CN106816428A - Wafer fuse element and its preparation method with precut substrate - Google Patents
Wafer fuse element and its preparation method with precut substrate Download PDFInfo
- Publication number
- CN106816428A CN106816428A CN201510847489.0A CN201510847489A CN106816428A CN 106816428 A CN106816428 A CN 106816428A CN 201510847489 A CN201510847489 A CN 201510847489A CN 106816428 A CN106816428 A CN 106816428A
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- precut
- substrate
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- mentioned
- fuse element
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- 239000000758 substrate Substances 0.000 title claims abstract description 71
- 238000002360 preparation method Methods 0.000 title description 8
- 239000010410 layer Substances 0.000 claims abstract description 43
- 230000004308 accommodation Effects 0.000 claims abstract description 24
- 230000004888 barrier function Effects 0.000 claims abstract description 24
- 239000011241 protective layer Substances 0.000 claims abstract description 13
- 238000004519 manufacturing process Methods 0.000 claims description 17
- 239000000463 material Substances 0.000 claims description 17
- 238000000926 separation method Methods 0.000 claims description 9
- 238000000034 method Methods 0.000 claims description 7
- 238000005452 bending Methods 0.000 claims description 6
- 238000009434 installation Methods 0.000 claims description 3
- 230000001681 protective effect Effects 0.000 claims description 3
- 238000005520 cutting process Methods 0.000 claims description 2
- 230000000903 blocking effect Effects 0.000 claims 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 9
- 238000010891 electric arc Methods 0.000 description 7
- 238000005516 engineering process Methods 0.000 description 6
- 239000000741 silica gel Substances 0.000 description 6
- 229910002027 silica gel Inorganic materials 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 239000006004 Quartz sand Substances 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- 238000009825 accumulation Methods 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 239000004411 aluminium Substances 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 229910000648 terne Inorganic materials 0.000 description 2
- 235000006508 Nelumbo nucifera Nutrition 0.000 description 1
- 240000002853 Nelumbo nucifera Species 0.000 description 1
- 235000006510 Nelumbo pentapetala Nutrition 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- YCKOAAUKSGOOJH-UHFFFAOYSA-N copper silver Chemical compound [Cu].[Ag].[Ag] YCKOAAUKSGOOJH-UHFFFAOYSA-N 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
- 230000008719 thickening Effects 0.000 description 1
- 238000009834 vaporization Methods 0.000 description 1
- 230000008016 vaporization Effects 0.000 description 1
- 238000013316 zoning Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/525—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body with adaptable interconnections
- H01L23/5256—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body with adaptable interconnections comprising fuses, i.e. connections having their state changed from conductive to non-conductive
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/10—Applying interconnections to be used for carrying current between separate components within a device
- H01L2221/1068—Formation and after-treatment of conductors
Abstract
A kind of wafer fuse element with precut substrate, for being surface mounted to circuit board, the wafer fuse element includes：Substrate body, two ora terminalis with upper surface, lower surface and connection upper surface and lower surface, wherein substrate body is formed with the precut of opposite ends edge at least one of upper and lower surface；A pair separated from one another to connect electrode, connect electrode include respectively positioned at upper surface weld pad portion and the leg portion of lower surface is extended to by weld pad portion；One layer be located at upper surface, for closed-loop around circular the barrier layer in weld pad portion, for being collectively forming an accommodation space with substrate body, and circular barrier layer is not covered precut and is exposed to the open air outside；One fuse body for being soldered to weld pad portion respectively positioned at accommodation space and two ends；And one layer close block accommodation space closed protective layer.
Description
Technical field
The present invention is easy on a kind of wafer fuse element and its preparation method with precut substrate, especially one kind
Cut separate wafer fuse element and its preparation method.
Background technology
Fuse (fuse) is a kind of disposable elements being connected on circuit to protection circuit, generally using low resistance
Metal or alloy system thread or flaky material make, for example terne metal, aluminium, copper, silver, cupromanganese and copper silver
It is defined as fuse (fuse-link) by alloy etc., IEC127 standards, and general insurance silk is made up of three parts, one is
Melt part is the core of fuse, plays a part of to cut off electric current during fusing；The second is electrod assembly be used for connect melt with
Circuit, it is necessary to possess good electric conductivity；Last bracket component is above-mentioned parts is collectively forming a rigid structure, is carried
Convenience when rising installation or using fuse.
