CN212255778U

CN212255778U - Interposer chip structure and coupling assembly of optical fiber and photonic chip

Info

Publication number: CN212255778U
Application number: CN202020906833.5U
Authority: CN
Inventors: 飒米穆萨; 刘永
Original assignee: Suzhou Xianmi Technology Co ltd
Current assignee: Suzhou Xianmi Technology Co ltd
Priority date: 2020-05-26
Filing date: 2020-05-26
Publication date: 2020-12-29
Anticipated expiration: 2030-05-26

Abstract

The utility model relates to an optical fiber technology field specifically discloses an interposer chip, wherein, include: the optical fiber module comprises a substrate, wherein a plurality of waveguide structures are arranged on the substrate at intervals, each waveguide structure comprises a connecting waveguide and spot size converters arranged at two ends of the connecting waveguide, the spot size converter at one end of the connecting waveguide is used for realizing mode matching with an optical fiber, and the spot size converter at the other end of the connecting waveguide is used for realizing mode matching with a photonic chip. The utility model also discloses a coupling subassembly of optic fibre and photon chip. The utility model provides an interposer chip sets up a plurality of waveguide structures through the interval on the base plate, and every waveguide structure all includes a connection waveguide and two spot size converters, and this interposer chip can realize optic fibre and photonic chip's effective coupling when the effect of realization to optic fibre and photonic chip coupling, and the end face coupling loss can be less than 1 dB.

Description

Interposer chip structure and coupling assembly of optical fiber and photonic chip

Technical Field

The utility model relates to an optical fiber technology field especially relates to an interior interposer chip structure and including this interior interposer chip structure's optic fibre and photonic chip's coupling subassembly.

Background

Integrated photonics, and in particular silicon photonics, is receiving increasing attention in many fields of application, such as data communication, high performance computing, communications, autopilot and sensing, and so on. However, integrated photonics still faces many challenges, which prevent its large-scale industrial application. One of the major challenges is how to achieve efficient coupling between standard single mode fibers and photonic chips. The difficulty is that the cross-sectional dimensions of the two are not matched seriously, the diameter of the fiber core of the standard single-mode optical fiber is about 10 mu m, and the cross-sectional dimension of the planar waveguide on the integrated photonic chip is 4 x 0.5 mu m²~1*0.2µm². At present, the optical coupling between the optical fiber and the photonic chip is mainly realized by adopting a grating or lens coupling scheme, the end face coupling loss of the two schemes is 2-3 dB, and nearly half of optical power has to be wasted. In addition, the efficiency of grating coupling depends on the wavelength, and a specific grating coupler can only realize high-efficiency coupling within a certain wavelength range and cannot meet application requirements with wide requirements on the working wavelength range. In addition, the two methods both require a complicated alignment process in the process of assembling the optical fiber and the chip, are slow, and are not suitable for mass production.

At present, there are no products on the market that can solve the above problems, only some simple optical fiber array products are provided, the end face of the optical fiber array is slightly complicated to be subjected to tapering treatment or lens coupling, and the industry still lacks a solution capable of improving the assembly process.

Disclosure of Invention

The utility model provides an interposer chip structure reaches optic fibre and photon chip's coupling subassembly including this interposer chip structure, solves the unable problem that realizes optic fibre and photon chip effective coupling that exists among the correlation technique.

As a first aspect of the present invention, there is provided an interposer chip, including: the optical fiber module comprises a substrate, wherein a plurality of waveguide structures are arranged on the substrate at intervals, each waveguide structure comprises a connecting waveguide and spot size converters arranged at two ends of the connecting waveguide, the spot size converter at one end of the connecting waveguide is used for realizing mode matching with an optical fiber, and the spot size converter at the other end of the connecting waveguide is used for realizing mode matching with a photonic chip.

As another aspect of the present invention, there is provided a coupling assembly of an optical fiber and a photonic chip, wherein the coupling assembly includes: an optical fiber array, a photonic chip, and the interposer chip described above, the optical fiber array and the photonic chip being connected by the interposer chip.

Further, the fiber array includes a plurality of optical fibers, each optical fiber connecting one waveguide structure in the interposer chip.

Further, the photonic chip comprises a silicon photonics chip.

The utility model provides an interposer chip sets up a plurality of waveguide structures through the interval on the base plate, and every waveguide structure all includes a connection waveguide and two spot size converters, and this interposer chip can realize optic fibre and photonic chip's effective coupling when the effect of realization to optic fibre and photonic chip coupling, and the end face coupling loss can be less than 1 dB.

Drawings

The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the principles of the invention and not to limit the invention.

Fig. 1 is a schematic diagram of a waveguide structure provided by the present invention.

Fig. 2 is a schematic structural diagram of an interposer chip according to the present invention.

Fig. 3 is a schematic diagram of an interposer module formed by an optical fiber array and an interposer chip according to the present invention.

