CN112341972A - Flexible wave-absorbing material and preparation method thereof, wave-absorbing adhesive tape and preparation method thereof - Google Patents
Flexible wave-absorbing material and preparation method thereof, wave-absorbing adhesive tape and preparation method thereof Download PDFInfo
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- CN112341972A CN112341972A CN202011246424.8A CN202011246424A CN112341972A CN 112341972 A CN112341972 A CN 112341972A CN 202011246424 A CN202011246424 A CN 202011246424A CN 112341972 A CN112341972 A CN 112341972A
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- wave
- sensitive adhesive
- pressure
- absorbing
- silver ion
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- 239000011358 absorbing material Substances 0.000 title claims abstract description 51
- 238000002360 preparation method Methods 0.000 title claims abstract description 37
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 65
- 239000002250 absorbent Substances 0.000 claims abstract description 43
- 230000002745 absorbent Effects 0.000 claims abstract description 43
- 239000003822 epoxy resin Substances 0.000 claims abstract description 36
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 36
- 239000000853 adhesive Substances 0.000 claims abstract description 35
- 230000001070 adhesive effect Effects 0.000 claims abstract description 35
- 239000003085 diluting agent Substances 0.000 claims abstract description 32
- 239000012752 auxiliary agent Substances 0.000 claims abstract description 23
- 229920001971 elastomer Polymers 0.000 claims abstract description 15
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- 229920002635 polyurethane Polymers 0.000 claims abstract description 11
- 239000004814 polyurethane Substances 0.000 claims abstract description 11
- 239000002994 raw material Substances 0.000 claims abstract description 8
- 239000004820 Pressure-sensitive adhesive Substances 0.000 claims description 140
- 239000004744 fabric Substances 0.000 claims description 138
- 239000010410 layer Substances 0.000 claims description 104
- FOIXSVOLVBLSDH-UHFFFAOYSA-N Silver ion Chemical compound [Ag+] FOIXSVOLVBLSDH-UHFFFAOYSA-N 0.000 claims description 99
- 238000000576 coating method Methods 0.000 claims description 71
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- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 19
- 239000002518 antifoaming agent Substances 0.000 claims description 19
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 claims description 18
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 claims description 16
- 239000004745 nonwoven fabric Substances 0.000 claims description 14
- 229910052709 silver Inorganic materials 0.000 claims description 14
- 239000004332 silver Substances 0.000 claims description 14
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 claims description 12
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 12
- 229910001431 copper ion Inorganic materials 0.000 claims description 12
- 239000000203 mixture Substances 0.000 claims description 12
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 claims description 11
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 claims description 11
- 229920005989 resin Polymers 0.000 claims description 11
- 239000011347 resin Substances 0.000 claims description 11
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- NEIHULKJZQTQKJ-UHFFFAOYSA-N [Cu].[Ag] Chemical compound [Cu].[Ag] NEIHULKJZQTQKJ-UHFFFAOYSA-N 0.000 claims description 7
- 238000001914 filtration Methods 0.000 claims description 7
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- 238000011065 in-situ storage Methods 0.000 claims description 7
- 150000002500 ions Chemical class 0.000 claims description 7
- VMWYVTOHEQQZHQ-UHFFFAOYSA-N methylidynenickel Chemical compound [Ni]#[C] VMWYVTOHEQQZHQ-UHFFFAOYSA-N 0.000 claims description 7
- 239000004810 polytetrafluoroethylene Substances 0.000 claims description 7
- 229920001343 polytetrafluoroethylene Polymers 0.000 claims description 7
- 229910052710 silicon Inorganic materials 0.000 claims description 7
- 239000010703 silicon Substances 0.000 claims description 7
- 238000005507 spraying Methods 0.000 claims description 7
- DKPFZGUDAPQIHT-UHFFFAOYSA-N Butyl acetate Natural products CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 claims description 6
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 claims description 6
- -1 iron-silicon-aluminum Chemical compound 0.000 claims description 6
- 239000007769 metal material Substances 0.000 claims description 6
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 5
- XEVZIAVUCQDJFL-UHFFFAOYSA-N [Cr].[Fe].[Si] Chemical compound [Cr].[Fe].[Si] XEVZIAVUCQDJFL-UHFFFAOYSA-N 0.000 claims description 4
- KSIIOJIEFUOLDP-UHFFFAOYSA-N [Si].[Fe].[Ni] Chemical compound [Si].[Fe].[Ni] KSIIOJIEFUOLDP-UHFFFAOYSA-N 0.000 claims description 4
- 229910052799 carbon Inorganic materials 0.000 claims description 4
- 229920001940 conductive polymer Polymers 0.000 claims description 4
- 239000004020 conductor Substances 0.000 claims description 4
- 229910000859 α-Fe Inorganic materials 0.000 claims description 4
- BIJOYKCOMBZXAE-UHFFFAOYSA-N chromium iron nickel Chemical compound [Cr].[Fe].[Ni] BIJOYKCOMBZXAE-UHFFFAOYSA-N 0.000 claims description 3
- 239000002861 polymer material Substances 0.000 claims description 3
- 238000003825 pressing Methods 0.000 claims description 3
- 239000004721 Polyphenylene oxide Substances 0.000 claims description 2
- 239000006096 absorbing agent Substances 0.000 claims description 2
- 239000012790 adhesive layer Substances 0.000 claims description 2
- 150000001412 amines Chemical class 0.000 claims description 2
- 150000004982 aromatic amines Chemical class 0.000 claims description 2
- 229920000570 polyether Polymers 0.000 claims description 2
- 229910052751 metal Inorganic materials 0.000 abstract description 19
- 239000002184 metal Substances 0.000 abstract description 19
- 238000010521 absorption reaction Methods 0.000 abstract description 12
- 239000011888 foil Substances 0.000 abstract description 9
- 238000011161 development Methods 0.000 abstract description 5
- 239000012528 membrane Substances 0.000 description 37
- 239000004760 aramid Substances 0.000 description 20
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- 239000000463 material Substances 0.000 description 17
- 238000007747 plating Methods 0.000 description 15
- 238000001755 magnetron sputter deposition Methods 0.000 description 10
- SQGYOTSLMSWVJD-UHFFFAOYSA-N silver(1+) nitrate Chemical compound [Ag+].[O-]N(=O)=O SQGYOTSLMSWVJD-UHFFFAOYSA-N 0.000 description 10
- 238000012360 testing method Methods 0.000 description 9
- 239000008096 xylene Substances 0.000 description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
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- 239000004917 carbon fiber Substances 0.000 description 3
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 3
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- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 2
- 229910010271 silicon carbide Inorganic materials 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 229910000599 Cr alloy Inorganic materials 0.000 description 1
- 206010028980 Neoplasm Diseases 0.000 description 1
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- 230000009286 beneficial effect Effects 0.000 description 1
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Images
Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/21—Paper; Textile fabrics
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2265—Oxides; Hydroxides of metals of iron
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2463/00—Presence of epoxy resin
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Inorganic Chemistry (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
The invention provides a flexible wave-absorbing material and a preparation method thereof, and a wave-absorbing adhesive tape and a preparation method thereof, wherein the flexible wave-absorbing material comprises the following raw materials in percentage by weight: 40-50% of an electromagnetic wave absorbent, 10-20% of an adhesive, 30-35% of a diluent, 1-3% of a curing agent and 1-2% of an auxiliary agent; the adhesive comprises epoxy resin and modified epoxy resin, wherein the modified epoxy resin comprises one or more of rubber modified epoxy resin, polyurethane modified epoxy resin and polyacrylate modified epoxy resin. The wave-absorbing adhesive tape disclosed by the invention has good mechanical properties and excellent electromagnetic wave absorption performance, effectively solves the technical problems that the existing electromagnetic shielding adhesive tape is poor in shielding effectiveness, a metal foil layer is easy to oxidize, the overall mass of the adhesive tape is heavier and the like, and realizes the development trend that the wave-absorbing adhesive tape is thin in thickness and light in mass and is suitable for narrow spaces.
