CN212095838U

CN212095838U - Polishing and grinding device for LED chip production

Info

Publication number: CN212095838U
Application number: CN202020579367.4U
Authority: CN
Inventors: 不公告发明人
Original assignee: Zhaoqing Yueneng Technology Co Ltd
Current assignee: Chengdu Shengxin Integrated Circuit Co ltd
Priority date: 2020-04-17
Filing date: 2020-04-17
Publication date: 2020-12-08
Anticipated expiration: 2030-04-17

Abstract

The utility model relates to a LED chip production technical field just discloses a LED chip production is with polishing grinding device, including polishing the box, the inside fixed mounting of polishing the box has the step pillar, the fixed cover of top surface of step pillar has connect the support frame, the top surface fixedly connected with polishing platform of support frame, water service tank has been seted up to the inside of polishing platform, water service tank's top surface is provided with the apopore, one side fixed mounting of polishing platform has the water pump, the opposite side fixed mounting of water pump has the water tank, one side of apopore is provided with the step and leads to the groove, the step leads to the groove and sets up the inside at polishing platform. The utility model discloses an inside water service tank of seting up of polishing platform is linked together with water pump, water tank, with inside polishing solution from apopore blowout and chip raw materials contact in the water tank, changes the operation mode of side liquid feeding in the past, shortens the time interval that polishing solution and chip raw materials accomplished the contact among the polishing process, guarantees polishing quality.

Description

Polishing and grinding device for LED chip production

Technical Field

The utility model relates to a LED chip production technical field specifically is a LED chip production is with polishing grinding device.

Background

An LED chip, also called a reflective chip, is the core component of an LED lamp, and its main function is to convert electrical energy into light energy, the main material of the chip is monocrystalline silicon, the semiconductor wafer is composed of two parts, one part is a P-type semiconductor, inside which holes dominate, and the other end is an N-type semiconductor, where electrons are mainly present, and when the two semiconductors are connected together, a P-N junction is formed between them, and when current is applied to the wafer through a wire, the electrons are pushed to the P-region, where they recombine with the holes, and then emit energy in the form of light.

Need pass through the polishing and grinding technology in the production process of LED chip, but current burnishing device is polishing solution in the polishing process and is all spraying through the side usually, and the mill of rotation state has certain the blockking to polishing solution, can prolong the time interval of polishing solution and LED chip contact, influences polishing quality to current burnishing device clamping time is longer, has certain influence to production efficiency.

SUMMERY OF THE UTILITY MODEL

Not enough to prior art, the utility model provides a LED chip production is with polishing grinding device possesses the short, the convenient advantage of clamping of time interval of polishing solution and LED chip contact, has solved the problem mentioned among the above-mentioned background art.

The utility model provides a following technical scheme: a polishing and grinding device for producing LED chips comprises a polishing box body, wherein a step pillar is fixedly arranged in the polishing box body, a support frame is fixedly sleeved on the top surface of the step pillar, a polishing table is fixedly connected to the top surface of the support frame, a water through groove is formed in the polishing table, a water outlet hole is formed in the top surface of the water through groove, a water pump is fixedly arranged on one side of the polishing table, a water tank is fixedly arranged on the other side of the water pump, a step through groove is formed in one side of the water outlet hole, the step through groove is formed in the polishing table, a positioning sleeve is movably sleeved in the step through groove, a small electric cylinder is fixedly arranged in the positioning sleeve, a movable plate is movably connected to the outer side of the positioning sleeve, a sleeve rod is arranged between one side of the movable plate and the inner wall of the, the top surface fixed mounting of mill has servo motor, servo motor's the fixed cover in bottom has connect the translucent cover, the top surface fixedly connected with synchronous servo electric jar of translucent cover, the fixed accepting frame that has cup jointed in the top outside of synchronous servo electric jar.

Carefully selecting, the polishing box is internally provided with a liquid storage cavity, and one side of the bottom of the polishing box is provided with a water outlet valve.

Carefully, fixed mounting has the inlet tube between water pump and the polishing platform, and fixed mounting has the pipe that absorbs water between water pump and the water tank, the water inlet has been seted up to the top surface of water tank, the delivery port has been seted up to the bottom of water tank.

Carefully, the outside swing joint of position sleeve has four fly leafs, and the inside contactless that the surface of position sleeve led to the groove with the step, the fixed cover of position sleeve connects at the top of small-size electric jar, small-size electric jar bottom surface fixedly connected with support, the support of small-size electric jar bottom surface is fixed to be cup jointed in the inside of support frame.

Carefully, the groove of stepping down has been seted up to one side of translucent cover, and the groove activity of stepping down of translucent cover one side cup joints the outside in inlet tube one end, the fixed outside of cup jointing at the mill of translucent cover.

And carefully selecting the water through grooves in a cross shape, wherein the depth value of the water through grooves is smaller than the thickness value of the polishing box body.

