CN210951501U - Split semiconductor heating device - Google Patents
Split semiconductor heating device Download PDFInfo
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- CN210951501U CN210951501U CN201921808722.4U CN201921808722U CN210951501U CN 210951501 U CN210951501 U CN 210951501U CN 201921808722 U CN201921808722 U CN 201921808722U CN 210951501 U CN210951501 U CN 210951501U
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- 238000010438 heat treatment Methods 0.000 title claims abstract description 174
- 239000004065 semiconductor Substances 0.000 title claims abstract description 118
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 151
- 238000009434 installation Methods 0.000 claims abstract description 10
- 239000007788 liquid Substances 0.000 claims description 9
- 239000003292 glue Substances 0.000 claims description 7
- 239000000919 ceramic Substances 0.000 claims description 6
- 238000005265 energy consumption Methods 0.000 abstract description 5
- 230000009286 beneficial effect Effects 0.000 abstract 1
- 230000000694 effects Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
- 238000004378 air conditioning Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000005485 electric heating Methods 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 2
- 239000004590 silicone sealant Substances 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000003034 coal gas Substances 0.000 description 1
- 238000005034 decoration Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 239000003915 liquefied petroleum gas Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000003345 natural gas Substances 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000002689 soil Substances 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
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- Instantaneous Water Boilers, Portable Hot-Water Supply Apparatuses, And Control Of Portable Hot-Water Supply Apparatuses (AREA)
Abstract
The utility model relates to a split type semiconductor heating device. The technical scheme is as follows: the water inlet end of the water separator is connected to the water inlet end of the semiconductor heating pipe through a water inlet pipe and a water pump, the water outlet end of the semiconductor heating pipe is connected to the water return end of the water separator through a water return pipe, a plurality of ground heating pipes are arranged between the water inlet end of the water separator and the water return end of the water separator, and the ground heating pipes are arranged underground in a room to be heated and heated; the upper part of the semiconductor heating pipe is provided with a junction box, and the junction box is connected to a controller through a lead to realize the control of the semiconductor heating pipe; and a water flow switch is arranged between the water inlet pipe and the semiconductor heating pipe. The beneficial effects are that: the utility model discloses utilize current ground heating coil, at indoor kitchen or bathroom installation semiconductor heater, directly heat through semiconductor heater to the circulating water of ground heating coil, do not need the boiler, the control of being convenient for can realize along with opening along with, opens instant heating promptly, realizes the heating of nimble control, and the energy consumption is low.
Description
Technical Field
The utility model relates to a heating device, in particular to split type semiconductor heating device.
Background
In the north, the heating modes commonly used in winter include the following modes, 1, central heating, which is a clean and guaranteed heating mode that a heating group transmits municipal heating to a user home through a pipeline, and has relatively high safety performance but large overall energy consumption. 2. The radiant floor heating can be realized by various different modes such as a household gas heating furnace, a municipal heating pipe network and a residential boiler room. The heating mode has uniform temperature and is energy-saving, but has higher requirement on the pipe, and can also deform the furniture after a long time. 3. The gas heating mode takes natural gas, liquefied petroleum gas, coal gas and electricity as energy sources, can automatically set heating time and measure according to individual households, but has potential safety hazards, and influences heating when gas is too little in winter. 4. Household central air-conditioning system: the application places are as follows: the villa has the advantages that: the grade is high, the appearance is good, and the comfort level is high; the 'air-cooled type' with a fresh air system is more comfortable; the temperature and the time can be adjusted in advance; the solar energy heat collector is suitable for low-density houses and villas with large areas, and is high in installation cost, large in early investment and poor in heating effect in winter when in severe cold. 5. Household electric boiler: the temperature can be freely adjusted to be suitable for residences: villa principle: electric energy is adopted for heating. The advantages are that: the floor area is small, the installation is simple, and the operation is convenient; also can provide life hot water when the heating, the shortcoming is that the energy consumption is high, and the intensification is slow, need heat the hot water heating of boiler earlier just can heat, 6, electric power heating: the electric heating has more environmental protection and individual operability. The greatest disadvantage is the high requirements and the relatively high costs of use. Such a heating system is being tested in large cities such as Beijing. 7. The electrothermal film heating is a pure resistance type heating body made by printing special conductive ink between two layers of polyester films by taking electric power as an energy source, and is matched with an independent temperature control device, and a low-temperature radiation electrothermal film is used as the heating body, most of the electrothermal film is of a ceiling type, and a small part of the electrothermal film is laid in a wall or even under the floor. The heating system has the characteristics of constant temperature adjustability, economy, comfort, environmental protection, long service life, maintenance-free property and the like, but has the defects of slow heating, generally 1-1.5 hours for heating the indoor temperature to 18 ℃, synchronous system installation and decoration, incapability of nailing, punching and the like on a ceiling.
Disclosure of Invention
The utility model aims at providing a split type semiconductor heating device to the above-mentioned defect that prior art exists, utilize current ground heating coil, at indoor kitchen or bathroom installation semiconductor heater, directly heat the circulating water of ground heating coil through semiconductor heater, do not need the boiler, its rate of heating is fast, and the controlled temperature of being convenient for has realized along with opening along with, the mode of the nimble control heating on need not closing.
The utility model provides a split type semiconductor heating device, its technical scheme is: the water heater comprises a controller (1), a semiconductor heating pipe (2), a water inlet end (3) of a water distributor, a water return pipe (4), a water return end (5) of the water distributor, a junction box (6), a water replenishing tank (7), a water pump (8), a water flow switch (9), a ground heating pipe (10), a lead (11) and a water inlet pipe (12), wherein the water inlet end (3) of the water distributor is connected to the water inlet end of the semiconductor heating pipe (2) through the water inlet pipe (12) and the water pump (8), the water outlet end of the semiconductor heating pipe (2) is connected to the water return end (5) of the water distributor through the water return pipe, a plurality of ground heating pipes (10) are distributed between the water inlet end (3) of the water distributor and the water return end (5) of the water distributor, and the ground heating; the upper part of the semiconductor heating pipe (2) is provided with a junction box (6), and the junction box (6) is connected to the controller (1) through a lead (11) to realize the control of the semiconductor heating pipe (2); a water flow switch (9) is arranged between the water inlet pipe (12) and the semiconductor heating pipe (2).
Preferably, the water inlet pipe (12) or the water return pipe (4) is connected with the water replenishing tank (7) through a longitudinal water pipe.
Preferably, above-mentioned semiconductor heating pipe (2) includes shell body (2.1), inner tube (2.2), semiconductor heating plate (2.3), water supply connector (2.5) and return water joint (2.6), shell body (2.1) suit is in the outside of inner tube (2.2), and the one end of inner tube (2.2) is equipped with water supply connector (2.5), and the other end is equipped with return water joint (2.6), a plurality of semiconductor heating plate (2.3) are installed to the cavity between shell body (2.1) and inner tube (2.2), and through heat-conducting glue fixed semiconductor heating plate (2.3), heat the liquid that inner tube (2.2) flowed through a plurality of semiconductor heating plate (2.3).
Preferably, the semiconductor heating sheet (2.3) adopts a PTC semiconductor ceramic heating body and is of a strip-shaped structure.
Preferably, above-mentioned semiconductor heating pipe (2) includes shell body (2.1), inner tube (2.2), semiconductor heating plate (2.3), interior semiconductor heating body (2.4) water supply connector (2.5) and return water connector (2.6), shell body (2.1) suit is in the outside of inner tube (2.2), and the one end of inner tube (2.2) is equipped with water supply connector (2.5), and the other end is equipped with return water connector (2.6), a plurality of semiconductor heating plates (2.3) are installed to the cavity between shell body (2.1) and inner tube (2.2), and through heat-conducting glue fixed semiconductor heating plate (2.3) install three criss-cross interior semiconductor heating body of group (2.4) in inner tube (2.2), form three and cross the liquid passageway, heat the liquid that flows through semiconductor heating plate (2.4) in a plurality of semiconductor heating plates (2.3) and inner tube (2.2).
