CN212257447U - Assembled surface-mounted light-emitting diode - Google Patents
Assembled surface-mounted light-emitting diode Download PDFInfo
- Publication number
- CN212257447U CN212257447U CN202021255449.XU CN202021255449U CN212257447U CN 212257447 U CN212257447 U CN 212257447U CN 202021255449 U CN202021255449 U CN 202021255449U CN 212257447 U CN212257447 U CN 212257447U
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- CN
- China
- Prior art keywords
- support
- sides
- pins
- emitting diode
- epoxy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- 239000004593 Epoxy Substances 0.000 claims abstract description 13
- 239000007787 solid Substances 0.000 claims abstract description 8
- 238000009434 installation Methods 0.000 claims abstract description 7
- 230000017525 heat dissipation Effects 0.000 claims description 11
- 239000013078 crystal Substances 0.000 claims description 6
- 241000218202 Coptis Species 0.000 claims description 2
- 235000002991 Coptis groenlandica Nutrition 0.000 claims description 2
- 238000004806 packaging method and process Methods 0.000 abstract description 2
- 239000003822 epoxy resin Substances 0.000 description 6
- 229920000647 polyepoxide Polymers 0.000 description 6
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000005286 illumination Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- FGRBYDKOBBBPOI-UHFFFAOYSA-N 10,10-dioxo-2-[4-(N-phenylanilino)phenyl]thioxanthen-9-one Chemical compound O=C1c2ccccc2S(=O)(=O)c2ccc(cc12)-c1ccc(cc1)N(c1ccccc1)c1ccccc1 FGRBYDKOBBBPOI-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000000084 colloidal system Substances 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000004020 luminiscence type Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
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Abstract
The utility model provides a pair of assembled paster emitting diode, which comprises a bracket, the support upper end is equipped with the storage tank of undercut, the storage tank bottom is equipped with solid brilliant seat, be fixed with the diode wafer on the solid brilliant seat, gu the brilliant seat both sides are equallyd divide and do not are equipped with negative pole pin, positive pole pin, support lower extreme both sides all are equipped with first screw, all be equipped with the confession on negative pole pin, the positive pole pin the hole of dodging that first screw passed, the storage tank upside still is equipped with the epoxy apron, the epoxy apron includes the arc portion, connects the installation department of arc portion lower extreme, support upper end both sides all are equipped with the shoulder hole, the shoulder hole is interior to be inserted and is equipped with the buckle, the installation department edge is equipped with the confession buckle one end male spacing groove. The utility model discloses a paster emitting diode, mode through the equipment makes up epoxy apron and support, and packaging efficiency is higher.
Description
Technical Field
The utility model relates to a light emitting diode technical field, concretely relates to assembled paster emitting diode.
Background
In the technical field of illumination, the light-emitting diode gradually replaces the original bulb and is used as a new generation of mainstream illumination light source due to the advantages of low use voltage, low energy consumption, strong applicability, high stability, multicolor luminescence and the like. The LED is mainly composed of five materials of a bracket, silver colloid, a wafer, a gold wire and epoxy resin. Generally, a light emitting diode is manufactured by fixing a wafer on a support, soldering the wafer to two pins on the support through gold wires, and then manufacturing epoxy resin on the upper end of the wafer, wherein the manufacturing is completed after the epoxy resin is cured. Although the process is simple, the whole process takes a long time because a certain time is needed for curing and molding after the epoxy resin is manufactured.
SUMMERY OF THE UTILITY MODEL
To above problem, the utility model provides an assembled paster emitting diode, mode combination epoxy apron and support through the equipment, the packaging efficiency is higher.
In order to achieve the above object, the present invention provides the following technical solutions:
an assembled Surface Mount Device (SMD) Light Emitting Diode (LED) comprises a support, wherein a containing groove which is sunken downwards is arranged at the upper end of the support, a solid crystal seat is arranged at the bottom of the containing groove, a diode wafer is fixed on the solid crystal seat, cathode pins and anode pins are respectively arranged on two sides of the solid crystal seat, gold threads are respectively connected between the diode wafer and the cathode pins and between the diode wafer and the anode pins, through holes for the cathode pins and the anode pins to pass through are respectively arranged on two sides of the lower end of the support, first screws are respectively arranged on two sides of the lower end of the support, avoiding holes for the first screws to pass through are respectively arranged on the cathode pins and the anode pins, an epoxy cover plate is further arranged on the upper side of the containing groove and comprises an arc-shaped part and a mounting part connected to the lower end of the arc-shaped part, stepped holes are respectively, the installation department edge is equipped with the confession buckle one end male spacing groove.
Specifically, the inner side surface of the accommodating groove is provided with a reflection sheet.
Specifically, grooves are formed in two sides of the lower end of the die bonding seat, and one ends of the cathode pin and one ends of the anode pin are inserted into the grooves.
Specifically, the support lower extreme still is equipped with the breach groove, the breach inslot is fixed with the heating panel, heating panel upper end middle part is connected with the extension, the extension is located under the diode wafer.
Specifically, the heat dissipation plate is fixed in the notch groove through a second screw.
The utility model has the advantages that:
firstly, the surface mount light emitting diode of the utility model combines the epoxy cover plate and the bracket in an assembling mode, the epoxy cover plate can be produced in a large batch in actual production, and the epoxy cover plate can be fixed on the bracket by simple buckling of the buckle, so that the assembling efficiency is higher;
and secondly, a heat dissipation plate is added, so that the heat dissipation efficiency of the diode wafer is improved.
