CN212303619U - Working plate - Google Patents

Abstract

The utility model provides a working plate, including frame part, soaking part and heating part are located frame part's inside, and the upper surface and the frame part of soaking part bond, and the lower surface and the heating part of soaking part bond. The utility model discloses can make the degree of consistency control of working disc surface temperature within three percent, and through the thermal-insulated function of thermal-insulated dish, it is less to the heat of its below release to reduce the working disc, can alleviate the change of mechanism size, shape below the working disc that leads to because temperature change when avoiding the heat waste to because thermal-insulated dish pressurized deflection is less, introduction that can reduce the error makes this working disc be applicable to in the wafer probe platform.

Description

Working plate

Technical Field

The utility model relates to a semiconductor device technical field, in particular to working disc.

Background

The working disc is an important component of the wafer probe station, and the heating function of the working disc is an important function for detecting the wafer. However, the heating uniformity of the working disk in the current market is low, and heat can be released below the working disk after heating, so that the heating uniformity of the working disk is obviously not suitable for a wafer probe station, and how to improve the heating uniformity of the working disk and avoid releasing heat below the working disk is a problem which needs to be solved urgently in the industry.

SUMMERY OF THE UTILITY MODEL

In view of the above technical problem, the utility model aims at providing a working disc realizes the even heating to the wafer through frame part, soaking part and heating part, and is less to the heat of working disc below release, reduces the influence to the part below the working disc. In order to achieve the above purpose, the utility model adopts the following specific technical scheme:

the utility model provides a working plate, including frame part, soaking part and heating part, frame part includes the dial plate and has the thermal-insulated dish in thermal-insulated chamber, and soaking part and heating part are located thermal-insulated intracavity, and screw and thermal-insulated dish fixed connection are passed through to the top that the dial plate is located thermal-insulated chamber, and the upper surface of soaking part bonds with the lower surface of dial plate, and the lower surface and the heating part of soaking part bond.

Preferably, the soaking portion comprises a first heat-conducting strip and a homogenizing disc, the upper surface of the first heat-conducting strip is bonded with the dial, and the lower surface of the first heat-conducting strip is bonded with the upper surface of the homogenizing disc.

Preferably, the heating part comprises a second heat-conducting fin, a heating fin and a third heat-conducting fin, the upper surface of the second heat-conducting fin is bonded with the lower surface of the homogenization disc, the lower surface of the second heat-conducting fin is bonded with the upper surface of the heating fin, and the lower surface of the heating fin is bonded with the upper surface of the third heat-conducting fin.

Preferably, the lower surface of the third heat-conducting sheet is bonded to the heat insulating plate.

Preferably, the heating sheet and the second heat-conducting sheet have a gap therebetween.

Preferably, a wire outlet hole is reserved at the position of the heat insulation disc corresponding to the gap.

Preferably, the thermally insulating disk is a ceramic disk.

Preferably, the homogenization disc is an alumina ceramic plate.

Preferably, the first heat-conducting fin, the second heat-conducting fin and the third heat-conducting fin are all silica gel fins.

The utility model discloses can gain following technological effect:

1. the uniformity of the surface temperature of the working disc can be controlled within three percent;

2. the heat released downwards by the working disc is reduced by the heat insulation function of the heat insulation disc, so that the waste of heat is avoided;

3. the size and shape changes of the part below the working disc caused by temperature changes are reduced;

4. the influence on the detection precision when the working plate is heated is reduced;

5. the heat insulation disc has small compression deformation, can reduce the introduction of errors, and enables the working disc to be suitable for a wafer probe station.

Drawings

Fig. 1 is a top view of a work plate according to an embodiment of the present invention;

FIG. 2 is a cross-sectional view taken along line A-A of FIG. 1;

FIG. 3 is a block diagram of a frame portion according to one embodiment of the present invention;

fig. 4 is a structural view of a soaking part according to an embodiment of the present invention;

fig. 5 is a structural view of a heating portion according to an embodiment of the present invention.

Wherein the reference numerals include: the heat-insulating plate comprises a frame part 1, a dial plate 1-1, a heat-insulating plate 1-2, screws 1-3, lead extension holes 1-4, a soaking part 2, a first heat-conducting fin 2-1, a homogenizing plate 2-2, a heating part 3, a second heat-conducting fin 3-1, a heating fin 3-2, a third heat-conducting fin 3-3 and a gap 3-4.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention will be further described in detail with reference to the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and do not constitute limitations on the invention.