Preferably, the internal semiconductor heating body (2.4) comprises a fixing support (2.4.1) and internal semiconductor heating sheets (2.4.2), the fixing support (2.4.1) comprises three groups of cuboid frames, and the internal semiconductor heating sheets (2.4.2) are installed in each group of frames.
Preferably, the inner semiconductor heating sheet (2.4.2) adopts a PTC semiconductor ceramic heating body and is of a strip-shaped structure.
The utility model has the advantages that: the utility model discloses utilize current ground heating coil, at indoor kitchen or bathroom installation semiconductor heater, directly heat the circulating water of ground heating coil through semiconductor heater, do not need the boiler, because semiconductor heater's rate of heating is fast, the control of being convenient for, just so can realize opening at any time with using, open promptly and heat promptly, realize the heating of nimble control, compare in current electric heating and electric boiler, its rate of heating is fast, the control of being convenient for; compared with centralized heat supply, the system is energy-saving and environment-friendly, the heat utilization rate is greatly improved, accurate control of each room is realized, heating can be stopped when no person is in the day, heating is started half an hour before work at night, the person is warm after going home, and the person is stopped when going away; in addition, compared with the heating effect of a household central air-conditioning system, the heating device has better comfort level and is not changed greatly, the heating device can be directly connected to the water separator of the existing floor heating pipe and can be applied, and the floor heating mode is verified in recent years, so that the heating device has good effect, high comfort level and low energy consumption.
Drawings
FIG. 1 is a schematic structural diagram of the present invention;
FIG. 2 is a schematic structural diagram of a semiconductor heating tube;
FIG. 3 is a cross-sectional view of a first embodiment of a semiconductor heating tube;
FIG. 4 is a cross-sectional view of a second embodiment of a semiconductor heating tube;
FIG. 5 is a schematic structural view of an internal semiconductor heater of a second embodiment of a semiconductor heating tube;
FIG. 6 is a schematic front view of the structure of FIG. 5;
in the upper diagram: the device comprises a controller 1, a semiconductor heating pipe 2, a water inlet end 3 of a water separator, a water return pipe 4, a water return end 5 of the water separator, a junction box 6, a water replenishing tank 7, a water pump 8, a water flow switch 9, a ground heating pipe 10, a lead 11, a water inlet pipe 12 and an electromagnetic valve 13; the device comprises an outer shell 2.1, an inner tube 2.2, a semiconductor heating sheet 2.3, an inner semiconductor heating body 2.4, a water inlet joint 2.5, a water return joint 2.6, a fixing support 2.4.1 and an inner semiconductor heating sheet 2.4.2.
Detailed Description
The preferred embodiments of the present invention will be described in conjunction with the accompanying drawings, and it will be understood that they are presented herein only to illustrate and explain the present invention, and not to limit the present invention.
Referring to fig. 2 and 3, semiconductor heating pipe 2 includes shell body 2.1, inner tube 2.2, semiconductor heating plate 2.3, water supply connector 2.5 and return water connector 2.6, the shell body 2.1 suit is in the outside of inner tube 2.2, and the one end of inner tube 2.2 is equipped with water supply connector 2.5, and the other end is equipped with return water connector 2.6, a plurality of semiconductor heating plates 2.3 are installed to the cavity between shell body 2.1 and the inner tube 2.2, and through the fixed semiconductor heating plate 2.3 of heat conduction glue, heat the liquid that inner tube 2.2 flowed through a plurality of semiconductor heating plates 2.3.
