CN212012618U - Detachable wireless communication module structure and wireless communication equipment - Google Patents

Abstract

The utility model discloses a detachable wireless communication module structure and wireless communication equipment, wherein the wireless communication module structure comprises a circuit board, a shielding cover, a heat dissipation unit, at least one module interface and a plurality of positioning holes; a plurality of positioning holes are distributed on the circuit board; the module interface and the shielding case are fixedly arranged on a first board surface of the circuit board, and the heat dissipation unit is arranged on a second board surface of the circuit board; the circuit board is electrically connected with the target board through the module interface. The utility model can facilitate the module manufacturer and the client to flexibly replace the module; the client does not need to carry out secondary surface mounting on the module, so that the cost is reduced; the design cost for developing the TE adapter plate by a module manufacturer is reduced; the problem of poor module heat dissipation is solved; the cost for manufacturing the PINTEST clamp is saved; the module interfaces are centralized, the probability of ESD/EOS problems is reduced, and the condition that the module is in malfunction due to damage of the module is avoided.

Description

Detachable wireless communication module structure and wireless communication equipment

Technical Field

The utility model relates to a module design technical field, in particular to detachable wireless communication modular structure and wireless communication equipment.

Background

Modules produced by existing module manufacturers are packaged by LGA (land grid array) or LCC (chip on chip) and LGA, and these modules are assembled on a mainboard of a customer by being subjected to secondary oven-through for mounting.

The following describes the problems of the existing module design scheme in detail with reference to the module manufacturer side and the client side:

for the module vendor side: (1) in the research and development and debugging process, a developer must use a TE adapter plate (a kind of adapter plate) to weld a module to the TE adapter plate and then connect the module to an EVB plate (evaluation plate), which is complicated in connection process and may cause signal transmission incompleteness; (2) when a module manufacturer researches and develops a module, a special clamp for designing the module is needed to carry out pin test (pin test), the problem of high cost exists, and the condition of poor contact between a bottom pad of the module and an ejector pin of the clamp often occurs when the clamp is used for carrying out the test, so that the test failure condition is caused; (3) when the module is subjected to chip mounting, if heat-conducting silica gel or heat-conducting silicone grease is added between a heat source such as a Central Processing Unit (CPU), a Power Management Unit (PMU), a Power Amplifier (PA) and the like and a shielding cover to enhance the heat dissipation function of the module, the module cannot be subjected to secondary chip mounting because the furnace temperature can reach about 240 ℃ during furnace passing, the silica gel and the silicone grease are likely to be melted due to too high furnace temperature, and finally the expected heat dissipation effect cannot be achieved. (4) Due to the fact that the number of PINs of the module is large and the PINs are scattered, the problems of production and use of the module, such as ESD (electrostatic discharge)/EOS (excessive electrical stress), are easily caused, the module is damaged, and even the module fails to function.

For the client: the customer generally attaches the module to the customer motherboard by way of secondary attachment. When the module needs to be replaced during maintenance or update iteration, the module must be blown off by a large air gun and then welded to a mainboard of a client, and the operation process is very complicated.

SUMMERY OF THE UTILITY MODEL

The to-be-solved technical problem of the utility model is to have no matter at module manufacturer end or the defect that the customer end can't satisfy the in-service use demand effectively in order to overcome the module design among the prior art, aim at provides a detachable wireless communication modular structure and wireless communication equipment.

The utility model discloses an above-mentioned technical problem is solved through following technical scheme:

the utility model provides a detachable wireless communication module structure, which comprises a circuit board, a shielding cover, a heat dissipation unit, at least one module interface and a plurality of positioning holes;

the positioning holes are distributed on the circuit board;

the circuit board is fixed on the target board by penetrating through the positioning hole through a detachable screw structure;

the module interface and the shielding case are fixedly arranged on a first board surface of the circuit board, and the heat dissipation unit is arranged on a second board surface of the circuit board;

the circuit board is electrically connected with the target board through the module interface.

Preferably, the module interface includes a ZIF (Zero Insertion Force) connector or a B2B (Board to Board) connector or a Pin header connector.

Preferably, the module interface is connected to the target board using FPC (flexible circuit board) routing.

Preferably, different functional pins are arranged on the circuit board;

each of the module interfaces is electrically connected to at least one of the function pins on the circuit board.

Preferably, when the circuit board and the shielding case are both of a square structure, and the wireless communication module structure includes four module interfaces and four positioning holes, the four module interfaces are respectively arranged around the shielding case, and the four positioning holes are respectively arranged at four vertex angles of the circuit board.

Preferably, the heat source device on the circuit board and under the shielding case is filled with heat-conducting silica gel or heat-conducting silicone grease.

Preferably, the target board comprises an EVB board of a template manufacturer end or a main board of a client end.

Preferably, the heat dissipation unit is a copper exposure area;

when the circuit board is fixedly connected with the mainboard of the client, the copper-exposed area is filled with the mainboard of the client through heat-conducting silica gel or heat-conducting silicone grease.

The utility model also provides a wireless communication equipment, wireless communication equipment includes foretell detachable wireless communication modular structure.

The utility model discloses an actively advance the effect and lie in:

(1) through the design of the positioning holes, the whole module structure can be disassembled by combining with a screw structure, and a module manufacturer and a module customer can conveniently and flexibly replace the module; the problem that the existing client needs to carry out secondary patch on the module is solved, so that the cost is reduced; TE adapter plates are not needed to be researched and developed by design module manufacturers, so that the design cost is reduced, and the situation that signal transmission is incomplete is avoided; the difficulty and cost of replacement and maintenance of the module are reduced; meanwhile, the cost for manufacturing the PINTEST clamp is saved, the method is suitable for testing the PINTEST function, and the condition of test failure is avoided; (2) the heat conducting silica gel or the heat conducting silicone grease is filled between the heat source device below the shielding case and the shielding case on the circuit board, so that the problem that the CPU performance cannot be exerted to the utmost extent due to poor module heat dissipation is solved, and the heat dissipation effect is improved; (3) the module interfaces are concentrated, the probability of ESD/EOS problems is reduced, the possibility of ESD/EOS generation of the module during production of a module manufacturer and use of a customer is reduced, and the condition that the module is damaged to cause malfunction of the module is avoided.

Drawings

Fig. 1 is a schematic structural diagram of a detachable wireless communication module structure according to embodiment 1 of the present invention.

Fig. 2 is a top view of the detachable wireless communication module structure according to embodiment 1 of the present invention.

Fig. 3 is a bottom view of the detachable wireless communication module structure according to embodiment 1 of the present invention.

Detailed Description

The present invention is further illustrated by way of the following examples, which are not intended to limit the scope of the invention.

Example 1

As shown in fig. 1, the detachable wireless communication module structure of the present embodiment includes a circuit board 1, at least one module interface 2, a plurality of positioning holes 3, a shielding case 4, and a heat dissipation unit 5.

A plurality of positioning holes 3 are arranged on the circuit board 1 (i.e., through holes on the circuit board), and the circuit board 1 is fixed on a target board by passing through the positioning holes 3 by means of a detachable screw structure.

Wherein, the circuit board is a PCB (printed circuit board); the target board comprises an EVB board at a template manufacturer end, a main board at a client end and the like.

Through the matching connection of the positioning holes and the screw structures, the whole wireless communication module structure can be flexibly installed and detached conveniently at a module manufacturer end and a client end.

The module interface 2 is fixedly arranged on one side or a first plate surface (upper surface) of the circuit board 1, and the circuit board 1 is electrically connected with the target board through the module interface 2.

Specifically, the module interface 2 includes, but is not limited to, a ZIF connector, a B2B connector, a Pin header connector, while the module interface 2 is connected with a target board using FPC traces.

In addition, different functional pins are arranged on the circuit board;

each module interface is electrically connected to at least one functional pin on the circuit board.

After the function pin is connected with the module interface electricity, the function pin that connects includes: vbat (battery voltage) power interface, Powerkey, Reset, GPIO (general purpose input/output) interface, ADC (analog-to-digital conversion) interface, high-speed bus interface, and the like; the high-speed bus interface includes an SPI (serial peripheral interface) bus interface, a USB2.0/USB3.0 (universal serial bus) interface, a USIM (universal subscriber identity module) card interface, an SD (secure digital) bus interface, an SDIO (secure digital input/output card) bus interface, an HSIC (inter-chip interconnection standard) bus interface, a PCM (pulse code modulation) bus interface, a Uart (universal asynchronous receiver transmitter) bus interface, an SGMII (serial gigabit media independent interface) bus interface, and the like.

The shield case 4 is provided on the upper surface, i.e., the first plate surface, of the circuit board 1.

Preferably, as shown in fig. 2, when the circuit board 1 and the shielding case 4 are both of a square structure, and the wireless communication module structure includes four module interfaces 2 and four positioning holes 3, the four module interfaces 2 are respectively disposed around the shielding case 4, and the four positioning holes 3 are respectively disposed at four vertex angles of the circuit board 1 (that is, the circuit board is fixed by means of a four-corner locking screw at this time).

The number and the layout positions of the module interfaces, the number and the layout positions of the positioning holes can be designed and adjusted according to actual requirements.