The working plate provided by the embodiment of the present invention will be described in detail below.

Fig. 1 and 2 show a top view and a cross-sectional structure along line a-a of a work tray according to an embodiment of the present invention, respectively.

As shown in fig. 1, the embodiment of the present invention provides a working plate, including: frame part 1, soaking part 2 and heating part 3, soaking part 2 bonds in frame part's inside with heating part 3, and soaking part 2 bonds in heating part 3's top, and the heat that heating part 3 produced transmits for soaking part 2, and soaking part 2 transmits for frame part 1 after with the heat soaking.

More specifically, the upper surface of the soaking portion 2 is bonded to the frame portion 1, the lower surface of the soaking portion 2 is bonded to the upper surface of the heating portion 3, and the lower surface of the heating portion 3 is bonded to the frame portion 1.

Fig. 3 shows a structure of a frame portion according to an embodiment of the present invention.

As shown in fig. 3, the frame part 1 comprises a dial 1-1 and a heat insulation disc 1-2, the dial 1-1 is used for bearing a wafer, the heat insulation disc 1-2 is provided with a heat insulation cavity, the soaking part 2 and the heating part 3 are positioned in the heat insulation cavity, the dial 1-1 is embedded above the heat insulation cavity and is fixedly connected with the heat insulation disc 1-2 through a screw 1-3. The upper surface of the soaking part 2 is adhered with the dial 1-1, and the lower surface of the heating part 3 is adhered with the heat insulation plate 1-2.

The projection shapes of the dial plate 1-1 and the heat insulation plate 1-2 on the horizontal plane are both circular, the screws 1-3 are uniformly distributed on the periphery of the frame part 1, four screws 1-3 are shown in the figure 1, and the dial plate 1-1 and the heat insulation plate 1-2 are locked by the four screws 1-3 from the side surface of the frame part 1, so that the screws 1-3 are prevented from damaging the surface of the dial plate 1-1.

After the dial 1-1 and the heat insulation disc 1-2 are locked by the screws 1-3, the frame part 1 has higher strength, and the deformation generated after the screws are pressed is smaller, so that the working disc can have a heating function and can still have better basic functions in the wafer detection process.

The heat insulating plate 1-2 is made of a material having both hardness and heat insulating function, for example, a material such as ceramics.

In an example of the present invention, a wire extending hole 1-4 is reserved on the side wall of the heat insulation chamber formed by the heat insulation disc 1-2, the wire of the heating part 3 is pulled out from the wire extending hole 1-4 to be connected to a power supply, and the heating part 3 generates heat when the power supply is turned on.

Fig. 4 shows a structure of a frame portion according to an embodiment of the present invention.

As shown in fig. 4, the soaking part 2 includes a first heat conduction sheet 2-1 and a homogenizing disk 2-2, an upper surface of the first heat conduction sheet 2-1 is bonded to the dial 1-1, and a lower surface of the first heat conduction sheet 2-1 is bonded to an upper surface of the homogenizing disk 2-2.

The heat generated by the heating part 3 is firstly transferred to the homogenizing disc 2-2 for uniform heating, the homogenizing disc 2-2 transfers the heat after uniform heating to the first heat conducting sheet 2-1, and the first heat conducting sheet 2-1 transfers the heat to the dial 1-1.

The homogenization plate 2-2 is made of aluminum oxide ceramic plates and other plates capable of realizing uniform heating.

Fig. 5 illustrates a structure of a heating portion according to an embodiment of the present invention.

As shown in fig. 5, the heating part 3 includes a second thermally conductive sheet 3-1, a heating sheet 3-2, and a third thermally conductive sheet 3-3, the upper surface of the second thermally conductive sheet 3-2 is bonded to the lower surface of the homogenizing disk 2-2, the lower surface of the second thermally conductive sheet 3-1 is bonded to the upper surface of the heating sheet 3-2, the lower surface of the heating sheet 3-2 is bonded to the upper surface of the third thermally conductive sheet 3-3, and the lower surface of the third thermally conductive sheet 3-3 is bonded to the heat insulating disk 1-2.

