CN212064489U - Heat dissipation heat sink that integrated circuit board was used - Google Patents
Heat dissipation heat sink that integrated circuit board was used Download PDFInfo
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- CN212064489U CN212064489U CN202020803948.1U CN202020803948U CN212064489U CN 212064489 U CN212064489 U CN 212064489U CN 202020803948 U CN202020803948 U CN 202020803948U CN 212064489 U CN212064489 U CN 212064489U
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- circuit board
- integrated circuit
- board body
- cooling
- heat
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Abstract
The utility model relates to a heat dissipation heat sink that integrated circuit board used, including coolant tank and integrated circuit board body, the equal fixed mounting in both sides of integrated circuit board body has the slider, and the last fixed mounting of coolant tank has the install bin, and coolant tank one side fixed mounting has the mounting bracket, and fixed mounting has the water pump in the mounting bracket, the beneficial effects of the utility model are that: heating panel and integrated circuit board body area of contact maximize, metal heat conduction is effectual, make the heat-sinking capability of integrated circuit board body obtain further promotion, the coolant liquid that drives in the coolant tank through the water pump simultaneously adsorbs the heat on the heating panel through the coolant liquid pipe circulation on the heating panel, make the heating panel can continuously absorb the heat on the integrated circuit board body and continuously dispel the heat, ensure that the integrated circuit board body can normal operating, avoid because the high temperature that the integrated circuit board body during operation produced leads to the integrated circuit board body to damage, influence the work efficiency of integrated circuit board body.
Description
[ technical field ] A method for producing a semiconductor device
The utility model relates to a heat dissipation heat sink, in particular to heat dissipation heat sink that integrated circuit board used belongs to circuit board processing technology field.
[ background of the invention ]
The integrated circuit board is a carrier for loading the integrated circuit, is generally applied to various electronic products, and can cause the integrated circuit board to generate heat due to long-term work of the electronic products, so that a cooling device is required to be used, the integrated circuit board can normally work, and the electronic products can normally run.
At present, the heat dissipation and cooling device for the integrated circuit board usually dissipates heat through a single fan, and the heat dissipation capability of the heat dissipation and cooling device is insufficient, so that the utility model provides a heat dissipation and cooling device for the integrated circuit board.
[ Utility model ] content
The utility model provides a heat dissipation heat sink that integrated circuit board was used for solve above-mentioned problem.
In order to solve the technical problem, the utility model provides a following technical scheme:
the utility model relates to a heat dissipation and cooling device for integrated circuit board, which comprises a cooling water tank and an integrated circuit board body, wherein both sides of the integrated circuit board body are fixedly provided with slide blocks, the cooling water tank is fixedly provided with an installation box, one side of the cooling water tank is fixedly provided with a mounting frame, a water pump is fixedly arranged in the mounting frame, the top end and the bottom end in the installation box are both provided with slide grooves, and two slide blocks are respectively connected in the two slide grooves in a sliding way, one side of the integrated circuit board body, which is close to the mounting frame, is provided with a heat dissipation plate, one side of the heat dissipation plate, which is far away from the integrated circuit board body, is fixedly provided with a cooling liquid conduit, and the heat dissipation plate is abutted against the integrated circuit board body, one side of the integrated circuit board body, the heat radiation fan is fixedly arranged in the installation box.
As a preferred technical scheme of the utility model, the install bin sets up to U type groove, just heating panel sliding connection is in the recess of install bin, the install bin is close to on coolant liquid pipe one side fixed mounting have a plurality of fixing bases, and a plurality of equal threaded connection has the fixed pin in the fixing base.
As a preferred technical scheme of the utility model, all be provided with water inlet and delivery port on water pump and the coolant tank, water inlet on the water pump and the delivery port intercommunication on the coolant tank, water pump delivery port department fixed mounting has the connecting pipe, just one side threaded connection of water pump is kept away from to connecting pipe on the water pump has flange, one side threaded connection that flange kept away from connecting pipe on the water pump is on the coolant liquid pipe, one side that flange was kept away from to the coolant liquid pipe communicates with coolant tank's water inlet.
As an optimal technical scheme of the utility model, install bin upper portion and be provided with the vent, and install the filter screen in the vent.
As an optimized technical scheme of the utility model, the coolant liquid pipe is a plurality of S types and heating panel fixed connection on the heating panel.
As an optimal technical scheme of the utility model, one side hinge connection of install bin has the dodge gate.
The utility model discloses the beneficial effect who reaches is: the air in the installation box is discharged through the rotation of the cooling fan, and the vent sucks new air, so that a ventilation state is formed between the inside of the installation box and the outside, the integrated circuit board body is ventilated and cooled, and the integrated circuit board body can normally work.
