CN212342382U - High-power resistor of press-fitting structure - Google Patents
High-power resistor of press-fitting structure Download PDFInfo
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- CN212342382U CN212342382U CN202022038209.0U CN202022038209U CN212342382U CN 212342382 U CN212342382 U CN 212342382U CN 202022038209 U CN202022038209 U CN 202022038209U CN 212342382 U CN212342382 U CN 212342382U
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Abstract
The utility model discloses a high-power resistor of pressure equipment structure, wherein the resistor includes resistance chip, a plurality of insulation substrate and two electrode slices, and a plurality of insulation substrate set up between two electrode slices, and resistance chip sets up and is being located between two innermost insulation substrate. According to the resistor, the resistor chip, the insulating substrate, the insulating film and the electrode plates are stacked layer by layer, so that the two electrode plates located on the outermost side are in a parallel state, the two electrode plates can be respectively fixed on the two external electrodes in a press-fitting mode, and then the resistor can simultaneously dissipate heat through the two electrode plates located at the two ends of the resistor in the working process.
Description
Technical Field
The utility model relates to an electric elements field, in particular to high-power resistor of pressure equipment structure.
Background
The resistor is an indispensable part of the present electronic devices, and as the electronic devices are applied more and more in various industries, the models of the electronic devices are more and more diversified and the sizes of the electronic devices are smaller, which leads to different requirements on the structures and the sizes of the resistors. Most of resistors used in an air cooling system and a water cooling system in an existing electric power system are mounted on a single surface, and most of heat of the resistor mounted on the single surface is dissipated through a mounting contact surface of the resistor, so that the heat dissipation rate of a part, far away from the mounting contact surface, of the resistor is low.
SUMMERY OF THE UTILITY MODEL
The utility model discloses aim at solving one of the technical problem that exists among the prior art at least. Therefore, the utility model provides a high-power resistor of pressure equipment structure can be fixed on two external electrodes through the pressure equipment hard with its two electrode slices, utilizes the two sides to dispel the heat simultaneously.
According to the utility model discloses a high-power resistor of pressure equipment structure of embodiment, including resistance chip; the insulation substrate comprises a plurality of first insulation substrates and a plurality of second insulation substrates, the first insulation substrates and the second insulation substrates are respectively arranged on two sides of the resistor chip, and the first insulation substrates are provided with first through holes; the electrode plates comprise a first electrode plate and a second electrode plate, the first electrode plate and the second electrode plate are respectively arranged on a first insulating substrate and a second insulating substrate which are positioned on the outermost side, the first electrode plate is electrically connected with the resistance chip through a conductive structure arranged in the first through hole, and the second electrode plate is electrically connected with the resistance chip through a conductive structure arranged on the outer side of the edge of the second insulating substrate.
According to the utility model discloses high-power resistor of pressure equipment structure has following beneficial effect at least: through setting up insulating substrate in resistance chip's both sides, set up two electrode slices on two insulating substrate in the outside, be connected two electrode slices with resistance chip electricity respectively, resistance chip, insulating substrate and electrode slice superpose layer upon layer, finally make the electrode slice that is located two sides be in the state of being parallel, when using this resistor, exert huge external force and press down respectively two electrode slices of resistor and fix on two external electrodes, it is together fixed with the direct crimping of external line to make the electrode slice, and then make the resistor dispel the heat simultaneously through two electrode slices that are located its both ends at the in-process of work, the radiating efficiency of improvement resistor.
According to some embodiments of the utility model, the two poles of the earth of resistance chip are first electrode and second electrode respectively, and the position of first electrode is just to first through-hole, and the second electrode salient is in the edge of second insulating substrate.
According to the utility model discloses a some embodiments, all be provided with insulating film between the adjacent insulating substrate, between insulating substrate and the electrode slice, insulating film's size can cover whole resistance chip.
