CN211781412U - High-power semiconductor quick heating device - Google Patents
High-power semiconductor quick heating device Download PDFInfo
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- CN211781412U CN211781412U CN202020084010.9U CN202020084010U CN211781412U CN 211781412 U CN211781412 U CN 211781412U CN 202020084010 U CN202020084010 U CN 202020084010U CN 211781412 U CN211781412 U CN 211781412U
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Abstract
The utility model relates to a high-power semiconductor fast heating device. The technical scheme is as follows: the heating device comprises a control box and a heating body box, wherein a main water outlet pipe, a semiconductor heating pipe group, a main water inlet pipe and a high-temperature sensor are arranged in the heating body box, the main water outlet pipe is positioned at the upper side, the outer end of the main water outlet pipe is provided with a water outlet, the main water outlet pipe is connected to the main water inlet pipe positioned at the lower side through the semiconductor heating pipe group, the outer end of the main water inlet pipe is provided with; the semiconductor heating tube group is formed by connecting a plurality of semiconductor heating tubes in parallel. The beneficial effects are that: the utility model discloses a semiconductor heating body, than traditional electric heating energy-conserving 30%, long service life uses three years thermal efficiency decay to be less than 10%, is far less than resistance heating equipment, and semiconductor heating pipe adopts nonrust corrugated steel pipe flexible connection with going out water piping connection, compares traditional electrical heating equipment and adopts PPR union coupling, and it is poor to have solved PPR pipe strength, the breakable problem of sclerosis in winter.
Description
Technical Field
The utility model relates to a high-power quick heating device, in particular to high-power semiconductor quick heating device.
Background
In the north, the heating modes commonly used in winter include the following modes, 1, central heating, which is a clean and guaranteed heating mode for a heating company to convey municipal heating to a user home through a pipeline, and has relatively high safety performance, but the whole energy waste is serious, and a resident often opens a window in winter. 2. The radiant floor heating can be realized by various different modes such as a household gas heating furnace, a municipal heating pipe network and a residential boiler room. The heating mode has uniform temperature and is energy-saving, but has higher requirement on the pipe, and can also deform the furniture after a long time. 3. The gas heating mode takes natural gas, liquefied petroleum gas, coal gas and electricity as energy sources, can automatically set heating time and measure according to individual households, but has potential safety hazards, and influences heating when gas is too little in winter. 4. Household central air-conditioning system: the application places are as follows: the villa has the advantages that: the grade is high, the appearance is good, and the comfort level is high; the 'air-cooled type' with a fresh air system is more comfortable; the temperature and the time can be adjusted in advance; the solar energy heat collector is suitable for low-density houses and villas with large areas, and is high in installation cost, large in early investment and poor in heating effect in winter when in severe cold. 5. Household electric boiler: the temperature can be freely adjusted to be suitable for residences: villa principle: electric energy is adopted for heating. The advantages are that: the floor area is small, the installation is simple, and the operation is convenient; also can provide life hot water when the heating, the shortcoming is that the energy consumption is high, and the intensification is slow, need heat the hot water heating of boiler earlier just can heat, 6, electric power heating: the electric heating has more environmental protection and individual operability. The greatest disadvantage is the high requirements and the relatively high costs of use. Such a heating system is being tested in large cities such as Beijing. 7. The electrothermal film heating is a pure resistance type heating body made by printing special conductive ink between two layers of polyester films by taking electric power as an energy source, and is matched with an independent temperature control device, and a low-temperature radiation electrothermal film is used as the heating body, most of the electrothermal film is of a ceiling type, and a small part of the electrothermal film is laid in a wall or even under the floor. The heating system has the characteristics of constant temperature adjustability, economy, comfort, environmental protection, long service life, maintenance-free property and the like, but has the defects of slow heating, generally 1-1.5 hours for heating the indoor temperature to 18 ℃, synchronous system installation and decoration, incapability of nailing, punching and the like on a ceiling.
The existing method of heating the cold water by adopting a semiconductor heating method cannot meet the requirement of high-power heating, and the high-power heating requires long heating time, high power and long service life; in addition, the problem of water leakage often appears in the junction of current semiconductor heating pipe and main inlet tube and main outlet pipe, is difficult to solve.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing a quick hot device of high-power semiconductor to the above-mentioned defect that prior art exists, solved the junction of semiconductor heating pipe and main inlet tube and main outlet pipe often can appear the problem of leaking to its simple manufacture, heating efficiency is high, and the temperature promotes fast, and power is big, long service life.
