CN212135377U - Server host computer heat abstractor - Google Patents
Server host computer heat abstractor Download PDFInfo
- Publication number
- CN212135377U CN212135377U CN202021389456.9U CN202021389456U CN212135377U CN 212135377 U CN212135377 U CN 212135377U CN 202021389456 U CN202021389456 U CN 202021389456U CN 212135377 U CN212135377 U CN 212135377U
- Authority
- CN
- China
- Prior art keywords
- fixedly connected
- plate
- heat
- server host
- fan
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Abstract
The utility model provides a heat dissipation device for a server host, which belongs to the technical field of computers and comprises a bottom plate, one side of the bottom plate is fixedly connected with a side plate, the back surface of the bottom plate is fixedly connected with a rear cover plate, the front surface of the bottom plate is fixedly connected with a front baffle plate, the top end of the front baffle plate is fixedly connected with a top plate, the front surface of the rear cover plate is provided with an air inlet, the front surface of the rear cover plate is fixedly connected with a fan barrel, the inner part of the fan barrel is movably connected with a fan blade, the lower surface of the top plate is fixedly connected with a fan, by the heat absorbing sheet arranged on the CPU chip, when the temperature of the CPU rises, the heat absorbing sheet can absorb heat, then the heat conducting fins transfer the heat from the heat absorbing fins to the heat radiating fins, and the heat loss of the heat radiating fins is accelerated by the arranged fan, therefore, the problem of heat dissipation requirements of the current server host with double central processing units or multiple central processing units is well solved.
Description
Technical Field
The utility model belongs to the technical field of the computer, concretely relates to server host computer heat abstractor.
Background
Under the popularization of computers and the rapid development of network technology, networks have become one of the most important media for acquiring data and can provide diversified information services. The smoothness of the network and the provision of mass data, the server host is one of the most important supports. The traditional server host is a single central processing unit, and along with the development of network links and the further popularization of network applications, the traditional server host with the single central processing unit cannot meet the requirements. Therefore, a server host with dual central processing units, a server host with multiple central processing units, has appeared on the market. However, as the number of the central processing units of the server host increases, the heat generated by the motherboard when the server host works also increases, and the heat dissipation mode of the traditional server host cannot well meet the heat dissipation requirement of the server host with double central processing units or multiple central processing units. Therefore, the heat dissipation problem of the server has become one of the main problems hindering the server with dual cpu or multiple cpu.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a server host computer heat abstractor aims at solving among the prior art along with the increase of the central processing unit of server host computer, and the heat that the server host computer during operation motherboard produced also increases thereupon, and the radiating mode of traditional server host computer has can not satisfy the problem of the heat dissipation demand of the server host computer that has two central processing units or many central processing units at present well.
In order to achieve the above object, the utility model provides a following technical scheme: a heat dissipation device for a server host comprises a bottom plate, wherein a side plate is fixedly connected to one side of the bottom plate, a rear cover plate is fixedly connected to the back of the bottom plate, a front baffle plate is fixedly connected to the front of the bottom plate, a top plate is fixedly connected to the top end of the front baffle plate, an air inlet is formed in the front of the rear cover plate, a fan barrel is fixedly connected to the front of the rear cover plate, a fan blade is movably connected to the inside of the fan barrel, a circuit board and a main plate are fixedly connected to one side of the side plate from front to back in sequence, a CPU chip is fixedly connected to one side of the main plate, a heat absorption plate is movably connected to one side of the CPU chip, a heat conduction plate is fixedly connected to one side of the heat absorption plate, a heat dissipation plate is fixedly connected to one, the lower surface of the top plate is fixedly connected with a fan.
In order to make this server host computer heat abstractor reach better heat absorption, conduct the utility model relates to an it is preferred, the material of heat absorbing sheet is metal copper.
In order to make this server host computer heat abstractor reach better radiating effect, as the utility model relates to an it is preferred, the material of fin is metal aluminium.
In order to make this server host computer heat abstractor reach better ventilation effect, conduct the utility model relates to an it is preferred, the louvre has been seted up in the front of preceding baffle.
In order to make this server host computer heat abstractor reach better radiating effect, conduct the utility model relates to an it is preferred, the thermovent has been seted up to one side of curb plate.
In order to make this server host computer heat abstractor reach the effect that prevents that the air intake from getting into the dust, conduct the utility model relates to an it is preferred, the back fixedly connected with dust screen of back shroud.
Compared with the prior art, the beneficial effects of the utility model are that:
1. the heat dissipation device of the server host can make the air with relatively low temperature outside sucked into the machine through the arrangement of the air inlet, the fan barrel, the fan blades and the heat dissipation holes, then the fan discharges the hot air inside through the heat dissipation holes to achieve the effect of air circulation, the temperature inside the machine is effectively reduced, when the temperature of the CPU rises, the heat can be transferred to the copper heat absorption sheet with better heat absorption performance through the heat absorption sheet arranged on the CPU chip, then the heat is transferred from the heat absorption sheet to the aluminum heat dissipation sheet with better heat dissipation performance through the heat conduction sheet, the heat loss of the heat dissipation sheet is accelerated through the arranged fan, the heat absorption sheet and the heat dissipation sheet can select different quantities according to the needs, so as to achieve better heat dissipation effect, thereby solving the problem that the heat generated by a mainboard when the server host works is increased along with the increase of a central processing unit of the server host, the heat dissipation method of the traditional server host can not well meet the heat dissipation requirement of the current server host with double central processing units or multiple central processing units.
2. This server host computer heat abstractor through the dust screen that sets up, can prevent that the air intake from getting into too much dust to the machine has been protected.
Drawings
The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention, and together with the description serve to explain the invention and not to limit the invention. In the drawings:
fig. 1 is a schematic view of an axial measurement structure of the present invention;
fig. 2 is a left side view structure diagram of the present invention;
FIG. 3 is a schematic view of an axial structure of the heat sink of the present invention;
fig. 4 is a schematic sectional view of the present invention.
In the figure: 1. a base plate; 2. a heat dissipation port; 3. a heat sink; 4. a circuit board; 5. a fan; 6. a main board; 7. a dust screen; 8. a blower barrel; 9. a fan blade; 10. a protection plate; 11. heat dissipation holes; 12. a fixing plate; 13. a heat absorbing sheet; 14. a heat conductive sheet; 15. a CPU chip; 16. a front baffle; 17. a rear cover plate; 18. a top plate; 19. a side plate; 20. and an air inlet.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Examples
Referring to fig. 1-4, the present invention provides the following technical solutions: a heat dissipation device of a server host comprises a bottom plate 1, a side plate 19 is fixedly connected to one side of the bottom plate 1, a rear cover plate 17 is fixedly connected to the back of the bottom plate 1, a front baffle 16 is fixedly connected to the front of the bottom plate 1, a top plate 18 is fixedly connected to the top end of the front baffle 16, an air inlet 20 is formed in the front of the rear cover plate 17, a fan barrel 8 is fixedly connected to the front of the rear cover plate 17, a fan blade 9 is movably connected to the interior of the fan barrel 8, a circuit board 4 and a main board 6 are sequentially and fixedly connected to one side of the side plate 19 from front to back, a CPU chip 15 is fixedly connected to one side of the main board 6, a heat absorption plate 13 is movably connected to one side of the CPU chip 15, a heat conduction plate 14 is fixedly connected to one side of the heat absorption plate 13, a heat dissipation plate, the lower surface of the top plate 18 is fixedly connected with a fan 5.
In the embodiment of the present invention, through the arrangement of the air inlet 20, the blower barrel 8, the fan blades 9 and the heat dissipation holes 11, the air with relatively low temperature outside can be sucked into the machine, the fan can discharge the hot air inside through the heat dissipation holes 11, thereby achieving the effect of air circulation, effectively reducing the temperature inside the machine, through the heat absorption plate arranged on the CPU chip 15, when the temperature of the CPU rises, the heat can be transferred to the copper heat absorption plate 13 with better heat absorption performance, then the heat can be transferred from the heat absorption plate to the aluminum heat dissipation plate 3 with better heat dissipation performance through the heat conduction plate 14, the heat loss of the heat dissipation plate 3 is accelerated through the arranged fan, the heat absorption plate 13 and the heat dissipation plate 3 can select different quantities as required, thereby achieving better heat dissipation effect, thereby solving the increase of the central processing unit along with the server host, the heat generated by the mainboard when the server host works is increased, and the heat dissipation mode of the traditional server host cannot well meet the heat dissipation requirement of the current server host with double central processing units or multiple central processing units.
Specifically, the heat sink 13 is made of copper.
In this embodiment: the material selected is copper, so that the heat absorbing sheet has a better heat absorbing effect.
Specifically, the heat sink 3 is made of metal aluminum.
In this embodiment: the material selected for use is aluminum, so that the radiating fins have a better radiating effect.
Specifically, the front surface of the front baffle 16 is provided with heat dissipation holes 11.
In this embodiment: through the setting of louvre 11, can let the air of inside and outside obtain better circulation.
Specifically, one side of the side plate 19 is provided with a heat dissipation port 2.
In this embodiment: through the setting of thermovent 2, can have better radiating effect.
Specifically, the rear surface of the rear cover plate 17 is fixedly connected with a dust screen 7.
In this embodiment: through the arrangement of the dustproof net 7, dust can be prevented from entering the interior of the machine through the air inlet, and therefore the machine is protected.
The electrical components presented in the document are all electrically connected with an external master controller and 220V mains, and the master controller can be a conventional known device controlled by a computer or the like.
The utility model discloses a theory of operation and use flow: when the heat dissipation device for the server host is used, air with relatively low temperature outside can be sucked into a machine through the air inlet 20, the fan barrel 8, the fan blades 9 and the heat dissipation holes 11, the fan is used for discharging hot air inside through the heat dissipation holes 11 to achieve the effect of air circulation, the temperature inside the machine is effectively reduced, when the temperature of a CPU rises through the heat absorption sheets arranged on the CPU chip 15, heat can be transferred to the copper heat absorption sheets 13 with good heat absorption performance, then the heat is transferred from the heat absorption sheets to the aluminum heat dissipation sheets 3 with good heat dissipation performance through the heat conduction sheets 14, the heat loss of the heat dissipation sheets 3 is accelerated through the arranged fan, different numbers of the heat absorption sheets 13 and the heat dissipation sheets 3 can be selected according to needs, so that better heat dissipation effect is achieved, and the problem that the central processing unit of the server host is increased is solved, the heat generated by the mainboard when the server host works is increased, and the heat dissipation mode of the traditional server host cannot well meet the heat dissipation requirement of the current server host with double central processing units or multiple central processing units.
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described in the foregoing embodiments, or equivalents may be substituted for elements thereof. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (6)
1. The utility model provides a server host computer heat abstractor, includes bottom plate (1), its characterized in that: a side plate (19) is fixedly connected to one side of the bottom plate (1), a rear cover plate (17) is fixedly connected to the back of the bottom plate (1), a front baffle plate (16) is fixedly connected to the front of the bottom plate (1), a top plate (18) is fixedly connected to the top end of the front baffle plate (16), an air inlet (20) is formed in the front of the rear cover plate (17), a fan barrel (8) is fixedly connected to the front of the rear cover plate (17), fan blades (9) are movably connected to the inside of the fan barrel (8), a circuit board (4) and a main board (6) are fixedly connected to one side of the side plate (19) from front to back in sequence, a CPU chip (15) is fixedly connected to one side of the main board (6), a heat absorbing sheet (13) is movably connected to one side of the CPU chip (15), a heat conducting sheet (14) is fixedly connected to one side of the heat absorbing sheet (13), the lower surface of the radiating fin (3) is fixedly connected with a fixing plate (12), one side of the fixing plate (12) is fixedly connected with a side plate (19), and the lower surface of the top plate (18) is fixedly connected with a fan (5).
2. The server host heat sink of claim 1, wherein: the heat absorbing sheet (13) is made of metal copper.
3. The server host heat sink of claim 1, wherein: the radiating fins (3) are made of metal aluminum.
4. The server host heat sink of claim 1, wherein: the front surface of the front baffle (16) is provided with heat dissipation holes (11).
5. The server host heat sink of claim 1, wherein: one side of the side plate (19) is provided with a heat dissipation port (2).
6. The server host heat sink of claim 1, wherein: the back of the rear cover plate (17) is fixedly connected with a dust screen (7).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021389456.9U CN212135377U (en) | 2020-07-15 | 2020-07-15 | Server host computer heat abstractor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021389456.9U CN212135377U (en) | 2020-07-15 | 2020-07-15 | Server host computer heat abstractor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212135377U true CN212135377U (en) | 2020-12-11 |
Family
ID=73684715
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021389456.9U Active CN212135377U (en) | 2020-07-15 | 2020-07-15 | Server host computer heat abstractor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212135377U (en) |
-
2020
- 2020-07-15 CN CN202021389456.9U patent/CN212135377U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN100383702C (en) | Improved structure of server | |
| CN201465020U (en) | Conduction and heat dissipation device of CPCI module | |
| CN201327611Y (en) | Computer case, mainboard and computer with case and mainboard | |
| CN204557356U (en) | A kind of computer CPU radiator | |
| CN212135377U (en) | Server host computer heat abstractor | |
| CN100410841C (en) | Heat sink of computer system | |
| CN210166749U (en) | Hardware heat dissipation tool for computer network | |
| CN108491054B (en) | Server heat radiation structure based on gas convection heat exchange | |
| CN201418228Y (en) | Heat sink | |
| CN100535829C (en) | Heat dissipating module of notebook computer | |
| CN212135374U (en) | Rack-mounted server cooling system | |
| CN208459916U (en) | A kind of compound server radiating case | |
| CN217821500U (en) | Active display card backplate heat abstractor | |
| CN104703443A (en) | Heat dissipation plug box | |
| CN215416527U (en) | Computing equipment and tubular heat dissipation device | |
| CN220962339U (en) | Efficient radiator structure for computer | |
| CN217721756U (en) | Ventilation structure of electrical equipment | |
| CN216596124U (en) | Server heat dissipation module structure | |
| CN215871385U (en) | Ad hoc network equipment based on RF wireless chip | |
| CN213518059U (en) | Integrated machine with 5G module | |
| CN210835942U (en) | Heat radiation structure for computer host | |
| CN213394524U (en) | Radiator installation fixing base | |
| CN212229564U (en) | Computer case | |
| CN201654666U (en) | Terminal, radiating module thereof and radiator | |
| CN210954840U (en) | Electronic component mounting case with heat dissipation system |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |