CN212299455U - Honeycomb-shaped high-power semiconductor quick heating device - Google Patents

Abstract

The utility model relates to a quick heating device of honeycombed high-power semiconductor. The water inlet box is located at the bottom of an inner cavity of the heating box, the water outlet box is located at the upper portion of the inner cavity of the heating box, a plurality of groups of semiconductor heating pipes are arranged between the water inlet box and the water outlet box to form honeycomb arrangement combination, the upper end of each semiconductor heating pipe is communicated to the water outlet box through a stainless steel corrugated pipe, and the lower end of each semiconductor heating pipe is communicated to the water inlet box through a stainless steel movable joint. The beneficial effects are that: the adoption of the graphene semiconductors arranged in a honeycomb manner enables heat production to be more concentrated, reduces heat loss, better takes away heat through circulation of the circulating pump, improves heat efficiency, greatly reduces the volume of equipment, lightens the weight of a product, reduces the manufacturing cost and has high heat efficiency; in addition, the semiconductor heating pipe adopts a three-layer heat preservation mode, so that the heat loss is reduced, the heat preservation effect is improved, the heat loss is reduced, and the overall heat efficiency of the equipment is improved by more than 10%.

Description

Honeycomb-shaped high-power semiconductor quick heating device

Technical Field

The utility model relates to a high-power semiconductor fast heating device, in particular to honeycombed high-power semiconductor fast heating device.

Background

In the north, the heating modes commonly used in winter include the following modes, 1, central heating, which is a clean and guaranteed heating mode for a heating company to convey municipal heating to a user home through a pipeline, and has relatively high safety performance, but the whole energy waste is serious, and a resident often opens a window in winter. 2. The radiant floor heating can be realized by various different modes such as a household gas heating furnace, a municipal heating pipe network and a residential boiler room. The heating mode has uniform temperature and is energy-saving, but has higher requirement on the pipe, and can also deform the furniture after a long time. 3. The gas heating mode takes natural gas, liquefied petroleum gas, coal gas and electricity as energy sources, can automatically set heating time and measure according to individual households, but has potential safety hazards, and influences heating when gas is too little in winter. 4. Household central air-conditioning system: the application places are as follows: the villa has the advantages that: the grade is high, the appearance is good, and the comfort level is high; the 'air-cooled type' with a fresh air system is more comfortable; the temperature and the time can be adjusted in advance; the solar energy heat collector is suitable for low-density houses and villas with large areas, and is high in installation cost, large in early investment and poor in heating effect in winter when in severe cold. 5. Household electric boiler: the temperature can be freely adjusted to be suitable for residences: villa principle: electric energy is adopted for heating. The advantages are that: the floor area is small, the installation is simple, and the operation is convenient; also can provide life hot water when the heating, the shortcoming is that the energy consumption is high, and the intensification is slow, need heat the hot water heating of boiler earlier just can heat, 6, electric power heating: the electric heating has more environmental protection and individual operability. The greatest disadvantage is the high requirements and the relatively high costs of use. Such a heating system is being tested in large cities such as Beijing. 7. The electrothermal film heating is a pure resistance type heating body made by printing special conductive ink between two layers of polyester films by taking electric power as an energy source, and is matched with an independent temperature control device, and a low-temperature radiation electrothermal film is used as the heating body, most of the electrothermal film is of a ceiling type, and a small part of the electrothermal film is laid in a wall or even under the floor. The heating system has the characteristics of constant temperature adjustability, economy, comfort, environmental protection, long service life, maintenance-free property and the like, but has the defects of slow heating, generally 1-1.5 hours for heating the indoor temperature to 18 ℃, synchronous system installation and decoration, incapability of nailing, punching and the like on a ceiling.

The existing method of heating by adopting a semiconductor is adopted to heat cold water, but the requirement of heating cannot be met, and the heating requirement is long in heating time, high in power and long in service life.

Disclosure of Invention

The utility model aims at providing a quick heating device of honeycombed high-power semiconductor to the above-mentioned defect that prior art exists, adopting the graphite alkene semiconductor heating technology of honeycomb arrangement, the thermal efficiency is higher.