Apply to the fuse of power circuit or powerful device, then except above three part further includes an arc extinguishing portion
Part, because the operating current of this kind equipment is big compared with general electronic equipment, the electricity of its two ends accumulation when melt part fuses
Lotus continues to increase, it is possible to produce melt part fusing even vaporization but electric current still maintains conducting, this is phenomenon of arc discharge
(arcing), foregoing arc-extinguishing unit is exactly the material character by good insulation properties and thermal conductivity, and by high compared with melt part
Electronegativity block phenomenon of arc discharge, the conventional material of current this area is quartz sand, inhales unnecessary electric charge via arc-extinguishing unit
Receive, the probability for reducing free of air reaches the situation for preventing electric current from maintaining conducting.
Largely to produce, known technology conventional at present, more based on big plate substrate, disposably formed it is up to a hundred very
To the preform of thousands of electrical fuse elements, finally separated, and be made a large amount of electrical fuse elements.It is common existing to manufacture
Cheng Zhong, as shown in figure 1, one layer of such as layer of silica gel 80 can be additionally coated with the substrate 8 of a plurality of fuses of preliminary forming
(silicon) the melt part and electrod assembly of fuse are covered.
Due to being belonging to the combination of different material between substrate 8 and layer of silica gel 80, cause mutual combination attachment dynamics not good and
Ductility between the two differs widely, even if adjacent substrate can but be covered with guard electrode part and the structure of melt part
In the position of defiber 81, even if being pre-formed fluted or mark of break in defiber 81, there is provided fragile structure part during separation,
But due to the presence of layer of silica gel 80, hence it is evident that hinder the separation smoothness of substrate 8, once directly apply for example to tap or break disconnected etc. outer
Power, the part of substrate 8 can preferentially disconnect, and layer of silica gel 80 later may disconnect or even maintain part to connect, and cause preform
Integrality itself is destroyed.Therefore, above-mentioned existing technologies the step of separating must by laser or diamond cutter, along point
Offline 81 one by one cutting could separate and form multiple independent electrical fuse elements, Making programme cannot slowly lift output and imitate
Rate, cost control is also therefore high, and undoubtedly the manufacturer to this area causes puzzlement.
In view of above-mentioned problem, the present inventor attempts to provide a kind of wafer fuse with precut substrate
Element, can effectively simplify excessively numerous and diverse production process, reduce cost of manufacture, the overall output efficiency of lifting and fine ratio of product；
And ensuring that precut will not be covered by other structures and outwards expose, lifting separates the smoothness of preform flow, and can
To select the curved portions elasticity bending that will further connect fuse body two ends away from substrate body so that curved portions are in fusing
Afterwards, residue in remainder at the curved portions of two ends can resilient separation each other, reduce the probability that phenomenon of arc discharge occurs, it is ensured that chip
The reliability that electrical fuse element is used, these all can be the focus to be paid attention to of the invention.
The content of the invention
One of the object of the invention is to provide a kind of unit of the wafer fuse with precut substrate of simplified production process
Part, reduces cost of manufacture, the overall fine ratio of product of lifting.
Another object of the present invention is to provide a kind of wafer fuse element with precut substrate, it is ensured that precut is not
Can be covered by other structures and outwards exposed, increase the smoothness of separation substrate flow.
Another object of the present invention is to provide a kind of manufacture method of wafer fuse element, will connect fuse body
The curved portions elasticity bending at two ends reduces the probability that phenomenon of arc discharge occurs, it is ensured that structure of the present invention uses upper away from substrate body
Reliability.
It is that, up to above-mentioned purpose, the present invention provides a kind of wafer fuse element with precut substrate, is installed for surface
To circuit board, the wafer fuse element includes：Substrate body, with upper surface, lower surface and connection upper surface and lower surface
Two ora terminalis, wherein substrate body is formed with the precut of opposite ends edge at least one of upper and lower surface；A pair
Separated from one another connects electrode, and connecting electrode includes being located at the weld pad portion of upper surface respectively and extend to lower surface by weld pad portion
Leg portion；One layer be located at upper surface, for closed-loop around the circular barrier layer in weld pad portion, for being collectively forming an appearance with substrate body
Between being empty, and do not cover precut and expose to the open air outside around barrier layer；One is located at accommodation space and two ends and is soldered respectively
To the fuse body in weld pad portion；And one layer close block accommodation space closed protective layer.