Through heating panel and integrated circuit board body area of contact maximize, metal heat conduction is effectual, make the heat-sinking capability of integrated circuit board body obtain further promotion, the coolant liquid in the water pump drive coolant tank passes through the heat on the cooling panel is adsorbed in the circulation of coolant liquid pipe on the heating panel simultaneously, make the heating panel can continuously absorb the heat on the integrated circuit board body and continuously dispel the heat, ensure that the integrated circuit board body can normal operating, avoid because the high temperature that the integrated circuit board body during operation produced leads to the integrated circuit board body to damage, influence the work efficiency of integrated circuit board body.
[ description of the drawings ]
The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention, and together with the description serve to explain the invention and not to limit the invention. In the drawings:
fig. 1 is a schematic structural view of a heat dissipation and cooling device for an integrated circuit board according to the present invention;
fig. 2 is a schematic front view of a heat dissipation and cooling device for an integrated circuit board according to the present invention;
fig. 3 is a schematic side view of a heat dissipation and cooling device for an integrated circuit board according to the present invention;
fig. 4 is a schematic structural view of the middle vent and the filter screen of the present invention.
In the figure: 1. a cooling water tank; 2. a mounting frame; 3. a water pump; 4. a connecting flange; 5. a heat dissipation plate; 6. a fixed seat; 7. a fixing pin; 8. a chute; 9. a protective cover; 10. a vent; 11. installing a box; 12. a heat radiation fan; 13. a slider; 14. an integrated circuit board body; 15. a coolant conduit; 16. a movable door; 17. and (5) filtering by using a filter screen.
[ detailed description ] embodiments
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Example (b): as shown in fig. 1-4, a heat dissipation and cooling device for an integrated circuit board comprises a cooling water tank 1 and an integrated circuit board body 14, wherein two sides of the integrated circuit board body 14 are both fixedly provided with a slide block 13, the cooling water tank 1 is fixedly provided with an installation box 11, one side of the cooling water tank 1 is fixedly provided with an installation frame 2, the installation frame 2 is internally fixedly provided with a water pump 3, the top end and the bottom end in the installation box 11 are both provided with a chute 8, the two slide blocks 13 are respectively and slidably connected in the two chutes 8, one side of the integrated circuit board body 14 close to the installation frame 2 is provided with a heat dissipation plate 5, one side of the heat dissipation plate 5 far away from the integrated circuit board body 14 is fixedly provided with a cooling liquid conduit 15, the heat dissipation plate 5 abuts against the integrated circuit board body 14, one side of the integrated circuit board body 14 far away from the heat, the heat radiation fan 12 is fixedly installed in the installation case 11.
The water pump 3 and the cooling water tank 1 are both provided with a water inlet and a water outlet, the water inlet on the water pump 3 is communicated with the water outlet on the cooling water tank 1, the water outlet of the water pump 3 is fixedly provided with a connecting pipe, one side of the connecting pipe on the water pump 3, which is far away from the water pump 3, is in threaded connection with a connecting flange 4, one side of the connecting flange 4, which is far away from the connecting pipe on the water pump 3, is in threaded connection with a cooling liquid conduit 15, one side of the cooling liquid conduit 15, which is far away from the connecting flange 4, is communicated with the water inlet of the cooling water tank 1, the cooling liquid in the cooling water tank 1 is driven by the water pump 3 to circularly adsorb the heat on the cooling plate 5 through the cooling liquid conduit 15, so that the cooling plate 5 can continuously absorb the temperature on, the damage of the integrated circuit board body 14 caused by high temperature generated during the operation of the integrated circuit board body 14 is avoided, and the working efficiency of the integrated circuit board body 14 is prevented from being influenced.
Installing box 11 upper portion is provided with vent 10, and installs filter screen 17 in vent 10, drives the inside air escape of installing box 11 when being convenient for inside radiator fan 12 rotates through vent 10, reaches the effect to integrated circuit board body 14 ventilation cooling, and filter screen 17 avoids the dust in the air to flow into installing box 11 in, influences integrated circuit board body 14 ventilation cooling effect.
The cooling liquid guide pipe 15 is a plurality of S-shaped on the heat dissipation plate 5 and is fixedly connected with the heat dissipation plate 5, and the effect of heat dissipation and temperature reduction is further improved by increasing the contact area of the cooling liquid guide pipe 15 and the heat dissipation plate 5.
One side of the installation box 11 is hinged with a movable door 16, and the integrated circuit board body 14 is convenient to install and detach by opening the movable door 16.
Specifically, when the utility model is used, the air in the installation box 11 is discharged through the rotation of the cooling fan 12, the vent 10 sucks in new air, so that the inside of the installation box 11 and the outside form a ventilation state, the integrated circuit board body 14 is ventilated and cooled, the normal operation of the integrated circuit board body 14 is ensured, the contact area between the cooling plate 5 and the integrated circuit board body 14 is maximized, the metal heat conduction effect is good, the heat dissipation capability of the integrated circuit board body 14 is further improved, meanwhile, the water pump 3 drives the cooling liquid in the cooling water tank 1 to circularly adsorb the heat on the cooling plate 5 through the cooling liquid conduit 15, the cooling plate 5 can continuously absorb the heat on the integrated circuit board body 14 for continuous heat dissipation, the normal operation of the integrated circuit board body 14 is ensured, and the damage of the integrated circuit board body 14 caused by the high temperature generated when the integrated circuit board body 14 works is avoided, affects the operating efficiency of the integrated circuit board body 14;
carry in the fixing base 6 through fixed pin 7 screw thread even and form spacing fixed to heating panel 5 in the install bin 11, keep closely laminating between heating panel 5 and integrated circuit board body 14, ensure the radiating effect, convenient to detach changes heating panel 5 simultaneously, opens portable door 16 and is convenient for install and dismantle integrated circuit board body 14.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (6)
1. The heat dissipation and cooling device for the integrated circuit board is characterized by comprising a cooling water tank (1) and an integrated circuit board body (14), wherein sliders (13) are fixedly mounted on two sides of the integrated circuit board body (14), an installation box (11) is fixedly mounted on the cooling water tank (1), an installation frame (2) is fixedly mounted on one side of the cooling water tank (1), a water pump (3) is fixedly mounted in the installation frame (2), sliding grooves (8) are formed in the top end and the bottom end in the installation box (11), the two sliders (13) are respectively connected in the two sliding grooves (8) in a sliding manner, a cooling plate (5) is arranged on one side, close to the installation frame (2), of the integrated circuit board body (14), a cooling liquid guide pipe (15) is fixedly mounted on one side, far away from the integrated circuit board body (14), of the cooling plate (5), and heating panel (5) offset with integrated circuit board body (14), integrated circuit board body (14) are kept away from heating panel (5) one side and are provided with radiator fan (12), just radiator fan (12) are close to on one side of integrated circuit board body (14) joint have protective cover (9), radiator fan (12) fixed mounting is in install bin (11).
2. The heat dissipation and cooling device for the integrated circuit board as claimed in claim 1, wherein the mounting box (11) is configured as a U-shaped groove, the heat dissipation plate (5) is slidably connected in the groove of the mounting box (11), a plurality of fixing seats (6) are fixedly installed on one side of the mounting box (11) close to the coolant conduit (15), and a plurality of fixing pins (7) are screwed in the fixing seats (6).
3. The heat dissipation and cooling device for the integrated circuit board according to claim 1, wherein the water pump (3) and the cooling water tank (1) are both provided with a water inlet and a water outlet, the water inlet on the water pump (3) is communicated with the water outlet on the cooling water tank (1), the water outlet of the water pump (3) is fixedly provided with a connecting pipe, one side, away from the water pump (3), of the connecting pipe on the water pump (3) is in threaded connection with the connecting flange (4), one side, away from the connecting pipe on the water pump (3), of the connecting flange (4) is in threaded connection with the cooling liquid conduit (15), and one side, away from the connecting flange (4), of the cooling liquid conduit (15) is communicated with the water inlet of the cooling water tank (1).
4. The heat dissipation and cooling device for the integrated circuit board as claimed in claim 1, wherein a ventilation opening (10) is formed in the upper portion of the mounting box (11), and a filter screen (17) is installed in the ventilation opening (10).
5. The heat sink for an ic board as claimed in claim 1, wherein the coolant conduit (15) is formed in a plurality of S-shapes on the heat sink (5) and is fixedly connected to the heat sink (5).
6. The heat sink for the integrated circuit board as claimed in claim 1, wherein a movable door (16) is hinged to one side of the mounting box (11).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020803948.1U CN212064489U (en) | 2020-05-14 | 2020-05-14 | Heat dissipation heat sink that integrated circuit board was used |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020803948.1U CN212064489U (en) | 2020-05-14 | 2020-05-14 | Heat dissipation heat sink that integrated circuit board was used |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212064489U true CN212064489U (en) | 2020-12-01 |
Family
ID=73520676
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020803948.1U Active CN212064489U (en) | 2020-05-14 | 2020-05-14 | Heat dissipation heat sink that integrated circuit board was used |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212064489U (en) |
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2020
- 2020-05-14 CN CN202020803948.1U patent/CN212064489U/en active Active
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