Compared with the prior art, the utility model discloses possess following beneficial effect:

1. the utility model discloses an inside water service tank of seting up of polishing platform is linked together with water pump, water tank, with inside polishing solution from apopore blowout and chip raw materials contact in the water tank, changes the operation mode of side liquid feeding in the past, shortens the time interval that polishing solution and chip raw materials accomplished the contact among the polishing process, guarantees polishing quality.

2. The utility model discloses a small-size electric jar drives position sleeve elevating movement and bulldozes the fly leaf, makes the fly leaf and the inner wall that the step led to the groove mutually support and carry out automatic clamping to the chip raw materials, shortens the clamping time, improves production efficiency to reduce staff's intensity of labour, improve the enthusiasm of work.

Drawings

FIG. 1 is a schematic sectional view of the structure of the present invention;

FIG. 2 is a schematic top view of the polishing table of the present invention;

FIG. 3 is an enlarged schematic view of the point A in the structure diagram of the present invention in FIG. 2;

FIG. 4 is a schematic cross-sectional view of the polishing table of the present invention;

fig. 5 is a front view of the structure moving plate of the present invention.

In the figure: 1. polishing the box body; 2. a step support; 3. a support frame; 4. a polishing table; 5. a water trough; 6. a water outlet hole; 7. a water inlet pipe; 8. a water pump; 9. a water tank; 10. a step through groove; 11. a small electric cylinder; 12. a positioning sleeve; 13. a movable plate; 14. chip raw materials; 15. a sleeved rod; 16. a grinding disc; 17. a servo motor; 18. a transparent cover; 19. a synchronous servo electric cylinder; 20. a water outlet valve; 21. a bearing frame.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-5, a polishing and grinding device for producing LED chips comprises a polishing case 1, a liquid storage cavity is formed in the polishing case 1, a water outlet valve 20 is disposed on one side of the bottom of the polishing case 1, the polishing liquid used in the processing process is temporarily stored in the liquid storage cavity formed in the polishing case 1, and is subsequently released and recycled through the water outlet valve 20, so as to reduce the processing cost, a step pillar 2 is fixedly mounted in the polishing case 1, a supporting frame 3 is fixedly sleeved on the top surface of the step pillar 2, a polishing table 4 is fixedly connected to the top surface of the supporting frame 3, a water through groove 5 is formed in the polishing table 4, the water through groove 5 is cross-shaped, the depth value of the water through groove 5 is smaller than the thickness value of the polishing case 1, the water through groove 5 is cross-shaped and can maximally include four step through grooves 10 on the top surface of the polishing table 4, the polishing device provides favorable conditions for achieving the purpose of shortening the time interval of contact between polishing solution and chip raw materials 14 in the polishing process, a water outlet hole 6 is formed in the top surface of a water through groove 5, a water pump 8 is fixedly installed on one side of a polishing table 4, a water tank 9 is fixedly installed on the other side of the water pump 8, a water inlet pipe 7 is fixedly installed between the water pump 8 and the polishing table 4, a water suction pipe is fixedly installed between the water pump 8 and the water tank 9, a water inlet is formed in the top surface of the water tank 9, a water outlet is formed in the bottom of the water tank 9, the water through groove 5 formed in the polishing table 4 is communicated with the water pump 8 and the water tank 9, the polishing solution in the water tank 9 is sprayed out from the water outlet hole 6 to be in contact with the chip raw materials 14, the conventional operation mode of side liquid adding is changed, the time interval of, the step through groove 10 is arranged inside the polishing table 4, the positioning sleeve 12 is movably sleeved inside the step through groove 10, the small electric cylinder 11 is fixedly installed inside the positioning sleeve 12, the movable plate 13 is movably connected to the outer side of the positioning sleeve 12, the four movable plates 13 are movably connected to the outer side of the positioning sleeve 12, the surface of the positioning sleeve 12 is not in contact with the inside of the step through groove 10, the positioning sleeve 12 is fixedly sleeved on the top of the small electric cylinder 11, the support is fixedly connected to the bottom surface of the small electric cylinder 11, the support on the bottom surface of the small electric cylinder 11 is fixedly sleeved inside the support frame 3, the movable plate 13 is pushed and pressed by the positioning sleeve 12 through the lifting motion of the small electric cylinder 11, the movable plate 13 is matched with the inner wall of the step through groove 10 to automatically clamp the chip raw material 14, the clamping time is shortened, the production efficiency is improved, the labor intensity, be provided with between one side of fly leaf 13 and the inner wall that the groove 10 was led to the step and

cup joint pole

15, 4 top surfaces of polishing platform are provided with mill 16, the top surface fixed mounting of mill 16 has servo motor 17, servo motor 17's bottom is fixed to cup joint has translucent cover 18, the groove of stepping down has been seted up to one side of translucent cover 18, and the groove activity of stepping down of translucent cover 18 one side cup joints in the outside of inlet tube 7 one end, translucent cover 18 is fixed to be cup jointed in the outside of mill 16, shelter from the polishing solution that erupts in the course of working through translucent cover 18, and transparent material also favourable processing is observed, the top surface fixedly connected with synchronous servo electric jar 19 of translucent cover 18, the top outside of synchronous servo electric jar 19 is fixed.