The heat source device below the shielding case 4 on the circuit board 1 is filled with the shielding case 4 through heat-conducting silica gel or heat-conducting silicone grease, so that the heat dissipation at the chip level is effectively reduced, and the heat dissipation effect of the wireless communication module structure is improved.

Heat source devices include, but are not limited to, CPU, PMU, PA, among others.

As shown in fig. 3, the heat dissipating unit 5 is disposed on the other side or second plate surface (bottom) of the circuit board 1.

Preferably, the heat dissipation unit 5 is a copper-exposed area. When the circuit board 1 is fixedly connected with the mainboard of the client, the exposed copper area and the mainboard of the client are filled with heat-conducting silica gel or heat-conducting silicone grease, so that the heat dissipation capability of the module can be greatly enhanced, and the heat dissipation effect of the wireless communication module structure is further improved.

Wherein, the size of the copper exposure area can be designed and adjusted according to the reality.

The utility model discloses in: (1) through the design of the positioning holes, the whole module structure can be disassembled by combining with a screw structure, and a module manufacturer and a module customer can conveniently and flexibly replace the module; the problem that the existing client needs to carry out secondary patch on the module is solved, so that the cost is reduced; TE adapter plates are not needed to be researched and developed by design module manufacturers, so that the design cost is reduced, and the situation that signal transmission is incomplete is avoided; the difficulty and cost of replacement and maintenance of the module are reduced; meanwhile, the cost for manufacturing the PINTEST clamp is saved, the method is suitable for testing the PINTEST function, and the condition of test failure is avoided; (2) the heat conducting silica gel or the heat conducting silicone grease is filled between the heat source device below the shielding case and the shielding case on the circuit board, so that the problem that the CPU performance cannot be exerted to the utmost extent due to poor module heat dissipation is solved, and the heat dissipation effect is improved; (3) the module interfaces are concentrated, the probability of ESD/EOS problems is reduced, the possibility of ESD/EOS generation of the module during production of a module manufacturer and use of a customer is reduced, and the condition that the module is damaged to cause malfunction of the module is avoided.

Example 2

The wireless communication apparatus of the present embodiment includes the detachable wireless communication module structure of embodiment 1.

The wireless communication device includes but is not limited to an internet of things wireless communication device, an industrial wireless communication device and a mobile phone.

In this embodiment, the wireless communication device includes a detachable wireless communication module structure, which improves the overall assembly efficiency of the wireless communication device.

Although specific embodiments of the present invention have been described above, it will be understood by those skilled in the art that this is by way of example only and that the scope of the invention is defined by the appended claims. Various changes and modifications to these embodiments may be made by those skilled in the art without departing from the spirit and the principles of the present invention, and these changes and modifications are all within the scope of the present invention.

Claims (9)

1. A detachable wireless communication module structure is characterized in that the wireless communication module structure comprises a circuit board, a shielding cover, a heat dissipation unit, at least one module interface and a plurality of positioning holes;

the positioning holes are distributed on the circuit board;

the circuit board is fixed on the target board by penetrating through the positioning hole through a detachable screw structure;

the module interface and the shielding case are fixedly arranged on a first board surface of the circuit board, and the heat dissipation unit is arranged on a second board surface of the circuit board;

the circuit board is electrically connected with the target board through the module interface.

2. A detachable wireless communication module structure as claimed in claim 1, wherein the module interface comprises a ZIF connector, a B2B connector, or a Pin header connector.

3. The detachable wireless communication module structure of claim 1, wherein the module interface is connected to the target board using FPC traces.

4. A detachable wireless communication module structure according to claim 1, wherein the circuit board is provided with different functional pins;

each of the module interfaces is electrically connected to at least one of the function pins on the circuit board.

5. The detachable wireless communication module structure of claim 1, wherein when the circuit board and the shielding case are both square, and the wireless communication module structure includes four module interfaces and four positioning holes, the four module interfaces are respectively disposed around the shielding case, and the four positioning holes are respectively disposed at four corners of the circuit board.

6. A detachable wireless communication module structure according to claim 1 or 5, wherein a space between the heat source device on the circuit board under the shield case and the shield case is filled with heat conductive silicone or heat conductive silicone grease.

7. The detachable wireless communication module structure of claim 1, wherein the target board comprises an EVB board of a template manufacturer side or a main board of a client side.

8. The detachable wireless communication module structure of claim 7, wherein the heat dissipation unit is a copper exposed area;

when the circuit board is fixedly connected with the mainboard of the client, the copper-exposed area is filled with the mainboard of the client through heat-conducting silica gel or heat-conducting silicone grease.

9. A wireless communication device, characterized in that it comprises a detachable wireless communication module structure according to any one of claims 1 to 8.

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