CN212138229U - Servo driver with novel radiator structure - Google Patents
Servo driver with novel radiator structure Download PDFInfo
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- CN212138229U CN212138229U CN202021326629.2U CN202021326629U CN212138229U CN 212138229 U CN212138229 U CN 212138229U CN 202021326629 U CN202021326629 U CN 202021326629U CN 212138229 U CN212138229 U CN 212138229U
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- servo driver
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- radiator
- conducting layer
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Abstract
The utility model relates to a servo driver technical field specifically discloses a take servo driver of novel radiator structure, which comprises a housin, be provided with the installation cavity in the casing, the servo driver body is installed to the bottom of installation cavity, servo driver's top is provided with the heat-conducting layer, the top of heat-conducting layer still is provided with the radiator, still be provided with the semiconductor refrigeration piece between radiator and the heat-conducting layer, just the refrigeration face of semiconductor refrigeration piece with the heat-conducting layer butt. The servo driver with the novel radiator structure adopts a semiconductor refrigeration technology, so that the overall temperature of the servo driver body is effectively guaranteed to be uniform, and local overheating is avoided.
Description
Technical Field
The utility model relates to a servo driver technical field especially relates to a take servo driver of novel radiator structure.
Background
With the development of electronic industry technology, electronic products are being developed in a direction of high power density and high efficiency to achieve light weight and miniaturization, and the heat generation amount of each heating component is increased accordingly. For most electronic components, the failure rate increases exponentially with the temperature rise, and according to statistics of relevant literatures, 55% of failures of electronic equipment are caused by overhigh temperature. It is also statistically expected that, for a system, an increase in the temperature of individual electronic components will lead to a decrease in the overall reliability of the system. Preventing thermal failure of electronic components is a major goal of thermal control. How the system dissipates heat of the heating components inside the equipment to ensure the normal operation of the system becomes a key problem which must be mainly solved by designers.
The servo driver is also called servo controller and servo amplifier, and is one controller for controlling servo motor, similar to frequency converter acting on common AC motor, and belongs to the field of servo system. The servo motor is generally controlled by three modes of position, speed and moment, so that the high-precision positioning of a transmission system is realized, and the servo motor is a high-end product of a transmission technology at present. In the servo driver, the radiator plays the role of a heat dissipation core, and the main heating source radiates most of heat to the external heat layer by means of the radiator. Therefore, the optimal design of the heat sink plays a crucial role in the thermal design of the whole product.
Can use refrigerating plant to carry out supplementary heat dissipation to electronic component among the prior art, nevertheless can not guarantee among this type of prior art that this refrigerating plant carries out even heat dissipation to heating element, can lead to heating element's local high temperature, and the radiating efficiency is lower, influences electronic component's performance.
SUMMERY OF THE UTILITY MODEL
In order to solve the technical problem, an object of the utility model is to provide a take servo driver of novel radiator structure, take servo driver of novel radiator structure to adopt the semiconductor refrigeration technique, it is even effectively to guarantee servo driver body bulk temperature, avoids local overheat.
In order to achieve the technical effects, the utility model adopts the following technical scheme:
the utility model provides a take servo driver of novel radiator structure, includes the casing, be provided with the installation cavity in the casing, the servo driver body is installed to the bottom of installation cavity, servo driver's top is provided with the heat-conducting layer, the top of heat-conducting layer still is provided with the radiator, still be provided with the semiconductor refrigeration piece between radiator and the heat-conducting layer, just the refrigeration face of semiconductor refrigeration piece with the heat-conducting layer butt.
Further, the heat conduction layer is a graphene heat conduction film or heat conduction silica gel.
Furthermore, the radiator comprises a base plate and a plurality of fins fixedly connected with the base plate, and the fins are arranged on one side, far away from the semiconductor refrigeration sheet, of the base plate.
Further, the section of the rib is triangular or trapezoidal, and the diameter of the top of the rib is smaller than that of the bottom of the rib.
Further, still be provided with in the casing with the heat dissipation chamber of installation cavity intercommunication, be provided with radiator fan in the heat dissipation chamber.
Further, the heat dissipation fan and the heat sink are arranged at the same height.
Further, the fan is an axial fan.
Compared with the prior art, the beneficial effects of the utility model are that: the utility model provides a pair of take servo driver of novel radiator structure adopts the semiconductor refrigeration piece to refrigerate, and set up one deck heat-conducting layer between servo driver body and the semiconductor refrigeration piece, this heat-conducting layer is preferred to the material that coefficient of heat conductivity is great, and preferred graphite alkene heat conduction film or heat conduction silica gel material are through setting up this type of heat-conducting layer, can make servo driver body surface temperature's more even, strengthens the heat transfer on its horizontal direction, avoids local overheat, and the heat on the vertical side then transmits to the air through the fin of radiator, and the hot-air in rethread radiator fan blows off the casing to the casing outside, and the gas flow in the reinforcing casing is convenient for improve the radiating effect, guarantees the stability of servo driver body operation, improves user's use and experiences.
Drawings
Fig. 1 is a schematic view of an overall structure of a servo driver with a novel heat sink structure according to an embodiment of the present invention;
fig. 2 is a cross-sectional view of a servo driver a-a' with a novel heat sink structure according to an embodiment of the present invention;
the reference signs are: 10-shell, 101-radiating through hole, 20-servo driver body, 21-heat conducting strip, 22-heat conducting layer, 23-semiconductor refrigerating sheet, 24 a-base plate, 24 b-fin, 24-radiator and 30-radiating fan.