The working principle is as follows: when the small electric jar is used, the movable plate 13 moves along the direction far away from the inner wall of the step through groove 10, then the chip raw material 14 is vertically placed between one side of the movable plate 13 and the inner wall of the step through groove 10, the bottom surface of the chip raw material 14 contacts the step surface inside the step through groove 10, two sides of the chip raw material 14 are tightly contacted with the surface of the sleeving rod 15, after the completion, the movable plate 13 is pushed along the direction close to the inner wall of the step through groove 10, the pushing is stopped when one side of the movable plate 13 moves to be attached to the surface of one side of the chip raw material 14, three mounting structures left inside the step through groove 10 are sequentially placed into the single chip raw material 14 according to the steps, after the completion, the small electric jar 11 is started, the telescopic rod inside the small electric jar 11 drives the positioning sleeve 12 to ascend at a constant speed, four protruded end surfaces, then accomplish the automatic clamping to chip raw materials 14, after the installation, start synchronous servo electric jar 19, lower mill 16 and translucent cover 18, and make the bottom surface of mill 16 contact the top surface of chip raw materials 14, then start water pump 8, carry the polishing solution in the water tank 9 to the inside water trough 5 of polishing platform 4 through the inlet tube 7 of the suction pipe of water pump 8 one side and opposite side, and spout through apopore 6, contact chip raw materials 14, start servo motor 17 afterwards, it polishes to drive the rotatory top surface to chip raw materials 14 of mill 16, can.

It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Simultaneously in the utility model discloses an in the drawing, fill the pattern and just do not do any other injecions for distinguishing the picture layer.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a LED chip production is with polishing grinding device, includes polishing box (1), its characterized in that: the polishing device is characterized in that a step pillar (2) is fixedly mounted inside the polishing box body (1), a support frame (3) is fixedly sleeved on the top surface of the step pillar (2), a polishing table (4) is fixedly connected to the top surface of the support frame (3), a water through groove (5) is formed in the polishing table (4), a water outlet hole (6) is formed in the top surface of the water through groove (5), a water pump (8) is fixedly mounted on one side of the polishing table (4), a water tank (9) is fixedly mounted on the other side of the water pump (8), a step through groove (10) is formed in one side of the water outlet hole (6), the step through groove (10) is formed in the polishing table (4), a positioning sleeve (12) is movably sleeved on the inside of the step through groove (10), a small electric cylinder (11) is fixedly mounted on the inside of the positioning sleeve (12), and a movable plate (13) is, be provided with between one side of fly leaf (13) and the inner wall that the groove (10) was led to the step and cup jointed pole (15), polishing platform (4) top surface is provided with mill (16), the top surface fixed mounting of mill (16) has servo motor (17), the bottom of servo motor (17) is fixed to be cup jointed transparent cover (18), the top surface fixedly connected with synchronous servo electric jar (19) of transparent cover (18), the top outside of synchronous servo electric jar (19) is fixed to be cup jointed and is accepted frame (21).

2. The polishing and grinding device for producing the LED chip as claimed in claim 1, wherein: the polishing box body (1) is internally provided with a liquid storage cavity, and one side of the bottom of the polishing box body (1) is provided with a water outlet valve (20).

3. The polishing and grinding device for producing the LED chip as claimed in claim 1, wherein: the polishing machine is characterized in that a water inlet pipe (7) is fixedly installed between the water pump (8) and the polishing table (4), a water suction pipe is fixedly installed between the water pump (8) and the water tank (9), a water inlet is formed in the top surface of the water tank (9), and a water outlet is formed in the bottom of the water tank (9).

4. The polishing and grinding device for producing the LED chip as claimed in claim 1, wherein: the outside swing joint of position sleeve (12) has four fly leaves (13), and the inside contactless that the surface and the step of position sleeve (12) led to groove (10), the fixed cover of position sleeve (12) connects at the top of small-size electric jar (11), small-size electric jar (11) bottom surface fixedly connected with support, the support of small-size electric jar (11) bottom surface is fixed to be cup jointed in the inside of support frame (3).

5. The polishing and grinding device for producing the LED chip as claimed in claim 1, wherein: the water inlet pipe is characterized in that a yielding groove is formed in one side of the transparent cover (18), the yielding groove in one side of the transparent cover (18) is movably sleeved on the outer side of one end of the water inlet pipe (7), and the transparent cover (18) is fixedly sleeved on the outer side of the grinding disc (16).

6. The polishing and grinding device for producing the LED chip as claimed in claim 1, wherein: the water trough (5) is in a cross shape, and the depth value of the water trough (5) is smaller than the thickness value of the polishing box body (1).