Description
Technical Field
The invention relates to the technical field of wave-absorbing materials, in particular to a flexible wave-absorbing material and a preparation method thereof, and a wave-absorbing adhesive tape and a preparation method thereof.
Background
With the continuous development of the technological level, more and more electronic and electrical devices enter various fields of life and production, such as smart phones, notebook computers, smart printers, PDAs, LCD displays and the like. These devices also radiate electromagnetic energy outwards during normal operation, and the radiated electromagnetic energy not only interferes with each other, but also has great influence on human health after long-term exposure to the electromagnetic energy, and even induces cancer lesion. In addition, miniaturization and high integration are mainstream trends in development of electronic products, the thickness of the electronic products is thinner and thinner, and particularly on an integrated main board, the number of elements is larger and smaller, so that an interference source is close to a sensitive device, and an interference path is shortened. The increase in operating frequency increases the amount of radiation and also increases the probability of interference. In order to solve the problem, the requirements for electromagnetic compatibility and shielding are higher and higher at home and abroad, and the electromagnetic compatibility and shielding method mainly starts from the two aspects that the equipment is not interfered when working in an electromagnetic environment and the equipment cannot cause electromagnetic interference which cannot be borne by any things in the environment when working normally.
At present, electromagnetic wave pollution is reduced by mainly adopting electromagnetic shielding materials and electromagnetic absorption materials to shield or absorb electromagnetic waves. Among them, the electromagnetic shielding material is common, and mainly is a metal cover shield or a mesh. The metal shielding cover or the mesh can reduce the external radiation interference of the electronic equipment, the mutual crosstalk between modules can be reduced by using a plurality of metal shielding covers, but the weight of the product is greatly increased, and the electromagnetic shielding capability of the metal shielding cover or the mesh has large anisotropy, namely the electromagnetic wave absorption capability is prone to be remarkably reduced when the incident angle of the electromagnetic wave is increased. In addition to the above two main drawbacks, it is fatal that the electromagnetic shielding material can only isolate the electromagnetic wave and cannot eliminate the electromagnetic pollution, and in some cases, such as base station, signal data line, etc., is feasible, but in some cases, such as radio frequency identification, is not applicable.
In order to solve the problem that the metal shielding case or the mesh has a heavy weight, an electromagnetic shielding tape appears on the market as a substitute product. At present, the traditional electromagnetic shielding adhesive tape mainly comprises a metal foil layer and a pressure-sensitive adhesive layer, the product quality is reduced to a certain extent, but the metal foil layer (particularly copper) is easy to oxidize, and the integral conductivity and electromagnetic shielding effect of the product are influenced. In addition, the presence of the metal foil layer causes variation in the fit performance of the adhesive tape, and wrinkles are likely to occur during use and also easily torn in the length and width directions. In addition, the conventional epoxy resin is often selected as a base material of the wave-absorbing coating, but the coating material has the defects of poor coating flexibility, brittleness, easy peeling and the like caused by high crosslinking density and large internal stress after curing.
Therefore, the existing wave-absorbing material and the electromagnetic shielding adhesive tape need to be improved.
Disclosure of Invention
In view of the above, the invention provides a flexible wave-absorbing material and a preparation method thereof, a wave-absorbing adhesive tape and a preparation method thereof, so as to solve the technical defects in the prior art.
In a first aspect, the invention provides a flexible wave-absorbing material, which comprises the following raw materials in percentage by weight: 40-50% of an electromagnetic wave absorbent, 10-20% of an adhesive, 30-35% of a diluent, 1-3% of a curing agent and 1-2% of an auxiliary agent;
the adhesive comprises epoxy resin and modified epoxy resin, wherein the modified epoxy resin comprises one or more of rubber modified epoxy resin, polyurethane modified epoxy resin and polyacrylate modified epoxy resin.
Optionally, the flexible wave absorbing material, the electromagnetic wave absorbent, includes one or more of a metal material, a carbon-based conductive material, and a conductive polymer material; wherein the metal material comprises one or more of iron-silicon-chromium, iron-silicon-aluminum, iron-silicon-nickel, iron-chromium-nickel, ferrite and carbonyl iron powder; the diluent comprises one or more of dimethylbenzene, cyclohexanone, n-butanol, ethyl acetate and butyl acetate; the auxiliary agent comprises one or more of a leveling agent, an anti-settling agent and a defoaming agent; the curing agent comprises one or more of polyether amine, phenolic aldehyde amine and aromatic amine.
In a second aspect, the invention further provides a preparation method of the flexible wave-absorbing material, which comprises the following steps:
adding the electromagnetic wave absorbent and absolute ethyl alcohol into a stirrer, stirring and dispersing, then adding a silane coupling agent, stirring, filtering and drying to obtain a pretreated electromagnetic wave absorbent;
and adding the adhesive, the diluent and the auxiliary agent into a container, stirring and dispersing, then adding the pretreated electromagnetic wave absorbent, continuing stirring, adding the curing agent, and stirring to obtain the flexible wave-absorbing material.
Optionally, in the preparation method of the flexible wave-absorbing material, the adhesive, the diluent and the auxiliary are added into a container, the adhesive, the diluent and the auxiliary are uniformly dispersed at a stirring speed of 1200-1500 rpm, then the stirring speed is reduced to 300-600 rpm, the pretreated electromagnetic wave absorbent is added, then the mixture is continuously stirred at 1200-1500 rpm for 20-30 min, the curing agent is added, and the flexible wave-absorbing material is obtained after stirring.
In a third aspect, the present invention further provides a wave-absorbing adhesive tape, including:
silver ion conductive cloth;
the pressure-sensitive adhesive layer is positioned on one side of the silver ion conductive cloth;
the flexible wave-absorbing coating is positioned on the other side of the silver ion conductive cloth;
the release film is positioned on one side of the pressure-sensitive adhesive layer, which is far away from the silver ion conductive cloth;
the flexible wave-absorbing coating is prepared from the flexible wave-absorbing material.
Optionally, the release film of the wave-absorbing adhesive tape comprises one of a PE release film, a PET release film, a PI release film, an OPP release film and a PTFE release film; the pressure-sensitive adhesive layer is one of a conductive pressure-sensitive adhesive layer and a non-conductive pressure-sensitive adhesive layer.
Optionally, the conductive pressure-sensitive adhesive layer of the wave-absorbing adhesive tape comprises one of a silver conductive pressure-sensitive adhesive, a silver copper conductive pressure-sensitive adhesive and a nickel carbon conductive pressure-sensitive adhesive; the non-voltage-sensitive adhesive layer comprises one of rubber pressure-sensitive adhesive, organic silicon resin pressure-sensitive adhesive, polyacrylate pressure-sensitive adhesive and polyurethane pressure-sensitive adhesive.
In a fourth aspect, the invention also provides a preparation method of the wave-absorbing adhesive tape, which comprises the following steps:
providing silver ion conductive cloth;
preparing a pressure-sensitive adhesive layer on one side of the silver ion conductive cloth;
preparing a flexible wave-absorbing coating on the other side of the silver ion conductive cloth;
and preparing a release film on one side of the pressure-sensitive adhesive layer, which is far away from the silver ion conductive cloth.
Optionally, the preparation method of the wave-absorbing adhesive tape is characterized in that the preparation method of the flexible wave-absorbing coating comprises the following steps:
and spraying the flexible wave-absorbing material to the other side surface of the silver ion conductive cloth, drying for 3-6 hours at 35-45 ℃, and then drying for 18-24 hours at 75-85 ℃ to obtain the flexible wave-absorbing coating.
