CN212269962U - Insulation shielding wave-absorbing composite material - Google Patents

Insulation shielding wave-absorbing composite material Download PDF

Info

Publication number
CN212269962U
CN212269962U CN202020243591.6U CN202020243591U CN212269962U CN 212269962 U CN212269962 U CN 212269962U CN 202020243591 U CN202020243591 U CN 202020243591U CN 212269962 U CN212269962 U CN 212269962U
Authority
CN
China
Prior art keywords
layer
wave
composite material
absorbing
aluminum foil
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202020243591.6U
Other languages
Chinese (zh)
Inventor
朱娜
施艳萍
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hanping Kunshan Electronic Co ltd
Original Assignee
Hanping Kunshan Electronic Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hanping Kunshan Electronic Co ltd filed Critical Hanping Kunshan Electronic Co ltd
Priority to CN202020243591.6U priority Critical patent/CN212269962U/en
Application granted granted Critical
Publication of CN212269962U publication Critical patent/CN212269962U/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Landscapes

  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

The utility model relates to an insulation shielding wave-absorbing composite material. It includes: the aluminum foil wave-absorbing material comprises a plastic film layer, a curing adhesive layer, an aluminum foil layer and a wave-absorbing material layer, wherein one surface of the aluminum foil layer is provided with the curing adhesive layer, the surface of the curing adhesive layer, which deviates from the aluminum foil layer, is provided with the plastic film layer, and the other surface of the aluminum foil layer is provided with the wave-absorbing material layer. The insulating shielding wave-absorbing composite material has good insulativity, shielding performance and magnetic conductivity, and when the insulating shielding wave-absorbing composite material is used, only the adhesive layer is required to be arranged on the surface of the wave-absorbing material layer deviating from the aluminum foil layer, and then the insulating shielding wave-absorbing composite material is attached to the surface of a component through the adhesive layer. The use is quick and convenient. Moreover, the insulation shielding wave-absorbing composite material with the structure has relatively low cost. When the plastic film layer is a polyimide film, a polyamide film or a polyether-ether-ketone film, the composite material has high temperature resistance.