The technical scheme is as follows: a honeycombed high-power semiconductor quick heating device comprises a distribution box (8) and a heating box (9), wherein the heating box (9) comprises a water inlet box body (1), a stainless steel union joint (2), semiconductor heating pipes (3), a stainless steel corrugated pipe (4), a water outlet box body (5), a hot water outlet (6) and a cold water inlet (7), the water inlet box body (1) is positioned at the bottom of an inner cavity of the heating box (9), the water outlet box body (5) is positioned at the upper part of the inner cavity of the heating box (9), a plurality of groups of semiconductor heating pipes (3) are distributed between the water inlet box body (1) and the water outlet box body (5) to form a honeycombed arrangement combination, the upper end of each semiconductor heating pipe (3) is communicated to the water outlet box body (5) through the stainless steel corrugated pipe (4), the lower end of each semiconductor heating pipe (3) is communicated to the water inlet box body (1), and the outer end of the water inlet box body, the outer end of the water outlet box body (5) is provided with a hot water outlet (6); the semiconductor heating pipe (3) is connected to a distribution box (8) on one side of the heating box (9) through a lead.

Preferably, above-mentioned semiconductor heating pipe (3) include semiconductor heating inner tube (3.1), heat preservation asbestos cloth (3.2), rubber and plastic heat preservation cotton (3.3), heat shrinkage bush (3.4), the outside parcel of semiconductor heating inner tube (3.1) has heat preservation asbestos cloth (3.2), and the outside of heat preservation asbestos cloth (3.2) is equipped with rubber and plastic heat preservation cotton (3.3), is equipped with heat shrinkage bush (3.4) in the outside of rubber and plastic heat preservation cotton (3.3).

Preferably, the outer wall of the semiconductor heating inner tube (3.1) has a tubular structure with a polygonal cross section, and the inner wall has a circular cross section or a polygonal cross section.

Preferably, a graphene film is arranged in the semiconductor heating inner tube (3.1).

Preferably, the stainless steel corrugated pipe (4) comprises a corrugated pipe main body and loose joints, the loose joints are respectively arranged at two ends of the corrugated pipe main body, the lower loose joint is connected with the semiconductor heating pipe (3), and the upper loose joint is communicated with the water outlet tank body (5).

Preferably, the lower end of the semiconductor heating pipe (3) is connected with the water inlet tank body (1) through a stainless steel movable joint (2).

Preferably, the outer wall of the semiconductor heating inner pipe (3.1) is of a hexagonal cross-section tubular structure.

The utility model has the advantages that: 1. the installation structure greatly reduces the volume of the equipment, lightens the weight of the product, reduces the manufacturing cost, has high thermal efficiency and long service life, saves energy by 30 percent compared with the traditional electric heating equipment, and has the service life three times longer than that of the traditional electric heating equipment;

2. the semiconductor heating pipe of the utility model adopts a three-layer heat preservation mode, the heat preservation asbestos cloth at the innermost layer can resist high temperature, thereby not only playing a role of heat preservation, but also playing a role of heat insulation, and ensuring that the rubber and plastic heat preservation cotton can not deform due to high temperature; the heating pipe can be tightly wrapped by the elasticity of the rubber-plastic heat-preservation cotton, so that the heat loss is reduced; by means of the heat shrinkage characteristic of the heat shrinkage sleeve, the heat insulation cotton can more tightly wrap the heating pipe, heat loss is reduced, the heat insulation effect is improved, heat loss is reduced, and the overall heat efficiency of the equipment is improved by over 10%;

3. the stainless steel corrugated pipe with the double-end loose joint is adopted, so that the problem that the rigid connection between the semiconductor heating pipe and the pipe fitting is easy to leak water can be solved, and the two ends of the semiconductor heating pipe are connected by the loose joint, so that the heating pipe is convenient to install and replace;

4. the whole equipment is divided into two parts, so that the electricity and the water are separated, and the electricity utilization safety of the equipment is ensured.

Drawings

FIG. 1 is a schematic structural diagram of the present invention;

FIG. 2 is a schematic diagram of the structure A-A of FIG. 1;

FIG. 3 is a schematic view of the structure B-B of FIG. 1;

FIG. 4 is a schematic cross-sectional view of a semiconductor heating tube;

in the upper diagram: a water inlet box body (1), a stainless steel movable joint (2), a semiconductor heating pipe (3), a stainless steel corrugated pipe (4), a water outlet box body (5), a hot water outlet (6), a cold water inlet (7), a distribution box (8), a heating box (9),

The heat-insulating plastic pipe comprises a semiconductor heating inner pipe (3.1), heat-insulating asbestos cloth (3.2), rubber and plastic heat-insulating cotton (3.3) and a heat-shrinkable sleeve (3.4).

Detailed Description

The preferred embodiments of the present invention will be described in conjunction with the accompanying drawings, and it will be understood that they are presented herein only to illustrate and explain the present invention, and not to limit the present invention.

Embodiment 1, referring to fig. 1-3, the honeycomb-shaped high-power semiconductor fast heating device provided by the present invention comprises a distribution box (8) and a heating box (9), wherein the heating box (9) comprises a water inlet box body (1), a stainless steel union (2), semiconductor heating pipes (3), a stainless steel corrugated pipe (4), a water outlet box body (5), a hot water outlet (6), and a cold water inlet (7), the water inlet box body (1) is located at the bottom of the inner cavity of the heating box (9), the water outlet box body (5) is located at the upper part of the inner cavity of the heating box (9), a plurality of groups of semiconductor heating pipes (3) are arranged between the water inlet box body (1) and the water outlet box body (5) to form a honeycomb-shaped arrangement combination, the upper end of each semiconductor heating pipe (3) is communicated to the water outlet heating pipe box body (5) through the stainless steel corrugated pipe (4), and the lower end of each semiconductor heating pipe (3) is communicated to the water inlet box, the outer end of the water inlet tank body (1) is provided with a cold water inlet (7), and the outer end of the water outlet tank body (5) is provided with a hot water outlet (6); the semiconductor heating pipe (3) is connected to a distribution box (8) on one side of the heating box (9) through a lead.

Referring to the attached drawing 4, the semiconductor heating pipe (3) comprises a semiconductor heating inner pipe (3.1), heat-preservation asbestos cloth (3.2), rubber and plastic heat-preservation cotton (3.3) and a heat-shrinkable sleeve (3.4), the heat-preservation asbestos cloth (3.2) is wrapped on the outer side of the semiconductor heating inner pipe (3.1), the rubber and plastic heat-preservation cotton (3.3) is arranged on the outer side of the heat-preservation asbestos cloth (3.2), the heat-shrinkable sleeve (3.4) is arranged on the outer side of the rubber and plastic heat-preservation cotton (3.3), and the heat-preservation asbestos cloth on the innermost layer can resist high temperature, so that the heat-preservation effect and the heat-insulation effect are achieved, and the rubber and; the heating pipe can be tightly wrapped by the elasticity of the rubber-plastic heat-preservation cotton, so that the heat loss is reduced; through the pyrocondensation characteristic of pyrocondensation bushing, make the cotton heating pipe of more tightly wrapping up of heat preservation, reduce the heat loss, improve the heat preservation effect, reduce calorific loss, make the whole thermal efficiency of equipment improve more than 10%.

Referring to fig. 4, the outer wall of the semiconductor heating inner tube (3.1) is of a tubular structure with a hexagonal section, and the inner wall of the semiconductor heating inner tube is of a circular section or an octagonal section; the graphene film is arranged in the semiconductor heating inner tube (3.1).

Referring to the attached figure 3, the stainless steel corrugated pipe (4) of the utility model comprises a corrugated pipe main body and a loose joint, wherein the loose joint is respectively arranged at two ends of the corrugated pipe main body, is connected with the semiconductor heating pipe (3) through the loose joint at the lower end and is communicated with the water outlet box body (5) through the loose joint at the upper end; the lower end of the semiconductor heating pipe (3) is connected with the water inlet tank body (1) through a stainless steel movable joint (2). Go out water tank loose joint structure: the box body is formed by welding stainless steel pipes and steel plates, and has no other threaded connection and no water leakage problem.

When the semiconductor heating device is used, cold water is pumped into the water inlet box body (1) through the circulating pump, the cold water enters the water outlet box body (5) through the semiconductor heating pipes (3), at the moment, power is supplied to each group of semiconductor heating pipes (3) through the distribution box, the honeycomb-shaped semiconductor heating pipes (3) generate heat to heat the cold water, and then the cold water is discharged through the water outlet box body (5), so that high-power heating or hot water supply is realized; the graphene semiconductor heating technology with the honeycomb arrangement is adopted, so that heat production is more concentrated, heat loss is reduced, heat is better taken away through circulation of the circulating pump, the heat efficiency is improved, the size of the equipment is greatly reduced through the installation structure, the weight of the product is reduced, and the manufacturing cost is reduced.

Embodiment 2, the utility model provides a honeycombed high-power semiconductor quick heating device, including block terminal (8) and heating cabinet (9), heating cabinet (9) includes into water box (1), stainless steel union (2), semiconductor heating pipe (3), stainless steel bellows (4), play water box (5), hot water outlet (6), cold water inlet (7), into water box (1) is located the bottom of heating cabinet (9) inner chamber, goes out water box (5) and is located the upper portion of heating cabinet (9) inner chamber, has laid multiunit semiconductor heating pipe (3) between into water box (1) and play water box (5), forms honeycombed array combination, and the upper end of every semiconductor heating pipe (3) communicates through stainless steel bellows (4) and goes out water box (5), and the lower extreme of every semiconductor heating pipe (3) communicates through stainless steel union (2) into water box (1), the outer end of the water inlet tank body (1) is provided with a cold water inlet (7), and the outer end of the water outlet tank body (5) is provided with a hot water outlet (6); the semiconductor heating pipe (3) is connected to a distribution box (8) on one side of the heating box (9) through a lead.

The outer wall of the semiconductor heating inner tube (3.1) in the semiconductor heating tube (3) is of a tubular structure with an octagonal cross section, and the inner wall of the semiconductor heating inner tube is of a hexagonal cross section.

The above description is only a preferred embodiment of the present invention, and any person skilled in the art may modify the present invention or modify it into an equivalent technical solution by using the technical solutions described above. Therefore, any simple modifications or equivalent replacements made according to the technical solution of the present invention belong to the scope of the claimed invention as far as possible.

Claims (7)

1. A honeycomb-shaped high-power semiconductor quick heating device is characterized in that: comprises a distribution box (8) and a heating box (9), wherein the heating box (9) comprises a water inlet box body (1), a stainless steel union joint (2), semiconductor heating pipes (3), a stainless steel corrugated pipe (4), a water outlet box body (5), a hot water outlet (6) and a cold water inlet (7), the water inlet box body (1) is positioned at the bottom of an inner cavity of the heating box (9), the water outlet box body (5) is positioned at the upper part of the inner cavity of the heating box (9), a plurality of groups of semiconductor heating pipes (3) are distributed between the water inlet box body (1) and the water outlet box body (5) to form a honeycombed arrangement combination, the upper end of each semiconductor heating pipe (3) is communicated to the water outlet box body (5) through the stainless steel corrugated pipe (4), the lower end of each semiconductor heating pipe (3) is communicated to the water inlet box body (1), and the outer end of the water inlet box, the outer end of the water outlet box body (5) is provided with a hot water outlet (6); the semiconductor heating pipe (3) is connected to a distribution box (8) on one side of the heating box (9) through a lead.

2. The honeycomb-shaped high-power semiconductor quick heating device according to claim 1, wherein: semiconductor heating pipe (3) include semiconductor heating inner tube (3.1), heat preservation asbestos cloth (3.2), rubber and plastic heat preservation cotton (3.3), heat shrinkage bush (3.4), the outside parcel of semiconductor heating inner tube (3.1) has heat preservation asbestos cloth (3.2), and the outside of heat preservation asbestos cloth (3.2) is equipped with rubber and plastic heat preservation cotton (3.3), is equipped with heat shrinkage bush (3.4) in the outside of rubber and plastic heat preservation cotton (3.3).

3. The honeycomb-shaped high-power semiconductor quick heating device according to claim 2, wherein: the outer wall of the semiconductor heating inner pipe (3.1) is of a tubular structure with a polygonal section, and the inner wall of the semiconductor heating inner pipe is of a circular section or a polygonal section.

4. The honeycomb-shaped high-power semiconductor quick heating device according to claim 2, wherein: the graphene film is arranged in the semiconductor heating inner tube (3.1).

5. The honeycomb-shaped high-power semiconductor quick heating device according to claim 1, wherein: the stainless steel corrugated pipe (4) comprises a corrugated pipe main body and loose joints, the loose joints are arranged at two ends of the corrugated pipe main body respectively and are connected with the semiconductor heating pipe (3) through the loose joint at the lower end and communicated with the water outlet box body (5) through the loose joint at the upper end.

6. The honeycomb-shaped high-power semiconductor quick heating device according to claim 1, wherein: the lower end of the semiconductor heating pipe (3) is connected with the water inlet tank body (1) through a stainless steel movable joint (2).

7. The honeycomb-shaped high-power semiconductor quick heating device according to claim 3, wherein: the outer wall of the semiconductor heating inner pipe (3.1) is of a tubular structure with a hexagonal section.

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