According to the utility model discloses a some embodiments still are provided with the shell, and resistance chip, insulating substrate, insulating film and electrode piece set up in the inside of shell, and it has insulating heat-conducting glue all to fill between resistance chip, insulating substrate, insulating film, electrode piece and the shell.
According to some embodiments of the utility model, be provided with the second through-hole on the first electrode piece, first through-hole sets up with the second through-hole is concentric.
According to some embodiments of the utility model, still be provided with second through-hole complex abaculus.
According to the utility model discloses a some embodiments, the medial surface of second through-hole is provided with the first groove of dodging, and the side that first electrode slice is close to first insulating substrate is provided with the second groove of dodging.
According to some embodiments of the utility model, be provided with the third on the lateral wall of second electrode slice and dodge the groove.
Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.
Drawings
The above and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:
fig. 1 is a perspective view of a resistor according to an embodiment of the present invention;
fig. 2 is an exploded view of a resistor according to an embodiment of the present invention;
fig. 3 is a schematic diagram of a resistor chip according to an embodiment of the present invention;
fig. 4 is a perspective view of an electrode sheet provided with a second through hole in an embodiment of the present invention.
Reference numerals:
the resistor comprises a resistor 100, a resistor chip 110, a first electrode 111, a second electrode 112, a first insulating substrate 120, a first through hole 121, a second insulating substrate 130, a first electrode sheet 140, a second through hole 141, a first avoidance groove 142, a second avoidance groove 143, a third avoidance groove 144, an embedding block 145, a second electrode sheet 150 and a shell 160.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary only for the purpose of explaining the present invention, and should not be construed as limiting the present invention.
In the description of the present invention, it should be understood that the orientation or positional relationship indicated with respect to the orientation description, such as up, down, front, rear, left, right, etc., is based on the orientation or positional relationship shown in the drawings, and is only for convenience of description and simplification of description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention.
In the description of the present invention, a plurality of means are one or more, a plurality of means are two or more, and the terms greater than, less than, exceeding, etc. are understood as not including the number, and the terms greater than, less than, within, etc. are understood as including the number. If the first and second are described for the purpose of distinguishing technical features, they are not to be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated or implicitly indicating the precedence of the technical features indicated.
In the description of the present invention, unless there is an explicit limitation, the words such as setting, installation, connection, etc. should be understood in a broad sense, and those skilled in the art can reasonably determine the specific meanings of the above words in combination with the specific contents of the technical solution.
Referring to fig. 1 and 2, the high-power resistor of the press-fitting structure according to the embodiment of the present invention includes a resistor chip 110, an insulating substrate, and an electrode plate. The resistor chip 110 is provided in one piece, the resistor chip 110 is formed by cutting an alloy resistor, is manufactured in a sheet structure and is provided in a bent shape, and two poles of the resistor chip 110 electrically connected with the outside are respectively provided at the middle and the edge thereof. The number of the insulating substrates is two, the two insulating substrates are respectively a first insulating substrate 120 and a second insulating substrate 130, the first insulating substrate 120 and the second insulating substrate 130 are respectively arranged on two sides of the resistor chip 110, and the first insulating substrate 120 is provided with first through holes 121 at the same position. The number of the electrode sheets is two, the two electrode sheets are a first electrode sheet 140 and a second electrode sheet 150, respectively, the first electrode sheet 140 is disposed on the outer side surface of the first insulating substrate 120, and the second electrode sheet 150 is disposed on the outer side surface of the second insulating substrate 130. The first electrode sheet 140 and the second electrode sheet 150 are respectively disposed on the outer side surfaces of the two insulating substrates, and the side surfaces of the first insulating substrate 120 and the second insulating substrate 130 can both cover the side surface of the resistor chip 110, so that the resistor chip 110 can be completely separated from the first electrode sheet 140 by the first insulating substrate 120, and the resistor chip 110 can be completely separated from the second electrode sheet 150 by the second insulating substrate 130. The first electrode sheet 140 is electrically connected to the resistance chip 110 through a conductive structure disposed in the first through hole 121, and the second electrode sheet 150 is electrically connected to the resistance chip 110 through a conductive structure disposed outside an edge of the second insulating substrate 130.