The semiconductor heating sheet 2.3 adopts a PTC semiconductor ceramic heating body and is of a strip-shaped structure, the heat conducting glue adopts silicone sealant, and the semiconductor heating sheet 2.3 is sealed by the silicone sealant after being arranged in a cavity between the outer shell and the inner tube; in addition, the controller 1 controls the semiconductor heating tube 2 to be heated or shut down at regular time or to be switched on or off manually and remotely by using the prior art well known to those skilled in the art. In addition, an electromagnetic valve 13 can be additionally arranged between each floor heating pipe and the water separator, and the switch of each room in the room is controlled through remote or timing or induction operation, so that the temperature of each room is effectively controlled, and the heating is more reasonably used.
The utility model discloses a use as follows:
firstly, selecting a proper installation position, connecting two or more groups of ground heating pipes or radiators of old communities with water paths and installing and fixing the ground heating pipes or radiators of the old communities, wherein a water replenishing hopper is higher than the highest point of a pipeline and connected to a lower pipeline of return water in parallel, the installation method of the lower pipeline is the same as that of the soil heating pipe, and the lower pipeline is provided with a water pump for forced circulation; in a room temperature control mode, when the room temperature is lower than the set room temperature control temperature, the circulating pump is started, and the semiconductor heating pipe is started to heat; and when the room temperature is higher than the set room temperature control temperature plus 5 ℃, closing the semiconductor heating tube and stopping the circulation. The room temperature can be manually adjusted within the range of 10-35 ℃; in addition, according to the requirement condition of each room, the ground heating pipe or the radiator of the room without people can be closed.
the utility model discloses a semiconductor heating pipe 2 includes shell body 2.1, inner tube 2.2, semiconductor heating plate 2.3, interior semiconductor heating body 2.4 water supply connector 2.5 and return water connector 2.6, shell body 2.1 suit is in the outside of inner tube 2.2, and the one end of inner tube 2.2 is equipped with water supply connector 2.5, and the other end is equipped with return water connector 2.6, a plurality of semiconductor heating plates 2.3 are installed to the cavity between shell body 2.1 and the inner tube 2.2, and through the fixed semiconductor heating plate 2.3 of heat-conducting glue install three intercrossing interior semiconductor heating body 2.4 of group in the inner tube 2.2, form three liquid passageway of crossing, heat the liquid of flowing through semiconductor heating body 2.4 in a plurality of semiconductor heating plates 2.3 and the inner tube 2.2.
Referring to fig. 5 and 6, the internal semiconductor heating element 2.4 comprises a fixing support 2.4.1 and an internal semiconductor heating sheet 2.4.2, wherein the fixing support 2.4.1 comprises three groups of rectangular frames, the internal semiconductor heating sheet 2.4.2 is arranged in each group of frames, and in addition, the internal semiconductor heating sheet 2.4.2 adopts a PTC semiconductor ceramic heating element and is of a strip-shaped structure.
The utility model discloses a structure is compared in embodiment 1, and the structure is complicated, and the cost of manufacture is slightly higher, but heats the effect better, can effectually heat the circulating water, directly falls into 3 with the circulating water, and the interior semiconductor heating plate is direct and the circulating water contact, and heat conversion rate is higher to reduce the energy consumption, realized the further promotion of efficiency.
The above description is only a preferred embodiment of the present invention, and any person skilled in the art may modify the present invention or modify it into an equivalent technical solution by using the technical solutions described above. Therefore, any simple modifications or equivalent replacements made according to the technical solution of the present invention belong to the scope of the claimed invention as far as possible.
