CN109664567B - Thin-sheet type heat-conducting wave-absorbing composite material and preparation method thereof - Google Patents
Thin-sheet type heat-conducting wave-absorbing composite material and preparation method thereof Download PDFInfo
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Abstract
The invention discloses a sheet type heat-conducting wave-absorbing composite material and a preparation method thereof. The sheet-type heat-conducting wave-absorbing composite material comprises a heat conducting layer and a wave-absorbing layer, wherein the heat conducting layer comprises 8-15% of high polymer binder, 80-87% of heat conducting agent and less than or equal to 5% of auxiliary agent by weight percentage; the wave-absorbing layer comprises 5-17% of polymer binder, 80-92% of magnetic powder and less than or equal to 3% of auxiliary agent, and in the preparation process, the single-layer thickness of the heat conducting layer is 0.07-0.13mm, and the single-layer thickness of the wave-absorbing layer is 0.07-0.13 mm. The compound has good heat dissipation property, good wave absorbing property, excellent mechanical property, weather resistance, corrosion resistance, environmental protection and other comprehensive properties, and is expected to be a novel ideal heat-conducting wave absorbing material.
Description
Technical Field
The invention relates to the field of wave-absorbing materials and heat-conducting materials, in particular to a sheet type heat-conducting wave-absorbing composite material and a preparation method thereof.
Background
As electronic devices are becoming thinner, faster, higher frequency and more highly integrated, heat dissipation may occur at any position of the electronic devices, which may affect the working stability, reliability and service life of the electronic devices, and even damage the devices. The parts where the heat dissipation problem is easy to occur are usually at the positions of chips with digital control/power amplification, and the heat conducting gasket can be used for effectively guiding or conducting redundant heat generated by equipment to the graphite layer, so that the chips are not overheated, the surface layer heat is uniformly diffused along the surface direction, the occurrence of a point heat source case is avoided, and the embodiment effect is enhanced.
The heat conducting gasket is a heat conducting medium material synthesized by taking rubber as a base material and metal oxide and the like as heat conducting agents through a special process. Because the heat-conducting gasket contains a large amount of rubber polymer materials (generally, the mass fraction is not less than 10, even higher), the heat-conducting performance of the heat-conducting gasket is poor, the heat-conducting coefficient is 0.7-4.0W/(m.K), and the preparation process has high control requirement, time-consuming operation and great difficulty.
In addition, people find that the electromagnetic interference problem still exists while solving the heat dissipation problem through the heat conduction gasket, so when the heat conduction gasket is attached to the surface of the chip, the heat conduction gasket is required to have good heat conduction characteristics and good wave absorption characteristics. However, most of the conventional heat conducting gaskets have low magnetic permeability and do not have good wave absorption characteristics.
Disclosure of Invention
The invention aims to overcome the defects of the background technology and provides a composite material with wave-absorbing and heat-conducting properties and a preparation method thereof.
The sheet-type wave-absorbing material is a flexible sheet-type material prepared by taking a polymer binder as a base material and taking soft magnetic alloy and ferrite magnetic powder as an absorbent through a casting or calendering process, and has good absorption and shielding functions on electromagnetic noise. The invention discovers that if the heat-conducting agent with good heat conductivity and the magnetic powder with excellent wave-absorbing performance are compounded to prepare the heat-conducting wave-absorbing composite material, the compound has good heat-radiating characteristic and good wave-absorbing performance, and in addition, the heat-conducting wave-absorbing composite material has excellent comprehensive performances of mechanical performance, weather resistance, corrosion resistance, environmental protection and the like, and is expected to be a novel ideal heat-conducting wave-absorbing material.
Based on the research, the sheet type heat-conducting wave-absorbing composite material disclosed by the invention comprises a heat-conducting layer and a wave-absorbing layer, and the applicant regulates and controls the performance of the composite material by adjusting the number, thickness, formula and process of the heat-conducting layer and the wave-absorbing layer in the composite wave-absorbing material.
