CN213024257U

CN213024257U - Computer motherboard heat abstractor with dustproof effect

Info

Publication number: CN213024257U
Application number: CN202022381741.2U
Authority: CN
Inventors: 郑铮
Original assignee: Tangshan Normal University
Current assignee: Tangshan Normal University
Priority date: 2020-10-23
Filing date: 2020-10-23
Publication date: 2021-04-20
Anticipated expiration: 2030-10-23

Abstract

The utility model discloses a computer motherboard heat abstractor with dustproof effect, including lower casing, last casing and water pump, go up casing bottom in the middle of seted up first recess, and first recess is opening U font structure down, upward set up the second recess in the middle of the casing top, and the second recess is opening U font structure up, first recess inner wall top both ends all are provided with the crashproof pad with third recess inner wall below both ends, second recess opening part all is provided with the dust screen with fourth recess opening part, and the inside second driving motor that is provided with of dust screen on the fourth recess, the equal fixed mounting of first driving motor and second driving motor output has the impeller. This computer motherboard heat abstractor with dustproof effect, forced air cooling and water-cooling carry out dual heat dissipation, and the radiating effect is good, forms the circulation of air of being convenient for of heat dissipation channel, and the air current near the mainboard can be discharged smoothly under the effect of fan simultaneously.

Description

Computer motherboard heat abstractor with dustproof effect

Technical Field

The utility model relates to a computer motherboard technical field specifically is a computer motherboard heat abstractor with dustproof effect.

Background

The computer motherboard heat abstractor is a device for the cooling of computer motherboard, and the mainboard of computer can produce a large amount of heats when high-speed operation, leads to the too high influence computer operation of mainboard temperature, generally need install special radiator additional.

However, the existing computer motherboard heat dissipation device only dissipates heat through one fan, does not cooperate with water cooling to perform double heat dissipation, and is poor in heat dissipation effect, and meanwhile, due to the fact that air circulation is not smooth, hot air cannot be effectively discharged under the action of the fan, the temperature of a motherboard rises, so that the problem is solved by the computer motherboard heat dissipation device with the dustproof effect.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a computer motherboard heat abstractor with dustproof effect to solve present computer motherboard heat abstractor who proposes in the above-mentioned background art and only dispel the heat through a fan, do not cooperate the water-cooling to carry out dual heat dissipation, the radiating effect is relatively poor, current computer motherboard heat abstractor leads to the problem that the mainboard temperature risees because the circulation of air is not smooth to lead to hot-air can not effectual discharge under the effect of fan simultaneously.

In order to achieve the above object, the utility model provides a following technical scheme: a computer motherboard heat dissipation device with dustproof effect comprises a lower shell, an upper shell and a water pump, wherein a first groove is formed in the middle of the bottom of the upper shell, the first groove is of a U-shaped structure with a downward opening, a second groove is formed in the middle of the top of the upper shell, the second groove is of a U-shaped structure with an upward opening, a first driving motor is fixedly mounted in the middle of the inside of the second groove, a water tank is fixedly mounted on the right side of the top of the upper shell, the water pump is arranged on the right side of the water tank, the water pump is communicated with the water tank through a guide pipe, the output end of the water pump is fixedly connected with a water outlet pipe, one end of the water outlet pipe, which is far away from the water pump, is communicated with the inside of the upper shell, a water inlet of the water tank is fixedly connected with a water inlet pipe, the anti-collision device is characterized in that anti-collision pads are arranged at two ends above the upper portion of the first groove inner wall and at two ends below the lower portion of the third groove inner wall, dust screens are arranged at the positions of the second groove opening and the fourth groove opening, a second driving motor is arranged inside the dust screen on the fourth groove, and impellers are fixedly arranged at the output ends of the first driving motor and the second driving motor.

Preferably, go up casing bottom both ends and the equal fixed mounting in casing top both ends down and have the installed part, all be provided with the bolt hole on the installed part, and go up and pass through fastening bolt fixed connection between casing and the lower casing.

Preferably, the second groove and the fourth groove are both provided with auxiliary heat dissipation holes, one ends of the auxiliary heat dissipation holes are communicated with the second groove and the fourth groove, and the other ends of the auxiliary heat dissipation holes are communicated with the upper shell and the lower shell.

Preferably, a first connecting pipe is arranged below the left side of the upper shell, a rubber sealing plug is fixedly mounted at one end, located outside the upper shell, of the first connecting pipe, and a first mounting groove is formed below the right side of the upper shell.

Preferably, the left side of the lower shell is provided with a second mounting groove, the middle inside the second mounting groove is provided with a needle tube, the right side of the lower shell is provided with a second connecting tube, the second mounting groove is matched with the first connecting tube, and the second connecting tube is matched with the first mounting groove.

Preferably, the upper casing and the lower casing are both internally provided with heat dissipation holes, two ends of each heat dissipation hole positioned in the upper casing are respectively communicated with the second groove and the first groove, and two ends of each heat dissipation hole positioned in the lower casing are respectively communicated with the third groove and the fourth groove.

Compared with the prior art, the beneficial effects of the utility model are that: the computer mainboard heat dissipation device with the dustproof effect has the advantages that double heat dissipation is performed through air cooling and water cooling, the heat dissipation effect is good, a heat dissipation channel is formed, air circulation is facilitated, and meanwhile air flow near the mainboard can be smoothly discharged under the action of a fan;

1. the air cooling heat dissipation device is provided with a first groove, a second groove, a third groove and a fourth groove, a mainboard is placed in the third groove, the upper shell is connected with the lower shell through a fastening bolt, so that the mainboard is clamped by the first groove and the third groove, an anti-collision pad inside the first groove and the third groove prevents the mainboard from being damaged by the first groove and the third groove, a second driving motor inside the fourth groove dissipates heat of the mainboard through a heat dissipation hole inside the lower shell, external cold air is sucked from an auxiliary heat dissipation hole to increase the heat dissipation effect, airflow near the mainboard is discharged through the first driving motor inside the second groove, an air cooling heat dissipation channel is formed to fully dissipate heat to the outside, the heat dissipation strength of the mainboard is increased, and dust accumulation on the mainboard can be fully avoided through a dust screen arranged on the second groove and the fourth groove;

2. be equipped with the water pump, go up casing and lower casing, it passes through fastening bolt with lower casing to go up the casing and is connected, thereby the syringe needle pipe of casing pierces through the rubber sealing plug on the first connecting pipe down, the inlet tube pierces through the sealing plug of second connecting pipe, first mounting groove and first connecting pipe looks adaptation, second mounting groove and second connecting pipe looks adaptation, thereby go up the casing and form closed water-cooling channel with the internal portion of lower casing, realize the hydrologic cycle in the cooling tube through water tank and water pump, absorb the heat on the mainboard with higher speed, through be provided with louvre and supplementary louvre at water-cooling channel, utilize first driving motor and second driving motor to drive the air current and flow, dispel the heat through air-cooled and water-cooled dual cooperation, the.

Drawings

Fig. 1 is a schematic view of the front cross-sectional structure of the present invention;

FIG. 2 is a schematic view of the upper housing structure of the present invention;

fig. 3 is a schematic view of the lower housing structure of the present invention.

In the figure: 1. a lower housing; 2. fastening a bolt; 3. auxiliary heat dissipation holes; 4. an upper housing; 5. an impeller; 6. a dust screen; 7. a first drive motor; 8. a second groove; 9. a water pump; 10. a water tank; 11. a first groove; 12. a third groove; 13. a second drive motor; 14. a fourth groove; 15. heat dissipation holes; 16. a mounting member; 17. a water outlet pipe; 18. a first mounting groove; 19. a water inlet pipe; 20. a rubber sealing plug; 21. a first connecting pipe; 22. a second mounting groove; 23. a second connecting pipe; 24. an anti-collision pad; 25. a needle tube.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-3, the present invention provides a technical solution: a computer motherboard heat dissipation device with dustproof effect comprises a lower shell 1, an upper shell 4 and a water pump 9, wherein a first groove 11 is arranged in the middle of the bottom of the upper shell 4, the first groove 11 is of a U-shaped structure with a downward opening, a second groove 8 is arranged in the middle of the top of the upper shell 4, the second groove 8 is of a U-shaped structure with an upward opening, a first driving motor 7 is fixedly arranged in the middle of the inside of the second groove 8, a water tank 10 is fixedly arranged on the right side of the top of the upper shell 4, the water pump 9 is arranged on the right side of the water tank 10, the water pump 9 is communicated with the water tank 10 through a conduit, the output end of the water pump 9 is fixedly connected with a water outlet pipe 17, one end of the water outlet pipe 17, which is far away from the water pump 9, is communicated with the inside of the upper shell 4, a water inlet 19 is fixedly, and set up fourth recess 14 in the middle of lower casing 1 bottom, first recess 11 inner wall top both ends and third recess 12 inner wall below both ends all are provided with crashproof pad 24, and second recess 8 opening part and fourth recess 14 opening part all are provided with dust screen 6, and the inside second driving motor 13 that is provided with of dust screen 6 on the fourth recess 14, and the equal fixed mounting of first driving motor 7 and second driving motor 13 output has impeller 5.

As shown in FIG. 1, FIG. 2 and FIG. 3, both ends of the bottom of the upper housing 4 and both ends of the top of the lower housing 1 are fixedly provided with mounting members 16, the mounting members 16 are provided with bolt holes, the upper housing 4 is fixedly connected with the lower housing 1 through fastening bolts 2, both ends of the second groove 8 and the fourth groove 14 are provided with auxiliary heat dissipation holes 3, one end of each auxiliary heat dissipation hole 3 is communicated with the second groove 8 and the fourth groove 14, the other end of each auxiliary heat dissipation hole 3 is communicated with the upper housing 4 and the lower housing 1, the mainboard is placed in the third groove 12, the upper housing 4 is connected with the lower housing 1 through the fastening bolts 2, so that the first groove 11 and the third groove 12 clamp the mainboard, the first groove 11 and an anti-collision pad 24 in the third groove 12 prevent the first groove 11 and the third groove 12 from damaging the mainboard, the second driving motor 13 in the fourth groove 14 dissipates heat of the mainboard through the heat dissipation holes 15 in the lower housing 1, simultaneously with outside cold air from supplementary louvre 3 suction increase radiating effect, through the inside first driving motor 7 of second recess 8, with near the air current discharge of mainboard, form forced air cooling heat dissipation channel and fully dispel the heat to the external world, strengthened the radiating dynamics of mainboard, the dust screen 6 that second recess 8 and fourth recess 14 set up can fully avoid the accumulation of dust on the mainboard.

As shown in fig. 1, 2 and 3, a first connecting pipe 21 is arranged below the left side of the upper casing 4, a rubber sealing plug 20 is fixedly arranged at one end of the first connecting pipe 21 positioned outside the upper casing 4, a first mounting groove 18 is arranged below the right side of the upper casing 4, a second mounting groove 22 is arranged at the left side of the lower casing 1, a needle tube 25 is arranged in the middle of the inside of the second mounting groove 22, a second connecting pipe 23 is arranged at the right side of the lower casing 1, the second mounting groove 22 is matched with the first connecting pipe 21, the second connecting pipe 23 is matched with the first mounting groove 18, thereby casing 1's syringe needle pipe 25 pierces through rubber sealing plug 20 on the first connecting pipe 21 down, inlet tube 19 pierces through rubber sealing plug 20 of second connecting pipe 23, first mounting groove 18 and second connecting pipe 23 looks adaptation, second mounting groove 22 and first connecting pipe 21 looks adaptation, thereby go up casing 4 and casing 1 inside closed water-cooling channel that forms down, realize the hydrologic cycle in the cooling tube through water tank 10 and water pump 9, absorb the heat on the mainboard with higher speed, through be provided with louvre 15 and supplementary louvre 3 at water-cooling channel, utilize first driving motor 7 and second drive 13 motor to drive the air current and flow, dispel the heat through air-cooling and water-cooling dual cooperation, the radiating effect is good.