Optionally, the preparation method of the wave-absorbing adhesive tape comprises the following steps: pressing the pressure-sensitive adhesive on one side of the silver ion conductive cloth by adopting a hot pressing process to obtain a pressure-sensitive adhesive layer;
the preparation method of the silver ion conductive cloth comprises the following steps: copper ions are plated on the non-woven fabric, and then silver nano ions are generated on the surface of the non-woven fabric through in-situ exchange reaction to prepare the silver ion conductive fabric.
Compared with the prior art, the flexible wave-absorbing material and the preparation method thereof, the wave-absorbing adhesive tape and the preparation method thereof have the following beneficial effects:
(1) the flexible wave-absorbing coating prepared by the flexible wave-absorbing material meets the performance requirements that the elongation at break is more than or equal to 130 percent and the adhesive force is more than or equal to 12MPa, has excellent electromagnetic wave absorption performance, and effectively overcomes the defects that the coating is easy to crack and fall off at the motion part of weapon equipment;
(2) the wave-absorbing adhesive tape can meet the mechanical property requirements that the breaking elongation in the transverse direction and the longitudinal direction is more than or equal to 100 percent and the peeling strength is more than or equal to 1500N/m, has excellent electromagnetic wave absorption performance, has the effective absorption bandwidth of less than or equal to-4 dB of wave-absorbing strength exceeding 20GHz and the strongest absorption peak value less than-20 dB, effectively solves the technical problems that the traditional electromagnetic shielding adhesive tape has poor shielding efficiency, a metal foil layer is easy to oxidize, the overall quality of the adhesive tape is heavier and the like, and realizes the requirements of thin thickness, light weight and suitability for the development trend of narrow space The requirement of shielding materials is under the present conditions that the internal space is smaller and smaller.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below. It is obvious that the drawings in the following description are only some embodiments of the invention, and that for a person skilled in the art, other drawings can be derived from them without inventive effort.
Fig. 1 is a schematic structural diagram of the wave-absorbing adhesive tape of the invention.
Detailed Description
In the following, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be obtained by a person skilled in the art without any inventive step based on the embodiments of the present invention, are within the scope of the present invention.
Example 1
A flexible wave-absorbing material comprises the following raw materials in percentage by weight:
48.5 percent of electromagnetic wave absorbent, 13.5 percent of adhesive, 35 percent of diluent, 1.6 percent of curing agent and 1.4 percent of auxiliary agent.
Specifically, the electromagnetic wave absorbent comprises one or more of a metal material, a carbon-based conductive material and a conductive polymer material; wherein the metal material comprises one or more of iron-silicon-chromium, iron-silicon-aluminum, iron-silicon-nickel, iron-chromium-nickel, ferrite and carbonyl iron powder; the carbon-based conductive material comprises one or more of carbon black, carbon fiber, graphene, silicon carbide and the like; the conductive polymer comprises one or more of polyaniline, polybenzimidazole and the like; specifically, in the embodiment of the present application, carbonyl iron powder and carbon fiber are used in a mass ratio of 1: 0.05.
Specifically, the adhesive comprises epoxy resin and/or modified epoxy resin, wherein the epoxy resin comprises one of E-35, E-42, E-44 and E-51; the modified epoxy resin comprises one of rubber modified epoxy resin, polyurethane modified epoxy resin and polyacrylate modified epoxy resin; specifically, in the embodiment of the application, the adhesive is a mixture of E44 and a urethane-modified epoxy resin, wherein the mass of the urethane-modified epoxy resin accounts for 80% of the total mass of the adhesive.
Specifically, the diluent comprises one or more of xylene, cyclohexanone, n-butanol, ethyl acetate and butyl acetate, and specifically, in the embodiment of the application, the diluent is a compound diluent of xylene and cyclohexanone in a mass ratio of 1: 1.
Specifically, the curing agent comprises one or more of NX-2040, T-31, GR701 and D400, and the curing agent in the embodiment of the application adopts NX-2040.
Specifically, the auxiliary agent comprises one or more of a leveling agent, an anti-settling agent and a defoaming agent; the leveling agent comprises KYC-616, BYK-333 or BYK-306; the anti-settling agent comprises one of MT-6650, BYK-425 and BYK-410; the defoaming agent comprises one of DL-1365, F-2594 and MH-2082, specifically, the auxiliary agent in the embodiment of the application comprises a leveling agent, an anti-settling agent and a defoaming agent mixture, specifically, KYC-616 is adopted as the leveling agent, BYK-425 is adopted as the anti-settling agent, DL-1365 is adopted as the defoaming agent, and the mass ratio of the leveling agent to the anti-settling agent to the defoaming agent is 1:1: 1.
Based on the same inventive concept, the application also provides a preparation method of the flexible wave-absorbing material, which comprises the following steps:
s1, adding the electromagnetic wave absorbent into a stirrer containing absolute ethyl alcohol according to the mass ratio, stirring and dispersing for 60min, and then adding a silane coupling agent for embedding treatment, so that the wettability of the surface of the absorbent is improved, and the compatibility between the absorbent and resin is enhanced. Subsequently, continuously stirring and dispersing uniformly, filtering, washing for 3 times by using absolute ethyl alcohol, and drying to obtain a pretreated electromagnetic wave absorbent;
s2, adding the adhesive, the diluent and the auxiliary agent into a container according to the mass ratio, stirring and dispersing for 20min at the speed of 1200rpm, then reducing the stirring speed to 300rpm, then adding the pretreated electromagnetic wave absorbent prepared in the step S1, continuing stirring for 30min at the speed of 1200rpm, then adding the curing agent, and stirring uniformly to obtain the flexible wave-absorbing material.
Based on the same inventive concept, the application also provides a wave-absorbing adhesive tape, which is of a four-layer structure and comprises the following components in parts by weight as shown in figure 1:
the silver ion conductive cloth 3 has the functions of replacing the traditional metal foil layer, reducing the overall quality of the wave-absorbing adhesive tape, effectively improving the mechanical property, particularly the tear resistance, of the wave-absorbing adhesive tape and serving as a reflecting layer of the wave-absorbing adhesive tape;
the pressure sensitive adhesive layer 2 is positioned on one side of the silver ion conductive cloth 3, and has the functions of connecting the conductive cloth layer on one hand and adhering to the surface of the base material on the other hand to play a role in fixing;
the flexible wave-absorbing coating 4 is positioned on the other side of the silver ion conductive cloth 3, has good mechanical properties, particularly flexibility, and simultaneously has excellent electromagnetic wave absorption performance;
the release film 1 is positioned on one side of the pressure-sensitive adhesive layer 2, which is far away from the silver ion conductive cloth 3, and mainly plays a role in protecting the pressure-sensitive adhesive layer before use;
the flexible wave-absorbing coating is prepared from the flexible wave-absorbing material.
Specifically, release film 1 includes that PE leaves type membrane, PET leaves type membrane, PI and leaves type membrane, OPP leaves type membrane and PTFE and leaves one of type membrane, and the thickness of leaving type membrane 1 is less than or equal to 20 μm, and is specific, and it is 20 μm's PET that thickness is adopted from type membrane 1 in this application embodiment.
Specifically, the pressure-sensitive adhesive layer 2 is one of a conductive pressure-sensitive adhesive layer and a non-conductive pressure-sensitive adhesive layer, and the conductive pressure-sensitive adhesive layer comprises one of a silver conductive pressure-sensitive adhesive, a silver copper conductive pressure-sensitive adhesive and a nickel carbon conductive pressure-sensitive adhesive, and specifically can be 3M-9707, 3M-9709, 3M-9712, 3M-7751 and the like; the non-conductive pressure-sensitive adhesive layer can be one of rubber pressure-sensitive adhesives, organic silicon resin pressure-sensitive adhesives, polyacrylate pressure-sensitive adhesives and polyurethane pressure-sensitive adhesives, and specifically comprises Dow Corning 280A, Dow Corning 282 and the like, the thickness of the pressure-sensitive adhesive is 40-60 micrometers, and specifically, in the embodiment of the application, the pressure-sensitive adhesive layer 2 is made of conductive pressure-sensitive adhesive 3M-9707 with the thickness of 50 micrometers.
Specifically, the silver ion conductive fabric 3 is a conductive fabric prepared by selecting an aramid nonwoven fabric with biaxial tension (elongation at break is greater than or equal to 100%) and excellent tear resistance as a base material, plating copper ions on the aramid nonwoven fabric by a physical plating process (a magnetron sputtering coating process, a vacuum phase coating process, a plasma coating process), and then generating silver nano ions through an in-situ exchange reaction. Specifically, the preparation process of the silver ion conductive cloth comprises the following steps: putting the aramid fiber fabric into vacuum plasma equipment for low-temperature plasma treatment, so that the cleanliness of the fabric surface is improved, and the bonding force between the fabric and the metal layer is enhanced; and then plating copper ions on the surface of the fabric by adopting a physical method (a magnetron sputtering coating process, a vacuum phase coating process and a plasma coating process), putting the aramid fabric plated with copper on the surface into a reaction vessel containing a surfactant to perform a silver ion replacement reaction with a prepared silver nitrate solution, and reducing the aramid fabric into nano silver particles on the surface of the fabric until the reaction is complete to obtain the silver ion conductive fabric. The prepared silver ion conductive cloth has excellent electromagnetic shielding performance, and the shielding effectiveness is more than or equal to 60 dB; the surface resistance of the silver ion conductive cloth 3 is less than or equal to 2.0 omega/cm; the shielding effectiveness in the frequency band of 0.1 GHz-100 GHz is more than or equal to 60 dB; the elongation at break in both the transverse direction and the longitudinal direction exceeds 150 percent; the total thickness of the silver ion conductive cloth 3 is less than or equal to 0.20mm, and specifically, the thickness of the silver ion conductive cloth 3 in the application is selected to be 0.15 mm.
Based on the same inventive concept, the application also provides a preparation method of the wave-absorbing adhesive tape, which comprises the following steps:
a1, laminating a layer of pressure-sensitive adhesive on one side of the silver ion conductive cloth by adopting a hot pressing process to obtain a pressure-sensitive adhesive layer;
a2, spraying the flexible wave-absorbing material to the other side of the silver ion conductive cloth by adopting a cold spraying process and using a kettle-discharging spray gun with the caliber of 1.0-1.2 mm, drying for 4 hours at 40 ℃, and drying for 20 hours at 80 ℃ until the coating is completely cured to prepare the flexible wave-absorbing coating;
and A3, adhering a release film on one side of the pressure sensitive adhesive layer, which is far away from the silver ion conductive cloth, by a roller adhering process.
Example 2
A flexible wave-absorbing material comprises the following raw materials in percentage by weight:
45.5 percent of electromagnetic wave absorbent, 16.5 percent of adhesive, 34.5 percent of diluent, 1.8 percent of curing agent and 1.7 percent of auxiliary agent.
Specifically, in the embodiment of the present application, iron-silicon-chromium alloy powder and carbon fiber are used as the electromagnetic wave absorbent in a mass ratio of 1: 0.05.
Specifically, in the embodiment of the application, the adhesive is a mixture of E44 and a rubber modified epoxy resin, wherein the mass of the rubber modified epoxy resin accounts for 80% of the total mass of the adhesive.
Specifically, in the embodiment of the application, the diluent is a compound diluent of xylene and cyclohexanone in a mass ratio of 1: 1.
Specifically, the curing agent comprises one or more of NX-2040, T-31, GR701 and D400, and in the embodiment of the application, the D400 and NX-2040 are compounded in a mass ratio of 1: 1.
Specifically, the auxiliary agent in the embodiment of the application comprises a leveling agent, an anti-settling agent and an antifoaming agent mixture, specifically, BYK-333 is adopted as the leveling agent, MT-6650 is adopted as the anti-settling agent, F-2594 is adopted as the antifoaming agent, and the mass ratio of the leveling agent to the anti-settling agent to the antifoaming agent is 1:1: 1.
Based on the same inventive concept, the application also provides a preparation method of the flexible wave-absorbing material, which comprises the following steps:
s1, adding the electromagnetic wave absorbent into a stirrer containing absolute ethyl alcohol according to the mass ratio, stirring and dispersing for 60min, and then adding a silane coupling agent for embedding treatment, so that the wettability of the surface of the absorbent is improved, and the compatibility between the absorbent and resin is enhanced. Subsequently, continuously stirring and dispersing uniformly, filtering, washing for 3 times by using absolute ethyl alcohol, and drying to obtain a pretreated electromagnetic wave absorbent;
s2, adding the adhesive, the diluent and the auxiliary agent into a container according to the mass ratio, stirring and dispersing for 20min at the speed of 1200rpm, then reducing the stirring speed to 300rpm, then adding the pretreated electromagnetic wave absorbent prepared in the step S1, continuing stirring for 30min at the speed of 1200rpm, then adding the curing agent, and stirring uniformly to obtain the flexible wave-absorbing material.
Based on the same inventive concept, the application also provides a wave-absorbing adhesive tape, which is of a four-layer structure and comprises the following components in parts by weight as shown in figure 1:
the silver ion conductive cloth 3 has the functions of replacing the traditional metal foil layer, reducing the overall quality of the wave-absorbing adhesive tape, effectively improving the mechanical property, particularly the tear resistance, of the wave-absorbing adhesive tape and serving as a reflecting layer of the wave-absorbing adhesive tape;
the pressure sensitive adhesive layer 2 is positioned on one side of the silver ion conductive cloth 3, and has the functions of connecting the conductive cloth layer on one hand and adhering to the surface of the base material on the other hand to play a role in fixing;
the flexible wave-absorbing coating 4 is positioned on the other side of the silver ion conductive cloth 3, has good mechanical properties, particularly flexibility, and simultaneously has excellent electromagnetic wave absorption performance;
the release film 1 is positioned on one side of the pressure-sensitive adhesive layer 2, which is far away from the silver ion conductive cloth 3, and mainly plays a role in protecting the pressure-sensitive adhesive layer before use;
the flexible wave-absorbing coating is prepared from the flexible wave-absorbing material.
Specifically, release film 1 includes that PE leaves type membrane, PET leaves type membrane, PI and leaves type membrane, OPP leaves type membrane and PTFE and leaves one of type membrane, and the thickness of leaving type membrane 1 is less than or equal to 20 μm, and is specific, and it is 20 μm's PET that thickness is adopted from type membrane 1 in this application embodiment.
Specifically, the pressure-sensitive adhesive layer 2 is one of a conductive pressure-sensitive adhesive layer and a non-conductive pressure-sensitive adhesive layer, and the conductive pressure-sensitive adhesive layer comprises one of a silver conductive pressure-sensitive adhesive, a silver copper conductive pressure-sensitive adhesive and a nickel carbon conductive pressure-sensitive adhesive, and specifically can be 3M-9707, 3M-9709, 3M-9712, 3M-7751 and the like; the non-conductive pressure-sensitive adhesive layer can be one of rubber pressure-sensitive adhesives, organic silicon resin pressure-sensitive adhesives, polyacrylate pressure-sensitive adhesives and polyurethane pressure-sensitive adhesives, and specifically comprises Dow Corning 280A, Dow Corning 282 and the like, the thickness of the pressure-sensitive adhesive is 40-60 micrometers, and specifically, in the embodiment of the application, the pressure-sensitive adhesive layer 2 is made of conductive pressure-sensitive adhesive 3M-9709 with the thickness of 50 micrometers.
