CN212230395U - Silicon chip defect detection device - Google Patents

Silicon chip defect detection device Download PDF

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Publication number
CN212230395U
CN212230395U CN202021086555.XU CN202021086555U CN212230395U CN 212230395 U CN212230395 U CN 212230395U CN 202021086555 U CN202021086555 U CN 202021086555U CN 212230395 U CN212230395 U CN 212230395U
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CN
China
Prior art keywords
shell
fixed mounting
belt
detection device
servo motor
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Expired - Fee Related
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CN202021086555.XU
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Chinese (zh)
Inventor
江水德
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Quzhou Sansheng Electronics Co ltd
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Quzhou Sansheng Electronics Co ltd
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Priority to CN202021086555.XU priority Critical patent/CN212230395U/en
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Publication of CN212230395U publication Critical patent/CN212230395U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Abstract

The utility model relates to a silicon chip detects technical field, and discloses a detection device of silicon chip defect, which comprises an outer shell, the inside fixed mounting of shell has servo motor, servo motor's output shaft fixed mounting has the driving roller, the inside movable mounting of shell has the center deflector roll that is located the driving roller top, the equal fixed mounting in both sides has the fixed plate that quantity is two about the shell, the inside and the left side of shell are two equal movable mounting has the left first guide pulley that is located servo motor between the fixed plate, the inside and the right side of shell are two equal movable mounting has the second guide pulley that is located the servo motor right side between the fixed plate, first guide pulley, center deflector roll and driving roller are connected through first belt drive, second guide pulley, center deflector roll and driving roller are connected through second belt drive. This detection device of silicon chip defect can carry out the inspection of full aspect to the silicon chip, and the inspection effect is better, and more convenient to use person uses.