The utility model provides a high-power semiconductor fast heat facility, its technical scheme is: the control system comprises a control box (1) and a heating body box (2), wherein a main air switch (1.1), a direct-current power supply (1.2), a PLC (programmable logic controller) controller (1.3), an intermediate relay (1.4) and an air distribution switch (1.5) are arranged in the control box (1), and the intermediate relay (1.4) and the air distribution switch (1.5) are controlled by the PLC controller (1.3) to realize three-level control on the heating body box (2); a main water outlet pipe (3), a semiconductor heating pipe set (5), a main water inlet pipe (6) and a high-temperature sensor (8) are arranged in a heating body box (2), the main water outlet pipe (3) is positioned at the upper side, the outer end of the main water outlet pipe is provided with a water outlet (4), the main water outlet pipe is connected to the main water inlet pipe (6) positioned at the lower side through the semiconductor heating pipe set (5), the outer end of the main water inlet pipe (6) is provided with a water inlet (7), and the inner end of; the semiconductor heating tube set (5) is formed by connecting a plurality of semiconductor heating tubes in parallel.
Preferably, each semiconductor heating pipe comprises an upper stainless steel corrugated pipe (5.1), a wire aligning joint (5.2), a lower stainless steel corrugated pipe (5.3), an upper semiconductor heating pipe body (5.4) and a lower semiconductor heating pipe body (5.5), the upper semiconductor heating pipe body (5.4) and the lower semiconductor heating pipe body (5.5) are connected through the wire aligning joint (5.2), and the upper end of the upper semiconductor heating pipe body (5.4) is connected to the main water outlet pipe (3) through the upper stainless steel corrugated pipe (5.1); the lower end of the lower semiconductor heating tube body (5.5) is connected to the main water inlet tube (6) through a lower stainless steel corrugated tube (5.3).
Preferably, rubber sealing gaskets are respectively arranged at two ends of the upper stainless steel corrugated pipe (5.1), and rubber sealing gaskets are respectively arranged at two ends of the lower stainless steel corrugated pipe (5.3).
Preferably, a high temperature sensor is provided on the upper part of the upper semiconductor heating tube body (5.4).
Preferably, above-mentioned upper semiconductor heating body (5.4) includes semiconductor heating strip (5.4.1), aluminum alloy body (5.4.2), rivers passageway (5.4.4), ternary cladding material (5.4.5), semiconductor heating strip (5.4.1) press in the cavity of aluminum alloy body (5.4.2), the center of aluminum alloy body (5.4.2) is rivers passageway (5.4.4) aluminum alloy body (5.4.2) and the skin of rivers contact are equipped with ternary cladding material (5.4.5).
Preferably, the semiconductor heating bar (5.4.1) is formed by pressing a semiconductor heating sheet (a 1), an electrode sheet (a 2) and a polyimide film (a 3), and the semiconductor heating sheet (a 1) is adhered between the two electrode sheets (a 2) through conductive silver adhesive.
Preferably, the semiconductor heat generating sheet (a 1) is a 280-degree constant temperature heating sheet.
Preferably, the outer end of the electrode sheet (a 2) is provided with a positive electrode (a 4) and a negative electrode (a 5).
The utility model has the advantages that: the utility model adopts the semiconductor heating pipe body, saves energy by 30 percent compared with the traditional electric heating, has long service life, reduces the thermal efficiency attenuation by less than 10 percent after being used for three years, and is far lower than resistance heating equipment; the heating equipment is normal-pressure equipment, and has higher safety factor compared with a coal-fired gas-fired boiler; the semiconductor heating pipe group of the utility model adopts three-level control, and the PLC, the intermediate relay and the air distribution switch are controlled in sequence, thereby fundamentally solving the problem of 'striking fire' when the high-power load is switched on, and simultaneously solving the technical problems of frequent start and stop of the AC contactor and short service life in the running process of the device; in addition, the control box and the heating body box are respectively arranged in two spaces, so that water and electricity are really separated, and the safety coefficient is high; the installation is simple, and the heating can be realized only by connecting the equipment water supply and return water with the user heating water supply and return water; moreover, semiconductor heating pipe and play water piping connection adopt stainless steel corrugated pipe flexible connection, compare traditional electrical heating equipment and adopt PPR union coupling, have solved PPR pipe intensity difference, the breakable problem of hardening winter. Compare rigid connection such as stainless steel or copper, solved because of the poor problem of the leakproofness that the pipe fitting cooperation precision is not high leads to, adopt rubber seal pad, solved the problem that the tradition adopted the raw material tape to seal ageing leaking, bearing strength is high moreover.
