CN216596124U

CN216596124U - Server heat dissipation module structure

Info

Publication number: CN216596124U
Application number: CN202123266430.2U
Authority: CN
Inventors: 凌昊; 丁占祥; 崔浩
Original assignee: Shenzhen Shixin Information Technology Co ltd
Current assignee: Shenzhen Shixin Information Technology Co ltd
Priority date: 2021-12-23
Filing date: 2021-12-23
Publication date: 2022-05-24
Anticipated expiration: 2031-12-23

Abstract

The utility model relates to a server technical field just discloses a server heat dissipation module structure, which comprises a housin, the front end of casing is provided with the apron, the upper end fixedly connected with second heat dissipation mechanism of casing, the rear end fixedly connected with third heat dissipation mechanism of casing, the inside rear end fixedly connected with heat conduction silica gel board of casing. This server heat dissipation module structure, install the casing inside with the server earlier, increase the different heat dissipation mechanism of three groups in the outside of casing again, fan through the casing upper end tentatively dispels the heat, the use of cooperation fan simultaneously can be cooled down to the casing inside through the condensation plate, when the high temperature, the heat that the server distributed out can be absorbed to the heat conduction silica gel board of the inside rear end of casing, and give the heat-conducting plate with the heat transfer, the aquatic is arranged in to the heat-conducting plate, cool down the heat-conducting plate through water, realize the multiunit cooling, improve the radiating effect to the inside server of casing, the practicality is greatly improved.

Description

Server heat dissipation module structure

Technical Field

The utility model relates to a server technical field specifically is a server heat dissipation module structure.

Background

A server is one of computers that runs faster, is more heavily loaded, and is more expensive than a regular computer. The server provides calculation or application services for other clients (such as terminals like PC, smart phone, ATM and the like and even large equipment like train systems and the like) in the network. The server has high-speed CPU computing capability, long-time reliable operation, strong I/O external data throughput capability and better expansibility.

The server rack that current server used does not have fine heat radiation structure, and some racks all are simple adopts the fan to dispel the heat, and the radiating effect is not good, and when a large amount of servers were moved, the heat that produces can't in time dispel the heat, influences the normal operating of server, greatly reduced the practicality.

SUMMERY OF THE UTILITY MODEL

Technical problem to be solved

The utility model provides a not enough to prior art, the utility model provides a server heat dissipation module structure to solve the server rack that the current server that provides in the above-mentioned background art used and not have fine heat radiation structure, some racks all are simple adoption fan and dispel the heat, and the radiating effect is not good, and when a large amount of servers were run, the heat that produces can't in time dispel the heat, influences the normal operating of server, greatly reduced the problem of practicality.

(II) technical scheme

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a server heat dissipation module structure, includes the casing, the front end of casing is provided with the apron, the front end of apron is provided with control panel, the left and right sides of casing is the first heat dissipation mechanism of fixedly connected with respectively, the upper end fixedly connected with second heat dissipation mechanism of casing, the rear end fixedly connected with third heat dissipation mechanism of casing, the inside rear end fixedly connected with heat conduction silica gel board of casing.

Preferably, the length and the width of the cover plate are the same as those of the shell, and the cover plate is detachably connected with the front end of the shell through a bolt, so that the server is conveniently detached and installed.

Preferably, first heat dissipation mechanism includes condensation plate, protection casing and radiating fin, the protection casing sets up in the outside of condensation plate, and with casing fixed connection, radiating fin fixed mounting is both ends about the casing outside, first heat dissipation mechanism symmetry is provided with two sets ofly, every group first heat dissipation mechanism is provided with two, condensation plate and control panel electric connection can cool down the processing to the casing inside.

Preferably, the second heat dissipation mechanism comprises an installation shell, heat dissipation holes, a fan and a dust screen, the heat dissipation holes are formed in the upper end of the installation shell, the fan is arranged inside the installation shell, the dust screen is fixedly connected to the lower end of the installation shell, the fan is electrically connected with the control panel, circulation of air is accelerated, and heat is taken out of the shell.

Preferably, the third heat dissipation mechanism includes water tank, water, end cover and heat-conducting plate, the inside of water tank is provided with water, the upper end of water tank is provided with the end cover, one side that the inside of water tank is close to heat conduction silica gel board is provided with the heat-conducting plate, carries out thermal conduction through heat conduction silica gel board.

Preferably, can dismantle the connection through the bolt between the upper end of end cover and water tank, the one end fixed mounting of heat-conducting plate is in the rear end of casing, the other end of heat-conducting plate passes the inside that the water tank extends to the water tank, cools down the heat-conducting plate through water for thermal giving off.

Compared with the prior art, the utility model provides a server heat dissipation module structure possesses following beneficial effect: this server heat dissipation module structure, install the casing inside with the server earlier, increase the different heat dissipation mechanism of three groups in the outside of casing again, fan through the casing upper end tentatively dispels the heat, the use of cooperation fan simultaneously can be cooled down to the casing inside through the condensation plate, when the high temperature, the heat that the server distributed out can be absorbed to the heat conduction silica gel board of the inside rear end of casing, and give the heat-conducting plate with the heat transfer, the aquatic is arranged in to the heat-conducting plate, cool down the heat-conducting plate through water, realize the multiunit cooling, improve the radiating effect to the inside server of casing, the practicality is greatly improved.

Drawings

Fig. 1 is a schematic perspective view of the present invention;

FIG. 2 is a schematic view of the internal three-dimensional structure of the present invention;

FIG. 3 is a schematic view of the three-dimensional structure of the present invention;

FIG. 4 is a schematic sectional view of the present invention;

fig. 5 is a schematic sectional view of the second heat dissipation mechanism of the present invention.

Wherein: 1. a housing; 2. a cover plate; 3. a control panel; 4. a first heat dissipation mechanism; 5. a second heat dissipation mechanism; 6. a third heat dissipation mechanism; 7. a heat-conducting silica gel plate; 41. a condensing plate; 42. a protective cover; 43. a heat dissipating fin; 51. mounting a shell; 52. heat dissipation holes; 53. a fan; 54. a dust screen; 61. a water tank; 62. water; 63. an end cap; 64. a heat conducting plate.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-5, the present invention provides the following technical solutions: a server heat dissipation module structure comprises a shell 1, wherein a cover plate 2 is arranged at the front end of the shell 1, the length and width of the cover plate 2 are the same as those of the shell 1, the cover plate 2 is detachably connected with the front end of the shell 1 through bolts, the server is convenient to disassemble and install, a control panel 3 is arranged at the front end of the cover plate 2, first heat dissipation mechanisms 4 are fixedly connected to the left side and the right side of the shell 1 respectively, each first heat dissipation mechanism 4 comprises a condensation plate 41, a protective cover 42 and heat dissipation fins 43, the protective cover 42 is arranged on the outer side of the condensation plate 41 and is fixedly connected with the shell 1, the heat dissipation fins 43 are fixedly arranged at the left end and the right end of the outer side of the shell 1, the first heat dissipation mechanisms 4 are symmetrically arranged in two groups, two groups are arranged on each group of first heat dissipation mechanisms 4, and the condensation plate 41 is electrically connected with the control panel 3 and can cool the interior of the shell 1;

the upper end of the shell 1 is fixedly connected with a second heat dissipation mechanism 5, the second heat dissipation mechanism 5 comprises an installation shell 51, heat dissipation holes 52, a fan 53 and a dust screen 54, the heat dissipation holes 52 are formed in the upper end of the installation shell 51, the fan 53 is arranged inside the installation shell 51, the dust screen 54 is fixedly connected to the lower end of the installation shell 51, and the fan 53 is electrically connected with the control panel 3, so that the circulation of air is accelerated, and heat is taken out of the shell 1;

the rear end fixedly connected with third heat dissipation mechanism 6 of casing 1, third heat dissipation mechanism 6 includes water tank 61, water 62, end cover 63 and heat-conducting plate 64, the inside of water tank 61 is provided with water 62, the upper end of water tank 61 is provided with end cover 63, one side that the inside of water tank 61 is close to heat conduction silica gel plate 7 is provided with heat-conducting plate 64, carry out thermal conduction through heat conduction silica gel plate 7, can dismantle the connection through the bolt between the upper end of end cover 63 and water tank 61, the one end fixed mounting of heat-conducting plate 64 is at the rear end of casing 1, the other end of heat-conducting plate 64 passes the inside that water tank 61 extended to water tank 61, cool down heat-conducting plate 64 through water 62, accelerate thermal giving off, the inside rear end fixedly connected with heat conduction silica gel plate 7 of casing 1.

The working principle is as follows: install the server inside casing 1 earlier, later install apron 2 through the bolt, the heat that produces when the server just begins to operate can dispel the heat through second heat dissipation mechanism 5, accelerate the circulation of air to dispel the heat through fan 53, can dispel the heat through first heat dissipation mechanism 4 and third heat dissipation mechanism 6 to casing 1 inside after the operation period, begin to cool down the processing to casing 1 inside through condensation plate 41 this moment, partial heat is absorbed by heat conduction silica gel plate 7 simultaneously, heat conduction silica gel plate 7 gives heat-conducting plate 64 with the heat transfer, water 62 is arranged in to heat-conducting plate 64 this moment, cool down heat-conducting plate 64 through water 62, cooperation fan 53's use, the radiating effect to the server improves by a wide margin.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a server heat dissipation module structure, includes casing (1), its characterized in that: the heat dissipation device is characterized in that a cover plate (2) is arranged at the front end of the shell (1), a control panel (3) is arranged at the front end of the cover plate (2), a first heat dissipation mechanism (4) is fixedly connected to the left side and the right side of the shell (1), a second heat dissipation mechanism (5) is fixedly connected to the upper end of the shell (1), a third heat dissipation mechanism (6) is fixedly connected to the rear end of the shell (1), and a heat conduction silica gel plate (7) is fixedly connected to the rear end of the interior of the shell (1).

2. The heat dissipation module structure of claim 1, wherein: the length and width of the cover plate (2) are the same as those of the shell (1), and the cover plate (2) is detachably connected with the front end of the shell (1) through a bolt.

3. The heat dissipation module structure of claim 1, wherein: first heat dissipation mechanism (4) include condensation plate (41), protection casing (42) and radiating fin (43), protection casing (42) set up in the outside of condensation plate (41), and with casing (1) fixed connection, radiating fin (43) fixed mounting is at both ends about casing (1) outside, first heat dissipation mechanism (4) symmetry is provided with two sets ofly, every group first heat dissipation mechanism (4) are provided with two, condensation plate (41) and control panel (3) electric connection.

4. The heat dissipation module structure of claim 1, wherein: the second heat dissipation mechanism (5) comprises an installation shell (51), heat dissipation holes (52), a fan (53) and a dust screen (54), the heat dissipation holes (52) are formed in the upper end of the installation shell (51), the fan (53) is arranged inside the installation shell (51), the dust screen (54) is fixedly connected to the lower end of the installation shell (51), and the fan (53) is electrically connected with the control panel (3).

5. The heat dissipation module structure of claim 1, wherein: the third heat dissipation mechanism (6) comprises a water tank (61), water (62), an end cover (63) and a heat conduction plate (64), wherein the water (62) is arranged inside the water tank (61), the end cover (63) is arranged at the upper end of the water tank (61), and the heat conduction plate (64) is arranged on one side, close to the heat conduction silica gel plate (7), of the inside of the water tank (61).

6. The heat dissipation module structure of claim 5, wherein: can dismantle the connection through the bolt between the upper end of end cover (63) and water tank (61), the one end fixed mounting of heat-conducting plate (64) is in the rear end of casing (1), the other end of heat-conducting plate (64) passes water tank (61) and extends to the inside of water tank (61).