In some embodiments of the present invention, it is preferable that the heat conducting layer is 4 to 5 layers, and the wave absorbing layer is 5 to 6 layers.
Further, the heat conduction layer comprises 8-15% of polymer binder, 80-87% of heat conduction agent and less than or equal to 5% of auxiliary agent by weight percentage; the wave absorbing layer comprises 5-17% of polymer binder, 80-92% of magnetic powder and less than or equal to 3% of auxiliary agent.
Further, the high molecular binder is a high molecular polymer, and may be selected from one or more of polyurethane, polyacrylate, polymethyl methacrylate, polyvinyl alcohol, ethyl cellulose, and cellulose acetate butyrate.
Further, the heat conductive agent includes one or more of silicon carbide, magnesium oxide, aluminum oxide, and zinc oxide.
In some embodiments of the present invention, it is preferable that the thermally conductive agent is spherical and has a diameter of 0.5 to 3 μm.
Further, the magnetic powder comprises one or more of manganese zinc ferrite, nickel zinc ferrite, iron nickel, iron silicon aluminum and iron silicon chromium.
In some embodiments of the present invention, it is preferable that the magnetic powder has a thickness of 0.5 to 3 μm.
Further, the auxiliary agent comprises one or more of a dispersing agent, a curing agent and a curing catalyst.
In some embodiments of the present invention, it is preferable that the mass ratio of the dispersant, the curing agent and the curing catalyst in the heat-conducting layer assistant is (1-3): (6-8): 1.
in some embodiments of the present invention, preferably, the mass ratio of the dispersing agent, the curing agent and the curing catalyst in the wave-absorbing layer auxiliary agent is (2-4): (5-7): 1.
furthermore, the invention also provides a preparation method of the sheet type heat-conducting wave-absorbing composite material, which comprises the following steps:
(1) firstly, uniformly mixing a high-molecular binder, a heat-conducting agent, a solvent and an auxiliary agent according to the required weight percentage, and preparing the mixture into a single-layer heat-conducting material by a casting process;
(2) uniformly mixing a high-molecular binder, magnetic powder, a solvent and an auxiliary agent according to the required weight percentage, and preparing the mixture into a single-layer electromagnetic wave absorption material by a casting process;
(3) and (3) respectively taking the m heat conduction layers and the n electromagnetic wave absorption layers to carry out laminating heat treatment, and finally obtaining the double-layer heat conduction wave absorption composite wave absorbing material.
In some embodiments of the invention, the thickness of the heat conducting layer is 0.07-0.13mm, preferably 0.10mm, and the thickness of the wave absorbing layer is 0.07-0.13mm, preferably 0.10 mm.
Further, m is more than or equal to 1 and n is more than or equal to 1 in the step (3).
In some embodiments of the present invention, preferably, m is 4 or 5, and n is 5 or 6.
In the method, the solvent is not limited, the binder and other auxiliary agents can be well dissolved, and an environment-friendly solvent is selected as far as possible.
In the method, the hot pressing temperature, the pressure and the time in the laminating heat treatment are not limited, and only the layers can be tightly combined, and meanwhile, the heat-conducting wave-absorbing composite material is fully cured.
The sheet type heat-conducting wave-absorbing composite material and the preparation method thereof provided by the invention have the following characteristics:
(1) compared with the traditional single heat conduction material, the heat conduction wave absorption composite material is prepared by adding the electromagnetic wave absorption layer, has good heat dissipation characteristic and good wave absorption performance, and has excellent mechanical property and flexibility, weather resistance, corrosion resistance and environmental protection.
(2) The preparation method adopted by the invention is simple, the process is easy to control, the large-scale production is facilitated, the compound is fully subjected to hot pressing treatment, the close combination of heat conduction and wave absorption layers can be ensured, air gaps are avoided, the heat conduction and wave absorption performance of the composite material is more excellent, and meanwhile, the accurate control of the thickness is easy to realize.
Drawings
FIG. 1 is a structure of a sheet-type heat-conducting wave-absorbing composite material of the present invention;
wherein, 1 represents a heat dissipation layer, 2 represents a wave absorbing layer, and m and n are both more than or equal to 1.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention. It is to be understood that the following description is only illustrative of the present invention and is not to be construed as limiting the present invention.
The terms "comprises," "comprising," "includes," "including," "has," "having," "contains," "containing," or any other variation thereof, as used herein, are intended to cover a non-exclusive inclusion. For example, a composition, process, method, article, or apparatus that comprises a list of elements is not necessarily limited to only those elements but may include other elements not expressly listed or inherent to such composition, process, method, article, or apparatus.
When an amount, concentration, or other value or parameter is expressed as a range, preferred range, or as a range of upper preferable values and lower preferable values, this is to be understood as specifically disclosing all ranges formed from any pair of any upper range limit or preferred value and any lower range limit or preferred value, regardless of whether ranges are separately disclosed. For example, when a range of "1 to 5" is disclosed, the described range should be interpreted to include the ranges "1 to 4", "1 to 3", "1 to 2 and 4 to 5", "1 to 3 and 5", and the like. When a range of values is described herein, unless otherwise stated, the range is intended to include the endpoints thereof and all integers and fractions within the range.
The indefinite articles "a" and "an" preceding an element or component of the invention are not intended to limit the number requirement (i.e., the number of occurrences) of the element or component. Thus, "a" or "an" should be read to include one or at least one, and the singular form of an element or component also includes the plural unless the number clearly indicates the singular.
Furthermore, the description below of the terms "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above are not necessarily for the same embodiment or example.
Further, the technical features of the embodiments of the present invention may be combined with each other as long as they do not conflict with each other.
Example 1
As shown in fig. 1, the sheet-type heat-conducting wave-absorbing composite material has a double-layer structure of a heat-conducting layer and a wave-absorbing layer. The performance of the composite material is regulated and controlled by adjusting the number, thickness, formula and process of heat-conducting layers and wave-absorbing layers in the composite wave-absorbing material.
(1) The heat conducting layer comprises the following components in percentage by weight:
high-molecular binder: 10 percent of
Heat-conducting agent: 86 percent of the total weight
Auxiliary agent: 4 percent of
The high molecular binder is polyurethane, and can meet the requirements of the casting process of heat conduction materials.
The heat conducting agent is spherical silicon carbide with the diameter of 0.8-3 mu m.
The auxiliary agent comprises a dispersing agent, a polyurethane curing agent and a curing catalyst, and the mass ratio of the dispersing agent to the polyurethane curing agent to the curing catalyst is 1:8: 1.
The thickness of the single layer of the heat conduction layer is 0.10 mm.
(2) The wave-absorbing layer comprises the following components in percentage by weight:
high-molecular binder: 9 percent of
Magnetic powder: 89 percent
Auxiliary agent: 2 percent of
The high molecular binder is polyacrylate, and the requirement can meet the requirement of the wave-absorbing material casting process.
The magnetic powder is ferrum-silicon-aluminum, the thickness is 0.5-2 μm, the diameter-thickness ratio (the size in the diameter direction and the size in the thickness direction) is more than 50: 1.
the auxiliary agent comprises a dispersing agent, a polyacrylate curing agent and a curing catalyst, and the mass ratio of the dispersing agent to the polyacrylate curing agent to the curing catalyst is 3:6: 1.
The thickness of the single layer of the wave absorbing layer is 0.10 mm.
The preparation method comprises the following steps:
firstly, the high-molecular binder polyurethane, the silicon carbide, the solvent and other auxiliary agents are uniformly mixed according to the proportion, and then the mixture is made into the heat conduction material with the single-layer thickness of 0.10mm by the casting process. The high molecular adhesive polyacrylate, the ferrum-silicon-aluminum, the solvent and other auxiliary agents are uniformly mixed according to the proportion, and then the mixture is prepared into the wave-absorbing material with the single-layer thickness of 0.10mm by a casting process. And respectively taking 5 layers of heat conduction materials and 5 layers of wave-absorbing materials to carry out laminating heat treatment, and finally obtaining the sheet type heat conduction wave-absorbing composite material with the thickness of 0.5 mm.
The laminating heat treatment is to laminate the heat conduction layer and the absorption layer together and then carry out hot press molding. The hot pressing temperature is 135 ℃, the pressure is 50MPa, the time is 5 minutes, the heat conduction layer and the wave absorption layer can be tightly combined, and the solidification is sufficient.
Comparative example 1
This example is a comparative example to example 1.
The raw materials and the proportion of the heat conduction layer in the embodiment 1 are selected, and 10 layers of heat conduction materials are taken according to the preparation process in the embodiment 1 to prepare the sheet type heat conduction material with the thickness of 0.5mm through hot pressing.
Example 2
As shown in fig. 1, the sheet-type heat-conducting wave-absorbing composite material has a double-layer structure of a heat-conducting layer and a wave-absorbing layer. The performance of the composite material is regulated and controlled by adjusting the number, thickness, formula and process of heat-conducting layers and wave-absorbing layers in the composite wave-absorbing material.
(1) The heat conducting layer comprises the following components in percentage by weight:
high-molecular binder: 12 percent of
Heat-conducting agent: 84 percent
Auxiliary agent: 4 percent of
The polymer binder is polymethyl methacrylate, and the requirement can meet the requirement of a casting process of a heat conduction material.
The heat conducting agent is spherical alumina with the diameter of 1-3 μm.
The auxiliary agent comprises a dispersing agent, a polymethyl methacrylate curing agent and a curing catalyst, and the mass ratio of the dispersing agent to the polymethyl methacrylate curing agent to the curing catalyst is 3:6: 1.
The thickness of the single layer of the heat conduction layer is 0.10 mm.
(2) The wave-absorbing layer comprises the following components in percentage by weight:
high-molecular binder: 8 percent of
Magnetic powder: 90 percent of
Auxiliary agent: 2 percent of
The high molecular binder is polyurethane, and can meet the requirements of the wave-absorbing material casting process.
The magnetic powder is spherical nickel-zinc ferrite with the diameter of 0.5-3 μm.
The auxiliary agent comprises a dispersing agent, a polyurethane curing agent and a curing catalyst, and the mass ratio of the dispersing agent to the polyurethane curing agent to the curing catalyst is 4:5: 1.
The thickness of the single layer of the wave absorbing layer is 0.10 mm.
The preparation method comprises the following steps:
firstly, uniformly mixing a macromolecular binder polymethyl methacrylate, alumina, a solvent and other auxiliary agents according to a proportion, and then preparing the mixture into a heat conduction material with a single-layer thickness of 0.10mm by a casting process. The macromolecular binder polyurethane, the nickel-zinc ferrite, the solvent and other auxiliary agents are uniformly mixed according to the proportion, and then the mixture is prepared into the wave-absorbing material with the single-layer thickness of 0.10mm by a casting process. And respectively taking 4 layers of heat conduction materials and 6 layers of wave-absorbing materials to carry out laminating heat treatment, and finally obtaining the sheet type heat conduction wave-absorbing composite material with the thickness of 0.5 mm.
The laminating heat treatment is to laminate the heat conduction layer and the absorption layer together and then carry out hot press molding. The hot pressing temperature is 150 ℃, the pressure is 50MPa, the time is 4 minutes, the heat conduction layer and the wave absorption layer can be tightly combined, and the solidification is sufficient.
Comparative example 2
This example is a comparative example to example 2.
Selecting the raw materials and the proportion of the heat conduction layer and the absorption layer in the embodiment 2, and preparing the sheet type heat conduction wave absorption composite material with the thickness of 0.5mm by taking 3 layers of heat conduction materials and 7 layers of wave absorption materials and carrying out hot pressing according to the preparation process in the embodiment 2.
Example 3
As shown in fig. 1, the sheet-type heat-conducting wave-absorbing composite material has a double-layer structure of a heat-conducting layer and a wave-absorbing layer. The performance of the composite material is regulated and controlled by adjusting the number, thickness, formula and process of heat-conducting layers and wave-absorbing layers in the composite wave-absorbing material.
(1) The heat conducting layer comprises the following components in percentage by weight:
high-molecular binder: 14 percent of
Heat-conducting agent: 82 percent of
Auxiliary agent: 4 percent of
The high molecular binder is ethyl cellulose, and the requirement can meet the requirement of the casting process of the heat conduction material.
The heat conducting agent is spherical zinc oxide with the diameter of 0.5-2 μm.
The auxiliary agent comprises a dispersing agent, an ethyl cellulose curing agent and a curing catalyst, and the mass ratio of the dispersing agent to the ethyl cellulose curing agent to the curing catalyst is 3:6: 1.
The thickness of the single layer of the heat conduction layer is 0.10 mm.
(2) The wave-absorbing layer comprises the following components in percentage by weight:
high-molecular binder: 15 percent of
Magnetic powder: 82 percent of
Auxiliary agent: 3 percent of
The high molecular binder is polyvinyl alcohol, and the requirements can meet the requirements of the wave-absorbing material casting process.
The magnetic powder is made of iron, silicon and chromium, the thickness is 1-3 mu m, and the diameter-thickness ratio (the size in the diameter direction and the size in the thickness direction) is more than 30: 1.
the auxiliary agent comprises a dispersing agent, a polyvinyl alcohol curing agent and a curing catalyst, and the mass ratio of the dispersing agent to the polyvinyl alcohol curing agent to the curing catalyst is 2:7: 1.
The thickness of the single layer of the wave absorbing layer is 0.10 mm.
The preparation method comprises the following steps:
firstly, the macromolecular binder ethyl cellulose, zinc oxide, solvent and other auxiliary agents are uniformly mixed according to the proportion, and then the mixture is made into the heat conduction material with the single-layer thickness of 0.10mm by the casting process. The macromolecular adhesive polyvinyl alcohol, the iron silicon chromium, the solvent and other auxiliary agents are uniformly mixed according to the proportion, and then the mixture is prepared into the wave-absorbing material with the single-layer thickness of 0.10mm by a casting process. And respectively taking 4 layers of heat conduction materials and 6 layers of wave-absorbing materials to carry out laminating heat treatment, and finally obtaining the sheet type heat conduction wave-absorbing composite material with the thickness of 0.5 mm.
The laminating heat treatment is to laminate the heat conduction layer and the absorption layer together and then carry out hot press molding. The hot pressing temperature is 120 ℃, the pressure is 50MPa, the time is 7 minutes, the heat conduction layer and the wave absorption layer can be tightly combined, and the solidification is sufficient.
Comparative example 3
This example is a comparative example to example 3.
Selecting the raw materials and the proportion of the heat conduction layer and the absorption layer in the embodiment 3, and taking 2 layers of heat conduction materials and 8 layers of wave-absorbing materials according to the preparation process in the embodiment 1 to prepare the sheet type heat conduction wave-absorbing composite material with the thickness of 0.5mm through hot pressing.
The sheet type heat-conducting and wave-absorbing materials prepared in examples 1 to 3 and comparative examples 1 to 3 were tested for wave-absorbing performance (reflection loss) and thermal conductivity, and the test results are shown in table 1:
TABLE 1 wave absorption Properties (reflection losses) and thermal conductivity test results
As can be seen from Table 1, compared with the traditional single heat conduction material, the sheet type heat conduction and wave absorption composite material provided by the invention has the advantages that the wave absorption property is obviously improved, the absorption frequency band is wide, and meanwhile, the heat conduction performance of the composite material is not obviously reduced.
It will be understood by those skilled in the art that the foregoing is only a preferred embodiment of the present invention, and is not intended to limit the invention, and that any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the scope of the present invention.
Claims (4)
1. A preparation method of a sheet type heat-conducting wave-absorbing composite material is characterized by comprising the following steps:
(1) firstly, uniformly mixing a high-molecular binder, a heat-conducting agent, a solvent and an auxiliary agent according to the required weight percentage, and preparing the mixture into a single-layer heat-conducting material by a casting process;
(2) uniformly mixing a high-molecular binder, magnetic powder, a solvent and an auxiliary agent according to the required weight percentage, and preparing the mixture into a single-layer electromagnetic wave absorption material by a casting process;
(3) respectively taking m heat conduction layers and n electromagnetic wave absorption layers to carry out laminating heat treatment, and finally obtaining the double-layer heat conduction wave absorption composite wave absorption material;
the thickness of the heat conduction layer is 0.07-0.13mm in a single layer, and the thickness of the wave absorbing layer is 0.07-0.13mm in a single layer;
m =4 or 5, n =5 or 6 in the step (3);
the heat conduction layer comprises 8-15% of high polymer binder, 80-87% of heat conduction agent and less than or equal to 5% of auxiliary agent by weight percentage; the wave absorbing layer comprises 5-17% of polymer binder, 80-92% of magnetic powder and less than or equal to 3% of auxiliary agent;
the high molecular binder is a high molecular polymer, and the high molecular polymer is one or more of polyurethane, polyacrylate, polymethyl methacrylate, polyvinyl alcohol, ethyl cellulose and cellulose acetate butyrate;
the heat conducting agent comprises one or more of silicon carbide, magnesium oxide, aluminum oxide and zinc oxide, and is spherical and 0.5-3 mu m in diameter;
the auxiliary agent comprises one or more of a dispersing agent, a curing agent and a curing catalyst, wherein the dispersing agent, the curing agent and the curing catalyst in the heat-conducting layer auxiliary agent have the mass ratio of (1-3): (6-8): 1; the wave-absorbing layer auxiliary agent comprises a dispersing agent, a curing agent and a curing catalyst, wherein the mass ratio of the dispersing agent to the curing catalyst is (2-4): (5-7): 1.
2. the sheet-type heat-conducting and wave-absorbing composite material obtained by the preparation method of the sheet-type heat-conducting and wave-absorbing composite material according to claim 1, wherein the sheet-type heat-conducting and wave-absorbing composite material comprises a heat-conducting layer and a wave-absorbing layer.
3. The sheet type heat-conducting wave-absorbing composite material obtained by the preparation method of the sheet type heat-conducting wave-absorbing composite material according to claim 2, wherein the heat-conducting layer is 4-5 layers, and the wave-absorbing layer is 5-6 layers.
4. The sheet-type heat-conducting and wave-absorbing composite material obtained by the preparation method of the sheet-type heat-conducting and wave-absorbing composite material according to claim 3, wherein the magnetic powder comprises one or more of manganese zinc ferrite, nickel zinc ferrite, iron nickel, iron silicon aluminum and iron silicon chromium, and the thickness of the magnetic powder is 0.5-3 μm.
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| CN111589675B (en) * | 2020-05-18 | 2022-02-08 | 横店集团东磁股份有限公司 | High-thermal-conductivity electromagnetic wave absorption composite sheet and preparation method thereof |
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| CN113199837A (en) * | 2021-05-12 | 2021-08-03 | 深圳和畅电磁材料有限公司 | Preparation method of high-performance heat-conducting wave-absorbing composite material |
| CN114654823B (en) * | 2022-03-29 | 2023-04-25 | 重庆科技学院 | Mn-Zn ferrite-FeSiAl composite wave-absorbing material and preparation method thereof |
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| CN106165559A (en) * | 2014-03-25 | 2016-11-23 | 乐金华奥斯有限公司 | electromagnetic wave shielding sheet and preparation method thereof |
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