Drawings
Fig. 1 is a schematic structural view of an assembled surface mount light emitting diode of the present invention.
Fig. 2 is an enlarged view of a portion a in fig. 1.
The reference signs are: the LED chip comprises a bracket 1, a containing groove 11, a stepped hole 12, a reflector plate 13, a second screw 14, a die bond 2, a diode chip 3, a cathode pin 4, an anode pin 5, a gold wire 6, a first screw 7, an epoxy cover plate 8, an arc part 81, an installation part 82, a limiting groove 821, a buckle 9, a heat dissipation plate 10 and an extension part 101.
Detailed Description
The present invention will be described in further detail with reference to the following examples and drawings, but the present invention is not limited thereto.
As shown in fig. 1-2:
an assembled surface mount light emitting diode comprises a bracket 1, wherein the upper end of the bracket 1 is provided with a containing groove 11 which is sunken downwards, the bottom of the containing groove 11 is provided with a die bonding seat 2, a diode wafer 3 is fixed on the die bonding seat 2, two sides of the die bonding seat 2 are respectively provided with a cathode pin 4 and an anode pin 5, gold wires 6 are connected between the diode wafer 3 and the cathode pin 4 and the anode pin 5, two sides of the bracket 1 are respectively provided with a through hole for the cathode pin 4 and the anode pin 5 to pass through, two sides of the lower end of the bracket 1 are respectively provided with a first screw 7, two sides of the cathode pin 4 and the anode pin 5 are respectively provided with a avoiding hole for the first screw 7 to pass through, the upper side of the containing groove 11 is also provided with an epoxy resin cover plate 8, the epoxy resin cover plate 8 comprises an arc part 81 and a mounting part 82 connected with the lower end of the arc part 81, the edge of installation department 82 is equipped with and supplies buckle 9 one end male spacing groove 821, and the back is detained to buckle 9, utilizes buckle 9 end to carry out spacing fixed to epoxy apron 8, in order to improve paster emitting diode's leakproofness, can coat glue at the handing-over department of epoxy apron 8 and support 1 and seal.
Preferably, the inner side surface of the accommodating groove 11 is provided with a reflective sheet 13, and the reflective sheet 13 has a certain inclination, so as to reflect light emitted by the diode chip 3 during operation.
Preferably, in order to prevent one end of each of the cathode pin 4 and the anode pin 5 from tilting, both sides of the lower end of the die paddle 2 are provided with grooves, and one end of each of the cathode pin 4 and the anode pin 5 is inserted into the grooves.
Preferably, in order to improve the heat dissipation efficiency of the diode chip 3, the lower end of the bracket 1 is further provided with a notch groove, a heat dissipation plate 10 is fixed in the notch groove, the middle part of the upper end of the heat dissipation plate 10 is connected with an extension part 101, and the extension part 101 is located right below the diode chip 3.
Preferably, the heat dissipation plate 10 is fixed in the notch groove by the second screw 14.
The above embodiments only represent one embodiment of the present invention, and the description thereof is more specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.
Claims (5)
1. The assembled patch light-emitting diode is characterized by comprising a support (1), wherein a downward-recessed accommodating groove (11) is formed in the upper end of the support (1), a solid crystal seat (2) is arranged at the bottom of the accommodating groove (11), a diode wafer (3) is fixed on the solid crystal seat (2), cathode pins (4) and anode pins (5) are respectively arranged on two sides of the solid crystal seat (2), gold threads (6) are connected between the diode wafer (3) and the cathode pins (4) and between the diode wafer and the anode pins (5), through holes for the cathode pins (4) and the anode pins (5) to pass through are formed in two sides of the support (1), first screws (7) are arranged on two sides of the lower end of the support (1), and avoiding holes for the first screws (7) to pass through are formed in the cathode pins (4) and the anode pins (5), storage tank (11) upside still is equipped with epoxy apron (8), epoxy apron (8) include arc portion (81), connect installation department (82) of arc portion (81) lower extreme, support (1) upper end both sides all are equipped with shoulder hole (12), shoulder hole (12) interpolation is equipped with buckle (9), installation department (82) edge is equipped with the confession buckle (9) one end male spacing groove (821).
2. The assembled patch led of claim 1, wherein the inner side of the receiving groove (11) is provided with a reflective sheet (13).
3. The assembled patch light-emitting diode of claim 1, wherein grooves are formed on both sides of the lower end of the die attach base (2), and one ends of the cathode pin (4) and the anode pin (5) are inserted into the grooves.
4. The assembled patch light-emitting diode according to claim 1, wherein the lower end of the support (1) is further provided with a notch groove, a heat dissipation plate (10) is fixed in the notch groove, an extension part (101) is connected to the middle part of the upper end of the heat dissipation plate (10), and the extension part (101) is located right below the diode chip (3).
5. The assembled patch LED according to claim 4, wherein the heat dissipation plate (10) is fixed in the notch groove by a second screw (14).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021255449.XU CN212257447U (en) | 2020-06-30 | 2020-06-30 | Assembled surface-mounted light-emitting diode |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021255449.XU CN212257447U (en) | 2020-06-30 | 2020-06-30 | Assembled surface-mounted light-emitting diode |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212257447U true CN212257447U (en) | 2020-12-29 |
Family
ID=73979311
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021255449.XU Expired - Fee Related CN212257447U (en) | 2020-06-30 | 2020-06-30 | Assembled surface-mounted light-emitting diode |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212257447U (en) |
-
2020
- 2020-06-30 CN CN202021255449.XU patent/CN212257447U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20201229 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |