CN212299456U

CN212299456U - Semiconductor heating and water heating integrated machine

Info

Publication number: CN212299456U
Application number: CN202020811654.3U
Authority: CN
Inventors: 徐赛; 孙康康
Original assignee: Shandong Guoqi New Energy Technology Co ltd
Current assignee: Shandong Guoqi New Energy Technology Co ltd
Priority date: 2020-05-15
Filing date: 2020-05-15
Publication date: 2021-01-05
Anticipated expiration: 2030-05-15

Abstract

The utility model relates to a semiconductor heating hot water all-in-one. The technical scheme is as follows: the heating water inlet pipe and the tap water inlet pipe are mutually independent, penetrate into the semiconductor heating body along the inner cavity of the integrated machine shell, extend out from the lower side of the semiconductor heating body through bending once or more than once in the inner cavity of the semiconductor heating body, and penetrate through the bottom of the integrated machine shell to form a heating water outlet and a hot water outlet. The beneficial effects are that: the semi-conductor heating body is adopted, so that the energy-saving electric heating device has the advantages of long service life and high heat efficiency, saves energy compared with the traditional electric heating device, has long service life, really realizes water-electricity separation, and can conduct the waste heat of heating in winter to a hot water pipeline, thereby further realizing the purpose of energy conservation.

Description

Semiconductor heating and water heating integrated machine

Technical Field

The utility model relates to a semiconductor heating device, in particular to semiconductor heating hot water all-in-one.

Background

In the north, the heating modes commonly used in winter include the following modes, 1, central heating, which is a clean and guaranteed heating mode that a heating group transmits municipal heating to a user home through a pipeline, and has relatively high safety performance but large overall energy consumption. 2. The radiant floor heating can be realized by various different modes such as a household gas heating furnace, a municipal heating pipe network and a residential boiler room. The heating mode has uniform temperature and is energy-saving, but has higher requirement on the pipe, and can also deform the furniture after a long time. 3. The gas heating mode takes natural gas, liquefied petroleum gas, coal gas and electricity as energy sources, can automatically set heating time and measure according to individual households, but has potential safety hazards, and influences heating when gas is too little in winter. 4. Household central air-conditioning system: the application places are as follows: the villa has the advantages that: the grade is high, the appearance is good, and the comfort level is high; the 'air-cooled type' with a fresh air system is more comfortable; the temperature and the time can be adjusted in advance; the solar energy heat collector is suitable for low-density houses and villas with large areas, and is high in installation cost, large in early investment and poor in heating effect in winter when in severe cold. 5. Household electric boiler: the temperature can be freely adjusted to be suitable for residences: villa principle: electric energy is adopted for heating. The advantages are that: the floor area is small, the installation is simple, and the operation is convenient; also can provide life hot water when the heating, the shortcoming is that the energy consumption is high, and the intensification is slow, need heat the hot water heating of boiler earlier just can heat, 6, electric power heating: the electric heating has more environmental protection and individual operability. The greatest disadvantage is the high requirements and the relatively high costs of use. Such a heating system is being tested in large cities such as Beijing. 7. The electrothermal film heating is a pure resistance type heating body made by printing special conductive ink between two layers of polyester films by taking electric power as an energy source, and is matched with an independent temperature control device, and a low-temperature radiation electrothermal film is used as the heating body, most of the electrothermal film is of a ceiling type, and a small part of the electrothermal film is laid in a wall or even under the floor. The heating system has the characteristics of constant temperature adjustability, economy, comfort, environmental protection, long service life, maintenance-free property and the like, but has the defects of slow heating, generally 1-1.5 hours for heating the indoor temperature to 18 ℃, synchronous system installation and decoration, incapability of nailing, punching and the like on a ceiling.

The company applies for a Chinese patent application No. 2019218087224 with a patent name of 'split type semiconductor heating device' in 2019, 10 and 25, and directly heats circulating water of a floor heating pipe through a semiconductor heater without a boiler, so that the heating speed is high, the temperature is convenient to control, and the mode of flexibly controlling heating without switching off and switching on at any time is realized. However, the function of heating hot water is not integrated, and heating and hot water heating are not realized as separate functions. The existing method is that water is often taken from a heating pipeline for household use, and the problem that the temperature of heating water is reduced, so that the indoor temperature is influenced, the environment is not protected, the water in the heating pipeline is recycled, and the household use is unsafe.

Disclosure of Invention

The utility model aims at providing a semiconductor heating hot water all-in-one to the above-mentioned defect that prior art exists, directly divide into two sets of pipelines of independence with heating water heating and hot water heating to form the all-in-one structure, adopt the semiconductor to heat, its thermal efficiency is high, and is fast, energy-concerving and environment-protective.

The utility model provides a semiconductor heating hot water all-in-one, its technical scheme is: comprises an integrated shell (1), a control display (2), a heating water inlet (3), a heating water outlet (4), a tap water inlet (5), a hot water outlet (6), a semiconductor heating body (7), a heating water inlet pipe (8), a tap water inlet pipe (9), a hot water outlet pipe (10) and a heating water outlet pipe (11), wherein the front of the integrated shell (1) is provided with the control display (2), the semiconductor heating body (7) is arranged in the inner cavity of the integrated shell (1), the inner cavity of the semiconductor heating body (7) is provided with a plurality of groups of semiconductor heating strips (7.2) and heat exchange sheets (7.4), the bottom of the integrated shell (1) is provided with the heating water inlet (3) and the tap water inlet (5) which are respectively connected with the heating water inlet pipe (8) and the tap water inlet pipe (9), and the heating water, pass along all-in-one casing (1) inner chamber and get into in semiconductor heating body (7) to stretch out from semiconductor heating body (7) downside again through once or more than once buckling at semiconductor heating body (7) inner chamber, pass the bottom of all-in-one casing (1) again and form heating delivery port (4) and hot water delivery port (6), at heating inlet tube (8) installation circulating pump (16), make the water of heating inlet tube (8) can the forced circulation.

Preferably, a hot water temperature sensor (12) is arranged at the hot water outlet (6), a heating water temperature sensor (13) is arranged at the heating water outlet (4), and a high temperature sensor (14) is arranged in the semiconductor heating body (7).

Preferably, a water flow switch (15) is installed on the side of the circulation pump (16) of the heating water inlet pipe (8).

Preferably, the semiconductor heating body (7) comprises a heating body shell (7.1), a semiconductor heating bar (7.2), heat-insulating cotton (7.3) and heat exchange fins (7.4), wherein the heat-insulating cotton (7.3) is arranged on the heating body shell (7.1), the heat exchange fins (7.4) are arranged in the inner cavity of the heating body shell (7.1), the heating water inlet pipe (8) and the tap water inlet pipe (9) are mutually independent, and the heat exchange fins (7.4) in the inner cavity of the semiconductor heating body (7) are bent once or more than once and then extend out of the lower side of the semiconductor heating body (7); a plurality of groups of semiconductor heating strips (7.2) are arranged in gaps among the heat exchange fins (7.4), and heat energy generated by the semiconductor heating strips (7.2) is quickly transferred to a heating water inlet pipe (8) and a tap water inlet pipe (9) through the heat exchange fins (7.4).

Preferably, the heat exchange fins (7.4) are stacked in multiple rows, and multiple groups of semiconductor heating strips (7.2) are arranged between every two rows at intervals.

Preferably, the heat exchange plates (7.4) adopt corrugated heat exchange plates.

Preferably, the heat exchange plates (7.4) are corrugated heat exchange plates made of thermite materials.

Preferably, an on-off key (2.1), a setting key (2.2), a temperature-raising key (2.3), a temperature-lowering key (2.4) and a timing key (2.5) are respectively arranged on the lower side of the control display (2).

The utility model has the advantages that: the utility model discloses a semiconductor heating strip is as heating element, has longe-lived, advantage that the thermal efficiency is high, compares traditional electric heating equipment energy-conservation 30%, and the life-span is 3-5 times of traditional heating equipment. The adopted semiconductor heating body has high thermal efficiency, really realizes water-electricity separation and heating hot water pipeline separation, and when the heating and hot water functions are used simultaneously in winter, the waste heat of heating can be conducted to the hot water pipeline, thereby further realizing the purpose of energy conservation; when heating is not needed in spring, summer and autumn, the circulating pump and the water flow switch can be closed, and only the hot water function is realized; the semiconductor heating strips are electrified to generate heat, and the heat is conducted to the pipeline through the corrugated aluminum alloy heat exchange sheets, so that the heat transfer efficiency is high; the corrugated heat exchange plate is made of aluminum alloy materials, has the advantages of high heat conductivity coefficient and high temperature resistance without deformation, and can efficiently conduct heat generated by the semiconductor heating bar to pipeline liquid; the heating pipeline and the hot water pipeline are separately designed, so that the problem that the heating water cannot be used for hot water due to the fact that the heating water is not environment-friendly after being circulated for many times and even becomes turbid is solved.

Drawings

FIG. 1 is a front view of the present invention;

FIG. 2 is a schematic structural diagram of the present invention;

FIG. 3 is a schematic bottom view of the semiconductor heater;

FIG. 4 is a schematic top view of the semiconductor heater;

FIG. 5 is a schematic view of the structure of the semiconductor heating body;

FIG. 6 is a schematic view of a mounting face of a semiconductor heating strip;

in the upper diagram: an integrated machine shell 1, a control display 2, a heating water inlet 3, a heating water outlet 4, a tap water inlet 5, a hot water outlet 6, a semiconductor heating body 7, a heating water inlet pipe 8, a tap water inlet pipe 9, a hot water outlet pipe 10, a heating water outlet pipe 11, a hot water temperature sensor 12, a heating water temperature sensor 13, a high temperature sensor 14, a water flow switch 15 and a circulating pump 16,

an on-off key 2.1, a setting key 2.2, a temperature-raising key 2.3, a temperature-lowering key 2.4, a timing key 2.5,

The heating body comprises a heating body shell 7.1, a semiconductor heating bar 7.2, heat preservation cotton 7.3 and heat exchange fins 7.4.

Detailed Description

The preferred embodiments of the present invention will be described in conjunction with the accompanying drawings, and it will be understood that they are presented herein only to illustrate and explain the present invention, and not to limit the present invention.

Embodiment 1, refer to fig. 1-6, the utility model provides a semiconductor heating and water heating integrated machine, including integrated machine housing 1, control display 2, heating water inlet 3, heating water outlet 4, running water inlet 5, hot water outlet 6, semiconductor heating body 7, heating water inlet pipe 8, running water inlet pipe 9, hot water outlet pipe 10, heating water outlet pipe 11, the front of integrated machine housing 1 is equipped with control display 2, is equipped with semiconductor heating body 7 in the inner chamber of integrated machine housing 1, is equipped with multiunit semiconductor heating strip 7.2 and heat exchanger fin 7.4 in the inner chamber of semiconductor heating body 7, is equipped with heating water inlet 3 and running water inlet 5 in the bottom of integrated machine housing 1, connects heating water inlet pipe 8 and running water inlet pipe 9 respectively, heating water inlet pipe 8 and running water inlet pipe 9 are independent each other, pass along integrated machine housing 1 inner chamber and get into semiconductor heating body 7, and the inner cavity of the semiconductor heating body 7 is bent once and then extends out from the lower side of the semiconductor heating body 7, and then penetrates through the bottom of the integrated machine shell 1 to form a heating water outlet 4 and a hot water outlet 6, and a circulating pump 16 is arranged on a heating water inlet pipe 8, so that water in the heating water inlet pipe 8 can be forcibly circulated.

Referring to fig. 2, a hot water temperature sensor 12 is disposed at the hot water outlet 6 for monitoring the temperature of hot water, a heating water temperature sensor 13 is disposed at the heating water outlet 4 for monitoring the temperature of heating water, and a high temperature sensor 14 is disposed in the semiconductor heating body 7 for monitoring the temperature inside the semiconductor heating body 7. The heating pipeline is made of copper pipes, the heat conduction coefficient is high, and ternary spraying treatment is performed on the inner surface of the pipeline, so that the inner surface scaling probability is reduced.

In addition, a water flow switch 15 is installed on one side of a circulating pump 16 of the heating water inlet pipe 8, and is used in cooperation with the circulating pump 16 to control the switching and circulation of the heating water.

Referring to the attached drawings 3-6, the semiconductor heating body 7 provided by the utility model comprises a heating body shell 7.1, a semiconductor heating bar 7.2, heat preservation cotton 7.3 and heat exchange fins 7.4, wherein the heating body shell 7.1 is provided with the heat preservation cotton 7.3, the heat exchange fins 7.4 are arranged in the inner cavity of the heating body shell 7.1, the heating water inlet pipe 8 and the tap water inlet pipe 9 are mutually independent, and the heat exchange fins 7.4 in the inner cavity of the semiconductor heating body 7 are bent once or more than once and then extend out from the lower side of the semiconductor heating body 7; a plurality of groups of semiconductor heating strips 7.2 are arranged in gaps among the heat exchange fins 7.4, and heat energy generated by the semiconductor heating strips 7.2 is quickly transferred to a heating water inlet pipe 8 and a tap water inlet pipe 9 through the heat exchange fins 7.4.

Specifically, above-mentioned heat exchanger fin 7.4 stack is provided with the multirow, the utility model discloses use and set up five rows of heat exchanger fins from top to bottom as the example, the interval is equipped with a plurality of groups semiconductor heating strip 7.2 between per two rows.

Specifically, the corrugated heat exchange plate made of the aluminothermic material is adopted by the heat exchange plate 7.4, the corrugated heat exchange plate is made of an aluminum alloy material, and the corrugated heat exchange plate has the advantages of high heat conductivity coefficient and high temperature resistance and no deformation, and can efficiently conduct heat generated by the semiconductor heating bar to pipeline liquid.

Furthermore, referring to fig. 2, the lower side of the control display 2 is respectively provided with an on-off key 2.1, a setting key 2.2, a warming key 2.3, a cooling key 2.4 and a timing key 2.5, which is convenient for operation and control.

The utility model discloses a semiconductor heating strip has longe-lived, advantage that the thermal efficiency is high as heating element. Compared with the traditional electric heating equipment, the energy is saved by 30 percent, and the service life of the electric heating equipment is 3-5 times that of the traditional heating equipment. The adopted semiconductor heating body has high thermal efficiency, really realizes water-electricity separation and heating hot water pipeline separation, and when the heating and hot water functions are used simultaneously in winter, the waste heat of heating can be conducted to the hot water pipeline, thereby further realizing the purpose of energy conservation; when heating is not needed in spring, summer and autumn, the circulating pump and the water flow switch can be closed, and only the hot water function is realized. The semiconductor heating strips are electrified to generate heat, the heat is conducted to the pipeline through the corrugated aluminum alloy heat exchange sheets, and the heat transfer efficiency is high. The corrugated heat exchange plate is made of aluminum alloy materials, has the advantages of high heat conductivity coefficient and high temperature resistance without deformation, and can conduct almost zero loss of heat generated by the semiconductor heating bar to pipeline liquid. The heating and hot water pipeline separation design solves the problem that heating water cannot be used for hot water due to the fact that the heating water is not environment-friendly after being circulated for many times and even becomes turbid. The heating pipeline in the heating core is made of copper pipes, the heat conduction coefficient is high, and ternary spraying treatment is performed on the inner surface of the pipeline, so that the scaling probability of the inner surface is reduced. The hot water pipeline is made of copper pipes meeting the national sanitation standard, the heat conductivity coefficient is high, and the produced hot water is safe and sanitary.

Embodiment 2, referring to fig. 1-6, the semiconductor heating and water heating integrated machine of the present invention comprises an integrated machine housing 1, a control display 2, a heating water inlet 3, a heating water outlet 4, a tap water inlet 5, a hot water outlet 6, a semiconductor heating body 7, a heating water inlet pipe 8, a tap water inlet pipe 9, a hot water outlet pipe 10, and a heating water outlet pipe 11, wherein the control display 2 is disposed on the front side of the integrated machine housing 1, the semiconductor heating body 7 is disposed in the inner cavity of the integrated machine housing 1, a plurality of groups of semiconductor heating strips 7.2 and heat exchanging fins 7.4 are disposed in the inner cavity of the semiconductor heating body 7, the heating water inlet 3 and the tap water inlet 5 are disposed at the bottom of the integrated machine housing 1 and respectively connected to the heating water inlet pipe 8 and the tap water inlet pipe 9, the heating water inlet pipe 8 and the tap, and the inner cavity of the semiconductor heating body 7 is bent twice and then extends out from the lower side of the semiconductor heating body 7, and then passes through the bottom of the shell 1 of the integrated machine to form a heating water outlet 4 and a hot water outlet 6, and a circulating pump 16 is arranged on a heating water inlet pipe 8, so that the water of the heating water inlet pipe 8 can be forcibly circulated. Thus, under the condition that space allows, high-power heating is realized, and the heating speed is higher.

The above description is only a preferred embodiment of the present invention, and any person skilled in the art may modify the present invention or modify it into an equivalent technical solution by using the technical solutions described above. Therefore, any simple modifications or equivalent replacements made according to the technical solution of the present invention belong to the scope of the claimed invention as far as possible.

Claims

1. The utility model provides a semiconductor heating hot water all-in-one which characterized by: comprises an integrated shell (1), a control display (2), a heating water inlet (3), a heating water outlet (4), a tap water inlet (5), a hot water outlet (6), a semiconductor heating body (7), a heating water inlet pipe (8), a tap water inlet pipe (9), a hot water outlet pipe (10) and a heating water outlet pipe (11), wherein the front of the integrated shell (1) is provided with the control display (2), the semiconductor heating body (7) is arranged in the inner cavity of the integrated shell (1), the inner cavity of the semiconductor heating body (7) is provided with a plurality of groups of semiconductor heating strips (7.2) and heat exchange sheets (7.4), the bottom of the integrated shell (1) is provided with the heating water inlet (3) and the tap water inlet (5) which are respectively connected with the heating water inlet pipe (8) and the tap water inlet pipe (9), and the heating water, pass along all-in-one casing (1) inner chamber and get into in semiconductor heating body (7) to stretch out from semiconductor heating body (7) downside again through once or more than once buckling at semiconductor heating body (7) inner chamber, pass the bottom of all-in-one casing (1) again and form heating delivery port (4) and hot water delivery port (6), at heating inlet tube (8) installation circulating pump (16), make the water of heating inlet tube (8) can the forced circulation.

2. The semiconductor heating and water heating integrated machine according to claim 1, wherein: a hot water temperature sensor (12) is arranged at the hot water outlet (6), a heating water temperature sensor (13) is arranged at the heating water outlet (4), and a high temperature sensor (14) is arranged in the semiconductor heating body (7).

3. The semiconductor heating and water heating integrated machine according to claim 1, wherein: and a water flow switch (15) is arranged on one side of a circulating pump (16) of the heating water inlet pipe (8).

4. The semiconductor heating and water heating integrated machine according to claim 1, wherein: the semiconductor heating body (7) comprises a heating body shell (7.1), a semiconductor heating bar (7.2), heat-insulating cotton (7.3) and heat exchange fins (7.4), wherein the heat-insulating cotton (7.3) is arranged on the heating body shell (7.1), the heat exchange fins (7.4) are arranged in the inner cavity of the heating body shell (7.1), and the heating water inlet pipe (8) and the tap water inlet pipe (9) are bent once or more than once in the heat exchange fins (7.4) in the inner cavity of the semiconductor heating body (7) and then extend out of the lower side of the semiconductor heating body (7); a plurality of groups of semiconductor heating strips (7.2) are arranged in gaps among the heat exchange fins (7.4), and heat energy generated by the semiconductor heating strips (7.2) is quickly transferred to a heating water inlet pipe (8) and a tap water inlet pipe (9) through the heat exchange fins (7.4).

5. The semiconductor heating and water heating integrated machine according to claim 4, wherein: the heat exchange fins (7.4) are arranged in a plurality of rows in an overlapping mode, and a plurality of groups of semiconductor heating strips (7.2) are arranged between every two rows at intervals.

6. The semiconductor heating and water heating integrated machine according to claim 4, wherein: the heat exchange plates (7.4) adopt corrugated heat exchange plates.

7. The semiconductor heating and water heating integrated machine according to claim 5, wherein: the heat exchange plates (7.4) are corrugated heat exchange plates made of aluminothermic materials.

8. The semiconductor heating and water heating integrated machine according to claim 1, wherein: the lower side of the control display (2) is respectively provided with an on-off key (2.1), a setting key (2.2), a warming key (2.3), a cooling key (2.4) and a timing key (2.5).