Claims (7)
1. A split type semiconductor heating device is characterized in that: the water heater comprises a controller (1), a semiconductor heating pipe (2), a water inlet end (3) of a water distributor, a water return pipe (4), a water return end (5) of the water distributor, a junction box (6), a water replenishing tank (7), a water pump (8), a water flow switch (9), a ground heating pipe (10), a lead (11) and a water inlet pipe (12), wherein the water inlet end (3) of the water distributor is connected to the water inlet end of the semiconductor heating pipe (2) through the water inlet pipe (12) and the water pump (8), the water outlet end of the semiconductor heating pipe (2) is connected to the water return end (5) of the water distributor through the water return pipe, a plurality of ground heating pipes (10) are distributed between the water inlet end (3) of the water distributor and the water return end (5) of the water distributor, and the ground heating; the upper part of the semiconductor heating pipe (2) is provided with a junction box (6), and the junction box (6) is connected to the controller (1) through a lead (11) to realize the control of the semiconductor heating pipe (2); a water flow switch (9) is arranged between the water inlet pipe (12) and the semiconductor heating pipe (2).
2. The split type semiconductor heating device according to claim 1, characterized in that: the water inlet pipe (12) or the water return pipe (4) is connected with the water replenishing tank (7) through a longitudinal water pipe.
3. The split type semiconductor heating device according to claim 1, characterized in that: semiconductor heating pipe (2) include shell body (2.1), inner tube (2.2), semiconductor heating plate (2.3), water supply connector (2.5) and return water joint (2.6), shell body (2.1) suit is in the outside of inner tube (2.2), and the one end of inner tube (2.2) is equipped with water supply connector (2.5), and the other end is equipped with return water joint (2.6), a plurality of semiconductor heating plate (2.3) are installed to the cavity between shell body (2.1) and inner tube (2.2), and through heat-conducting glue fixed semiconductor heating plate (2.3), heat the liquid that inner tube (2.2) flowed through a plurality of semiconductor heating plate (2.3).
4. The split type semiconductor heating device according to claim 3, characterized in that: the semiconductor heating sheet (2.3) adopts a PTC semiconductor ceramic heating body and is of a strip-shaped structure.
5. The split type semiconductor heating device according to claim 3, characterized in that: semiconductor heating pipe (2) include shell body (2.1), inner tube (2.2), semiconductor heating plate (2.3), interior semiconductor heating body (2.4) water supply connector (2.5) and return water connector (2.6), shell body (2.1) suit is in the outside of inner tube (2.2), and the one end of inner tube (2.2) is equipped with water supply connector (2.5), and the other end is equipped with return water connector (2.6), a plurality of semiconductor heating plate (2.3) are installed to the cavity between shell body (2.1) and inner tube (2.2), and through heat-conducting glue fixed semiconductor heating plate (2.3) inner tube (2.2) interior three criss-cross interior semiconductor heating body of group (2.4) of installation form three and cross liquid passageway, heat the liquid that flows through semiconductor heating plate (2.4) in a plurality of semiconductor heating plate (2.3) and inner tube (2.2).
6. The split type semiconductor heating device according to claim 5, characterized in that: interior semiconductor heating body (2.4) include fixed bolster (2.4.1) and interior semiconductor heating piece (2.4.2) are constituteed, fixed bolster (2.4.1) comprise the frame of three groups of cuboids, semiconductor heating piece (2.4.2) in every group frame installation.
7. The split type semiconductor heating device according to claim 6, characterized in that: the inner semiconductor heating sheet (2.4.2) adopts a PTC semiconductor ceramic heating body and is of a strip-shaped structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921808722.4U CN210951501U (en) | 2019-10-25 | 2019-10-25 | Split semiconductor heating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921808722.4U CN210951501U (en) | 2019-10-25 | 2019-10-25 | Split semiconductor heating device |
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| Publication Number | Publication Date |
|---|---|
| CN210951501U true CN210951501U (en) | 2020-07-07 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921808722.4U Active CN210951501U (en) | 2019-10-25 | 2019-10-25 | Split semiconductor heating device |
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| CN (1) | CN210951501U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112178748A (en) * | 2020-10-09 | 2021-01-05 | 徐松 | Electric heating device using semiconductor ceramic |
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2019
- 2019-10-25 CN CN201921808722.4U patent/CN210951501U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112178748A (en) * | 2020-10-09 | 2021-01-05 | 徐松 | Electric heating device using semiconductor ceramic |
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