Manufacture method for making the foregoing wafer fuse element with precut substrate, comprises the following steps：a)
The a piece of base material with a upper surface and a lower surface is provided, the foregoing upper surface of the base material or lower surface are at least within
One, is formed with plural precut, is used to separate out a plurality of substrate bodies；And the upper surface side of each aforesaid base plate body point
Not Ju You one around barrier layer, each foregoing circular barrier layer is collectively forming an appearance with corresponding aforesaid base plate body respectively
Between being empty, and foregoing circular barrier layer is not covered foregoing precut and exposes foregoing precut to the open air；And respectively on each
State substrate body formed a pair it is separated from one another connect electrode, every a pair foregoing connect electrodes include respectively at least two be located at it is upper
The weld pad portion for stating upper surface and the leg portion that above-mentioned lower surface is extended to by foregoing weld pad portion；B) one by one in each above-mentioned appearance
It is respectively welded to above-mentioned weld pad portion between being empty, by the two ends of a fuse body；And c) one by one set closing block it is each before
State the closed protective layer of accommodation space, each aforementioned fuse body of closed protective.
Disclosed a kind of wafer fuse element and its preparation method with precut substrate, can effectively ensure that
Precut will not be covered by other structures and outwards expose, and thereby simplify excessively slow and expensive separating step, increase and separate
The smoothness of base material flow, reduces cost of manufacture, the overall output efficiency of lifting and fine ratio of product；And optionally by connection guarantor
The curved portions elasticity bending at the two ends of dangerous silk body is away from substrate body so that curved portions residue in the arc at two ends after fusing
The remainder in shape portion can resilient separation each other, reduce the probability that phenomenon of arc discharge occurs, it is ensured that wafer fuse element is used
Reliability in the case of high current, and then reach above-mentioned all of purpose.
Brief description of the drawings
Fig. 1 is the fuse structure top view of known technology.
The step of Fig. 2 is the first preferred embodiment of the invention flow chart, thereby shows the relevant wafer fuse unit of the present invention
The preparation method of part.
Fig. 3 has the still uncut top view of precut substrate for the first preferred embodiment of the invention, illustrates adjacent base
Precut is formed between plate body.
Fig. 4 for Fig. 3 side view, manifest the advance thermal sintering of base material circular barrier layer and explanation run through upper surface and under
The perforation on surface.
Fig. 5 welds the side view of fuse body for the accommodation space of the one of substrate body of Fig. 4 base materials.
Fig. 6 is fuse body fusing schematic diagram in Fig. 5, and being used to express the curved portions for residuing in two ends can elasticity point each other
From.
Fig. 7 is the side view that closed protective layer is inserted in accommodation space.
Fig. 8 is that each piece of substrate body is separated one by one with precut in Fig. 3 base materials, and completes the side-looking of electrical fuse element
Figure.
The step of Fig. 9 is the second preferred embodiment of the invention flow chart, thereby shows the relevant wafer fuse of the present invention
Another preparation method of element.
Figure 10 is that the second preferred embodiment of the invention drills through bowing for substrate body formation perforation in precut with instrument
View.
Figure 11 is the side view of Figure 10 substrate bodies, and thereby explanation is formed in perforation and connects electrode.
The substrate body that Figure 12 is connected after the completion of electrode fabrication for Figure 11 is located at upper surface and sets one layer of photoresistance film and light shield
Side view.
Figure 13 is that substrate body is common around forming a side view for accommodation space with around barrier layer in Figure 12.
Figure 14 sets one layer of side view of closed protective layer for the circular barrier layer of Figure 13.
Symbol description
1st, 1 ' ... substrate body 10,10 ' ... upper surfaces
11st, 11 ' ... precut 12,12 ' ... accommodation spaces
13 ... lower surface 14,14 ' ... is perforated
15 ... two ora terminalis 2,2 ' ... are around barrier layer
3rd, 3 ' ... connect electrode 30 ... weld pad portion
31 ... leg portions 4,4 ' ... fuse bodies
40 ... two ends 41 ... curved portions
5th, 5 ' ... closed protectives layer 50 ... arc extinguishing portion
51 ' ... top cover portion 7 ' ... light shields
70 ' ... photoresistance films
601-608 ... steps
Known elements
8 ... substrate 80 ... layer of silica gel
81 ... defibers
Specific embodiment
For the present invention foregoing and other technology contents, feature and effect, in the preferable of following cooperation Figure of description
In the detailed description of embodiment, can clearly appear from；Additionally, in embodiments, identical element is by with similar label table
Show.
The Making programme of first preferred embodiment of the invention as shown in the flowchart of figure 2, first such as step 601 and Fig. 3 institutes
Show, pluralized the substrate body 1 that is connected to each other, substrate adjacent to each other in a piece of advance zoning of the base material with ceramic material
All there is the precut 11 for being formed at such as chase of upper surface 10 between body 1, using can easily apply after Making programme terminates
External force is rapid to separate entire row preform and adjacent row, then again separates entire row preform one by one, and effectively to lift this example
Fluency when wafer fuse element makes, refer to Fig. 4, and each piece of upper surface of substrate body 1 10 has and substrate sheet
The phase same material of body 1 and the in advance circular barrier layer 2 of sinter molding, these circular barrier layers 2 avoid masking on being formed at completely
The precut 11 on surface 10, in case being finally separating the difficulty lifting of each substrate body 1.Certainly, such as those skilled in the art institute
Can know, even if foregoing precut changes can similarly be separated each piece of substrate body in lower surface shaping, having no can not.
In the accommodation space 12 being collectively forming around the substrate body 1 corresponding with each piece of barrier layer 2, got out with instrument
Two perforation 14 for running through upper surface 10 and lower surface 13 in pairs, then form connecting for metal conductive materials in perforation 14
Electrode 3, define herein to read smoothly, and what is contacted with upper surface 10 is weld pad portion 30；Lower surface 13 is extended to by weld pad portion 30
Be then leg portion 31, what both collectively formed this example connects electrode 3.Next as shown in step 602 and Fig. 5, in each appearance
Example is interpreted as the wherein one end at low resistance terne metal, aluminium, copper, the two ends 40 of the fuse body 4 of silver, in advance in 12 between being empty
One of weld pad portion 30 is soldered to slightly inclined angle, because the length of fuse body 4 is greater than two weld pad portions
Distance between 30, therefore such as step 603, when one end that fixation will not be soldered in two ends 40 is soldered to another weld pad portion 30,
The curved portions 41 for connecting two ends 40 elasticity can bend because of the extension characteristics of metal material so that curved portions 41 can be away from corresponding
Substrate body 1.Thereby ensuring that when such as 15A electric currents flow through its fusing of the cause of fuse body 4, with reference to Fig. 6, remaining in two ends 40
The nubbin of the curved portions 41 at place can each other resilient separation and space out, take precautions against curved portions 41 nubbin can because melting
And connect once again, allow fuse body 4 to lose effect of protection electronic circuit.
As shown in fig. 7, and then step 604, each accommodation space is inserted (not by the arc extinguishing portion 50 of closed protective layer 5
Label) in, the arc extinguishing portion 50 of this example is to liken the silica gel doped with quartz sand to, and the arc extinguishing portion 50 inserted in accommodation space will
Fuse body 4 low relative to the electronegativity of arc extinguishing portion 50 in each accommodation space is covered, causes the arc of fuse body 4
After portion 41 fuses, the meeting uptake and accumulation of arc extinguishing portion 50 prevents fuse body 4 in the unnecessary electric charge in the two ends 40 of fuse body 4
Ambient gas produce the situation of freeization because of high current, and then reduce the probability that phenomenon of arc discharge occurs.Certainly, as being familiar with this technology
Field personage is readily appreciated, even if individually inserting quartz sand powder herein, or even keeps being not filled with anything, equal nothing
Implement for fear of the present invention.
Last such as step 605, mechanical arm oppresses base material along precut 11 so that each substrate being initially connected to each other
Body 1 can be separated swimmingly, therefore such as Fig. 8, and the substrate body 1 after each separation is in the position of correspondence precut (non-label)
Put, two ora terminalis 15 of connection upper surface 10 and lower surface 13 can be formed with, so far constitute the wafer fuse element in this example.
Disclosed a kind of wafer fuse element and its preparation method with precut substrate, can effectively simplify
Excessively numerous and diverse production process, reduces cost of manufacture, the overall fine ratio of product of lifting；And ensure that precut will not be by other structures
Cover and outwards expose, increase the smoothness of separation substrate flow, and the curved portions bullet at the two ends of fuse body will be connected
Property bending away from substrate body so that curved portions after fusing, residue in two ends curved portions remainder can each other elasticity
Separate, reduce the probability that phenomenon of arc discharge occurs, it is ensured that the reliability that wafer fuse element is used.