According to practical situations, the two electrode pads and the resistor chip 110 may be electrically connected through a lead, or the two electrode pads and the resistor chip 110 may be electrically connected by disposing a metal conductive layer on the first through holes 121 or the sidewalls thereof on the plurality of insulating substrates.
According to the actual situation, the number of the insulating substrates may also be set to be two, one is a plurality of first insulating substrates 120, the other is a plurality of second insulating substrates 130, the first insulating substrates 120 and the second insulating substrates 130 are respectively disposed on two sides of the resistor chip 110, wherein all the first insulating substrates 120 are provided with first through holes 121 having the same position.
Through setting up insulating substrate in resistance chip 110's both sides, set up two electrode slices on the lateral surface of two sets of insulating substrate in the outside, be connected two electrode slices with resistance chip 110 electricity respectively, its advantage is, can make resistance chip 110, insulating substrate and electrode slice superpose layer upon layer, and two electrode slices are in parallel state, make the electrode slice of resistor 100 both sides can bear huge pressure. When the resistor 100 is used, huge pressure can be applied to press and fix the two electrode plates of the resistor 100 on the two external electrodes respectively, so that the resistor can simultaneously dissipate heat through the two electrode plates at the two ends of the resistor in the working process, and meanwhile, the installation space occupied by pins is saved.
Referring to fig. 3, according to some embodiments of the present invention, the two electrodes of the resistor chip 110 are the first electrode 111 and the second electrode 112, respectively, the first electrode 111 is located opposite to the first through hole 121, and the second electrode 112 protrudes from the edge of the second insulating substrate 130. By thus disposing the first and second electrodes 111 and 112, it is advantageous to facilitate electrical connection of the resistor chip 110 with the first and second electrode pads 140 and 150. When the resistance chip 110 is electrically connected to the first electrode tab 140 by using a lead, the middle of the lead passes through the first through hole 121, one end of the lead is connected to the first electrode 111, and the other end of the lead is connected to the first electrode tab 140; when the resistance chip 110 is electrically connected to the second electrode pad 150 by a lead, one end of the lead is connected to the second electrode 112, the other end of the lead is connected to the second electrode pad 150, and the middle of the lead crosses over the plurality of second insulating plates 130.
According to some embodiments of the present invention, an insulating film (not shown in the drawings) is disposed between adjacent insulating substrates, and an insulating film is disposed between the insulating substrate and the electrode sheet. By providing an insulating film, it is advantageous to achieve double protection of the resistor 100, reducing the likelihood that the resistor 100 will break down during operation. Meanwhile, the insulating film is sized to cover the entire resistor chip 110. Since the insulating substrate is made of a material having a certain hardness and strength and cannot be arbitrarily set in shape, the first electrode 111 is located at the end of the first through hole 121, and the second electrode 112 protrudes from the edge of the second insulating substrate 130, both the first insulating substrate 120 and the second insulating substrate 130 cannot completely cover the ends of the two electrodes of the resistor chip 110, and the ends of the two poles of the resistor chip 110 may cause resistance breakdown. Through setting up insulating film, its benefit is that insulating film is soft can be laid along with the object appearance, lays insulating film between adjacent insulating substrate to and lay between insulating substrate and electrode slice, utilize soft insulating film to compensate not by the part of separating between resistance chip 110 and the electrode slice, make insulating film can cover whole resistance chip 110 completely and realize the insulation between resistance chip 110 and the electrode slice, avoid the condition that resistor 100 is punctured to take place.
According to some embodiments of the present invention, a housing 160 is further provided, the resistor chip 110, the insulating substrate, the insulating film and the electrode plate are disposed inside the housing 16-, and insulating heat-conducting glue is filled between the resistor chip 110, the insulating substrate, the insulating film, the electrode plate and the housing 160. The resistance chip 110, the first insulating substrate 120, the second insulating substrate 130, the first electrode plate 140 and the second electrode plate 150 are integrally arranged inside the accommodating cavity of the shell 160, and the retaining edges can limit the movement of the resistance chip 110, the two insulating substrates and the two electrode plates and prevent the resistance chip 110, the two insulating substrates and the two electrode plates from falling off from the shell 160. All gaps among the resistance chip 110, the insulating substrate, the insulating film, the electrode slice and the shell 160 are filled with insulating heat-conducting glue, so that air among the resistance chip 110, the insulating substrate, the insulating film, the electrode slice and the shell 160 is squeezed out, and the phenomenon of breakdown when the resistor 100 is electrified for use is avoided; meanwhile, the insulating heat-conducting adhesive can be in full contact with the resistor chip 110, the insulating substrate, the insulating film, the electrode plate and the housing 160, so that the heat dissipation rate of each part in the resistor 100 is improved, and finally, the heat inside the resistor 100 is conducted to the two electrode plates on the two side surfaces of the resistor 100, so that the heat dissipation performance of the resistor 100 is improved.
Referring to fig. 2, according to some embodiments of the present invention, the first electrode sheet 140 is provided with a second through hole 141, and the first through hole 121 is concentrically disposed with the second through hole 141. The second through hole 141 is formed in the first electrode sheet 140, and the first through hole 121 and the second through hole 141 are concentrically arranged, so that the advantage that the insulating heat-conducting glue is conveniently injected into the first through hole 121 on the insulating substrate, and the difficulty of the manufacturing process is reduced.
Referring to fig. 2, according to some embodiments of the present invention, an insert 145 cooperating with the second through hole 141 is further provided. The insert 145 capable of being matched with the second through hole 141 is arranged, the second through hole 141 on the first electrode plate 140 is filled, the outer side face of the first electrode plate 140 forms a whole plane, and meanwhile, the insert 145 is in full contact with the insulating heat-conducting glue in the first through hole 121, so that the area of the first electrode plate 140 is increased, namely, the heat dissipation area of the first electrode plate 140 is increased, and the heat dissipation performance of the resistor 100 is improved.
Referring to fig. 4, according to some embodiments of the present invention, the inner side surface of the second through hole 141 is provided with a first avoiding groove 142, and the side surface of the first electrode sheet 140 close to the first insulating substrate 120 is provided with a second avoiding groove 143. The first avoiding groove 142 is provided to accommodate a conductive structure, such as a lead, when the resistor chip 110 is connected to the first and second electrode sheets 140 and 150, respectively, via the conductive structure, so that the lead is fixed when the lead is welded in the second through hole 141, and the contact area between the lead and the first electrode sheet 140 can be increased. A second avoiding groove 143 is provided on a side of the first electrode sheet 140 close to the first insulating substrate 120, and the second avoiding groove 143 is used to accommodate a welding beading generated when the lead is welded.
Referring to fig. 2, according to some embodiments of the present invention, a third avoidance groove 144 is provided on a side wall of the second electrode sheet 150. The third avoiding groove 144 is formed in the second electrode plate 150, so that the second electrode plate can be conveniently connected with a conductive structure, according to actual conditions, the third avoiding groove 144 can be selectively formed only on part of the side wall of the second electrode plate 150, the third avoiding groove 144 can also be formed in a whole circle of the side wall of the second electrode plate 150, if the third avoiding groove 144 is selectively formed in a whole circle of the side wall of the second electrode plate 150, the manufacturing cost can be reduced, and meanwhile, the third avoiding groove 144 and the resistor chip 110 do not need to be particularly aligned in the mounting and welding process.