Description

Silicon chip defect detection device
Technical Field
The utility model relates to a silicon chip detects technical field, specifically is a detection device of silicon chip defect.
Background
The silicon chip is an important material for manufacturing an integrated circuit, various semiconductor devices can be manufactured by means of photoetching, ion implantation and the like on the silicon chip, the chip manufactured by the silicon chip has remarkable computing capability, the development of the semiconductor is continuously promoted by the development of scientific technology, and the development of automation, computers and the like can reduce the manufacturing cost of the high-technology product of the silicon chip to a very low degree, so that the silicon chip is widely applied to aerospace, industry, agriculture and national defense, but the silicon chip needs certain precision when in use, if the silicon chip has defects, the use effect of the silicon chip can be influenced, and a detection device is required to detect the silicon chip before the silicon chip is used.
When the existing detection device is used, conveying is generally adopted, but a part of silicon wafers can be shielded in the conveying process of the conveying belt, so that the silicon wafers cannot be completely detected, and certain errors exist, and therefore the silicon wafer defect detection device is provided.
SUMMERY OF THE UTILITY MODEL
Technical problem to be solved
The utility model provides a not enough to prior art, the utility model provides a detection device of silicon chip defect possesses advantages such as detection effect is good, has solved current detection device and when using, generally adopts the conveyer belt conveying, but has partial silicon piece can be sheltered from at the in-process of conveyer belt conveying to can not detect completely, have the problem of certain error.
(II) technical scheme
For realizing the above-mentioned purpose that detection effect is good, the utility model provides a following technical scheme: a detection device for silicon wafer defects comprises an outer shell, wherein a servo motor is fixedly arranged inside the outer shell, a transmission roller is fixedly arranged on an output shaft of the servo motor, a central guide roller positioned above the transmission roller is movably arranged inside the outer shell, two fixing plates with two numbers are fixedly arranged on the left side and the right side of the outer shell, a first guide wheel positioned on the left side of the servo motor is movably arranged between the two fixing plates on the inner side and the left side of the outer shell, a second guide wheel positioned on the right side of the servo motor is movably arranged between the two fixing plates on the inner side and the right side of the outer shell, the first guide wheel, the central guide roller and the transmission roller are connected through first belt transmission, the second guide wheel, the central guide roller and the transmission roller are connected through second belt transmission, four detection seats are fixedly arranged inside the outer shell, and detection heads are fixedly arranged on one sides of the detection seats close to a first belt and a second, detect one side fixed mounting that the seat kept away from detecting the head and have the dead lever, the inside fixed mounting of shell has the fixing base, the equal fixed mounting in bottom of fixing base and the top of shell has step motor, step motor's output shaft fixed mounting has the threaded rod that extends to the dead lever inside, the top fixed mounting of shell inner wall has the camera.
Preferably, the bottom fixed mounting of shell has the pad foot, and the quantity of pad foot is four, four pad foot evenly distributed is in the bottom four corners of shell.
Preferably, the number of the first belts and the second belts is two, and the two second belts are located between the two first belts.
Preferably, the thickness of the second belt is half of the thickness of the first belt, and the backing plates respectively positioned at the bottoms of the first belt and the second belt are fixedly installed in the shell.
Preferably, the front side and the rear side of the detection seat are fixedly provided with sliding blocks, the shell is internally provided with a sliding groove matched with the sliding blocks, and the sliding blocks extend to the inside of the sliding groove.
Preferably, the fixing rod is internally provided with a threaded hole, and the threaded hole is matched with the threaded rod.
(III) advantageous effects
Compared with the prior art, the utility model provides a detection device of silicon chip defect possesses following beneficial effect:
this detection device of silicon chip defect, can drive the driving roller through starting servo motor and rotate, thereby can drive first belt and second belt and rotate simultaneously, the silicon chip that will detect is placed in the top of two first belts, then can convey to the inside of shell by first belt, then adopt through current mode and detect the head and can detect, the silicon chip can convey the top to the second belt through first belt, finally be walked by the conveying of second belt, because first belt and second belt are located different front and back positions, thereby wear the in-process of conveying and not shelter from same part, thereby can carry out the inspection of full aspect to the silicon chip, the inspection effect is better, more convenient to use person uses.
Drawings
FIG. 1 is a schematic structural view of the present invention;
fig. 2 is an enlarged schematic view of the structure at a position a of the present invention.
In the figure: the device comprises a shell 1, a servo motor 2, a driving roller 3, a central guide roller 4, a fixing plate 5, a first guide wheel 6, a second guide wheel 7, a first belt 8, a second belt 9, a detection seat 10, a detection head 11, a fixing rod 12, a fixing seat 13, a stepping motor 14, a threaded rod 15 and a camera 16.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-2, a silicon wafer defect detecting device comprises a housing 1, four pads are fixedly mounted at the bottom of the housing 1, the four pads are uniformly distributed at four corners of the bottom of the housing 1, a servo motor 2 is fixedly mounted in the housing 1, the type of the servo motor 2 can be ACSM130, a driving roller 3 is fixedly mounted on an output shaft of the servo motor 2, a central guide roller 4 positioned above the driving roller 3 is movably mounted in the housing 1, two fixing plates 5 are fixedly mounted on the left and right sides of the housing 1, a first guide wheel 6 positioned on the left side of the servo motor 2 is movably mounted between the two fixing plates 5 on the inner and left sides of the housing 1, a second guide wheel 7 positioned on the right side of the servo motor 2 is movably mounted between the two fixing plates 5 on the inner and right sides of the housing 1, the first guide wheel 6, the central guide roller 4 and the driving roller 3 are in transmission connection through a first belt 8, the second guide wheel 7, the central guide roller 4 and the driving roller 3 are in transmission connection through a second belt 9, the number of the first belts 8 and the second belts 9 is two, the two second belts 9 are positioned between the two first belts 8, the thickness of the second belts 9 is half of that of the first belts 8, backing plates respectively positioned at the bottoms of the first belts 8 and the second belts 9 are fixedly installed inside the shell 1, four detection seats 10 are fixedly installed inside the shell 1, sliding blocks are fixedly installed on the front side and the rear side of each detection seat 10, sliding grooves matched with the sliding blocks are formed inside the shell 1, the sliding blocks extend into the sliding grooves, detection heads 11 are fixedly installed on one sides, close to the first belts 8 and the second belts 9, of the detection seats 10 respectively, a fixing rod 12 is fixedly installed on one side, far away from the detection heads 11, and a fixing seat 13 is fixedly installed inside the shell 1, the bottom of the fixed seat 13 and the top of the shell 1 are both fixedly provided with a stepping motor 14, the model of the stepping motor 14 can be 130BYG350D, the output shaft of the stepping motor 14 is fixedly provided with a threaded rod 15 extending to the inside of the fixed rod 12, the inside of the fixed rod 12 is provided with a threaded hole, the threaded hole is matched with the threaded rod 15, the top of the inner wall of the shell 1 is fixedly provided with a camera 16, the silicon wafer defect detection device can drive the transmission roller 3 to rotate by starting the servo motor 2, so as to drive the first belt 8 and the second belt 9 to rotate simultaneously, a silicon wafer to be detected is placed on the top of the two first belts 8, then the silicon wafer can be transmitted to the inside of the shell 1 by the first belts 8, then the detection can be carried out by adopting the detection head 11 in the existing mode, the silicon wafer can be transmitted to the top of the second belt 9 by the first belts 8 and finally transmitted, because first belt 8 and second belt 9 are located different front and back positions to wear the in-process of conveying and not sheltering from same part, thereby can carry out the inspection of full aspect to the silicon chip, inspection effect is better, more convenient to use person uses.
In conclusion, the silicon wafer defect detection device can drive the transmission roller 3 to rotate by starting the servo motor 2, so as to drive the first belt 8 and the second belt 9 to rotate simultaneously, a silicon wafer to be detected is placed on the tops of the two first belts 8, then the silicon wafer can be transmitted to the inside of the shell 1 by the first belts 8, then the silicon wafer can be detected by adopting the detection head 11 in the existing mode, the silicon wafer can be transmitted to the top of the second belt 9 through the first belts 8 and finally transmitted away by the second belts 9, because the first belts 8 and the second belts 9 are positioned at different front and back positions, the same part is not shielded in the transmission process, the silicon wafer can be detected in all aspects, the detection effect is better, the silicon wafer defect detection device is more convenient for a user to use, the problem that the existing detection device generally adopts the transmission belt to transmit when in use, but part of the silicon wafer can be shielded in the transmission process of the transmission belt, therefore, the detection is not complete, and a certain error exists.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims (6)

1. A silicon chip defect detection device comprises a shell (1), and is characterized in that: the inside fixed mounting of shell (1) has servo motor (2), the output shaft fixed mounting of servo motor (2) has driving roller (3), the inside movable mounting of shell (1) has central deflector roll (4) that are located driving roller (3) top, the equal fixed mounting in both sides of shell (1) has fixed plate (5) that quantity is two, the inside and the left side of shell (1) are two equal movable mounting has first guide pulley (6) that are located servo motor (2) left between fixed plate (5), the inside and the right side of shell (1) are two equal movable mounting has second guide pulley (7) that are located servo motor (2) right side between fixed plate (5), first guide pulley (6), central deflector roll (4) and driving roller (3) are connected through first belt (8) transmission, second guide pulley (7), Center deflector roll (4) and driving roller (3) are connected through second belt (9) transmission, the inside fixed mounting of shell (1) has quantity to be four detection seat (10), the equal fixed mounting in one side that detection seat (10) are close to first belt (8) and second belt (9) respectively has detection head (11), one side fixed mounting who keeps away from detection head (11) is detected seat (10) has dead lever (12), the inside fixed mounting of shell (1) has fixing base (13), the equal fixed mounting in top of the bottom of fixing base (13) and shell (1) has step motor (14), the output shaft fixed mounting of step motor (14) has threaded rod (15) that extends to dead lever (12) inside, the top fixed mounting of shell (1) inner wall has camera (16).
2. The silicon wafer defect detection device according to claim 1, wherein: the bottom fixed mounting of shell (1) has the pad foot, and the quantity of pad foot is four, four pad foot evenly distributed in the bottom four corners of shell (1).
3. The silicon wafer defect detection device according to claim 1, wherein: the number of the first belts (8) and the second belts (9) is two, and the second belts (9) are located between the two first belts (8).
4. The silicon wafer defect detection device according to claim 1, wherein: the thickness of second belt (9) is half of first belt (8) thickness, and the inside fixed mounting of shell (1) has the backing plate that is located first belt (8) and second belt (9) bottom respectively.
5. The silicon wafer defect detection device according to claim 1, wherein: the front side and the rear side of the detection seat (10) are fixedly provided with sliding blocks, sliding grooves matched with the sliding blocks are formed in the shell (1), and the sliding blocks extend to the inside of the sliding grooves.
6. The silicon wafer defect detection device according to claim 1, wherein: the inside of the fixed rod (12) is provided with a threaded hole, and the threaded hole is matched with the threaded rod (15).
CN202021086555.XU 2020-06-13 2020-06-13 Silicon chip defect detection device Expired - Fee Related CN212230395U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202021086555.XU CN212230395U (en) 2020-06-13 2020-06-13 Silicon chip defect detection device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202021086555.XU CN212230395U (en) 2020-06-13 2020-06-13 Silicon chip defect detection device

Publications (1)

Publication Number Publication Date
CN212230395U true CN212230395U (en) 2020-12-25

Family

ID=73931638

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202021086555.XU Expired - Fee Related CN212230395U (en) 2020-06-13 2020-06-13 Silicon chip defect detection device

Country Status (1)

Country Link
CN (1) CN212230395U (en)

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CF01 Termination of patent right due to non-payment of annual fee
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Granted publication date: 20201225

Termination date: 20210613