As shown in Figures 9 to 11, if step 606 is wearing previous embodiment in the second preferred embodiment of the invention
Hole 14 ', is arranged in the precut 11 ' between adjacent substrate body 1 ', then with sputter so that instrument drills through substrate body 1 '
Technical matters connects electrode 3 ' the conductive metal materials such as middle plating the last layer such as copper or silver of perforation 14 ', however, only with sputter
Mode made, because the deficiency of the uniformity and thickness is difficult to reach good use reliability, therefore afterwards by this example
Base material carry out the means of barrel plating suppression or chemical plating, the electrode 3 ' that connects perforated in 14 ' thickened, when raising is conductively connected
Stability.And then Figure 12 and step 607 are refer to, one layer of photoresistance film 70 ' is imprinted in upper surface 10 ', then in photoresistance film 70 '
Top cover one group of light shield 7 ' be exposed, allow the exposed part of photoresistance film 70 ' to be cured, then by uncured photoresistance film
70 ' carry out development removal, and being formed has predetermined circular shape, and certainly, those skilled in the art can know easily, if foregoing
When the thickness of photoresistance film is not enough, effect for thickening can be reached in another layer of photoresistance film of impressing is increased in developed photoresistance film,
Above-mentioned exposure and development flow are repeated, until the thickness for completing predetermined becomes as shown in figure 13, one layer is arranged at upper surface 10 '
Circular barrier layer 2 ', part that is original uncured and suffering development removal is then defined as by around barrier layer 2 ' and correspondence
The accommodation space 12 ' that is collectively forming of substrate body 1 ', use completing multiple and not yet carry out the substrate bodies 1 ' of detached job
Structure.
Thereafter installation procedure is all identical with previous embodiment, does not add to repeat herein, is only described with regard to difference step
Illustrate, as shown in step 608 and Figure 14, after the fuse body 4 ' of previous embodiment is completed, by closed protective layer 5 '
Top cover portion 51 ' be covered on corresponding circular barrier layer 2 ', cause accommodation space 12 ' formed a complete closed cavity,
It is last then as previously described in a prior embodiment, applying external force to precut by mechanical arm carries out the detached job of substrate body so that
A plurality of wafer fuse elements can be quickly completed, effectively the expenditure that is smooth and reducing production cost of lifting Making programme.
The foregoing is only presently preferred embodiments of the present invention, it is impossible to the scope of present invention implementation is limited with this, it is every
The simple equivalence changes made according to claims of the present invention and description and modification, all should still belong to patent of the present invention and contain
In the range of lid.
Claims (9)
1. a kind of wafer fuse element with precut substrate, for being surface mounted to circuit board, the wafer fuse element
Including：
One substrate body, with a upper surface, one in contrast to the upper surface lower surface and connect under the upper surface and this
Two ora terminalis on surface, the wherein substrate body are formed with foregoing two ora terminalis of correspondence at least one of the upper surface and the lower surface
Precut；
A pair separated from one another to connect electrode, and this pair connects electrode to be included positioned at the weld pad portion of above-mentioned upper surface and by preceding respectively
State the leg portion that weld pad portion extends to above-mentioned lower surface；
One layer be located at the upper surface, for closed-loop around the circular barrier layer in above-mentioned weld pad portion, for being collectively forming with the substrate body
One accommodation space, and the circular barrier layer do not cover foregoing precut and exposes foregoing precut to the open air；
One fuse body for being soldered to above-mentioned weld pad portion respectively positioned at above-mentioned accommodation space and two ends；And
One layer is closed the closed protective layer for blocking the accommodation space.
2. there is the wafer fuse element of precut substrate as claimed in claim 1, the wherein fuse body is further included
Connect above-mentioned two ends and elasticity bending and away from the curved portions of aforesaid substrate body upper surface so that when foregoing curved portions fusing
When, remaining in curved portions nubbin at above-mentioned two ends can resilient separation each other.
3. there is the wafer fuse element of precut substrate as claimed in claim 1, wherein closed protective layer includes filling out
Fill the arc extinguishing portion higher than above-mentioned fuse body in the accommodation space and electronegativity.
4. the wafer fuse element with precut substrate as described in claim 1,2 or 3, the wherein closed protective layer bag
Include a top cover portion being covered on above-mentioned circular barrier layer.