Specifically, the silver ion conductive fabric 3 is a conductive fabric prepared by selecting an aramid nonwoven fabric with biaxial tension (elongation at break is greater than or equal to 100%) and excellent tear resistance as a base material, plating copper ions on the aramid nonwoven fabric by a physical plating process (a magnetron sputtering coating process, a vacuum phase coating process, a plasma coating process), and then generating silver nano ions through an in-situ exchange reaction. Specifically, the preparation process of the silver ion conductive cloth comprises the following steps: putting the aramid fiber fabric into vacuum plasma equipment for low-temperature plasma treatment, so that the cleanliness of the fabric surface is improved, and the bonding force between the fabric and the metal layer is enhanced; and then plating copper ions on the surface of the fabric by adopting a physical method (a magnetron sputtering coating process, a vacuum phase coating process and a plasma coating process), putting the aramid fabric plated with copper on the surface into a reaction vessel containing a surfactant to perform a silver ion replacement reaction with a prepared silver nitrate solution, and reducing the aramid fabric into nano silver particles on the surface of the fabric until the reaction is complete to obtain the silver ion conductive fabric. The prepared silver ion conductive cloth has excellent electromagnetic shielding performance, and the shielding effectiveness is more than or equal to 60 dB; the surface resistance of the silver ion conductive cloth 3 is less than or equal to 2.0 omega/cm; the shielding effectiveness in the frequency band of 0.1 GHz-100 GHz is more than or equal to 60 dB; the elongation at break in both the transverse direction and the longitudinal direction exceeds 150 percent; the total thickness of the silver ion conductive cloth 3 is less than or equal to 0.20mm, and specifically, the thickness of the silver ion conductive cloth 3 in the application is selected to be 0.2 mm.
Based on the same inventive concept, the application also provides a preparation method of the wave-absorbing adhesive tape, which comprises the following steps:
a1, laminating a layer of pressure-sensitive adhesive on one side of the silver ion conductive cloth by adopting a hot pressing process to obtain a pressure-sensitive adhesive layer;
a2, spraying the flexible wave-absorbing material to the other side of the silver ion conductive cloth by adopting a cold spraying process and using a kettle-discharging spray gun with the caliber of 1.0-1.2 mm, drying for 4 hours at 40 ℃, and drying for 20 hours at 80 ℃ until the coating is completely cured to prepare the flexible wave-absorbing coating;
and A3, adhering a release film on one side of the pressure sensitive adhesive layer, which is far away from the silver ion conductive cloth, by a roller adhering process.
Example 3
A flexible wave-absorbing material comprises the following raw materials in percentage by weight:
43 percent of electromagnetic wave absorbent, 19 percent of adhesive, 34.7 percent of diluent, 1.9 percent of curing agent and 1.4 percent of auxiliary agent.
Specifically, ferrite and carbon black are used in the electromagnetic wave absorber in the embodiment of the present application at a mass ratio of 1: 0.1.
Specifically, in the embodiment of the application, the adhesive is a mixture of E51 and a urethane-modified epoxy resin, wherein the mass of the urethane-modified epoxy resin accounts for 80% of the total mass of the adhesive.
Specifically, the diluent comprises one or more of xylene, cyclohexanone, n-butanol, ethyl acetate and butyl acetate, and specifically, in the embodiment of the application, the xylene and n-butanol compound diluent with the mass ratio of 1:1 is adopted.
Specifically, the curing agent comprises one or more of NX-2040, T-31, GR701 and D400, and the curing agent in the embodiment of the application adopts GR 701.
Specifically, the auxiliary agent in the embodiment of the application comprises a leveling agent, an anti-settling agent and a defoaming agent mixture, specifically, BYK-306 is adopted as the leveling agent, MT-6650 is adopted as the anti-settling agent, DL-1365 is adopted as the defoaming agent, and the mass ratio of the leveling agent to the anti-settling agent to the defoaming agent is 1:1: 1.
Based on the same inventive concept, the application also provides a preparation method of the flexible wave-absorbing material, which comprises the following steps:
s1, adding the electromagnetic wave absorbent into a stirrer containing absolute ethyl alcohol according to the mass ratio, stirring and dispersing for 60min, and then adding a silane coupling agent for embedding treatment, so that the wettability of the surface of the absorbent is improved, and the compatibility between the absorbent and resin is enhanced. Subsequently, continuously stirring and dispersing uniformly, filtering, washing for 3 times by using absolute ethyl alcohol, and drying to obtain a pretreated electromagnetic wave absorbent;
s2, adding the adhesive, the diluent and the auxiliary agent into a container according to the mass ratio, stirring and dispersing for 20min at the speed of 1200rpm, then reducing the stirring speed to 300rpm, then adding the pretreated electromagnetic wave absorbent prepared in the step S1, continuing stirring for 30min at the speed of 1200rpm, then adding the curing agent, and stirring uniformly to obtain the flexible wave-absorbing material.
Based on the same inventive concept, the application also provides a wave-absorbing adhesive tape, which is of a four-layer structure and comprises the following components in parts by weight as shown in figure 1:
the silver ion conductive cloth 3 has the functions of replacing the traditional metal foil layer, reducing the overall quality of the wave-absorbing adhesive tape, effectively improving the mechanical property, particularly the tear resistance, of the wave-absorbing adhesive tape and serving as a reflecting layer of the wave-absorbing adhesive tape;
the pressure sensitive adhesive layer 2 is positioned on one side of the silver ion conductive cloth 3, and has the functions of connecting the conductive cloth layer on one hand and adhering to the surface of the base material on the other hand to play a role in fixing;
the flexible wave-absorbing coating 4 is positioned on the other side of the silver ion conductive cloth 3, has good mechanical properties, particularly flexibility, and simultaneously has excellent electromagnetic wave absorption performance;
the release film 1 is positioned on one side of the pressure-sensitive adhesive layer 2, which is far away from the silver ion conductive cloth 3, and mainly plays a role in protecting the pressure-sensitive adhesive layer before use;
the flexible wave-absorbing coating is prepared from the flexible wave-absorbing material.
Specifically, release film 1 includes that PE leaves type membrane, PET leaves type membrane, PI and leaves type membrane, OPP from type membrane and PTFE and leaves one of type membrane, and the thickness of leaving type membrane 1 is less than or equal to 20 μm, and is specific, and it is 20 μm's OPP from type membrane to adopt thickness from type membrane 1 in this application embodiment.
Specifically, the pressure-sensitive adhesive layer 2 is one of a conductive pressure-sensitive adhesive layer and a non-conductive pressure-sensitive adhesive layer, and the conductive pressure-sensitive adhesive layer comprises one of a silver conductive pressure-sensitive adhesive, a silver copper conductive pressure-sensitive adhesive and a nickel carbon conductive pressure-sensitive adhesive, and specifically can be 3M-9707, 3M-9709, 3M-9712, 3M-7751 and the like; the non-conductive pressure-sensitive adhesive layer can be one of rubber pressure-sensitive adhesive, organic silicon resin pressure-sensitive adhesive, polyacrylate pressure-sensitive adhesive and polyurethane pressure-sensitive adhesive, and specifically comprises dow kangning 280A, dow kangning 282 and the like, the thickness of the pressure-sensitive adhesive is 40-60 micrometers, and specifically, in the embodiment of the application, the pressure-sensitive adhesive layer 2 is made of non-conductive pressure-sensitive adhesive dow kangning 282 with the thickness of 60 micrometers.
Specifically, the silver ion conductive fabric 3 is a conductive fabric prepared by selecting an aramid nonwoven fabric with biaxial tension (elongation at break is greater than or equal to 100%) and excellent tear resistance as a base material, plating copper ions on the aramid nonwoven fabric by a physical plating process (a magnetron sputtering coating process, a vacuum phase coating process, a plasma coating process), and then generating silver nano ions through an in-situ exchange reaction. Specifically, the preparation process of the silver ion conductive cloth comprises the following steps: putting the aramid fiber fabric into vacuum plasma equipment for low-temperature plasma treatment, so that the cleanliness of the fabric surface is improved, and the bonding force between the fabric and the metal layer is enhanced; and then plating copper ions on the surface of the fabric by adopting a physical method (a magnetron sputtering coating process, a vacuum phase coating process and a plasma coating process), putting the aramid fabric plated with copper on the surface into a reaction vessel containing a surfactant to perform a silver ion replacement reaction with a prepared silver nitrate solution, and reducing the aramid fabric into nano silver particles on the surface of the fabric until the reaction is complete to obtain the silver ion conductive fabric. The prepared silver ion conductive cloth has excellent electromagnetic shielding performance, and the shielding effectiveness is more than or equal to 60 dB; the surface resistance of the silver ion conductive cloth 3 is less than or equal to 2.0 omega/cm; the shielding effectiveness in the frequency band of 0.1 GHz-100 GHz is more than or equal to 60 dB; the elongation at break in both the transverse direction and the longitudinal direction exceeds 150 percent; the total thickness of the silver ion conductive cloth 3 is less than or equal to 0.20mm, and specifically, the thickness of the silver ion conductive cloth 3 in the application is selected to be 0.15 mm.
Based on the same inventive concept, the application also provides a preparation method of the wave-absorbing adhesive tape, which comprises the following steps:
a1, laminating a layer of pressure-sensitive adhesive on one side of the silver ion conductive cloth by adopting a hot pressing process to obtain a pressure-sensitive adhesive layer;
a2, spraying the flexible wave-absorbing material to the other side of the silver ion conductive cloth by adopting a cold spraying process and using a kettle-discharging spray gun with the caliber of 1.0-1.2 mm, drying for 4 hours at 40 ℃, and drying for 20 hours at 80 ℃ until the coating is completely cured to prepare the flexible wave-absorbing coating;
and A3, adhering a release film on one side of the pressure sensitive adhesive layer, which is far away from the silver ion conductive cloth, by a roller adhering process.
Example 4
A flexible wave-absorbing material comprises the following raw materials in percentage by weight:
49 percent of electromagnetic wave absorbent, 13 percent of adhesive, 34.8 percent of diluent, 1.5 percent of curing agent and 1.7 percent of auxiliary agent.
Specifically, in the embodiment of the present application, carbonyl iron powder and carbon black are used in a mass ratio of 1: 0.1.
Specifically, in the embodiment of the application, the adhesive is a mixture of E51 and a rubber modified epoxy resin, wherein the mass of the rubber modified epoxy resin accounts for 80% of the total mass of the adhesive.
Specifically, in the embodiment of the application, the diluent is a compound diluent of xylene and ethyl acetate in a mass ratio of 1: 1.
Specifically, D400 was used as the curing agent in the examples of the present application.
Specifically, the auxiliary agent in the embodiment of the application comprises a leveling agent, an anti-settling agent and a defoaming agent mixture, specifically, KYC-616 is adopted as the leveling agent, BYK-410 is adopted as the anti-settling agent, MH-2082 is adopted as the defoaming agent, and the mass ratio of the leveling agent to the anti-settling agent to the defoaming agent is 1:1: 1.
Based on the same inventive concept, the application also provides a preparation method of the flexible wave-absorbing material, which comprises the following steps:
s1, adding the electromagnetic wave absorbent into a stirrer containing absolute ethyl alcohol according to the mass ratio, stirring and dispersing for 60min, and then adding a silane coupling agent for embedding treatment, so that the surface wettability of the absorbent is improved, and the compatibility between the absorbent and resin is enhanced. Subsequently, continuously stirring and dispersing uniformly, filtering, washing for 3 times by using absolute ethyl alcohol, and drying to obtain a pretreated electromagnetic wave absorbent;
s2, adding the adhesive, the diluent and the auxiliary agent into a container according to the mass ratio, stirring and dispersing for 20min at the speed of 1200rpm, then reducing the stirring speed to 300rpm, then adding the pretreated electromagnetic wave absorbent prepared in the step S1, continuing stirring for 30min at the speed of 1200rpm, then adding the curing agent, and stirring uniformly to obtain the flexible wave-absorbing material.
Based on the same inventive concept, the application also provides a wave-absorbing adhesive tape, which is of a four-layer structure and comprises the following components in parts by weight as shown in figure 1:
the silver ion conductive cloth 3 has the functions of replacing the traditional metal foil layer, reducing the overall quality of the wave-absorbing adhesive tape, effectively improving the mechanical property, particularly the tear resistance, of the wave-absorbing adhesive tape and serving as a reflecting layer of the wave-absorbing adhesive tape;
the pressure sensitive adhesive layer 2 is positioned on one side of the silver ion conductive cloth 3, and has the functions of connecting the conductive cloth layer on one hand and adhering to the surface of the base material on the other hand to play a role in fixing;
the flexible wave-absorbing coating 4 is positioned on the other side of the silver ion conductive cloth 3, has good mechanical properties, particularly flexibility, and simultaneously has excellent electromagnetic wave absorption performance;
the release film 1 is positioned on one side of the pressure-sensitive adhesive layer 2, which is far away from the silver ion conductive cloth 3, and mainly plays a role in protecting the pressure-sensitive adhesive layer before use;
the flexible wave-absorbing coating is prepared from the flexible wave-absorbing material.
Specifically, release film 1 includes that PE leaves type membrane, PET leaves type membrane, PI and leaves type membrane, OPP from type membrane and PTFE and leaves one of type membrane, and the thickness of leaving type membrane 1 is less than or equal to 20 μm, and is specific, and it is 20 μm's OPP from type membrane to adopt thickness from type membrane 1 in this application embodiment.
Specifically, the pressure-sensitive adhesive layer 2 is one of a conductive pressure-sensitive adhesive layer and a non-conductive pressure-sensitive adhesive layer, and the conductive pressure-sensitive adhesive layer comprises one of a silver conductive pressure-sensitive adhesive, a silver copper conductive pressure-sensitive adhesive and a nickel carbon conductive pressure-sensitive adhesive, and specifically can be 3M-9707, 3M-9709, 3M-9712, 3M-7751 and the like; the non-conductive pressure-sensitive adhesive layer can be one of rubber pressure-sensitive adhesives, organic silicon resin pressure-sensitive adhesives, polyacrylate pressure-sensitive adhesives and polyurethane pressure-sensitive adhesives, and specifically comprises Dow Corning 280A, Dow Corning 282 and the like, the thickness of the pressure-sensitive adhesive is 40-60 micrometers, and specifically, in the embodiment of the application, the pressure-sensitive adhesive layer 2 is a conductive pressure-sensitive adhesive 3M-7751 with the thickness of 60 micrometers.
Specifically, the silver ion conductive fabric 3 is a conductive fabric prepared by selecting an aramid nonwoven fabric with biaxial tension (elongation at break is greater than or equal to 100%) and excellent tear resistance as a base material, plating copper ions on the aramid nonwoven fabric by a physical plating process (a magnetron sputtering coating process, a vacuum phase coating process, a plasma coating process), and then generating silver nano ions through an in-situ exchange reaction. Specifically, the preparation process of the silver ion conductive cloth comprises the following steps: putting the aramid fiber fabric into vacuum plasma equipment for low-temperature plasma treatment, so that the cleanliness of the fabric surface is improved, and the bonding force between the fabric and the metal layer is enhanced; and then plating copper ions on the surface of the fabric by adopting a physical method (a magnetron sputtering coating process, a vacuum phase coating process and a plasma coating process), putting the aramid fabric plated with copper on the surface into a reaction vessel containing a surfactant to perform a silver ion replacement reaction with a prepared silver nitrate solution, and reducing the aramid fabric into nano silver particles on the surface of the fabric until the reaction is complete to obtain the silver ion conductive fabric. The prepared silver ion conductive cloth has excellent electromagnetic shielding performance, and the shielding effectiveness is more than or equal to 60 dB; the surface resistance of the silver ion conductive cloth 3 is less than or equal to 2.0 omega/cm; the shielding effectiveness in the frequency band of 0.1 GHz-100 GHz is more than or equal to 60 dB; the elongation at break in both the transverse direction and the longitudinal direction exceeds 150%. The total thickness of the silver ion conductive cloth 3 is less than or equal to 0.20mm, and specifically, the thickness of the silver ion conductive cloth 3 in the application is selected to be 0.20 mm.
Based on the same inventive concept, the application also provides a preparation method of the wave-absorbing adhesive tape, which comprises the following steps:
a1, laminating a layer of pressure-sensitive adhesive on one side of the silver ion conductive cloth by adopting a hot pressing process to obtain a pressure-sensitive adhesive layer;
a2, spraying the flexible wave-absorbing material to the other side of the silver ion conductive cloth by adopting a cold spraying process and using a kettle-discharging spray gun with the caliber of 1.0-1.2 mm, drying for 4 hours at 40 ℃, and drying for 20 hours at 80 ℃ until the coating is completely cured to prepare the flexible wave-absorbing coating;
a3, preparing a release film on the side of the pressure sensitive adhesive layer far away from the silver ion conductive cloth.
Example 5
A flexible wave-absorbing material comprises the following raw materials in percentage by weight:
46 percent of electromagnetic wave absorbent, 16 percent of adhesive, 34.9 percent of diluent, 1.7 percent of curing agent and 1.4 percent of auxiliary agent.
Specifically, in the embodiment of the present application, iron-silicon-nickel alloy powder and silicon carbide in a mass ratio of 1:1 are used as the electromagnetic wave absorbent.
Specifically, in the embodiment of the application, a mixture of E42 and polyacrylate modified epoxy resin is selected as the adhesive, wherein the mass of the polyacrylate modified epoxy resin accounts for 80% of the total mass of the adhesive.
Specifically, the diluent comprises one or more of xylene, cyclohexanone, n-butanol, ethyl acetate and butyl acetate, and specifically, in the embodiment of the application, the diluent is a compound diluent of cyclohexanone and butyl acetate in a mass ratio of 1: 1.
Specifically, the curing agent comprises one or more of NX-2040, T-31, GR701 and D400, and the curing agent adopts T-31 in the specific embodiment of the application.
Specifically, the auxiliary agent in the embodiment of the application comprises a mixture of a leveling agent, an anti-settling agent and a defoaming agent, specifically, BYK-333 is adopted as the leveling agent, BYK-425 is adopted as the anti-settling agent, MH-2082 is adopted as the defoaming agent, and the mass ratio of the leveling agent to the anti-settling agent to the defoaming agent is 1:1: 1.
Based on the same inventive concept, the application also provides a preparation method of the flexible wave-absorbing material, which comprises the following steps:
s1, adding the electromagnetic wave absorbent into a stirrer containing absolute ethyl alcohol according to the mass ratio, stirring and dispersing for 60min, then adding a silane coupling agent for embedding treatment, stirring, filtering, washing for 3 times by using the absolute ethyl alcohol, and drying to obtain the pretreated electromagnetic wave absorbent;
s2, adding the adhesive, the diluent and the auxiliary agent into a container according to the mass ratio, stirring and dispersing for 20min at the speed of 1200rpm, then reducing the stirring speed to 300rpm, then adding the pretreated electromagnetic wave absorbent prepared in the step S1, continuing stirring for 30min at the speed of 1200rpm, then adding the curing agent, and stirring uniformly to obtain the flexible wave-absorbing material.
Based on the same inventive concept, the application also provides a wave-absorbing adhesive tape, as shown in fig. 1, comprising:
silver ion conductive cloth 3;
the pressure-sensitive adhesive layer 2 is positioned on one side of the silver ion conductive cloth 3;
the flexible wave-absorbing coating 4 is positioned on the other side of the silver ion conductive cloth 3;
the release film 1 is positioned on one side of the pressure sensitive adhesive layer 2, which is far away from the silver ion conductive cloth 3;
the flexible wave-absorbing coating is prepared from the flexible wave-absorbing material.
Specifically, release liner 1 includes that PE leaves type membrane, PET leaves type membrane, PI and leaves type membrane, OPP from type membrane and PTFE and leaves one of type membrane, and the thickness of leaving type membrane 1 is less than or equal to 20 μm, and is specific, and release liner 1 adopts the PE that thickness is 15 μm to leave type membrane in this application embodiment.
Specifically, the pressure-sensitive adhesive layer 2 is one of a conductive pressure-sensitive adhesive layer and a non-conductive pressure-sensitive adhesive layer, and the conductive pressure-sensitive adhesive layer comprises one of a silver conductive pressure-sensitive adhesive, a silver copper conductive pressure-sensitive adhesive and a nickel carbon conductive pressure-sensitive adhesive, and specifically can be 3M-9707, 3M-9709, 3M-9712, 3M-7751 and the like; the non-conductive pressure-sensitive adhesive layer can be one of rubber pressure-sensitive adhesives, organic silicon resin pressure-sensitive adhesives, polyacrylate pressure-sensitive adhesives and polyurethane pressure-sensitive adhesives, and specifically comprises Dow Corning 280A, Dow Corning 282 and the like, the thickness of the pressure-sensitive adhesive is 40-60 micrometers, and specifically, in the embodiment of the application, the pressure-sensitive adhesive layer 2 is made of conductive pressure-sensitive adhesive 3M-9712 with the thickness of 60 micrometers.
Specifically, the silver ion conductive fabric 3 is a conductive fabric prepared by selecting an aramid nonwoven fabric with biaxial tension (elongation at break is greater than or equal to 100%) and excellent tear resistance as a base material, plating copper ions on the aramid nonwoven fabric by a physical plating process (a magnetron sputtering coating process, a vacuum phase coating process, a plasma coating process), and then generating silver nano ions through an in-situ exchange reaction. Specifically, the preparation process of the silver ion conductive cloth comprises the following steps: putting the aramid fiber fabric into vacuum plasma equipment for low-temperature plasma treatment, so that the cleanliness of the fabric surface is improved, and the bonding force between the fabric and the metal layer is enhanced; and then plating copper ions on the surface of the fabric by adopting a physical method (a magnetron sputtering coating process, a vacuum phase coating process and a plasma coating process), putting the aramid fabric plated with copper on the surface into a reaction vessel containing a surfactant to perform a silver ion replacement reaction with a prepared silver nitrate solution, and reducing the aramid fabric into nano silver particles on the surface of the fabric until the reaction is complete to obtain the silver ion conductive fabric. The prepared silver ion conductive cloth has excellent electromagnetic shielding performance, and the shielding effectiveness is more than or equal to 60 dB; the surface resistance of the silver ion conductive cloth 3 is less than or equal to 2.0 omega/cm; the shielding effectiveness in the frequency band of 0.1 GHz-100 GHz is more than or equal to 60 dB; the elongation at break in both the transverse direction and the longitudinal direction exceeds 150%. The total thickness of the silver ion conductive cloth 3 is less than or equal to 0.20mm, and specifically, the thickness of the silver ion conductive cloth 3 in the application is selected to be 0.12 mm.
Based on the same inventive concept, the application also provides a preparation method of the wave-absorbing adhesive tape, which comprises the following steps:
a1, laminating a layer of pressure-sensitive adhesive on one side of the silver ion conductive cloth by adopting a hot pressing process to obtain a pressure-sensitive adhesive layer;
a2, spraying the flexible wave-absorbing material to the other side of the silver ion conductive cloth by adopting a cold spraying process and using a kettle-discharging spray gun with the caliber of 1.0-1.2 mm, drying for 4 hours at 40 ℃, and drying for 20 hours at 80 ℃ until the coating is completely cured to prepare the flexible wave-absorbing coating;
a3, preparing a release film on the side of the pressure sensitive adhesive layer far away from the silver ion conductive cloth.
The results of testing the elongation at break, peel strength and wave-absorbing performance of the wave-absorbing adhesive tapes prepared in examples 1 to 5 are shown in table 1 below. The mechanical properties of the wave-absorbing coating used in the wave-absorbing adhesive tape prepared in the embodiments 1 to 5 are shown in the following table 2. The method for testing the adhesive force of the wave-absorbing coating comprises the following steps: testing according to GB/T5210-2006 by using a double-stick method; the method for testing the breaking elongation of the wave-absorbing coating and the wave-absorbing adhesive tape comprises the following steps: pressing the prepared wave-absorbing adhesive tape into a dumbbell-shaped sample with a specified size by using a pneumatic punching machine, and testing according to the GB/T528-adulterated 2009 regulation; the method for testing the peel strength of the wave-absorbing adhesive tape comprises the following steps: testing was performed according to GB/T7122-;
the method for testing the wave absorbing performance of the wave absorbing adhesive tape comprises the following steps: and selecting an arch method by using a vector network analyzer, and performing the reflectivity of the wave-absorbing adhesive tape according to the GJB 2038A-2011 regulation.
TABLE 1 Performance test results of the wave-absorbing tapes prepared in different examples
As can be seen from the above table 1, the flexible high-peel-strength wave-absorbing adhesive tape prepared by the method has excellent mechanical properties, and can simultaneously meet the requirements that the elongation at break is more than or equal to 100% and the peel strength of the wave-absorbing adhesive tape stuck on an aluminum alloy base material is more than or equal to 1500N/m. In addition, the flexible high-peel-strength wave-absorbing adhesive tape prepared by the method has good wave-absorbing performance, and the effective bandwidth with the wave-absorbing strength less than or equal to-4 dB exceeds 20 GHz. The method controls the thickness of the wave-absorbing adhesive tape to be less than 1.00mm while meeting the performance, and meets the requirements of thin thickness, light weight and suitability for the development trend of narrow space.
Table 2-mechanical properties test results of wave-absorbing coating in different embodiments
| Adhesion (MPa) | Elongation at Break (%) | |
| Example 1 | 16.6 | 167.9 |
| Example 2 | 13.4 | 172.4 |
| Example 3 | 12.1 | 185.6 |
| Example 4 | 18.9 | 131.1 |
| Example 5 | 17.3 | 144.5 |
As can be seen from the above table 2, the wave-absorbing coating prepared by the method meets the performance requirements that the elongation at break is more than or equal to 130% and the adhesive force is more than or equal to 12MPa, has excellent electromagnetic wave absorption performance, and effectively overcomes the defects that the coating is easy to crack and fall off at the movement part of the weapon equipment.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents, improvements and the like that fall within the spirit and principle of the present invention are intended to be included therein.
Claims (10)
1. The flexible wave-absorbing material is characterized by comprising the following raw materials in percentage by weight:
40-50% of an electromagnetic wave absorbent, 10-20% of an adhesive, 30-35% of a diluent, 1-3% of a curing agent and 1-2% of an auxiliary agent;
the adhesive comprises epoxy resin and modified epoxy resin, wherein the modified epoxy resin comprises one or more of rubber modified epoxy resin, polyurethane modified epoxy resin and polyacrylate modified epoxy resin.
2. The flexible wave-absorbing material of claim 1, wherein the electromagnetic wave absorber comprises one or more of a metal material, a carbon-based conductive material, and a conductive polymer material; wherein the metal material comprises one or more of iron-silicon-chromium, iron-silicon-aluminum, iron-silicon-nickel, iron-chromium-nickel, ferrite and carbonyl iron powder; the diluent comprises one or more of dimethylbenzene, cyclohexanone, n-butanol, ethyl acetate and butyl acetate; the auxiliary agent comprises one or more of a leveling agent, an anti-settling agent and a defoaming agent; the curing agent comprises one or more of polyether amine, phenolic aldehyde amine and aromatic amine.
3. A method for preparing a flexible wave-absorbing material according to claim 1 or 2, comprising the following steps:
adding the electromagnetic wave absorbent and absolute ethyl alcohol into a stirrer, stirring and dispersing, then adding a silane coupling agent, stirring, filtering and drying to obtain a pretreated electromagnetic wave absorbent;
and adding the adhesive, the diluent and the auxiliary agent into a container, stirring and dispersing, then adding the pretreated electromagnetic wave absorbent, continuing stirring, adding the curing agent, and stirring to obtain the flexible wave-absorbing material.
4. The preparation method of the flexible wave-absorbing material according to claim 3, wherein the adhesive, the diluent and the auxiliary are added into a container, uniformly dispersed at a stirring speed of 1200-1500 rpm, then the stirring speed is reduced to 300-600 rpm, the pretreated electromagnetic wave absorbent is added, then the mixture is continuously stirred at 1200-1500 rpm for 20-30 min, then the curing agent is added, and the flexible wave-absorbing material is obtained after stirring.
5. A wave-absorbing adhesive tape is characterized by comprising:
silver ion conductive cloth;
the pressure-sensitive adhesive layer is positioned on one side of the silver ion conductive cloth;
the flexible wave-absorbing coating is positioned on the other side of the silver ion conductive cloth;
the release film is positioned on one side of the pressure-sensitive adhesive layer, which is far away from the silver ion conductive cloth;
wherein the flexible wave-absorbing coating is prepared from the flexible wave-absorbing material as claimed in claim 1 or 2.
6. The wave absorbing adhesive tape of claim 5, wherein the release film comprises one of a PE release film, a PET release film, a PI release film, an OPP release film and a PTFE release film; the pressure-sensitive adhesive layer is one of a conductive pressure-sensitive adhesive layer and a non-conductive pressure-sensitive adhesive layer.
7. The wave-absorbing adhesive tape according to claim 6, wherein the conductive pressure-sensitive adhesive layer comprises one of silver conductive pressure-sensitive adhesive, silver copper conductive pressure-sensitive adhesive and nickel carbon conductive pressure-sensitive adhesive; the non-voltage-sensitive adhesive layer comprises one of rubber pressure-sensitive adhesive, organic silicon resin pressure-sensitive adhesive, polyacrylate pressure-sensitive adhesive and polyurethane pressure-sensitive adhesive.
8. A preparation method of the wave-absorbing adhesive tape according to any one of claims 5 to 7, which is characterized by comprising the following steps:
providing silver ion conductive cloth;
preparing a pressure-sensitive adhesive layer on one side of the silver ion conductive cloth;
preparing a flexible wave-absorbing coating on the other side of the silver ion conductive cloth;
and preparing a release film on one side of the pressure-sensitive adhesive layer, which is far away from the silver ion conductive cloth.
9. The method for preparing the wave-absorbing adhesive tape according to claim 8, wherein the method for preparing the flexible wave-absorbing coating comprises the following steps:
and spraying the flexible wave-absorbing material to the other side surface of the silver ion conductive cloth, drying for 3-6 hours at 35-45 ℃, and then drying for 18-24 hours at 75-85 ℃ to obtain the flexible wave-absorbing coating.
10. The method for preparing the wave-absorbing adhesive tape according to claim 8, wherein the method for preparing the pressure-sensitive adhesive layer comprises the following steps: pressing the pressure-sensitive adhesive on one side of the silver ion conductive cloth by adopting a hot pressing process to obtain a pressure-sensitive adhesive layer;
the preparation method of the silver ion conductive cloth comprises the following steps: copper ions are plated on the non-woven fabric, and then silver nano ions are generated on the surface of the non-woven fabric through in-situ exchange reaction to prepare the silver ion conductive fabric.
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| CN115873440A (en) * | 2022-10-31 | 2023-03-31 | 航天科工武汉磁电有限责任公司 | High-temperature-resistant wave-absorbing coating and preparation method thereof, broadband wave-absorbing material and preparation method thereof |
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