Description

Insulation shielding wave-absorbing composite material
Technical Field
The utility model relates to a wave-absorbing material field especially relates to insulation shielding wave-absorbing composite material.
Background
The wave-absorbing material can effectively prevent harmful electromagnetic waves from causing mutual interference among components in the electronic equipment. However, in practical application, the shielding material is often used together, so that an ideal effect can be achieved. With the arrival of the 5G era, the requirements on the performance of materials are more and more diversified, and the traditional wave-absorbing material is inconvenient to use, single in function and high in price and cannot meet the requirements.
SUMMERY OF THE UTILITY MODEL
Therefore, it is necessary to provide an insulation shielding wave-absorbing composite material for solving the problem of inconvenient use of the conventional wave-absorbing material.
An insulating shielding wave-absorbing composite material is provided,
the method comprises the following steps: the aluminum foil wave-absorbing material comprises a plastic film layer, a curing adhesive layer, an aluminum foil layer and a wave-absorbing material layer, wherein one surface of the aluminum foil layer is provided with the curing adhesive layer, the surface of the curing adhesive layer, which deviates from the aluminum foil layer, is provided with the plastic film layer, and the other surface of the aluminum foil layer is provided with the wave-absorbing material layer.
The insulating shielding wave-absorbing composite material has good insulativity, shielding performance and magnetic conductivity, and when the insulating shielding wave-absorbing composite material is used, only the adhesive layer is required to be arranged on the surface of the wave-absorbing material layer deviating from the aluminum foil layer, and then the insulating shielding wave-absorbing composite material is attached to the surface of a component through the adhesive layer. The use is quick and convenient. Moreover, the insulation shielding wave-absorbing composite material with the structure has relatively low cost.
In one embodiment, one side of the wave-absorbing material layer, which is far away from the aluminum foil layer, is provided with a double-sided adhesive layer, and one side of the double-sided adhesive layer, which is far away from the wave-absorbing material layer, is provided with a release layer.
In one embodiment, the plastic film layer comprises one of the following materials: polyethylene terephthalate, polyimide films, polyamide films, and polyetheretherketone films.
In one embodiment, the plastic film layer has a thickness of 9 μm to 25 μm.
In one embodiment, the aluminum foil layer has a thickness of 9 μm to 25 μm.
In one embodiment, the thickness of the cured glue layer is 2 μm to 5 μm.
In one embodiment, the shielding effectiveness of the insulating shielding wave-absorbing composite material in a frequency band of 10MHz-3GHz is more than 80dB, and the magnetic permeability of the wave-absorbing material layer is 30-300.
In one embodiment, the double-sided adhesive layer is a substrate-free adhesive film or a PET double-sided adhesive tape.
In one embodiment, the overall thickness of the insulation shielding wave-absorbing composite material is 0.04mm-0.35mm, and the thickness of the wave-absorbing material layer is 0.02mm-0.3 mm.
In one embodiment, the double-sided adhesive layer is 1500g/inch in viscosity.
Drawings
Fig. 1 is a schematic view of an insulation shielding wave-absorbing composite material according to an embodiment of the present invention.
Wherein:
110. aluminium foil layer
120. Cured adhesive layer
130. Plastic film layer
140. Wave-absorbing material layer
150. Double-sided adhesive layer
160. Release layer
Detailed Description
In order to make the above objects, features and advantages of the present invention more comprehensible, embodiments of the present invention are described in detail below with reference to the accompanying drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. The present invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein, as those skilled in the art will be able to make similar modifications without departing from the spirit and scope of the present invention.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.
As shown in fig. 1, an embodiment of the utility model provides an insulating shielding wave-absorbing composite material, which includes: plastic film layer, solidification glue film, aluminium foil layer and absorbing material layer. One of the surface on aluminium foil layer is provided with the solidification glue film, the surface that the solidification glue film deviates from the aluminium foil layer is provided with plastic film layer, another surface on aluminium foil layer is provided with the absorbing material layer.
The insulating shielding wave-absorbing composite material has good insulativity, shielding performance and magnetic conductivity, and when the insulating shielding wave-absorbing composite material is used, only the adhesive layer is required to be arranged on the surface of the wave-absorbing material layer deviating from the aluminum foil layer, and then the insulating shielding wave-absorbing composite material is attached to the surface of a component through the adhesive layer. The use is quick and convenient. Moreover, the insulation shielding wave-absorbing composite material with the structure has relatively low cost. Furthermore, the LED lamp has good heat dissipation performance, and components cannot be damaged due to local over-ironing when the LED lamp is used.
During the use, can the utility model discloses a combined material's absorbing material layer deviates from the one side on aluminium foil layer and sets up the double faced adhesive tape, then is whole through the double faced adhesive tape attached on components and parts with combined material. The double-sided adhesive tape can be a non-base material adhesive film or a PET double-sided adhesive tape.
Specifically, the wave-absorbing material layer deviates from one side of aluminium foil layer is provided with double-sided adhesive layer, double-sided adhesive layer deviates from the one side of wave-absorbing material layer is provided with from the type layer.
Further, the double-sided adhesive layer is 1500g/inch in viscosity. No adhesive residue.
The plastic film layer, the cured adhesive layer, and the aluminum foil layer together form an aluminum foil mylar. The aluminum foil plays a role in shielding and insulating.
Specifically, a layer of curing glue is coated on the surface of the plastic film layer, and then the plastic film layer and the aluminum foil layer are compounded together.
In the above mylar aluminum foil structure, the plastic film layer may be one of polyethylene terephthalate (PET), Polyimide (PI), Polyamide (PA) and Polyetheretherketone (PEEK), and has a thickness of 9 μm to 25 μm. The thickness of the curing glue layer is 2-5 μm. The thickness of the aluminum foil layer is 9-25 μm. Wherein polyimide film (PI), polyamide membrane (PA) and polyether ether ketone membrane (PEEK) temperature resistant are up to 260 ℃, and compound the back with the aluminium foil, make the utility model discloses a combined material has high temperature resistance concurrently. Moreover, the aluminum foil mylar has good binding force among layers and is not easy to layer.
Specifically, the aluminum foil mylar compounding process can adopt the following processes: a plastic film with the thickness of 9-25 mu m is taken as a base material, a coating process is adopted, and the temperatures of three sections of ovens are respectively set as follows: 60-90 ℃, 70-100 ℃, 80-110 ℃ and the speed is set to be 30-50M/min, and then the aluminum foil is compounded.
In the embodiment, the insulation shielding wave-absorbing composite material takes aluminum foil mylar as a base material, a coating process is adopted, a uniform wave-absorbing material layer with a rough surface is formed on the aluminum surface of the aluminum foil mylar, and a vulcanization process is adopted to enable the surface of the wave-absorbing material layer to be smooth and flat.
Specifically, the coating front section of the wave-absorbing material layer can adopt the following process: the resin is one of ethylene propylene diene monomer, polyurethane and epoxy resin. The solvent is one or two of N-methyl pyrrolidone, cyclohexanone, butanone, N, N-dimethylformamide, xylene and ethyl acetate. The curing agent is one of dicumyl peroxide (DCP), Toluene Diisocyanate (TDI) and diphenylmethane diisocyanate (MDI). Using a sol-gel machine according to the ratio of resin to solvent in a ratio of 1: 2-1: 5, stirring at the temperature of 70-90 ℃ within 100r/min until the colloid is fully dissolved, then continuing to perform stirring for 24-48 h, standing to room temperature, and then performing magnetic powder: adding pure resin in a ratio of 6-10:1, selecting magnetic powder with magnetic conductivity of 30-300, adding solvent until the total addition of the solvent is 1-1.2 times of the weight of the resin and the magnetic powder, and stirring for 1-3 h at room temperature. Then adding the curing agent and stirring for 15min at the speed of 100r/min-500r/min, and coating on a machine after stirring.
Coating and vulcanizing process: the method comprises the steps of taking 0.020-0.055 mm thick aluminum foil Mylar as a base material, adopting a coating process, setting the temperature of each section of oven to be 85-135 ℃, setting the speed to be 0.5-1.5M/min, forming a uniform wave-absorbing material layer with a rough surface on the surface of the aluminum foil Mylar, and then adopting a drum vulcanizer to process the surface of the wave-absorbing material layer to be smooth and flat.
In the embodiment, the shielding effectiveness of the insulating shielding wave-absorbing composite material in a frequency band of 10MHz-3GHz is more than 80dB, and the magnetic permeability of the wave-absorbing material layer is 30-300.
In this embodiment, the overall thickness of the insulation shielding wave-absorbing composite material is 0.04mm to 0.35mm, for example, 0.04mm, 0.3mm, 0.35mm, and the like. The thickness of the wave-absorbing material layer is 0.02mm-0.3mm, such as 0.02mm, 0.2mm,0.3mm and the like.
It should be noted that, in the above-mentioned embodiments, the magnetic permeability is under the condition of 1 MHz.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only represent some embodiments of the present invention, and the description thereof is specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.

Claims (10)

1. An insulation shielding wave-absorbing composite material is characterized in that,
the method comprises the following steps: the aluminum foil wave-absorbing material comprises a plastic film layer, a curing adhesive layer, an aluminum foil layer and a wave-absorbing material layer, wherein one surface of the aluminum foil layer is provided with the curing adhesive layer, the surface of the curing adhesive layer, which deviates from the aluminum foil layer, is provided with the plastic film layer, and the other surface of the aluminum foil layer is provided with the wave-absorbing material layer.
2. The insulation shielding wave-absorbing composite material according to claim 1, wherein a double-sided adhesive layer is arranged on one side of the wave-absorbing material layer departing from the aluminum foil layer, and a release layer is arranged on one side of the double-sided adhesive layer departing from the wave-absorbing material layer.
3. The insulation shielding wave absorbing composite material of claim 1, wherein said plastic film layer comprises one of the following materials: polyethylene terephthalate, polyimide films, polyamide films, and polyetheretherketone films.
4. The insulation shielding wave absorbing composite material as claimed in claim 1, wherein the thickness of the plastic film layer is 9 μm to 25 μm.
5. The insulation shielding wave absorbing composite material of claim 1, wherein the aluminum foil layer has a thickness of 9 μm to 25 μm.
6. The insulation shielding wave absorbing composite material of claim 1, wherein the thickness of the cured glue layer is 2 μm to 5 μm.
7. The insulation shielding wave-absorbing composite material of claim 1, wherein the shielding effectiveness of the insulation shielding wave-absorbing composite material in a frequency band of 10MHz-3GHz is more than 80dB, and the magnetic permeability of the wave-absorbing material layer is 30-300.
8. The insulation shielding wave-absorbing composite material as claimed in claim 2, wherein the double-sided adhesive layer is a substrate-free adhesive film or a PET double-sided adhesive tape.
9. The insulation shielding wave-absorbing composite material of claim 1, wherein the overall thickness of the insulation shielding wave-absorbing composite material is 0.04mm-0.35mm, and wherein the thickness of the wave-absorbing material layer is 0.02mm-0.3 mm.
10. The insulation shielding wave absorbing composite material of claim 2, wherein the double-sided adhesive layer has a viscosity of 1500 g/inch.
CN202020243591.6U 2020-03-03 2020-03-03 Insulation shielding wave-absorbing composite material Active CN212269962U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202020243591.6U CN212269962U (en) 2020-03-03 2020-03-03 Insulation shielding wave-absorbing composite material

