CN201174378Y - Glue filling mould of semiconductor chip - Google Patents
Glue filling mould of semiconductor chip Download PDFInfo
- Publication number
- CN201174378Y CN201174378Y CNU200720064858XU CN200720064858U CN201174378Y CN 201174378 Y CN201174378 Y CN 201174378Y CN U200720064858X U CNU200720064858X U CN U200720064858XU CN 200720064858 U CN200720064858 U CN 200720064858U CN 201174378 Y CN201174378 Y CN 201174378Y
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- Prior art keywords
- core rod
- die
- mould
- metal material
- soft material
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- Expired - Fee Related
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- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
The utility model provides a glue pouring die which has a metal and plastic combined structure. The die comprises an upper die and a lower die, wherein die cores of the upper die and the lower die and a die holder are an integral part, and the die core is formed by a combined structure made of a metal material and a plastic flexible material. The die core body is made of the metal material. The die core body and the die holder which are connected together are an integrated structure of the metal material. A layer of a plastic flexible body material is covered on the outside of the die core body. The plastic flexible body material can be spray plated or brush plated on the metal material surface of the die core body. The plastic flexible body material can be FR engineering plastic such as polyfluortetraethylene plastic and the like, or PA engineering plastic such as nylon 66, PPA, PA6T, and the like.
Description
Technical field
The utility model relates to a kind of moulds of industrial equipment of processing technology of semiconductor device, refer in particular to a kind of chip encapsulating mould of power electronics silicon-controlled device, technology of the present utility model is mainly used in the chip encapsulating treatment process of high-power silicon controlled rectifier device, and the chip encapsulating that also can be used for other semiconductor element is handled.Belong to the power electronics technical field of manufacturing semiconductors.
Background technology
On the chip surface of many semiconductor device, it is outer to have a circle table top, work in-process to carry out the table top encapsulating to it to handle.In powerful thyristor of tradition and the diode chip for backlight unit processing, handling for the table top encapsulating all is to finish by a machine.But what the table top encapsulating mould of traditional compression joint type semiconductor chip adopted is the core rod of pure polytetrafluoroethylene, the core rod of pure polytetrafluoroethylene is installed in up and down on the die holder again, and core rod and die holder are two body structures.The encapsulating mould core and the die holder of this two body structures are what to separate, core rod can arbitrarily be changed, but because core rod all adopts plastic production, and core rod must have certain thickness when making, therefore be easy to occur cushion rubber size instability, superficial makings is not good enough, and easily strike-through and core rod are crossed problems such as low useful life.Therefore, in the table top encapsulating processing of traditional compression joint type semiconductor chip, need often carry out the replacing of core rod.(patent No. is ZL 98241698.9 to Chinese patent; Name is called " the semiconductor glue-pouring device of architecture advances ") a kind of semiconductor glue-pouring device of architecture advances disclosed, it is characterized in that architrave outside the both sides of mould, be horizontally set with a retaining edge with horizontal direction, and cooperate a pair of groove of answering of this retaining edge punch forming on lead frame, and make the groove side of lead frame have a deflection; When in lead frame is positioned over mould, carrying out encapsulating, the deflection of lead frame grooves on two sides can prevent that the colloidal sol of high pressure injection is from mould two side leakage glue, and stop the direct high pressure of colloidal sol to strike the retaining edge of mould in advance, and can significantly improve the useful life of mould retaining edge.But do not relate to the problem of materials of core rod, do not consider the structure of core rod yet.(number of patent application is 200620106825.2 to Chinese patent application; Name is called " oscillatory type vacuum glue filling bench ") a kind of oscillatory type vacuum glue filling bench also disclosed, comprise body and be arranged on the body and connect the vacuum chamber of vacuum pump, the vacuum chamber top is provided with by power set and drives the cover plate assembly that opens and closes, the vacuum chamber below is provided with vibrator, acting in conjunction by vacuum chamber and vibrator is to reach the purpose of carrying out encapsulating under vacuum and vibration condition, what be provided with in the vacuum chamber makes radially rotation and axially movable plastic container and is located at the bottom by handling the assembly drive, can just carry out, the workpiece rotating disk of counter-rotating, make encapsulating more flexible, fast, and can obtain better obturation behind the encapsulating and not hinder components and parts, glue-pouring device after the improvement has reliable in structure, simple to operate, it is convenient to clean, the encapsulating cost is low, the advantage that efficient is high.But this patent does not have the structure and material problem of the core rod of consideration yet.Therefore necessary this is further studied.
