduces the probability that phenomenon of arc discharge occurs, it is ensured that the reliability that wafer fuse element uses.
As shown in Figures 9 to 11, if step 606 is wearing previous embodiment in the second preferred embodiment of the invention
Hole 14 ', with tool drills through substrate body 1 ' and is set in the precut 11 ' between adjacent substrate ontology 1 ', then with sputter
What technical matters plated one layer of conductive metal material such as copper or silver in perforation 14 ' connects electrode 3 ', however, only with sputter
Mode made, since the deficiency of the uniformity and thickness is difficult to reach good use reliability, later by this example
Substrate carry out the means of barrel plating suppression or chemical plating, the electrode 3 ' that connects perforated in 14 ' is thickened, is improved when being conductively connected
Stability.And then Figure 12 and step 607 are please referred to, one layer of photoresistance film 70 ' is imprinted in upper surface 10 ', then in photoresistance film 70 '
Top cover one group of light shield 7 ' be exposed, allow 70 ' exposed part of photoresistance film to be cured, then by uncured photoresistance film
70 ' carry out development removal, and being formed has scheduled circular shape, and certainly, those skilled in the art can know easily, if aforementioned
When the thickness deficiency of photoresistance film, the effect of thickening can be reached in increasing another layer of photoresistance film of coining in developed photoresistance film,
Above-mentioned exposure and development process are repeated, is become as shown in figure 13 until completing scheduled thickness, one layer is set to upper surface 10 '
Circular barrier layer 2 ', part that is original uncured and suffering development removal is then defined as by around barrier layer 2 ' and corresponding
The accommodating space 12 ' that is collectively formed of substrate body 1 ', use and complete multiple substrate bodies 1 ' for not yet carrying out detached jobs
Structure.
Thereafter installation procedure is all identical as previous embodiment, does not add to repeat herein, is only described with regard to difference step
Illustrate, as shown in step 608 and Figure 14, after the fuse ontology 4 ' of previous embodiment is completed, by closed protective layer 5 '
Top cover portion 51 ' be covered on corresponding circular barrier layer 2 ', cause accommodating space 12 ' formed a complete closed cavity,
It is last then as previously described in a prior embodiment, by mechanical arm to precut apply external force carry out substrate body detached job so that
A plurality of wafer fuse elements can be quickly completed, the expenditure that is smooth and reducing production cost of production process is effectively promoted.
The foregoing is merely illustrative of the preferred embodiments of the present invention, cannot be limited the scope of implementation of the present invention with this, all
According to simple equivalent changes and modifications made by claims of the present invention and description, the invention patent culvert should still belong to
In the range of lid.
Claims (7)
1. a kind of wafer fuse element with precut substrate, for being surface mounted to circuit board, the wafer fuse element
Include:
One substrate body, with a upper surface, one in contrast to the upper surface lower surface and connect under the upper surface and this
Two ora terminalis on surface, wherein the substrate body is formed with corresponding aforementioned two ora terminalis at least one of the upper surface and the lower surface
Precut；
What a pair was separated from each other connects electrode, this respectively includes the weld pad portion positioned at above-mentioned upper surface, Ji Youqian to electrode is connected
State the leg portion that weld pad portion extends to above-mentioned lower surface；
One layer be located at the upper surface, for closed-loop around the circular barrier layer in above-mentioned weld pad portion, for being collectively formed with the substrate body
One accommodating space, and the circular barrier layer does not cover aforementioned precut and exposes aforementioned precut to the open air；
One positioned at above-mentioned accommodating space and both ends are soldered to the fuse ontology in above-mentioned weld pad portion respectively；And
One layer is closed the closed protective layer for blocking the accommodating space；
Wherein the fuse ontology, which further includes, connects above-mentioned both ends and elasticity bending and the arc far from aforesaid substrate body upper surface
Shape portion, so that when the fusing of aforementioned curved portion, remaining in curved portion nubbin at above-mentioned both ends can resilient separation each other.
2. wherein the closed protective layer includes filling out as described in claim 1 with the wafer fuse element of precut substrate
It fills in the accommodating space and electronegativity is higher than the arc extinguishing portion of above-mentioned fuse ontology.
3. having the wafer fuse element of precut substrate as claimed in claim 1 or 2, wherein the closed protective layer includes
One is covered in the top cover portion on above-mentioned circular barrier layer.
