CN112936439A - Mold for manufacturing circuit board with comb-shaped structure and manufacturing method - Google Patents
Mold for manufacturing circuit board with comb-shaped structure and manufacturing method Download PDFInfo
- Publication number
- CN112936439A CN112936439A CN201911333666.8A CN201911333666A CN112936439A CN 112936439 A CN112936439 A CN 112936439A CN 201911333666 A CN201911333666 A CN 201911333666A CN 112936439 A CN112936439 A CN 112936439A
- Authority
- CN
- China
- Prior art keywords
- die
- comb
- circuit board
- knife
- shaped structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 28
- 238000010008 shearing Methods 0.000 claims abstract description 7
- 238000004080 punching Methods 0.000 claims description 22
- 239000002699 waste material Substances 0.000 claims description 8
- 239000003292 glue Substances 0.000 claims description 7
- 239000000463 material Substances 0.000 claims description 6
- 238000000034 method Methods 0.000 claims description 6
- 230000002093 peripheral effect Effects 0.000 claims description 2
- 239000000853 adhesive Substances 0.000 claims 1
- 230000001070 adhesive effect Effects 0.000 claims 1
- 238000005520 cutting process Methods 0.000 abstract description 29
- 238000003801 milling Methods 0.000 description 4
- 229910000831 Steel Inorganic materials 0.000 description 3
- 239000010959 steel Substances 0.000 description 3
- 230000007547 defect Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 238000003698 laser cutting Methods 0.000 description 1
- 150000003071 polychlorinated biphenyls Chemical class 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
- B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
- B26F1/38—Cutting-out; Stamping-out
- B26F1/44—Cutters therefor; Dies therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
- B23P15/00—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass
- B23P15/24—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass dies
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
- B26D7/18—Means for removing cut-out material or waste
- B26D7/1818—Means for removing cut-out material or waste by pushing out
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
- B26F2210/00—Perforating, punching, cutting-out, stamping-out, severing by means other than cutting of specific products
- B26F2210/08—Perforating, punching, cutting-out, stamping-out, severing by means other than cutting of specific products of ceramic green sheets, printed circuit boards and the like
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Forests & Forestry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
Abstract
The invention relates to a die for manufacturing a circuit board with a comb-shaped structure and a manufacturing method thereof, in particular to a die for manufacturing the circuit board with the comb-shaped structure, which is characterized in that the die for manufacturing the circuit board is designed into an upper die and a lower die, the die-cutting knives of the dies of the upper die and the lower die are all of the comb-shaped structure which are connected into a whole, the edge of the comb-shaped die-cutting knife of the upper die is a continuous curved knife edge which is connected into a line, the edge of the comb-shaped die-cutting knife of the lower die is also a continuous curved knife edge which is connected into a line, the upper knife and the lower knife are in staggered alignment, so that the knife edges of the upper knife and the lower knife form a 'scissors' type shearing relation, and the circuit board is.
Description
Technical Field
The invention relates to the field of circuit boards, in particular to a mold for manufacturing a circuit board with a comb-shaped structure and a manufacturing method.
Background
Rigid circuit boards (PCBs) have been in the past for centuries, and for more efficient circuit board production, large boards (panels) have been produced by joining together small boards (PCS) to form a single circuit board. And then subdivided into individual Platelets (PCS) for use, or pre-subdivided into a plurality of connected Platelets (PCS) that are still partially connected, the method of subdivision being as follows:
1. the milling machine (milling machine) is used for milling a knife, the method is low in efficiency, and the path taken by the milling knife can be milled to a large part, so that waste is caused.
2. The die cutting method is characterized in that the die cutting is carried out by using a die designed by the traditional technology, when the die cutting is carried out, the small plates, namely PCS, are required to be designed with a distance of more than 1mm, the waste is caused by 3, the small plates are CUT by using a V-CUT machine, although the V-CUT machine realizes zero-distance jointed plates among the small plates, the waste is small, when the V-CUT machine is used for cutting, two thirds of the small plates are generally CUT, one third of the small plates is kept not to be CUT, one piece after welding elements is needed to be CUT once, and the V-CUT machine is also used for cutting straight lines once, so that the efficiency is low, and curves cannot be CUT.