5. a kind of manufacture method of the wafer fuse element with precut substrate, comprises the following steps：
A) a piece of base material with a upper surface and a lower surface is provided, the foregoing upper surface of the base material or lower surface are extremely
Few one of which, is formed with plural precut, is used to separate out a plurality of substrate bodies；And the upper table of each aforesaid base plate body
Surface side has one around barrier layer respectively, and each foregoing circular barrier layer is collectively forming with corresponding aforesaid base plate body respectively
One accommodation space, and foregoing circular barrier layer do not cover foregoing precut and exposes foregoing precut to the open air；And exist respectively
Each aforesaid substrate body formed a pair it is separated from one another connect electrode, the every a pair foregoing electrodes that connect include at least two respectively
The leg portion of above-mentioned lower surface is extended to positioned at the weld pad portion of above-mentioned upper surface and by foregoing weld pad portion；
B) it is respectively welded to above-mentioned weld pad portion one by one in each above-mentioned accommodation space, by the two ends of a fuse body；And
C) the closed protective layer that each foregoing accommodation space is blocked in closing, each aforementioned fuse sheet of closed protective are set one by one
Body.
6. there is the manufacture method of the wafer fuse element of precut substrate, wherein step b) as claimed in claim 5
The step of middle installation aforementioned fuse body, further includes following step：
B1 the curved portions elasticity bending respectively at the above-mentioned two ends of each aforementioned fuse body) will be connected one by one, away from corresponding
Each aforesaid substrate body.
7. there is the manufacture method of the wafer fuse element of precut substrate, wherein step c) as claimed in claim 5
Further include an arc extinguishing portion by each foregoing closed protective layer and be filled in corresponding each foregoing accommodation space, cover electronegativity
The secondary step c1 of low each aforementioned fuse body).
8. there is the manufacture method of the wafer fuse element of precut substrate, wherein step c) as claimed in claim 5
Further include the hyposynchronization that a top cover portion by each foregoing closed protective layer is covered on corresponding each above-mentioned circular barrier layer
Rapid c2).
9. the manufacture method of the wafer fuse element with precut substrate as described in claim 5,6,7 or 8, further includes
Step d) after step c) forms a plurality of wafer fuse elements along each foregoing pre-cut wire cutting base material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510847489.0A CN106816428B (en) | 2015-11-27 | 2015-11-27 | Wafer fuse element and its preparation method with precut substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510847489.0A CN106816428B (en) | 2015-11-27 | 2015-11-27 | Wafer fuse element and its preparation method with precut substrate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106816428A true CN106816428A (en) | 2017-06-09 |
| CN106816428B CN106816428B (en) | 2019-04-23 |
Family
ID=59102144
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510847489.0A Expired - Fee Related CN106816428B (en) | 2015-11-27 | 2015-11-27 | Wafer fuse element and its preparation method with precut substrate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106816428B (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101313382A (en) * | 2005-10-03 | 2008-11-26 | 保险丝公司 | Fuse with cavity forming enclosure |
| CN101894716A (en) * | 2009-05-21 | 2010-11-24 | 邱鸿智 | Metal-jointed high voltage fuse structure and manufacturing method thereof |
| CN102184816A (en) * | 2011-05-13 | 2011-09-14 | Aem科技(苏州)股份有限公司 | Suspended-fuse-wire-type surface-mount fuse and manufacturing method thereof |
| CN102664127A (en) * | 2012-05-10 | 2012-09-12 | 苏州晶讯科技股份有限公司 | Surface-mounted fuser |
-
2015
- 2015-11-27 CN CN201510847489.0A patent/CN106816428B/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101313382A (en) * | 2005-10-03 | 2008-11-26 | 保险丝公司 | Fuse with cavity forming enclosure |
| CN101894716A (en) * | 2009-05-21 | 2010-11-24 | 邱鸿智 | Metal-jointed high voltage fuse structure and manufacturing method thereof |
| CN102184816A (en) * | 2011-05-13 | 2011-09-14 | Aem科技(苏州)股份有限公司 | Suspended-fuse-wire-type surface-mount fuse and manufacturing method thereof |
| CN102664127A (en) * | 2012-05-10 | 2012-09-12 | 苏州晶讯科技股份有限公司 | Surface-mounted fuser |
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| CN106816428B (en) | 2019-04-23 |
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