The utility model content
The purpose of this utility model is in handling at the table top encapsulating of new semiconductor device chip, and the existing deficiency of core rod proposes a kind of table top encapsulating processing mould that can effectively prolong the semiconductor device chip in core rod useful life.
The purpose of this utility model is achieved through the following technical solutions: a kind of table top encapsulating mould of semiconductor element chip, the table top encapsulating mould of described semiconductor element chip is the mould of a kind of metal and plastics composite construction, mould comprises counterdie and patrix, the core rod of counterdie and patrix and die holder are single piece, and core rod is made of metal material and plastics soft material composite construction.The body of core rod is a metal material, the body of core rod and die holder are the metal material integrative-structures that links together, appearance at the body of core rod is coated with one deck plastics soft material, its plastics soft material can be that spraying plating or brush plating are on the body metal material surface of core rod, the plastics soft material can be fluororesin (FR) class engineering plastics, as polytetrafluoroethylplastic plastic etc., also can be nylon (PA) class engineering plastics, as nylon 66, PPA, PA6T etc.
Table top encapsulating processing method according to semiconductor element chip of the present utility model, for when the chip table encapsulating is handled, by having adopted core rod and die holder integral structure, and core rod has adopted metal material and plastics soft material composite construction, its core rod is under the prerequisite that guarantees its surperficial flexibility, can effectively improve the quality of cushion rubber, especially improve core rod useful life, reduce the replacing number of times of core rod.This encapsulating processing mode is compared with conventional art, and characteristics are as follows:
1, the glue-pouring method of plastic-blasting core rod can be realized the basic demand of encapsulating.
2, the shape of cushion rubber is stable, and size is accurate.
3, to the sealing in slit be improved significantly, easy to leak glue not.
4, to be significantly increased than traditional method the useful life of core rod.
5, the cost of core rod plastic-blasting is lower, and the steady quality of processing is reliable.
Description of drawings
Fig. 1 is a three-dimensional decomposition principle schematic diagram of the present utility model;
Fig. 2 is the structural representation view of an embodiment of the utility model.
Among the figure: 1, chip, 2, patrix, 3, counterdie, 4, fastening nut, 5, gum-injecting port.
Embodiment
The utility model will be further described below in conjunction with drawings and Examples.
The utility model relates to a kind of table top encapsulating processing method of semiconductor element chip as seen in Figure 1, and described encapsulating processing method is that the mould by cover core rod and a die holder one metal and a plastics composite construction carries out the encapsulating processing to the table top of semiconductor element chip.Specifically, it is that chip 1 is installed between the patrix 2 and counterdie 3 that is made of metal and plastics composite construction that described encapsulating is handled, with fastening nut 4 reinforcings slots close is fitted again, inject specific glue from gum-injecting port 5, chip is taken out in the demoulding behind hot setting.Wherein, described chip 1 is a part to be processed, and chip 1 need be installed between patrix 2 and the counterdie 3, and by fastening nut 4 reinforcings the slots close between patrix 2 and the counterdie 3 is fitted, inject specific glue from gum-injecting port 5 again, chip is taken out in the demoulding behind hot setting; Described upper die and lower die are to be used to form die cavity, are the moulds of industrial equipment of finishing the encapsulating operation of given shape and size, and upper die and lower die are with core rod and die holder and are one, and core rod is made of metal and plastics composite construction.