Fig. 4 is a schematic structural diagram of a coupling assembly of an optical fiber and a photonic chip according to the present invention.

Detailed Description

It should be noted that the embodiments and features of the embodiments of the present invention may be combined with each other without conflict. The present invention will be described in detail below with reference to the accompanying drawings in conjunction with embodiments.

In order to make the technical solution of the present invention better understood, the technical solution of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts shall belong to the protection scope of the present invention.

It should be noted that the terms "first," "second," and the like in the description and claims of the present invention and in the drawings described above are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used may be interchanged under appropriate circumstances for purposes of describing the embodiments of the invention herein. Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed, but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.

In the present embodiment, an interposer chip is provided, and fig. 1 and fig. 2 are schematic structural diagrams of an interposer chip 1 provided according to an embodiment of the present invention, as shown in fig. 1 and fig. 2, including: the photonic chip comprises a substrate 10, wherein a plurality of waveguide structures 20 are arranged on the substrate 10 at intervals, each waveguide structure 20 comprises a connecting waveguide 21 and spot size converters 22 arranged at two ends of the connecting waveguide 21, the spot size converter 22 at one end of the connecting waveguide 21 is used for realizing mode matching with an optical fiber, and the spot size converter 22 at the other end of the connecting waveguide 21 is used for realizing mode matching with a photonic chip.

The embodiment of the utility model provides an interposer chip sets up a plurality of waveguide structures through the interval on the base plate, and every waveguide structure all includes a connection waveguide and two spot size converters, and this interposer chip can realize the effective coupling of optic fibre and photon chip when realizing the effect to optic fibre and photon chip coupling, and the end face coupling loss can be less than 1 dB.

As another embodiment of the present invention, there is provided a coupling assembly of an optical fiber and a photonic chip, wherein as shown in fig. 3 and 4, the coupling assembly includes: the optical fiber array 2, the photonic chip 3 and the interposer chip 1 are described in the foregoing, and the optical fiber array 2 and the photonic chip 3 are connected through the interposer chip 1.

The embodiment of the utility model provides an optic fibre and photonic chip's coupling subassembly through adopting the interpolator chip before, can realize optic fibre and photonic chip's effective coupling, and the end face coupling loss can be less than 1 dB.

In particular, the fiber array 2 includes a plurality of optical fibers 4, each optical fiber 4 connecting one waveguide structure in the interposer chip 1.

Preferably, the photonic chip 3 comprises a silicon photonic chip.

Specifically, the interposer chip structure design shown in fig. 1 is schematic. The spot size converter on one side is used for realizing mode matching of the waveguide inside the interposer and the optical fiber, and the spot size converter on the other side is used for realizing mode matching of the waveguide inside the interposer and the input/output waveguide of the photonic chip, so that the coupling efficiency between the optical fiber and the integrated photonic chip can be maximized. The interposer chip can also integrate multiple waveguides with the matching fiber array, and fig. 2 is a layout diagram of the interposer chip composed of multiple waveguides. As shown in fig. 3, the integrated module can be provided as a complete product to a photonics chip vendor. Fig. 4 shows that the interposer module can be conveniently integrated with a silicon optical chip.

Therefore, the utility model provides a coupling assembly of optic fibre and photon chip provides new method for optic fibre and photon chip's effective coupling, and the end face coupling loss can be less than 1 dB. In addition, the effective coupling of the optical fiber and the photonic chip realized by the interposer chip has larger working bandwidth. Additionally, the utility model discloses still simplify the assembly process of optic fibre and photon chip, only need passive alignment alright accomplish the equipment.

It is to be understood that the above embodiments are merely exemplary embodiments that have been employed to illustrate the principles of the present invention, and that the present invention is not limited thereto. It will be apparent to those skilled in the art that various modifications and improvements can be made without departing from the spirit and substance of the invention, and these modifications and improvements are also considered to be within the scope of the invention.

Claims

1. An interposer chip structure, comprising: the optical fiber module comprises a substrate, wherein a plurality of waveguide structures are arranged on the substrate at intervals, each waveguide structure comprises a connecting waveguide and spot size converters arranged at two ends of the connecting waveguide, the spot size converter at one end of the connecting waveguide is used for realizing mode matching with an optical fiber, and the spot size converter at the other end of the connecting waveguide is used for realizing mode matching with a photonic chip.

2. An optical fiber and photonic chip coupling assembly, comprising: an optical fiber array, a photonic chip, and the interposer chip of claim 1, the optical fiber array and the photonic chip connected by the interposer chip.

3. The fiber-photonic chip coupling assembly of claim 2, wherein said fiber array comprises a plurality of optical fibers, each fiber connecting one waveguide structure in said interposer chip.

4. The fiber-photonic chip coupling assembly of claim 2, wherein said photonic chip comprises a silicon photonic chip.