4. Laser cutting can be performed at a zero interval, but the efficiency is low, the equipment is expensive, and the use cost is high.
In the past, how to cut a rigid circuit board by using a mold, dividing a large board into small boards and cutting the small boards after splicing at a zero interval is an unsolved problem in nearly a hundred years, and naturally, the cutting mold is divided into two types according to the principle: one type is a cutting die designed and manufactured according to the principle of kitchen knife cutting, and the die can only cut a very thin flexible circuit board obviously; the other type is a shearing die designed according to the principle of 'scissors', and the die can cut the rigid circuit board.
In order to overcome the defects and shortcomings, the invention designs a novel shearing die based on the 'scissors' principle, when a small board is spliced into a large board, the circuit board manufactured by the shearing die realizes zero-spacing splicing production, reduces waste and reduces cost, and the manufactured and cut circuit board is a circuit board which is obtained by cutting one large board into two 'comb' -shaped structures, so that the efficiency is high, the cost is low, and the circuit board with various different structures can be manufactured.
Disclosure of Invention
The invention relates to a die for manufacturing a circuit board with a comb-shaped structure and a manufacturing method thereof, in particular to a die for manufacturing the circuit board with the comb-shaped structure, which is characterized in that the die for manufacturing the circuit board is designed into an upper die and a lower die, the die-cutting knives of the dies of the upper die and the lower die are all of the comb-shaped structure which are connected into a whole, the edge of the comb-shaped die-cutting knife of the upper die is a continuous curved knife edge which is connected into a line, the edge of the comb-shaped die-cutting knife of the lower die is also a continuous curved knife edge which is connected into a line, the upper knife and the lower knife are in staggered alignment, so that the knife edges of the upper knife and the lower knife form a 'scissors' type shearing relation, and the circuit board is.
The invention provides a method for manufacturing a die for manufacturing a circuit board with a comb-shaped structure, which comprises the following steps of designing a circuit board die into an upper die and a lower die, wherein the punching knives of the upper die and the lower die are all in a comb-shaped structure connected into a whole, the edge of the comb-shaped punching knife of the upper die is a continuous curved knife edge connected into a line, the edge of the comb-shaped punching knife of the lower die is also a continuous curved knife edge connected into a line, the upper knife and the lower knife are in staggered alignment, so that the knife edges of the upper knife and the lower knife form a shearing relation in a scissor type, a material ejecting plate with a comb-shaped structure is further arranged on the lower die, the material ejecting plate is aligned with the punching knives of the comb-shaped structure of the upper die, a plurality of elastic glue is arranged below the material ejecting plate, and when the circuit board is punched by the die, the knife edges of the upper die and the lower die cut the circuit board into two circuit boards with the comb-, when the die punches and breaks the circuit board into two circuit boards with comb-shaped structures, the punching knife of the upper die is forcibly extruded on the circuit board, the pressure is transmitted to the ejector plate from the circuit board and then transmitted to the elastic glue from the ejector plate, when the upper die is lifted upwards, the counter elastic force of the elastic glue is transmitted back to the ejector plate, the circuit board with the comb-shaped structure on the ejector plate is jacked upwards and is jacked out from the punching knife of the lower die.
According to a preferred embodiment of the present invention, the mold for manufacturing the circuit board with the "comb" shaped structure is characterized in that the mold can be used for punching a rigid circuit board and a flexible circuit board.
According to a preferred embodiment of the present invention, the mold for manufacturing the circuit board with the "comb" shaped structure is characterized in that the circuit board with the "comb" shaped structure punched by the mold is designed and manufactured before punching, a large board formed by connecting a plurality of small boards into a whole is designed, the large board is designed such that the small boards in the large board have zero intervals without waste except that the peripheral frame is the edge waste for supporting, and the material can be saved and the cost can be reduced when the mold is used for manufacturing the circuit board.
The details of one or more embodiments of the invention are set forth in the accompanying drawings and the description below.
Drawings
The features, objects, and advantages of the present invention will become more apparent from the description set forth below when taken in conjunction with the drawings, a brief description of which follows.