Drawings
FIG. 1 is a schematic structural diagram of the present invention;
FIG. 2 is a schematic structural view of a semiconductor heating tube body;
FIG. 3 is a schematic structural view of the semiconductor heat bar of FIG. 2;
in the upper diagram: a control box 1, a heating body box 2, a main water outlet pipe 3, a water outlet 4, a semiconductor heating pipe group 5, a main water inlet pipe 6, a water inlet 7 and a high-temperature sensor 8,
an upper stainless steel corrugated pipe 5.1, a wire butt joint 5.2, a lower stainless steel corrugated pipe 5.3, an upper semiconductor heating pipe body 5.4 and a lower semiconductor heating pipe body 5.5,
the air conditioner comprises a main air switch 1.1, a direct-current power supply 1.2, a PLC (programmable logic controller) 1.3, an intermediate relay 1.4, an air distribution switch 1.5, a semiconductor heating sheet a1, an electrode sheet a2, a polyimide film a3, a positive electrode a4 and a negative electrode a 5.
Detailed Description
The preferred embodiments of the present invention will be described in conjunction with the accompanying drawings, and it will be understood that they are presented herein only to illustrate and explain the present invention, and not to limit the present invention.
Referring to fig. 1, each semiconductor heating tube includes an upper stainless steel corrugated tube 5.1, a wire pair joint 5.2, a lower stainless steel corrugated tube 5.3, an upper semiconductor heating tube body 5.4, and a lower semiconductor heating tube body 5.5, the upper semiconductor heating tube body 5.4 and the lower semiconductor heating tube body 5.5 are connected by the wire pair joint 5.2, and the upper end of the upper semiconductor heating tube body 5.4 is connected to the main water outlet pipe 3 by the upper stainless steel corrugated tube 5.1; the lower end of the lower semiconductor heating tube body 5.5 is connected to a main water inlet tube 6 through a lower stainless steel bellows 5.3.
Wherein, the both ends of going up stainless steel bellows 5.1 are equipped with rubber packing respectively, the both ends of lower stainless steel bellows 5.3 be equipped with rubber packing respectively.
Preferably, a high temperature sensor is provided on the upper portion of the upper semiconductor heating pipe body 5.4.
Referring to the attached drawing 2, the upper semiconductor heating tube body 5.4 comprises a semiconductor heating bar 5.4.1, an aluminum alloy tube body 5.4.2, a water flow channel 5.4.4 and a ternary coating 5.4.5, the semiconductor heating bar 5.4.1 is pressed in a cavity of the aluminum alloy tube body 5.4.2, the center of the aluminum alloy tube body 5.4.2 is the water flow channel 5.4.4, and the ternary coating 5.4.5 is arranged on the outer layer of the aluminum alloy tube body 5.4.2 contacted with water flow.
The heating pipe aluminum alloy body adopts aluminum alloy material die-casting to form, has good heat conductivity and certain mechanical strength, and the semiconductor strip that generates heat is pressed in the cavity of aluminum alloy body, with walk the water pipe way complete separation, really accomplishes water and electricity separation, compares in the mode of aquatic heating with traditional resistance direct plug-in, stops into the possibility of water electric leakage.
In addition, the surface of the aluminum alloy pipe body, which is in contact with water, is provided with the ternary coating, so that the adhesion of calcium and magnesium ions on the surface is reduced, and the problem of low heat conduction efficiency caused by scaling is further solved. Compared with the traditional electric heating, the heat conduction efficiency is reduced rapidly after the heating body is scaled, and the method has obvious advantages.
Referring to fig. 3, the semiconductor heating bar 5.4.1 is formed by pressing a semiconductor heating sheet a1, an electrode sheet a2 and a polyimide film a3, the semiconductor heating sheet a1 is adhered between the two electrode sheets a2 through conductive silver adhesive, the semiconductor heating sheet a1 adopts a 280-degree constant-temperature heating sheet, the outer end of the electrode sheet a2 is provided with a positive electrode a4 and a negative electrode a5, namely the heating sheet is electrified to rapidly heat to 280 ℃, and then the temperature is kept constant at 280 ℃. The semiconductor heating strip is not directly contacted with water, the contact temperature of the water and the heating surface is not high, the defect that the water quickly scales on the heating surface is avoided, compared with resistance wire heating, the heating temperature is 600 ℃, and the resistance heating pipe is inserted into the water, so that the damage rate of the resistance heating pipe due to scaling is high. The semiconductor heating plate is pasted between the two electrode plates by the conductive silver adhesive, and compared with the traditional heat conduction silica gel, the conductive silver adhesive has the advantages of high electric conductivity coefficient, good heat conduction performance, high temperature resistance and strong pasting property.
The utility model adopts the semiconductor material to manufacture the core heating element, saves energy by 30 percent compared with the traditional electric heating, has long service life of 60000 hours, and has thermal efficiency attenuation less than 10 percent after three years of use and far lower than resistance heating equipment; the heating equipment is normal pressure equipment, and has high safety coefficient compared with a coal-fired gas-fired boiler.