The heating plate 3-2 is connected with a wire, and generates heat after being electrified, one part of generated heat is upwards transmitted to the second heat conducting plate 3-1, the other part of generated heat is downwards transmitted to the third heat conducting plate 3-3, the second heat conducting plate 3-1 upwards transmits the heat to the homogenization disc 2-2, and the third heat conducting plate 3-3 downwards transmits the heat to the third heat conducting plate 3-3 to reach the heat insulation disc 1-2.

Because the heat conductivity of the heat insulation plate 1-2 is poor, heat can not be transferred below continuously, so that the heat released below the working plate can be reduced, and the size and shape changes of the components below the working plate caused by temperature changes are reduced while the waste of heat is avoided.

The heat returned by the third heat conducting fin 3-3 and the heat transferred upwards by the heating fin (3.2) are transferred to the homogenizing disk 2-2 together, and after the homogenizing disk 2-2 is soaked, the wafer on the dial 1-1 is uniformly heated through the first heat conducting fin 2-1 to the dial 1-1.

The third heat conducting sheet 3-3 has good heat conductivity, so that a certain heat equalizing effect can be achieved.

In some embodiments of the present invention, a gap 3-4 is formed between the heating plate 3-2 and the second heat-conducting plate 3-1, and the gap 3-4 makes the heat generated by the second heat-conducting plate 3-1 approach to a circular whole, thereby further improving the soaking effect.

The first heat-conducting fin 2-1, the second heat-conducting fin 3-1, and the third heat-conducting fin 3-3 are made of a material for conducting heat, such as silica gel.

In the specific example of the present invention, the wire drawing holes 1-4 are formed in the heat insulating plate 1-2 at positions corresponding to the gaps 3-4, thereby facilitating the drawing of the wire.

In the description herein, references to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., mean that a particular feature, portion, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, portions, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples and features of different embodiments or examples described in this specification can be combined and combined by one skilled in the art without contradiction.

Although embodiments of the present invention have been shown and described, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention, and that variations, modifications, substitutions and alterations can be made to the above embodiments by those of ordinary skill in the art without departing from the scope of the present invention.

The above detailed description of the present invention does not limit the scope of the present invention. Any other corresponding changes and modifications made according to the technical idea of the present invention should be included in the protection scope of the claims of the present invention.

Claims (9)

1. The utility model provides a working plate, its characterized in that, includes frame part, soaking part and heating part, frame part includes the dial plate and has the thermal-insulated dish in thermal-insulated chamber, the soaking part with the heating part is located thermal-insulated intracavity, the dial plate is located the top in thermal-insulated chamber pass through the screw with thermal-insulated dish fixed connection, the upper surface of soaking part with the bottom surface of dial plate bonds, the lower surface of soaking part with the heating part bonds.

2. The work plate of claim 1, wherein said homogenizing portion comprises a first heat-conducting plate and a homogenizing plate, an upper surface of said first heat-conducting plate being bonded to said dial plate, and a lower surface of said first heat-conducting plate being bonded to an upper surface of said homogenizing plate.

3. The work plate of claim 2, wherein the heating portion comprises a second thermally conductive sheet, a heating sheet, and a third thermally conductive sheet, wherein an upper surface of the second thermally conductive sheet is bonded to a lower surface of the homogenization plate, a lower surface of the second thermally conductive sheet is bonded to an upper surface of the heating sheet, and a lower surface of the heating sheet is bonded to an upper surface of the third thermally conductive sheet.

4. The work plate of claim 3 wherein a lower surface of said third thermally conductive sheet is bonded to said thermally insulating disk.

5. A work plate according to claim 3, wherein there is a gap between the heating plate and the second heat conducting plate.

6. The work tray according to claim 5, wherein a wire-drawing hole is reserved in the heat insulating tray at a position corresponding to the gap.

7. A working disk according to any of claims 1 to 6 wherein the thermally insulating disk is a ceramic disk.

8. The work plate of any of claims 2-6, wherein the homogenization plate is an alumina ceramic plate.

9. The work plate of claim 3 or 4, wherein the first, second, and third heat-conducting fins are silicone fins.

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