Embodiment one
As shown in Figure 2, the table top encapsulating of a kind of metal and plastics composite construction is handled mould, comprise patrix 2 and counterdie 3, the core rod of patrix 2 and counterdie 3 and die holder are single piece, and the core rod of patrix 2 and counterdie 3 all is made of metal material and plastics soft material composite construction.The body of core rod is a metal material, the body of core rod and die holder be link together for the metal material integrative-structure, appearance at the body of core rod is coated with one deck plastics soft material, its plastics soft material is that spraying plating is on the body metal material surface of core rod, about 10～30 μ m of plastics soft material coating, the plastics soft material is a polytetrafluoroethylplastic plastic.Be equipped with fastening nut 4 and gum-injecting port 5 on patrix 2, fastening nut 4 tightens together patrix 2 and counterdie 3 when the table top encapsulating is handled, and gum-injecting port 5 is used for potting compound.
Embodiment two
As shown in Figure 2, the table top encapsulating of a kind of metal and plastics composite construction is handled mould, comprises patrix 2 and counterdie 3, and the core rod of patrix 2 and counterdie 3 and die holder are single piece, and core rod is made of metal material and plastics soft material composite construction.The body of core rod is a metal material, the body of core rod and die holder are the metal material integrative-structures that links together, appearance at the body of core rod is coated with one deck plastics soft material, be characterized in: the plastics soft material is that brush plating is on the body metal material surface of core rod, the about 80 μ m of plastics soft material coating, the plastics soft material is nylon (PA) class engineering plastics, as nylon 66.
Embodiment three
As shown in Figure 2, the table top encapsulating of a kind of metal and plastics composite construction is handled mould, comprises patrix 2 and counterdie 3, and the core rod of patrix 2 and counterdie 3 and die holder are single piece, and core rod is made of metal material and plastics soft material composite construction.The body of core rod is a metal material, the body of core rod and die holder are the metal material integrative-structures that links together, appearance at the body of core rod is coated with one deck plastics soft material, be characterized in: the plastics soft material is that brush plating is on the body metal material surface of core rod, the about 50 μ m of plastics soft material coating, the plastics soft material is PPA or PA6T.
Claims (4)
1, a kind of mould encapsulating mould of semiconductor chip comprises counterdie and patrix, it is characterized in that: the core rod of described counterdie and patrix and die holder are single piece; The body of described core rod is a metal material, and the body of core rod and die holder are the metal material integrative-structures that links together, and is coated with one deck plastics soft material in the appearance of the body of core rod.
2, the mould encapsulating mould of semiconductor chip as claimed in claim 1, it is characterized in that: described plastics soft material be spraying plating or brush plating on the body metal material surface of core rod, the plastics soft material can be fluororesin (FR) class engineering plastics or nylon (PA) class engineering plastics.
3, the mould encapsulating mould of semiconductor chip as claimed in claim 1, it is characterized in that: described plastics soft material is a polytetrafluoroethylplastic plastic.
4, the mould encapsulating mould of semiconductor chip as claimed in claim 1, it is characterized in that: described plastics soft material is nylon 66, PPA or PA6T.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU200720064858XU CN201174378Y (en) | 2007-10-29 | 2007-10-29 | Glue filling mould of semiconductor chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU200720064858XU CN201174378Y (en) | 2007-10-29 | 2007-10-29 | Glue filling mould of semiconductor chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201174378Y true CN201174378Y (en) | 2008-12-31 |
Family
ID=40201504
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU200720064858XU Expired - Fee Related CN201174378Y (en) | 2007-10-29 | 2007-10-29 | Glue filling mould of semiconductor chip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201174378Y (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101964314A (en) * | 2010-08-21 | 2011-02-02 | 山东开元电子有限公司 | Self-calibration workpiece glue-pouring bonding method |
| CN109228080A (en) * | 2018-11-08 | 2019-01-18 | 大连理工大学 | A kind of two-plate mold of the moulding by casting for layer high molecule composite sheet |
-
2007
- 2007-10-29 CN CNU200720064858XU patent/CN201174378Y/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101964314A (en) * | 2010-08-21 | 2011-02-02 | 山东开元电子有限公司 | Self-calibration workpiece glue-pouring bonding method |
| CN109228080A (en) * | 2018-11-08 | 2019-01-18 | 大连理工大学 | A kind of two-plate mold of the moulding by casting for layer high molecule composite sheet |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20081231 Termination date: 20151029 |
|
| EXPY | Termination of patent right or utility model |