CN210951825U

CN210951825U - Heating device with built-in semiconductor PTC heating sheet

Info

Publication number: CN210951825U
Application number: CN201921906010.6U
Authority: CN
Inventors: 陆建华; 徐赛; 孙康康
Original assignee: Shandong Guoqi New Energy Technology Co ltd
Current assignee: Shandong Guoqi New Energy Technology Co ltd
Priority date: 2019-11-07
Filing date: 2019-11-07
Publication date: 2020-07-07
Anticipated expiration: 2029-11-07

Abstract

The utility model relates to a heating device of built-in semiconductor PTC heating plate. The technical scheme is as follows: a plurality of rectangular mounting grooves are formed in two ends of the heater shell, a plurality of semiconductor PTC heating sheets are respectively mounted on the mounting grooves in the heater shell to form a plurality of semiconductor PTC heating sheets which are arranged in parallel, and an electrode wire is arranged at one end of each semiconductor PTC heating sheet and is exposed out of the heater shell through the mounting grooves; and a water inlet pipe and a water outlet pipe are arranged at the top of the heating body shell. The beneficial effects are that: cold water enters the heating body shell from the water inlet pipe to rapidly heat the cold water, and the heated water flows into the heating pipe line through the water outlet pipe to be continuously and circularly heated, so that the indoor temperature is increased, and the heating requirement is met; but also can add the mount, improve fixed effect, fall the noise simultaneously, can also carry out the vortex, improve the heating effect, in a word, can satisfy the needs of heating, its simple structure uses reliably, longe-lived.

Description

Heating device with built-in semiconductor PTC heating sheet

Technical Field

The utility model relates to a semiconductor heating device, in particular to heating device of built-in semiconductor PTC piece that generates heat.

Background

In the north, the heating modes commonly used in winter include the following modes, 1, central heating, which is a clean and guaranteed heating mode for a heating company to convey municipal heating to a user home through a pipeline, and has relatively high safety performance, but the whole energy waste is serious, and a resident often opens a window in winter. 2. The radiant floor heating can be realized by various different modes such as a household gas heating furnace, a municipal heating pipe network and a residential boiler room. The heating mode has uniform temperature and is energy-saving, but has higher requirement on the pipe, and can also deform the furniture after a long time. 3. The gas heating mode takes natural gas, liquefied petroleum gas, coal gas and electricity as energy sources, can automatically set heating time and measure according to individual households, but has potential safety hazards, and influences heating when gas is too little in winter. 4. Household central air-conditioning system: the application places are as follows: the villa has the advantages that: the grade is high, the appearance is good, and the comfort level is high; the 'air-cooled type' with a fresh air system is more comfortable; the temperature and the time can be adjusted in advance; the solar energy heat collector is suitable for low-density houses and villas with large areas, and is high in installation cost, large in early investment and poor in heating effect in winter when in severe cold. 5. Household electric boiler: the temperature can be freely adjusted to be suitable for residences: villa principle: electric energy is adopted for heating. The advantages are that: the floor area is small, the installation is simple, and the operation is convenient; also can provide life hot water when the heating, the shortcoming is that the energy consumption is high, and the intensification is slow, need heat the hot water heating of boiler earlier just can heat, 6, electric power heating: the electric heating has more environmental protection and individual operability. The greatest disadvantage is the high requirements and the relatively high costs of use. Such a heating system is being tested in large cities such as Beijing. 7. The electrothermal film heating is a pure resistance type heating body made by printing special conductive ink between two layers of polyester films by taking electric power as an energy source, and is matched with an independent temperature control device, and a low-temperature radiation electrothermal film is used as the heating body, most of the electrothermal film is of a ceiling type, and a small part of the electrothermal film is laid in a wall or even under the floor. The heating system has the characteristics of constant temperature adjustability, economy, comfort, environmental protection, long service life, maintenance-free property and the like, but has the defects of slow heating, generally 1-1.5 hours for heating the indoor temperature to 18 ℃, synchronous system installation and decoration, incapability of nailing, punching and the like on a ceiling.

The existing method of heating cold water by adopting a semiconductor heating method can not meet the requirement of heating, so that the heating device with the built-in semiconductor PTC heating sheet specially designed for heating is specially designed.

Disclosure of Invention

The utility model aims at providing a heating device of built-in semiconductor PTC piece that generates heat to the above-mentioned defect that prior art exists, can satisfy the needs of heating, its simple structure, it is effectual to heat, uses reliably longe-lived.

The utility model provides a heating device of built-in semiconductor PTC heating plate, its technical scheme is: the heating device comprises a heating body shell (1), mounting grooves (2), a water inlet pipe (3), a water outlet pipe (4), an electrode wire (5) and semiconductor PTC heating sheets (6), wherein a plurality of rectangular mounting grooves (2) are formed in two ends of the heating body shell (1), the semiconductor PTC heating sheets (6) are respectively mounted in the mounting grooves (2) in the heating body shell (1) to form a plurality of semiconductor PTC heating sheets (6) which are arranged in parallel, the electrode wire (5) is arranged at one end of each semiconductor PTC heating sheet (6), and the semiconductor PTC heating sheets are exposed out of the heating body shell (1) through the mounting grooves (2); the top of the heating body shell (1) is provided with a water inlet pipe (3) and a water outlet pipe (4).

Preferably, a fixing frame (7) is arranged in the middle of the heating body shell (1), the fixing frame (7) is of a rectangular structure, a noise reduction layer (7.2) is arranged around the fixing frame (7), and a plurality of rectangular through holes (7.1) and water through holes (7.3) are formed in the front face of the fixing frame (7).

Preferably, the inside diameter of the rectangular through hole (7.1) is larger than the outside diameter of the semiconductor PTC heating sheet (6).

Preferably, the noise reduction layer (7.2) adopts a high-temperature resistant rubber ring.

Preferably, nine groups of water through holes (7.3) are provided.

Preferably, six sets of the rectangular through holes (7.1) are provided, the upper side is three sets, and the lower side is three sets.

Preferably, the semiconductor PTC heating sheet (6) is provided with one end of an electrode wire (5), and is fixed in the mounting groove (2) through a high-temperature-resistant structural adhesive, and the electrode wire (5) is exposed outside the heating body shell (1).

The utility model has the advantages that: cold water enters the heating body shell from the water inlet pipe, the plurality of semiconductor PTC heating sheets in the heating body shell rapidly heat the cold water, and the heated water flows into the heating pipe line through the water outlet pipe and is continuously and circularly heated, so that the indoor temperature is improved, and the heating requirement is met; but also can add the mount, improve fixed effect, fall the noise simultaneously, can also carry out the vortex, improve the heating effect, in a word, can satisfy the needs of heating, its simple structure uses reliably, longe-lived.

Drawings

Fig. 1 is a schematic structural diagram of a first embodiment of the present invention;

fig. 2 is a schematic structural view of a heating body housing of the present invention;

fig. 3 is a schematic structural diagram of a second embodiment of the present invention;

FIG. 4 is a schematic structural view of the fixing frame;

FIG. 5 is a schematic structural diagram of a semiconductor PTC heating sheet;

fig. 6 is a schematic structural view of a third embodiment of the present invention;

in the upper diagram: heating body shell 1, mounting groove 2, inlet tube 3, outlet pipe 4, electrode line 5, semiconductor PTC heating plate 6, mount 7, rectangle through hole 7.1, fall and make an uproar layer 7.2, water hole 7.3 cross.

Detailed Description

The preferred embodiments of the present invention will be described in conjunction with the accompanying drawings, and it will be understood that they are presented herein only to illustrate and explain the present invention, and not to limit the present invention.

Embodiment 1, refer to fig. 1-2, the utility model provides a built-in semiconductor PTC heating element's heating device, its technical scheme is: the heating body comprises a heating body shell 1, mounting grooves 2, a water inlet pipe 3, a water outlet pipe 4, an electrode wire 5 and semiconductor PTC heating sheets 6, wherein a plurality of rectangular mounting grooves 2 are formed in two ends of the heating body shell 1, the plurality of semiconductor PTC heating sheets 6 are respectively mounted in the mounting grooves 2 in the heating body shell 1 to form a plurality of semiconductor PTC heating sheets 6 which are arranged in parallel, the electrode wire 5 is arranged at one end of each semiconductor PTC heating sheet 6, and the semiconductor PTC heating sheets are exposed out of the heating body shell 1 through the mounting grooves 2; the top of the heating body shell 1 is provided with a water inlet pipe 3 and a water outlet pipe 4.

Wherein, the inside diameter of the rectangular through hole 7.1 is larger than the outside diameter of the semiconductor PTC heating sheet 6, so that each semiconductor PTC heating sheet 6 can be inserted into the rectangular through hole 7.1.

In addition, six groups are arranged in the rectangular through holes 7.1, the upper side is three groups, the lower side is three groups, and the semiconductor PTC heating sheet heating groups which are uniformly distributed are formed, so that the heating power is improved, and the heating effect is improved.

Referring to the attached drawing 5, the semiconductor PTC heating sheet 6 is provided with one end of an electrode wire 5, and is fixed in the mounting groove 2 by a high temperature resistant structure adhesive, and the electrode wire 5 is exposed outside the heating body shell 1 and is arranged on the same side, so that the power supply can be conveniently connected.

During the use, will the utility model provides a heating device installation heating wire of built-in semiconductor PTC piece that generates heat to connect the circulating pump, connect the power, in cold water gets into heating member shell 1 from the inlet tube, semiconductor PTC piece 6 that generates heat carries out rapid heating to cold water, and the water rethread outlet pipe after the heating flows into the heating wire, and continuous circulation heating to improve indoor temperature, realize the needs of heating.

Embodiment 2, refer to fig. 3 and 4, the utility model provides a built-in semiconductor PTC heating element's heating device, its technical scheme is: the heating body comprises a heating body shell 1, mounting grooves 2, a water inlet pipe 3, a water outlet pipe 4, an electrode wire 5 and semiconductor PTC heating sheets 6, wherein a plurality of rectangular mounting grooves 2 are formed in two ends of the heating body shell 1, the plurality of semiconductor PTC heating sheets 6 are respectively mounted in the mounting grooves 2 in the heating body shell 1 to form a plurality of semiconductor PTC heating sheets 6 which are arranged in parallel, the electrode wire 5 is arranged at one end of each semiconductor PTC heating sheet 6, and the semiconductor PTC heating sheets are exposed out of the heating body shell 1 through the mounting grooves 2; the top of the heating body shell 1 is provided with a water inlet pipe 3 and a water outlet pipe 4.

The middle part of the heating body shell 1 is provided with a fixed frame 7, the fixed frame 7 is of a rectangular structure, a noise reduction layer 7.2 is arranged around the fixed frame 7, and the front surface of the fixed frame 7 is provided with a plurality of rectangular through holes 7.1 and water through holes 7.3; the layer of making an uproar 7.2 falls adopts high temperature resistant rubber circle, like this, avoids cold water to get into heating device after, produces vibration and then produces the noise, influences the effect that the family used.

In addition, the water holes 7.3 of crossing are equipped with the multiunit, and this embodiment uses nine groups as an example, and the hydroenergy of the inlet tube of being convenient for can pass the mount smoothly, then returns out from the outlet pipe, and the mount can also play the effect of vortex, improves the heating effect of water.

During the use, will the utility model provides a heating device installation heating element line of built-in semiconductor PTC heating element, and connect the circulating pump, connect the power, cold water gets into in the heating member shell 1 from the inlet tube, semiconductor PTC heating element 6 carries out rapid heating to cold water, water after the heating is during through the mount, owing to be equipped with water hole 7.3, thus, cold water can produce the vortex, increased with the contact time and the area of semiconductor PTC heating element, heating efficiency has been improved, then, the water hole of crossing of rethread mount enters into the opposite side and continues to heat, the rethread outlet pipe flows into the heating pipe line, continuous circulation heating, thereby improve indoor temperature, realize the needs of heating.

Embodiment 3, the utility model provides a heating device of built-in semiconductor PTC heating plate, with embodiment 2 difference be, can design a plurality of mounts, cold water can produce the vortex many times, increased with the contact time and the area of semiconductor PTC heating plate, improved heating efficiency.

The above description is only a preferred embodiment of the present invention, and any person skilled in the art may modify the present invention or modify it into an equivalent technical solution by using the technical solutions described above. Therefore, any simple modifications or equivalent replacements made according to the technical solution of the present invention belong to the scope of the claimed invention as far as possible.

Claims

1. A heating device with a built-in semiconductor PTC heating sheet is characterized in that: the heating device comprises a heating body shell (1), mounting grooves (2), a water inlet pipe (3), a water outlet pipe (4), an electrode wire (5) and semiconductor PTC heating sheets (6), wherein a plurality of rectangular mounting grooves (2) are formed in two ends of the heating body shell (1), the semiconductor PTC heating sheets (6) are respectively mounted in the mounting grooves (2) in the heating body shell (1) to form a plurality of semiconductor PTC heating sheets (6) which are arranged in parallel, the electrode wire (5) is arranged at one end of each semiconductor PTC heating sheet (6), and the semiconductor PTC heating sheets are exposed out of the heating body shell (1) through the mounting grooves (2); the top of the heating body shell (1) is provided with a water inlet pipe (3) and a water outlet pipe (4).

2. A heating device with a built-in semiconductor PTC heating element according to claim 1, wherein: the middle part of heating body shell (1) be equipped with mount (7), mount (7) are the rectangle structure, are equipped with around mount (7) and fall layer of making an uproar (7.2), are equipped with a plurality of rectangle clearing holes (7.1) and water hole (7.3) in the front of mount (7).

3. A heating device with a built-in semiconductor PTC heating element according to claim 2, wherein: the inner diameter of the rectangular through hole (7.1) is larger than the outer diameter of the semiconductor PTC heating sheet (6).

4. A heating device with a built-in semiconductor PTC heating element according to claim 2, wherein: the noise reduction layer (7.2) is made of high-temperature resistant rubber rings.

5. A heating device with a built-in semiconductor PTC heating element according to claim 2, wherein: nine groups of water through holes (7.3) are arranged.

6. A heating device with a built-in semiconductor PTC heating element according to claim 2, wherein: six groups are arranged on the rectangular through holes (7.1), the upper side is three groups, and the lower side is three groups.

7. A heating device with a built-in semiconductor PTC heating element according to claim 2, wherein: semiconductor PTC heating plate (6) are equipped with the one end of electrode line (5), fix in mounting groove (2) through high temperature resistant structure glue, and electrode line (5) expose in the outside of heating body shell (1).