The working principle is as follows: when the computer motherboard heat dissipation device with the dustproof effect is used, as shown in fig. 1, fig. 2 and fig. 3, the motherboard is placed in the third groove 12, the upper shell 4 is connected with the lower shell 1 through the fastening bolt 2, so that the motherboard is clamped by the first groove 11 and the third groove 12, the crash pad 24 in the first groove 11 and the third groove 12 prevents the motherboard from being damaged by the first groove 11 and the third groove 12, the second driving motor 13 in the fourth groove 14 dissipates heat of the motherboard through the heat dissipation hole 15 in the lower shell 1, and sucks external cold air from the auxiliary heat dissipation hole 3 to increase the heat dissipation effect, exhausts the airflow near the motherboard through the first driving motor 7 in the second groove 8 to form an air cooling heat dissipation channel to fully dissipate heat to the outside, thereby increasing the heat dissipation strength of the motherboard, and the dust accumulation on the motherboard can be fully avoided by the dustproof net 6 arranged between the second groove 8 and the fourth groove 14, go up casing 4 and lower casing 1 and pass through fastening bolt 2 and be connected, thereby casing 1's syringe needle pipe 25 pierces through rubber sealing plug 20 on the first connecting pipe 21 down, inlet tube 19 pierces through rubber sealing plug 20 of second connecting pipe 23, first mounting groove 18 and second connecting pipe 23 looks adaptation, second mounting groove 22 and first connecting pipe 21 looks adaptation, thereby go up casing 4 and the inside closed water-cooling passageway that forms of casing 1 down, realize the hydrologic cycle in the cooling pipe through water tank 10 and water pump 9, absorb the heat on the mainboard with higher speed, through be provided with louvre 15 and supplementary louvre 3 at water-cooling passageway, utilize first driving motor 7 and second drive 13 motor to drive the air current and flow, through the dual water-cooling cooperation heat dissipation of forced air cooling and water-cooling, the radiating effect is good, this is exactly the whole process that computer motherboard heat abstractor module device who has dustproof effect uses.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a computer motherboard heat abstractor with dustproof effect, includes casing (1) down, goes up casing (4) and water pump (9), its characterized in that: the water pump is characterized in that a first groove (11) is formed in the middle of the bottom of the upper shell (4), the first groove (11) is of a U-shaped structure with a downward opening, a second groove (8) is formed in the middle of the top of the upper shell (4), the second groove (8) is of a U-shaped structure with an upward opening, a first driving motor (7) is fixedly mounted in the middle of the inner portion of the second groove (8), a water tank (10) is fixedly mounted on the right side of the top of the upper shell (4), a water pump (9) is arranged on the right side of the water tank (10), the water pump (9) is communicated with the water tank (10) through a guide pipe, an output end of the water pump (9) is fixedly connected with a water outlet pipe (17), one end, far away from the water pump (9), of the water outlet pipe (17) is communicated with the inner portion of the upper shell (4), a water inlet, the improved dustproof structure is characterized in that a third groove (12) is formed in the middle of the top of the lower shell (1), a fourth groove (14) is formed in the middle of the bottom of the lower shell (1), anti-collision pads (24) are arranged at two ends above the inner wall of the first groove (11) and at two ends below the inner wall of the third groove (12), dustproof nets (6) are arranged at openings of the second groove (8) and the fourth groove (14), a second driving motor (13) is arranged inside the dustproof nets (6) on the fourth groove (14), and impellers (5) are fixedly mounted at output ends of the first driving motor (7) and the second driving motor (13).

2. The heat sink with dust-proof effect for computer motherboard according to claim 1, wherein: go up casing (4) bottom both ends and the equal fixed mounting in casing (1) top both ends down have installed part (16), all be provided with the bolt hole on installed part (16), and go up and pass through fastening bolt (2) fixed connection between casing (4) and lower casing (1).

3. The heat sink with dust-proof effect for computer motherboard according to claim 1, wherein: and auxiliary heat dissipation holes (3) are formed in two ends of the second groove (8) and the fourth groove (14), one ends of the auxiliary heat dissipation holes (3) are communicated with the second groove (8) and the fourth groove (14), and the other ends of the auxiliary heat dissipation holes (3) are communicated with the upper shell (4) and the lower shell (1).

4. The heat sink with dust-proof effect for computer motherboard according to claim 1, wherein: a first connecting pipe (21) is arranged below the left side of the upper shell (4), a rubber sealing plug (20) is fixedly mounted at one end, located outside the upper shell (4), of the first connecting pipe (21), and a first mounting groove (18) is formed below the right side of the upper shell (4).

5. The heat sink with dust-proof effect for computer motherboard according to claim 1, wherein: the left side of the lower shell (1) is provided with a second mounting groove (22), the middle inside the second mounting groove (22) is provided with a needle tube (25), the right side of the lower shell (1) is provided with a second connecting pipe (23), the second mounting groove (22) is matched with the first connecting pipe (21), and the second connecting pipe (23) is matched with the first mounting groove (18).

6. The heat sink with dust-proof effect for computer motherboard according to claim 1, wherein: the upper casing (4) and the lower casing (1) are internally provided with heat dissipation holes (15), two ends of each heat dissipation hole (15) located inside the upper casing (4) are respectively communicated with the second groove (8) and the first groove (11), and two ends of each heat dissipation hole (15) located inside the lower casing (1) are respectively communicated with the third groove (12) and the fourth groove (14).