The heating pipe adopts three-level control, and the PLC, the intermediate relay and the AC contactor are sequentially controlled, so that the problem of 'striking fire' when a high-power load is switched on is fundamentally solved. Meanwhile, the technical problems of frequent start and stop of the alternating current contactor and short service life in the running process of the device are solved; the control box and the heating body box are respectively arranged in two spaces, so that water and electricity are really separated, and the safety factor is high; the installation is simple, and the heating can be realized only by connecting the equipment water supply and return water with the user heating water supply and return water.
The above description is only a few of the preferred embodiments of the present invention, and any person skilled in the art may modify the above-described embodiments or modify them into equivalent ones. Therefore, any simple modifications or equivalent replacements made according to the technical solution of the present invention belong to the scope of the claimed invention as far as possible.
Claims (8)
1. A high-power semiconductor quick heating device is characterized in that: the control system comprises a control box (1) and a heating body box (2), wherein a main air switch (1.1), a direct-current power supply (1.2), a PLC (programmable logic controller) controller (1.3), an intermediate relay (1.4) and an air distribution switch (1.5) are arranged in the control box (1), and the intermediate relay (1.4) and the air distribution switch (1.5) are controlled by the PLC controller (1.3) to realize three-level control on the heating body box (2); a main water outlet pipe (3), a semiconductor heating pipe set (5), a main water inlet pipe (6) and a high-temperature sensor (8) are arranged in a heating body box (2), the main water outlet pipe (3) is positioned at the upper side, the outer end of the main water outlet pipe is provided with a water outlet (4), the main water outlet pipe is connected to the main water inlet pipe (6) positioned at the lower side through the semiconductor heating pipe set (5), the outer end of the main water inlet pipe (6) is provided with a water inlet (7), and the inner end of; the semiconductor heating tube set (5) is formed by connecting a plurality of semiconductor heating tubes in parallel.
2. The high power semiconductor rapid heating device according to claim 1, wherein: each semiconductor heating pipe comprises an upper stainless steel corrugated pipe (5.1), a wire pair connector (5.2), a lower stainless steel corrugated pipe (5.3), an upper semiconductor heating pipe body (5.4) and a lower semiconductor heating pipe body (5.5), wherein the upper semiconductor heating pipe body (5.4) and the lower semiconductor heating pipe body (5.5) are connected through the wire pair connector (5.2), and the upper end of the upper semiconductor heating pipe body (5.4) is connected to the main water outlet pipe (3) through the upper stainless steel corrugated pipe (5.1); the lower end of the lower semiconductor heating tube body (5.5) is connected to the main water inlet tube (6) through a lower stainless steel corrugated tube (5.3).
3. The high power semiconductor rapid heating device according to claim 2, wherein: the two ends of the upper stainless steel corrugated pipe (5.1) are respectively provided with a rubber sealing gasket, and the two ends of the lower stainless steel corrugated pipe (5.3) are respectively provided with a rubber sealing gasket.
4. The high power semiconductor rapid heating device according to claim 2, wherein: the upper part of the upper semiconductor heating tube body (5.4) is provided with a high-temperature sensor.
5. The high power semiconductor rapid heating device according to claim 2, wherein: upper semiconductor heating body (5.4) include semiconductor heating strip (5.4.1), aluminum alloy body (5.4.2), rivers passageway (5.4.4), ternary cladding material (5.4.5), semiconductor heating strip (5.4.1) press in the cavity of aluminum alloy body (5.4.2), the center of aluminum alloy body (5.4.2) is rivers passageway (5.4.4) aluminum alloy body (5.4.2) are equipped with ternary cladding material (5.4.5) with the skin of rivers contact.
6. The high power semiconductor rapid heating device according to claim 5, wherein: the semiconductor heating strip (5.4.1) is formed by pressing a semiconductor heating sheet (a 1), an electrode sheet (a 2) and a polyimide film (a 3), and the semiconductor heating sheet (a 1) is adhered between the two electrode sheets (a 2) through conductive silver adhesive.
7. The high power semiconductor rapid heating device according to claim 6, wherein: the semiconductor heating sheet (a 1) adopts a 280-degree constant-temperature heating sheet.
8. The high power semiconductor rapid heating device according to claim 6, wherein: the outer end of the electrode plate (a 2) is provided with a positive electrode (a 4) and a negative electrode (a 5).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020084010.9U CN211781412U (en) | 2020-01-15 | 2020-01-15 | High-power semiconductor quick heating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020084010.9U CN211781412U (en) | 2020-01-15 | 2020-01-15 | High-power semiconductor quick heating device |
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| Publication Number | Publication Date |
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| CN211781412U true CN211781412U (en) | 2020-10-27 |
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| CN202020084010.9U Active CN211781412U (en) | 2020-01-15 | 2020-01-15 | High-power semiconductor quick heating device |
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| CN (1) | CN211781412U (en) |
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