Detailed Description
Embodiments of the present invention will be described in detail below with reference to the accompanying drawings. The following examples are only for illustrating the technical solutions of the present invention more clearly, and therefore are only examples, and the protection scope of the present invention is not limited thereby.
As shown in fig. 1-2, the servo driver with the novel heat sink structure provided by this embodiment includes a housing 10, a plurality of heat dissipation through holes 101 have all been seted up to relative both sides on the housing 10, be provided with the installation cavity and the heat dissipation cavity of mutual intercommunication in the housing 10, the installation cavity and the parallel setting in heat dissipation cavity are in inside the housing 10, just the heat dissipation cavity sets up the left side of installation cavity, install servo driver body 20 in the installation cavity, the heat dissipation intracavity is provided with radiator fan 30, the fan is convenient for dispel the heat to servo radiator 24.
In this embodiment, a plurality of heat conduction strips 21 are installed to the bottom of installation cavity, heat conduction strip 21 is metal material, servo driver body 20 the bottom with heat conduction strip 21 fixed connection, heat conduction strip 21 is convenient for through the simulated heat radiator principle servo driver's bottom dispels the heat.
In this embodiment, the top of servo driver body 20 is provided with graphite alkene heat conduction film, graphite alkene heat conduction film with servo driver body 20 bonds, graphite alkene heat conduction film's top still is provided with radiator 24, radiator 24 include base plate 24a and with a plurality of fins 24b of base plate 24a fixed connection, just fin 24b sets up base plate 24a keeps away from one side of semiconductor refrigeration piece 23, still be provided with semiconductor refrigeration piece 23 between radiator 24 and the heat-conducting layer 22, just semiconductor refrigeration piece 23 the refrigeration face with heat-conducting layer 22 butt, semiconductor refrigeration piece 23 the radiating surface with the base plate 24a butt of radiator 24. When using, will semiconductor refrigeration piece 23 and power intercommunication make it have the refrigeration function, through set up graphite alkene heat conduction film can carry out the horizontal direction with the heat effectively and transmit, with the regional heat of high temperature transmit to the low temperature region rapidly at the top of servo driver's body, improve local radiating efficiency, simultaneously, can solve the uneven problem of heat dissipation that semiconductor refrigeration piece 23 and servo driver body 20's size difference brought among the prior art, can make the refrigerated cooling effect of semiconductor transmits uniformly on the servo driver body 20 to improve radiating efficiency.
Preferably, a graphene heat conducting film is also arranged between the heat conducting strip 21 and the servo driver body 20, and a plurality of heat dissipation through holes 101 are further formed on the mounting side of the heat conducting strip 21 of the housing 10.
In this embodiment, the cross section of the fins 24b of the heat sink 24 is trapezoidal, the diameter of the top of the fins 24b is smaller than that of the bottom of the fins 24b, and the heights of the two adjacent fins 24b are different, so as to accelerate the airflow to pass through and improve the heat dissipation efficiency.
In the present embodiment, the heat dissipation fan 30 is an axial fan, the heat dissipation fan 30 and the heat sink 24 are disposed at the same height, and the installation direction of the fins 24b is parallel to the airflow direction.
Although the present invention has been described in detail with reference to the preferred embodiments, those skilled in the art will understand that the present invention can be modified or replaced with other embodiments without departing from the spirit and scope of the present invention, which should be construed as limited only by the appended claims. The technology, shape and construction parts which are not described in detail in the present invention are all known technology.
Claims (7)
1. The utility model provides a take servo driver of novel radiator structure which characterized in that: including casing (10), be provided with the installation cavity in casing (10), servo driver body (20) are installed to the bottom of installation cavity, servo driver's top is provided with heat-conducting layer (22), the top of heat-conducting layer (22) still is provided with radiator (24), still be provided with semiconductor refrigeration piece (23) between radiator (24) and heat-conducting layer (22), just the refrigeration face of semiconductor refrigeration piece (23) with heat-conducting layer (22) butt.
2. The servo driver with the novel heat sink structure as claimed in claim 1, wherein: the heat conduction layer (22) is a graphene heat conduction film.
3. The servo driver with the novel heat sink structure as claimed in claim 1, wherein: the radiator (24) comprises a base plate (24a) and a plurality of fins (24b) fixedly connected with the base plate (24a), and the fins (24b) are arranged on one side, far away from the semiconductor refrigerating sheet (23), of the base plate (24 a).
4. The servo driver with the novel heat sink structure as claimed in claim 3, wherein: the cross section of the rib (24b) is triangular or trapezoidal, and the diameter of the top of the rib (24b) is smaller than that of the bottom of the rib.
5. The servo driver with the novel heat sink structure as claimed in claim 1, wherein: the shell (10) is also internally provided with a heat dissipation cavity communicated with the installation cavity, and the heat dissipation cavity is internally provided with a heat dissipation fan (30).
6. The servo driver with the novel heat sink structure as claimed in claim 5, wherein: the heat radiation fan (30) and the radiator (24) are arranged at the same height.
7. The servo driver with the novel heat sink structure as claimed in claim 5, wherein: the fan is an axial fan.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021326629.2U CN212138229U (en) | 2020-07-08 | 2020-07-08 | Servo driver with novel radiator structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021326629.2U CN212138229U (en) | 2020-07-08 | 2020-07-08 | Servo driver with novel radiator structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212138229U true CN212138229U (en) | 2020-12-11 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021326629.2U Active CN212138229U (en) | 2020-07-08 | 2020-07-08 | Servo driver with novel radiator structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212138229U (en) |
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2020
- 2020-07-08 CN CN202021326629.2U patent/CN212138229U/en active Active
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