Fig. 1 is a schematic cross-sectional view of an upper die stamping knife including 11 connected "comb" shaped integrated stamping knives.
Fig. 2 is a plan view of a lower die cutter comprising 11 conjoined "comb" shaped integral die cutters.
Fig. 3 is a schematic cross-sectional view of the assembled mold.
Fig. 4 is a schematic cross-sectional view of a product placed in a mold before die cutting.
Fig. 5 is a schematic cross-sectional view of a die cut product placed in a mold.
Fig. 6 is a schematic plan view of the product before die cutting.
Figure 7 is a plan view of one of the two "comb" shaped products after die cutting.
Figure 8 is a plan view of a second of two "comb" shaped products after die cutting.
Figure 9 is a schematic plan view of two "comb" shaped products assembled together.
Detailed Description
The present invention will be described in detail below by taking preferred embodiments as examples.
It will be understood by those skilled in the art that the following descriptions are provided for purposes of illustration and description of certain preferred embodiments only and are not intended to limit the scope of the present invention.
Examples
1. Mold design
1.1, designing a connected circuit board (large board) comprising a plurality of circuit boards, wherein the length of the connected circuit board is 218mm, the width of the connected circuit board is 125mm, and the connected circuit board comprises 20 dies with the widest part of 8.0mm and is used for punching a rigid circuit board. The upper die stamping knife is a connected 'comb' -shaped integrated stamping knife 1.1 comprising 11 blades, one blade on one side is provided with a single-side blade, the other blades on the two sides are provided with cutting edges, the 'comb' -shaped connector is provided with a single-side blade, the head of each blade with two cutting edges is also provided with a single-side blade, all the cutting edges are connected into a curve, the lower die is also provided with a connected 'comb' -shaped integrated stamping knife 2.1 comprising 11 blades, one blade on one side is provided with a single-side blade, the other blades on two sides are provided with cutting edges, the 'comb' -shaped connector is provided with a single-side blade, the head of each blade with two cutting edges is also provided with a single-side blade, and all the cutting edges are connected into a curve (shown in figures 1, 2 and 3).
1.2, designing a comb-shaped jacking steel plate 3.1 (shown in figures 1 and 3) which is the same as the upper die.
2. Mold making
And cutting thick die steel plates according to the design by using a slow-feeding wire cutting mode to manufacture an upper die cutter, a lower die cutter and a material ejecting plate, and carrying out heat treatment on the upper die cutter and the lower die cutter. Then, an upper die frame and a lower die frame are manufactured, a die is installed, the upper die frame and the lower die frame are installed, a plurality of elastic glue 4.1 is installed on the lower die frame, a jacking steel plate 3.1 is installed on the elastic glue 4.1, two positioning pins 6.1 are installed on the lower die frame, an upper die positioning guide pillar and a lower die positioning guide pillar are connected, and the die is manufactured after the whole die is installed (shown in figure 3).
3 die-cutting demonstration
Checking the performance of punching equipment, mounting a die on a punching machine, placing a workpiece 5.1 to be punched between an upper die and a lower die according to a die positioning hole after null punching is carried out, starting the punching machine for punching, taking out two punched comb-shaped products, assembling the two comb-shaped products together by taking the punched positions as reference, and clamping and combining the two comb-shaped products into a whole (shown in figures 4, 5, 6, 7 and 8).
The present invention is described in detail with reference to the accompanying drawings by using a specific embodiment of a mold and a method for manufacturing a circuit board with a comb-like structure. It will be understood by those skilled in the art, however, that the foregoing is merely illustrative and descriptive of some specific embodiments and is not to be construed as limiting the scope of the invention, especially the scope of the claims.