4. a kind of manufacturing method of the wafer fuse element with precut substrate, including the following steps:
A) a piece of substrate with a upper surface and a lower surface is provided, the aforementioned upper surface of the substrate or lower surface are extremely
Few one of them, is formed with plural precut, to separate out a plurality of substrate bodies；And the upper table of each aforesaid base plate ontology
Surface side is respectively provided with one around barrier layer, and each aforementioned circular barrier layer is collectively formed with corresponding aforesaid base plate ontology respectively
One accommodating space, and aforementioned circular barrier layer does not cover aforementioned precut and exposes aforementioned precut to the open air；And exist respectively
Each aforesaid substrate ontology formed it is a pair of be separated from each other connect electrode, every aforementioned electrode that connects of a pair respectively includes at least two
The leg portion of above-mentioned lower surface is extended to positioned at the weld pad portion of above-mentioned upper surface and by aforementioned weld pad portion；
B) above-mentioned weld pad portion is respectively welded in each above-mentioned accommodating space, by the both ends of a fuse ontology one by one；More
Including secondary step b1) will connect one by one each aforementioned fuse ontology above-mentioned both ends curved portion respectively elasticity bending, it is separate
Corresponding each aforesaid substrate ontology；And
C) the closed protective layer for blocking each aforementioned accommodating space, each aforementioned fuse sheet of closed protective are closed in setting one by one
Body.
5. there is the manufacturing method of the wafer fuse element of precut substrate as claimed in claim 4, wherein step c)
It further includes an arc extinguishing portion by each aforementioned closed protective layer and is filled in corresponding each aforementioned accommodating space, cover electronegativity
The secondary step c1 of low each aforementioned fuse ontology).
6. there is the manufacturing method of the wafer fuse element of precut substrate as claimed in claim 4, wherein step c)
Further include the hyposynchronization that a top cover portion by each aforementioned closed protective layer is covered on corresponding each above-mentioned circular barrier layer
Rapid c2).
7. the manufacturing method of the wafer fuse element with precut substrate as described in claim 4,5 or 6, further includes
Step d) after step c) forms a plurality of wafer fuse elements along each aforementioned pre-cut wire cutting substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510847489.0A CN106816428B (en) | 2015-11-27 | 2015-11-27 | Wafer fuse element and its preparation method with precut substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510847489.0A CN106816428B (en) | 2015-11-27 | 2015-11-27 | Wafer fuse element and its preparation method with precut substrate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106816428A CN106816428A (en) | 2017-06-09 |
| CN106816428B true CN106816428B (en) | 2019-04-23 |
Family
ID=59102144
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510847489.0A Expired - Fee Related CN106816428B (en) | 2015-11-27 | 2015-11-27 | Wafer fuse element and its preparation method with precut substrate |
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| Country | Link |
|---|---|
| CN (1) | CN106816428B (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101313382A (en) * | 2005-10-03 | 2008-11-26 | 保险丝公司 | Fuse with cavity forming enclosure |
| CN101894716A (en) * | 2009-05-21 | 2010-11-24 | 邱鸿智 | Metal-jointed high voltage fuse structure and manufacturing method thereof |
| CN102184816A (en) * | 2011-05-13 | 2011-09-14 | Aem科技(苏州)股份有限公司 | Suspended-fuse-wire-type surface-mount fuse and manufacturing method thereof |
| CN102664127A (en) * | 2012-05-10 | 2012-09-12 | 苏州晶讯科技股份有限公司 | Surface-mounted fuser |
-
2015
- 2015-11-27 CN CN201510847489.0A patent/CN106816428B/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101313382A (en) * | 2005-10-03 | 2008-11-26 | 保险丝公司 | Fuse with cavity forming enclosure |
| CN101894716A (en) * | 2009-05-21 | 2010-11-24 | 邱鸿智 | Metal-jointed high voltage fuse structure and manufacturing method thereof |
| CN102184816A (en) * | 2011-05-13 | 2011-09-14 | Aem科技(苏州)股份有限公司 | Suspended-fuse-wire-type surface-mount fuse and manufacturing method thereof |
| CN102664127A (en) * | 2012-05-10 | 2012-09-12 | 苏州晶讯科技股份有限公司 | Surface-mounted fuser |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106816428A (en) | 2017-06-09 |
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Granted publication date: 20190423 |