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202020243591.6U CN212269962U (en) 2020-03-03 2020-03-03 Insulation shielding wave-absorbing composite material

Publications (1)

Publication Number Publication Date
CN212269962U true CN212269962U (en) 2021-01-01

Family

ID=73874923

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202020243591.6U Active CN212269962U (en) 2020-03-03 2020-03-03 Insulation shielding wave-absorbing composite material

Country Status (1)

Country Link
CN (1) CN212269962U (en)

Similar Documents

Publication Publication Date Title
CN108003812B (en) Reaction type heat-conducting insulating double-sided adhesive tape and preparation method thereof
KR101661583B1 (en) Electromagnetic wave shielding and absorbing sheet and manufacturing method of the same
CN104981138A (en) Electromagnetic shielding heat-dissipation film and manufacturing method thereof
US20070275237A1 (en) Electromagnetic shielding tape
KR102209172B1 (en) Method for producing soft magnetic film laminate circuit board
CN109664567B (en) Thin-sheet type heat-conducting wave-absorbing composite material and preparation method thereof
CN114274623B (en) High-temperature-resistant wave absorbing plate and preparation method thereof
CN101664733B (en) Method for making prepreg used for thick copper multilayer printed circuit board and prepreg
WO2020020195A1 (en) Fpc electromagnetic shielding film with polyimide film as insulating layer, and preparation method therefor
CN111806016A (en) Insulating adhesive film and preparation method thereof
CN105007704A (en) Composite heat-dissipation wave-absorbing film
KR20170076361A (en) Complex sheets with shielding and absorbing of electromagnetic waves and thermal dissipation, and methods of manufacturing the same
CN104972709A (en) High-heat-dissipation wave-absorbing composite film and manufacturing method thereof
KR102251415B1 (en) Preparation method of electromagnetic wave shielding film for flexible printed circuit board
CN106147227A (en) A kind of high-frequency copper-clad plate, prepreg and preparation method thereof
CN105282959B (en) High frequency cover film and its manufacturing method with low Dk and Df characteristics
CN115139589B (en) High-heat-conductivity copper-clad plate and preparation method thereof
CN112341972A (en) Flexible wave-absorbing material and preparation method thereof, wave-absorbing adhesive tape and preparation method thereof
CN102825861B (en) Heat-conductive two-sided flexible copper clad laminate and manufacturing method thereof
CN212269962U (en) Insulation shielding wave-absorbing composite material
TW201325425A (en) Electromagnetic wave shielding composited films and flexible printed circuit boards with the composite film
KR101498140B1 (en) Manufacturing method of cover layer for FPC and Manufacturing method of FPC and cover layer for FPC and FPC using the methods
CN203157257U (en) Compound type copper foil base plate with electromagnetic shielding effect
JPH0946012A (en) Low dielectric constant flexible wiring board
CN114716934A (en) Heat-conducting shielding composite material and preparation method thereof

Legal Events

Date Code Title Description
GR01 Patent grant
GR01 Patent grant