Claims (3)
1. A method for manufacturing a die for manufacturing a circuit board with a comb-shaped structure comprises designing a circuit board die into an upper die and a lower die, wherein punching knives of the upper die and the lower die are all in a comb-shaped structure connected into a whole, the edge of a comb-shaped punching knife of the upper die is a continuous curved knife edge connected into a line, the edge of the comb-shaped punching knife of the die is also a continuous curved knife edge connected into a line, the upper knife and the lower knife are in staggered alignment, so that the knife edges of the upper knife and the lower knife form a shearing relation in a scissor type, a stripper plate with a comb-shaped structure is further arranged on the lower die, the stripper plate is aligned with the punching knives of the comb-shaped structure of the upper die, a plurality of elastic adhesives are arranged below the stripper plate, and when the circuit board is punched by the die, the knife edges of the upper die and the lower die cut the circuit board into two circuit boards with the comb-shaped structures, when the die punches and breaks the circuit board into two circuit boards with comb-shaped structures, the punching knife of the upper die is forcibly extruded on the circuit board, the pressure is transmitted to the ejector plate from the circuit board and then transmitted to the elastic glue from the ejector plate, when the upper die is lifted upwards, the counter elastic force of the elastic glue is transmitted back to the ejector plate, the circuit board with the comb-shaped structure on the ejector plate is jacked upwards and is jacked out from the punching knife of the lower die.
2. The mold for manufacturing circuit boards with the comb-shaped structure according to claim 1, wherein the mold can be used for punching rigid circuit boards and flexible circuit boards.
3. The mold for manufacturing the circuit board with the comb-shaped structure according to claim 1 or 2, wherein the circuit board with the comb-shaped structure is designed and manufactured before punching, a plurality of small plates are integrally connected to form a large plate, the large plate is designed to have zero spacing without waste materials among the small plates in the large plate except for the peripheral frame which is used for supporting the edge waste materials, and the material and the cost can be saved when the mold is used for manufacturing the circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911333666.8A CN112936439A (en) | 2019-12-11 | 2019-12-11 | Mold for manufacturing circuit board with comb-shaped structure and manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911333666.8A CN112936439A (en) | 2019-12-11 | 2019-12-11 | Mold for manufacturing circuit board with comb-shaped structure and manufacturing method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112936439A true CN112936439A (en) | 2021-06-11 |
Family
ID=76234355
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911333666.8A Withdrawn CN112936439A (en) | 2019-12-11 | 2019-12-11 | Mold for manufacturing circuit board with comb-shaped structure and manufacturing method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112936439A (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202439065U (en) * | 2012-02-10 | 2012-09-19 | 中国皮革和制鞋工业研究院 | Sampling cutting mould for leather, textile, rubber and paper samples |
| CN103991106A (en) * | 2014-04-26 | 2014-08-20 | 王定锋 | Circuit board shearing and splitting mold and splitting method |
| CN105058502A (en) * | 2015-07-31 | 2015-11-18 | 惠州市世辉实业有限公司 | Light emitting diode (LED) circuit board die |
| CN207224152U (en) * | 2017-09-30 | 2018-04-13 | 莆田市城厢区星华电子模具有限公司 | Wiring board die cutting die |
| CN207954103U (en) * | 2018-03-15 | 2018-10-12 | 博罗县德隆电子有限公司 | A kind of circuit board mold |
| CN212372334U (en) * | 2019-12-11 | 2021-01-19 | 王定锋 | Mould for manufacturing circuit board with comb-shaped structure |
-
2019
- 2019-12-11 CN CN201911333666.8A patent/CN112936439A/en not_active Withdrawn
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202439065U (en) * | 2012-02-10 | 2012-09-19 | 中国皮革和制鞋工业研究院 | Sampling cutting mould for leather, textile, rubber and paper samples |
| CN103991106A (en) * | 2014-04-26 | 2014-08-20 | 王定锋 | Circuit board shearing and splitting mold and splitting method |
| CN105058502A (en) * | 2015-07-31 | 2015-11-18 | 惠州市世辉实业有限公司 | Light emitting diode (LED) circuit board die |
| CN207224152U (en) * | 2017-09-30 | 2018-04-13 | 莆田市城厢区星华电子模具有限公司 | Wiring board die cutting die |
| CN207954103U (en) * | 2018-03-15 | 2018-10-12 | 博罗县德隆电子有限公司 | A kind of circuit board mold |
| CN212372334U (en) * | 2019-12-11 | 2021-01-19 | 王定锋 | Mould for manufacturing circuit board with comb-shaped structure |
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| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20210611 |