CN207954103U - A kind of circuit board mold - Google Patents

Abstract

The utility model discloses a circuit board mould, comprising: an upper mold and a lower mold, the lower mold is fixed with a guide shaft, one end of the guide shaft passes through the upper mold and the upper mold slides relative to the guide shaft under the action of external force, the guide shaft There is a spring on the top, and the spring is arranged between the upper mold and the lower mold. The upper mold is equipped with multiple first cutters, and an upper groove is formed between every two first cutters. The lower mold is equipped with multiple second cutters. The cutting knife is provided with a lower groove between every two second cutting knives, the upper groove is engaged with the second cutting knife, the lower groove is engaged with the first cutting knife, the first cutting knife and the second cutting knife are staggered and correspond to each other , a groove is arranged on the lower groove, and the width of the groove is smaller than the width of the lower groove. The circuit board mold according to the embodiment of the utility model has a simple structure, can process a plurality of circuit boards at the same time, has high processing precision, high yield rate, and improves production efficiency.

Description

A circuit board mold

technical field

The utility model relates to the technical field of circuit board manufacturing molds, in particular to a circuit board mold.

Background technique

The circuit board industry usually uses molds to divide circuit boards, which is inefficient and has a high defect rate. In the existing circuit board molds, due to structural reasons, molds with more than two knife edges are usually easily deformed, and the positioning is not accurate, resulting in low circuit board processing efficiency, high defective rate, and frequent mold repairs, wasting time and cost. higher. Therefore, it is urgent to solve such problems.

Utility model content

The purpose of the utility model is to overcome the defects of the prior art and provide a circuit board mold.

In order to achieve the above object, the utility model proposes the following technical proposal: a circuit board mold, comprising: comprising an upper mold and a lower mold, the lower mold is fixedly provided with a guide shaft, and one end of the guide shaft passes through the upper mold and the upper die slides relative to the guide shaft under the action of external force, the guide shaft is provided with a spring, the spring is arranged between the upper die and the lower die, and the upper die is installed with multiple A first cutter, an upper groove is formed between each two first cutters, a plurality of second cutters are installed on the lower mold, and a lower groove is formed between each two second cutters. groove, the upper groove is engaged with the second cutter, the lower groove is engaged with the first cutter, the first cutter and the second cutter are staggered and correspond to each other, the A groove is arranged on the lower groove, and the width of the groove is smaller than that of the lower groove.

Preferably, the first cutter is longitudinally arranged on the upper die, and the second cutter is longitudinally arranged on the lower die.

Preferably, there are four guide shafts, and the four guide shafts are respectively arranged at four corners of the upper die and the lower die.

Preferably, the groove is arranged longitudinally at the bottom of the lower groove.

Preferably, the first cutter is integrally formed with the upper mold, and the second cutter is integrally formed with the lower mold.

Preferably, both the first cutter and the second cutter are metal cutters or ceramic cutters.

The beneficial effects of the utility model are: the structure is simple, a plurality of circuit boards can be processed at the same time, the processing precision is high, the rate of good products is high, and the production efficiency is improved.

Description of drawings

Fig. 1 is a structural schematic diagram of a circuit board mold of the present invention.

Reference signs: 1, upper die, 2, lower die, 3, guide shaft, 4, first cutter, 41, upper groove, 5, second cutter, 51, lower groove, 52, groove, 6. Spring.

Detailed ways

The technical solution of the embodiment of the utility model will be clearly and completely described below in conjunction with the accompanying drawings of the utility model.

As shown in FIG. 1 , a circuit board mold disclosed by the utility model includes an upper mold 1 and a lower mold 2 .

Specifically, the circuit board mold includes an upper mold 1 and a lower mold 2, the lower mold 2 is fixed with a guide shaft 3, one end of the guide shaft 3 passes through the upper mold 1 and the upper mold 1 slides relative to the guide shaft 3 under the action of an external force , the guide shaft 3 is provided with a spring 6, the spring 6 is arranged between the upper mold 1 and the lower mold 2, the upper mold 1 is equipped with a plurality of first cutters 4, and an upper mold is formed between every two first cutters 4. Groove 41, the lower die 2 is equipped with a plurality of second cutters 5, between every two second cutters 5 is provided with a lower groove 51, the upper groove 41 is engaged with the second cutter 5, and the lower groove 51 Engaging with the first cutter 4 , the first cutter 4 and the second cutter 5 are staggered to correspond to each other, and a groove 52 is provided on the lower groove 51 , and the width of the groove 52 is smaller than that of the lower groove 51 .

That is to say, the upper mold 1 and the lower mold 2 are connected through the guide shaft 3, one end of the guide shaft 3 is fixed on the lower mold 2, and the other end is slidingly connected with the upper mold 1, the guide shaft 3 is provided with a spring 6, and the spring 6 is arranged on the upper mold. Between the mold 1 and the lower mold 2, when the upper mold 1 is pressed down, the spring 6 is compressed, and the upper mold 1 is in contact with the lower mold 2. When the upper die 1 is released, the upper die 1 automatically returns under the action of the spring 6, and due to the action of the guide shaft 3, the alignment between the upper die 1 and the lower die 2 is accurate, and no deviation will occur.

As shown in Figure 1, the upper mold 1 is provided with a plurality of first cutters 4, an upper groove 41 is formed between the first cutters 4, and the lower mold 2 is provided with a plurality of second cutters 5, the second A lower groove 51 is formed between the cutters 5, and the first cutter 4 and the second cutter 5 are misplaced, that is to say, when the upper mold 1 and the lower mold 2 are closed, the first cutter 4 and the lower groove The groove 51 is engaged, and the second cutter 5 is engaged with the upper recess. A circuit board with multiple circuits can be produced through the first cutter 4 and the second cutter 5, and the structure is simple and easy to control.

Further, a groove 52 is provided at the bottom of the lower groove 51 , and the groove 52 is longitudinally arranged at the bottom of the lower groove 51 , and debris generated during cutting is collected through the groove 52 .

According to a preferred embodiment of the present utility model, the first cutter 4 is longitudinally arranged on the upper die 1 , and the second cutter 5 is longitudinally arranged on the lower die 2 to increase the length of the circuit board cutting groove.

Preferably, there are four guide shafts 3, and the four guide shafts 3 are respectively arranged at the four corners of the upper mold 1 and the lower mold 2. By setting the guide shafts 3 at the four corners of the upper die 1 and the lower die 2, the upper die 1 and the lower die 2 can be positioned more accurately, and the cutting accuracy can be improved.

According to an embodiment of the present utility model, the first cutter 4 is integrally formed with the upper mold 1, the second cutter 5 is integrally formed with the lower mold 2, and both the first cutter 4 and the second cutter 5 are metal cutters or Ceramic cutter.

The circuit board mold according to the embodiment of the utility model has a simple structure, can process a plurality of circuit boards at the same time, has high processing precision, high yield rate, and improves production efficiency.

The technical content and technical features of the utility model have been disclosed above, but those skilled in the art may still make various replacements and modifications based on the teaching and disclosure of the utility model without departing from the spirit of the utility model. Therefore, the protection of the utility model The scope should not be limited to the content disclosed in the embodiment, but should include various replacements and modifications that do not depart from the utility model, and are covered by the claims of this patent application.

Claims (6)

1. a kind of circuit board mold, which is characterized in that including：Upper die and lower die are fixed with guiding axis in the lower die, described One end of guiding axis passes through the upper mold and the relatively described guiding axis of the upper mold slides under external force, on the guiding axis Equipped with spring, the spring is arranged between the upper mold and the lower die, and the upper mold is equipped with a plurality of first cutter, described Upper groove is formed between the first cutter of each two, the lower die is equipped with a plurality of second cutter, the second cutter of each two Between be equipped with lower groove, the upper groove engages with second cutter, and the lower groove is engaged with first cutter, described First cutter and second cutter mutually stagger correspondence, and the lower groove is equipped with groove, and the width of the groove is less than institute State the width of lower groove.

2. circuit board mold according to claim 1, which is characterized in that first cutter is disposed longitudinally on the upper mold On, second cutter is disposed longitudinally in the lower die.

3. circuit board mold according to claim 1, which is characterized in that the guiding axis is four, four guiding Axis is separately positioned on the quadrangle of the upper mold and the lower die.

4. circuit board mold according to claim 1, which is characterized in that the bottom of the longitudinally disposed lower groove of groove Portion.

5. circuit board mold according to claim 1, which is characterized in that first cutter and the upper mold one at Type, second cutter are integrally formed with the lower die.

6. circuit board mold according to claim 1, which is characterized in that first cutter and second cutter are Metal cutter or ceramic cutter.