Referring to fig. 1 to 4, a high power resistor of a press-fitting structure according to an embodiment of the present invention is described in detail as a specific embodiment. It is to be understood that the following description is exemplary only, and is not a specific limitation of the invention.
The high power resistor of the press-fit structure includes a resistance chip 110, an insulating substrate, an insulating film, an electrode sheet, an insert 145, and a case 160. The resistor chip 110 is cut into a sheet shape by an alloy resistor, two poles of the resistor chip 110 are a first electrode 111 and a second electrode 112 respectively, the first electrode 111 faces the first through hole 121, and the second electrode 112 protrudes out of the edge of the second insulating substrate 130. The insulating substrates are provided with a plurality of first insulating substrates 120 and a plurality of second insulating substrates 130, and the first insulating substrates 120 are provided with first through holes 121. The insulating film is provided with a plurality of layers. The two electrode sheets are respectively a first electrode sheet 140 and a second electrode sheet 150, the first electrode sheet 140 is provided with a second through hole 141 concentric with the first through hole 121, the inner side surface of the second through hole 141 is provided with a first avoidance groove 142, the side surface of the first electrode sheet 140 close to the first insulating substrate 120 is provided with a second avoidance groove 143, and the side wall of the second electrode sheet 150 is provided with a third avoidance groove 144. The insert 145 is provided with one insert 145, and the insert 145 is matched with the second through hole 141, so that the first electrode plate 140 can form a complete plane by inserting the insert 145 into the second through hole 141.
A plurality of insulating substrates, electrode plates and an embedding block 145 are sequentially arranged on two sides of the resistor chip 110, a plurality of insulating films are arranged between adjacent insulating substrates and between the insulating substrates and the electrode plates, insulating heat-conducting glue is coated between the resistor chip 110 and the insulating substrates, between the insulating substrates and the insulating films and between the insulating films and the electrode plates, wherein the first insulating substrate 120 and the first electrode plate 140 are positioned on the same side of the resistor chip 110, and the insulating films positioned between the first through hole 121 and the second through hole 141 are also provided with corresponding holes to communicate the first through hole 121 and the second through hole 141; the second insulating substrate 13 and the second electrode tab 150 are located at the other side of the resistance chip 110. The first electrode sheet 140 is connected to the resistor chip 110 by a lead wire, the lead wire is disposed in the first avoiding groove 142 on the first through hole 121, and the lead wire is welded in the first avoiding groove 142, and a weld beading generated by welding is accommodated in the second avoiding groove 143; the second electrode plate 150 is connected to the resistor chip 110 by a lead, one end of the lead is welded in the third avoiding groove 144 formed in the second electrode plate 150, and the other end of the lead is electrically connected to the edge of the resistor chip 110. Insulating heat-conducting glue is injected into the first through hole 121 and the second through hole 141, and the insert 145 is embedded into the second through hole 141 and applies pressure to compact the insert 145. The whole body composed of the resistance chip 110, the insulating substrate, the insulating film, the electrode plate and the insert 145 is placed in the housing 160, and insulating heat-conducting glue is injected into the gap between the resistance chip 110, the insulating substrate, the insulating film, the electrode plate and the housing 160. After the resistor chip 110 is attached to the insulating substrate, the insulating substrate is attached to the insulating film, and the insulating film is attached to the electrode plate, pressure is applied to two side surfaces of the resistor chip 110, the insulating substrate, the insulating film, and the electrode plate, so that the resistor chip 110, the insulating substrate, the insulating film, and the electrode plate can be in full contact with the insulating heat-conducting adhesive.
According to the utility model discloses a high-power resistor of pressure equipment structure, through so setting up, can reach some effects as follows at least: the resistor chip 110, the insulating substrate, the insulating film, and the electrode sheets are stacked layer by layer, so that the first electrode sheet 140 and the second electrode sheet 150 are in a parallel state, and the electrode sheets on both sides of the resistor 100 can bear a large pressure. When the resistor 100 is used, the resistor 100 can be directly pressed and fixed on the two external electrodes by a huge external force, so that the heat of the resistor can be simultaneously dissipated by the two electrode sheets which are positioned at the two ends of the resistor and are in contact with the external electrodes in the working process. Meanwhile, the installation space occupied by the pins is saved, and the function of connecting two layers of circuits is achieved. The heat dissipation is directly performed through the electrode plates and the embedded blocks 145, so that the heat dissipation performance is good, and meanwhile, the heat dissipation performance of the resistor 100 is further improved by pouring insulating heat-conducting glue.
The embodiments of the present invention have been described in detail with reference to the accompanying drawings, but the present invention is not limited to the above embodiments, and various changes can be made without departing from the spirit of the present invention within the knowledge of those skilled in the art.
Claims (8)
1. High-power resistor of pressure equipment structure, its characterized in that includes:
a resistor chip;
the insulation substrate comprises a plurality of first insulation substrates and a plurality of second insulation substrates, the first insulation substrates and the second insulation substrates are respectively arranged on two sides of the resistor chip, and the first insulation substrates are provided with first through holes;
the electrode plates comprise a first electrode plate and a second electrode plate, the first electrode plate and the second electrode plate are respectively arranged on the first insulating substrate and the second insulating substrate which are positioned on the outermost side, the first electrode plate is electrically connected with the resistor chip through a conductive structure arranged in the first through hole, and the second electrode plate is electrically connected with the resistor chip through a conductive structure arranged on the outer side of the edge of the second insulating substrate.
2. A high power resistor of a press-fitting structure according to claim 1, wherein: the two poles of the resistor chip are respectively a first electrode and a second electrode, the first electrode is opposite to the first through hole, and the second electrode protrudes out of the edge of the second insulating substrate.
3. A high power resistor of a press-fitting structure according to claim 2, wherein: and insulating films are arranged between the adjacent insulating substrates and between the insulating substrates and the electrode plates, and the size of each insulating film can cover the whole resistor chip.
4. A high power resistor of a press-fitting structure according to claim 3, wherein: the resistance chip, the insulation substrate, the insulation film and the electrode plate are arranged in the shell, and insulation heat-conducting glue is filled among the resistance chip, the insulation substrate, the insulation film, the electrode plate and the shell.
5. A high power resistor of a press-fitting structure according to claim 4, wherein: the first electrode sheet is provided with a second through hole, and the first through hole and the second through hole are concentrically arranged.
6. A power resistor in a press-fitting structure according to claim 5, wherein: and an embedded block matched with the second through hole is also arranged.
7. A power resistor in a press-fitting structure according to claim 5, wherein: the inner side surface of the second through hole is provided with a first avoidance groove, and the side surface of the first electrode plate close to the first insulating substrate is provided with a second avoidance groove.
8. A power resistor in a press-fitting structure according to claim 5, wherein: and a third avoidance groove is formed in the side wall of the second electrode plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022038209.0U CN212342382U (en) | 2020-09-16 | 2020-09-16 | High-power resistor of press-fitting structure |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202022038209.0U CN212342382U (en) | 2020-09-16 | 2020-09-16 | High-power resistor of press-fitting structure |
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| CN212342382U true CN212342382U (en) | 2021-01-12 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112071538A (en) * | 2020-09-16 | 2020-12-11 | 广东意杰科技有限公司 | High-power resistor with press-fitting structure and manufacturing method of resistor |
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2020
- 2020-09-16 CN CN202022038209.0U patent/CN212342382U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112071538A (en) * | 2020-09-16 | 2020-12-11 | 广东意杰科技有限公司 | High-power resistor with press-fitting structure and manufacturing method of resistor |
| CN112071538B (en) * | 2020-09-16 | 2024-06-25 | 广东意杰科技有限公司 | High-power resistor with press-fit structure and manufacturing method of resistor |
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