CN212218686U - Board is torn open and divides board device to multilayer high frequency printed circuit board of 5G antenna - Google Patents
Board is torn open and divides board device to multilayer high frequency printed circuit board of 5G antenna Download PDFInfo
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- CN212218686U CN212218686U CN202020811998.4U CN202020811998U CN212218686U CN 212218686 U CN212218686 U CN 212218686U CN 202020811998 U CN202020811998 U CN 202020811998U CN 212218686 U CN212218686 U CN 212218686U
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Abstract
The utility model discloses a 5G antenna multilayer high-frequency printed circuit board disassembling and separating device, which comprises a positioning and pressing mechanism, a rolling shear mechanism and a rail cutting mechanism; the positioning and pressing mechanism is used for pressing and positioning the circuit board substrate and conveying the circuit board substrate to a position needing to be cut; the rolling and shearing mechanism is used for cutting the circuit board substrate conveyed by the positioning and pressing mechanism in the X direction and cutting the rail in the Y direction, the positioning and pressing mechanism conveys the circuit board substrate to the rolling and shearing mechanism and the rolling and cutting mechanism, and the rolling and shearing mechanism and the rolling and cutting mechanism are fused and assembled, so that the X/Y two-direction cutting process is realized, the equipment investment and the occupation of the machine space are greatly saved, the same machine is used for bidirectional cutting, the machine does not need to be replaced midway, the operation time is saved, and the production efficiency is improved.
Description
Technical Field
The utility model relates to a circuit board production technical field specifically is a 5G antenna multilayer high frequency printed circuit board tears board open and divides board device.
Background
The circuit board is a provider of electrical connection of electronic components, and the circuit board has the main advantages of greatly reducing errors of wiring and assembly, and improving the automation level and the production labor rate. The production of the circuit board needs to be sequentially processed by the procedures of drilling, electroplating, cleaning and green paint brushing to obtain a finished circuit board. The material used for producing the circuit board is the base plate, before producing the circuit board, need cut into the size of certain specification with rectangular shape base plate, then can carry out processes such as drilling, electroplating, current cut, the board separating mechanism can only do the cutting of unilateral to the circuit board base plate, can't realize the simultaneous cutting of bi-directional, and equipment input is many, and cutting efficiency is low, leads to the machine occupation space big, and production efficiency is low on the contrary.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to solve one of the technical problem that exists among the prior art at least, provide a 5G antenna multilayer high frequency printed circuit board that has saved equipment input and machine space and has taken up tears board and branch board device open.
In order to achieve the above purpose, the utility model provides a technical scheme is:
a board detaching and dividing device for a multilayer high-frequency printed circuit board of a 5G antenna comprises a positioning pressing mechanism, a rolling shear mechanism and a rail cutting mechanism;
the positioning and pressing mechanism is used for pressing and positioning the circuit board substrate and conveying the circuit board substrate to a position needing to be cut;
the rolling shear mechanism is used for cutting the circuit board substrate conveyed by the positioning pressing mechanism in the X direction;
and the rail cutting mechanism is used for cutting the circuit board substrate conveyed by the positioning pressing mechanism in the Y direction.
Preferably, the device also comprises a metal sensor, the metal sensor is respectively connected with the positioning pressing mechanism, the rolling shearing mechanism and the rail cutting mechanism, and the metal sensor is used for determining the position of the circuit board substrate on the positioning pressing mechanism, drawing the cutting size and respectively transmitting commands to the positioning pressing mechanism, the rolling shearing mechanism and the rail cutting mechanism.
Preferably, the rolling shear mechanism comprises a rolling shear disc for cutting the circuit board substrate in the X direction, and a first driving device for driving the rolling shear disc to move.
Preferably, the rail cutting mechanism comprises an upper rolling cutter for cutting the circuit board substrate in the Y direction, and a second driving device for driving the upper rolling cutter to move
The utility model has the advantages that: the utility model discloses in, location pressing mechanism carries circuit board base plate to rolling shear mechanism and rolling mechanism cut, and rolling shear mechanism and rolling mechanism fuse the equipment, have realized the process of cutting of X/Y both directions, very big saving equipment input and machine space occupy, same machine two-way cuts, need not change the machine midway, saved operating time, improvement production efficiency.
Drawings
The present invention will be described in further detail with reference to the accompanying drawings and specific embodiments.
Fig. 1 is an overall schematic diagram of the preferred embodiment of the present invention.
Description of reference numerals:
the device comprises a positioning pressing mechanism 1, a rolling shearing mechanism 2, a rolling shearing circular sheet 21, a first driving device 22, a rail cutting mechanism 3, an upper rolling cutter 31 and a second driving device 32.
Detailed Description
This section will describe in detail the embodiments of the present invention, preferred embodiments of the present invention are shown in the attached drawings, which are used to supplement the description of the text part of the specification with figures, so that one can intuitively and vividly understand each technical feature and the whole technical solution of the present invention, but they cannot be understood as the limitation of the protection scope of the present invention.
In the description of the present invention, it should be understood that the orientation or positional relationship indicated with respect to the orientation description, such as up, down, front, rear, left, right, etc., is based on the orientation or positional relationship shown in the drawings, and is only for convenience of description and simplification of description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention.
In the description of the present invention, a plurality of means are one or more, a plurality of means are two or more, and the terms greater than, less than, exceeding, etc. are understood as not including the number, and the terms greater than, less than, within, etc. are understood as including the number. If the first and second are described for the purpose of distinguishing technical features, they are not to be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated or implicitly indicating the precedence of the technical features indicated.
In the description of the present invention, unless there is an explicit limitation, the words such as setting, installation, connection, etc. should be understood in a broad sense, and those skilled in the art can reasonably determine the specific meanings of the above words in combination with the specific contents of the technical solution.
Referring to fig. 1, in a preferred embodiment of the present invention, a board detaching and dividing device for a 5G antenna multilayer high-frequency printed circuit board includes a positioning and pressing mechanism 1, a rolling shear mechanism 2 and a rail cutting mechanism 3;
the positioning and pressing mechanism 1 is used for pressing and positioning the circuit board substrate and conveying the circuit board substrate to a position needing to be cut;
the rolling shear mechanism 2 is used for cutting the circuit board substrate conveyed by the positioning pressing mechanism 1 in the X direction;
the rail cutting mechanism 3 is used for cutting the circuit board substrate conveyed by the positioning pressing mechanism 1 in the Y direction, the positioning pressing mechanism 1 conveys the circuit board substrate to the rolling shearing mechanism 2 and the rolling cutting mechanism for cutting, and the rolling shearing mechanism 2 and the rolling cutting mechanism are fused and assembled, so that the X/Y bidirectional cutting process is realized, the equipment investment and the occupation of machine space are greatly saved, the same machine is used for bidirectional cutting, the machine does not need to be replaced midway, the operation time is saved, the production efficiency is improved, wherein the positioning pressing mechanism 1 can be matched with a conveyor belt, a roller and the like for conveying, but is not limited to the conveying mode, technicians in the field can flexibly select the conveying mode according to the needs, and detailed description is not made additionally.
As a preferred embodiment of the present invention, it may also have the following additional technical features:
in the embodiment, the device also comprises a metal sensor which is respectively connected with the positioning pressing mechanism 1, the rolling shearing mechanism 2 and the rail cutting mechanism 3 and is used for determining the position of the circuit board substrate on the positioning pressing mechanism 1, drawing the cutting size and respectively transmitting commands to the positioning pressing mechanism 1, the rolling shearing mechanism 2 and the rail cutting mechanism 3, the cutting of the circuit board substrate has high requirements in the manufacturing process of the circuit board, the existing circuit board substrate cutting and separating devices have great defects in the processing of the substrate, particularly, the size error often exists when the circuit board substrate is cut, the cut circuit board substrate does not conform to the specification and causes material waste, the metal sensor senses the metal material through analog voltage and draws the sensed data, the position of the rolling shearing mechanism 2 and the distance to the rail cutting mechanism 3 are calculated through a program after the size range is drawn, and finally, carrying out corresponding conveying according to the drawn data, so that the cutting is more accurate, the phenomenon that the cutting is not in line with the specification is reduced, and the waste of the substrate is reduced.
In this embodiment, the rolling shear mechanism 2 includes a rolling shear disk 21 for cutting the circuit board substrate in the X direction, and a first driving device 22 for driving the rolling shear disk 21 to move, wherein the first driving device 22 is preferably a servo motor, the precision is more accurate, but not limited to this, and preferably, the rolling shear disk 21 is provided with a plurality of groups, and the cutting efficiency is higher, and in practical application, wherein, the rolling shear disk 21 is preferably formed by combining an upper disk and a lower disk, and the material conveyed by the positioning and pressing mechanism 1 is extruded and cut, and the cutting is more stable, and burrs are not easily generated, but not limited to this, and those skilled in the art can flexibly select the cutting device as required, and no detailed description is made herein.
In this embodiment, the rail cutting mechanism 3 includes an upper rolling cutter for Y-cutting the circuit board substrate, and a second driving device 32 for driving the upper rolling cutter to move, wherein the second driving device 32 is preferably in a motor transmission manner, and is more stable and has less vibration, but is not limited thereto, and those skilled in the art can flexibly select the upper rolling cutter as required, and detailed descriptions thereof are omitted.
The above additional technical features can be freely combined and used in superposition by those skilled in the art without conflict.
The above is only the preferred embodiment of the present invention, as long as the technical solution of the purpose of the present invention is realized by the substantially same means, all belong to the protection scope of the present invention.
Claims (4)
1. The utility model provides a 5G antenna multilayer high frequency printed circuit board tears board and divides board device which characterized in that: comprises a positioning pressing mechanism, a rolling shear mechanism and a rail cutting mechanism;
the positioning and pressing mechanism is used for pressing and positioning the circuit board substrate and conveying the circuit board substrate to a position needing to be cut;
the rolling shear mechanism is used for cutting the circuit board substrate conveyed by the positioning pressing mechanism in the X direction;
and the rail cutting mechanism is used for cutting the circuit board substrate conveyed by the positioning pressing mechanism in the Y direction.
2. The board disassembling and separating device for the multilayer high-frequency printed circuit board of the 5G antenna according to claim 1, wherein: the metal perceptron is used for determining the position of a circuit board substrate on the positioning pressing mechanism, drawing the cutting size and respectively conveying commands to the positioning pressing mechanism, the rolling shearing mechanism and the rail cutting mechanism.
3. The board disassembling and separating device for the multilayer high-frequency printed circuit board of the 5G antenna according to claim 1, wherein: the rolling shearing mechanism comprises a rolling shearing circular sheet for cutting the circuit board substrate in the X direction and a first driving device for driving the rolling shearing circular sheet to move.
4. The board disassembling and separating device for the multilayer high-frequency printed circuit board of the 5G antenna according to claim 1, wherein: the rail cutting mechanism comprises an upper rolling cutter used for cutting the circuit board substrate in the Y direction and a second driving device used for driving the upper rolling cutter to move.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020811998.4U CN212218686U (en) | 2020-05-15 | 2020-05-15 | Board is torn open and divides board device to multilayer high frequency printed circuit board of 5G antenna |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020811998.4U CN212218686U (en) | 2020-05-15 | 2020-05-15 | Board is torn open and divides board device to multilayer high frequency printed circuit board of 5G antenna |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212218686U true CN212218686U (en) | 2020-12-25 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020811998.4U Active CN212218686U (en) | 2020-05-15 | 2020-05-15 | Board is torn open and divides board device to multilayer high frequency printed circuit board of 5G antenna |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212218686U (en) |
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2020
- 2020-05-15 CN CN202020811998.4U patent/CN212218686U/en active Active
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