CN212011580U - Glass insulator and oxygen-free copper sealing structure - Google Patents
Glass insulator and oxygen-free copper sealing structure Download PDFInfo
- Publication number
- CN212011580U CN212011580U CN202020734705.7U CN202020734705U CN212011580U CN 212011580 U CN212011580 U CN 212011580U CN 202020734705 U CN202020734705 U CN 202020734705U CN 212011580 U CN212011580 U CN 212011580U
- Authority
- CN
- China
- Prior art keywords
- oxygen
- glass insulator
- free copper
- transition ring
- sealing structure
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 239000011521 glass Substances 0.000 title claims abstract description 47
- 239000012212 insulator Substances 0.000 title claims abstract description 43
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 40
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 40
- 239000010949 copper Substances 0.000 title claims abstract description 40
- 238000007789 sealing Methods 0.000 title claims abstract description 20
- 230000007704 transition Effects 0.000 claims abstract description 28
- 229910000679 solder Inorganic materials 0.000 claims abstract description 24
- 238000005538 encapsulation Methods 0.000 claims abstract description 9
- 238000004806 packaging method and process Methods 0.000 claims description 14
- 238000000034 method Methods 0.000 abstract description 8
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 abstract description 6
- 238000005245 sintering Methods 0.000 abstract description 4
- 229910052759 nickel Inorganic materials 0.000 abstract description 3
- 238000003466 welding Methods 0.000 abstract description 3
- 239000000463 material Substances 0.000 description 4
- 230000005540 biological transmission Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000012217 deletion Methods 0.000 description 1
- 230000037430 deletion Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
Images
Abstract
The utility model discloses a glass insulator and oxygen-free copper sealing structure, including the pin, the pin lateral wall is provided with the glass insulator, the glass insulator lateral wall is provided with the transition ring, the transition ring lateral wall is provided with the oxygen-free copper shell, be provided with the encapsulation solder layer between oxygen-free copper shell and the transition ring, this glass insulator and oxygen-free copper sealing structure, through being equipped with oxygen-free copper shell, transition ring, glass insulator, pin and encapsulation solder layer structure, can reduce the glass insulator and oxygen-free copper shell and directly seal the risk that the glass insulator can break in the long-time use process, and can reduce the stress of glass insulator in the sintering process, guarantee that the gas tightness of glass insulator meets the requirements; and the transition ring has good welding performance with the oxygen-free copper shell after being plated with nickel, and the reliability and the air tightness of the transition ring brazed by adopting the Ag-based solder can meet the requirements.
Description
Technical Field
The utility model relates to the technical field of machinery, specifically be a glass insulator and oxygen-free copper sealing structure.
Background
In the field of metal packaging, a metal packaging shell of a high-power laser is usually made of an oxygen-free copper material, has the characteristics of high heat dissipation, sealing property, circuit transmission, corrosion resistance and the like, and as a pin for connecting the transmission of an external circuit and an internal circuit of a shell, the packaging of the high-power laser must have high sealing property, insulating property and good conductivity. In the prior art, a glass insulator is generally directly used as an insulating material for packaging an oxygen-free copper shell and pins, but due to the difference of linear expansion coefficients of the glass and the oxygen-free copper material, large internal stress can be caused in the high-temperature sintering process, the package shell is easy to crack glass in the long-time use process, and the air tightness and the insulating property can be possibly reduced.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a glass insulator and oxygen-free copper sealing structure to solve the problem that proposes among the above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a glass insulator and anaerobic copper sealing structure, includes the pin, the pin lateral wall is provided with the glass insulator, the glass insulator lateral wall is provided with the transition ring, the transition ring lateral wall is provided with anaerobic copper shell, be provided with encapsulation solder layer between anaerobic copper shell and the transition ring.
Preferably, the packaging solder layer is an Ag-based solder layer.
Preferably, the transition ring is annular in cross section.
Preferably, the package solder layer is disposed between the oxygen-free copper enclosure and the transition ring junction.
Preferably, the packaging solder layer is annular in cross section.
Preferably, the pin penetrates through an inner cavity of the glass insulator.
Compared with the prior art, the beneficial effects of the utility model are that: according to the glass insulator and oxygen-free copper sealing structure, the oxygen-free copper shell, the transition ring, the glass insulator, the pins and the packaging solder layer structure are arranged, so that the risk that the glass insulator is broken when the glass insulator and the oxygen-free copper shell are directly sealed and connected in a long-time use process can be effectively reduced, the stress of the glass insulator in a sintering process is reduced, and the air tightness of the glass insulator is ensured to meet the requirement; and the transition ring has good welding performance with the oxygen-free copper shell after being plated with nickel, and the reliability and the air tightness of the transition ring brazed by adopting the Ag-based solder can meet the requirements.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a sectional view taken along line A-A of FIG. 1;
fig. 3 is a partially enlarged view of fig. 2.
In the figure: 1 oxygen-free copper shell, 2 transition rings, 3 glass insulators, 4 pins and 5 packaging solder layers.
Detailed Description
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs; the terminology used in the description of the application herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application; the terms "including" and "having," and any variations thereof, in the description and claims of this application and the description of the above figures are intended to cover non-exclusive inclusions.
Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the application. The appearances of the phrase in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. It is explicitly and implicitly understood by one skilled in the art that the embodiments described herein can be combined with other embodiments.
Referring to fig. 1-3, the present invention provides a technical solution: a glass insulator and oxygen-free copper sealing structure comprises a pin 4, and a packaging solder layer 5 is arranged at the right end of the joint of an oxygen-free copper shell 1 and a transition ring 2. The outer side wall of the pin 4 is provided with a glass insulator 3, the outer side wall of the glass insulator 3 is provided with a transition ring 2, and the cross section of the transition ring 2 is annular.
In this embodiment, 2 lateral walls of transition ring are provided with oxygen-free copper shell 1, be provided with encapsulation solder layer 5 between oxygen-free copper shell 1 and transition ring 2, encapsulation solder layer 5 is Ag base encapsulation solder layer, just 5 cross-sections on encapsulation solder layer are the annular. It should be noted that, by adding the transition ring 2 between the glass insulator 3 and the oxygen-free copper housing 1, the air tightness and the insulation performance of the oxygen-free copper housing 1 can be ensured under long-term use, and the sealing reliability is improved; and can reduce the internal stress formed during the sintering process of the glass insulator 3. The pin 4 penetrates through the inner cavity of the glass insulator 3, so that the glass insulator 3 is prevented from cracking in the using process.
During welding, because the transition ring 2 has a larger linear expansion coefficient than the glass insulator 3, the oxygen-free copper shell 1, the glass insulator 3, the pin 4 assembly and the packaging solder layer 5 are brazed at 780 ℃ through a special tunnel furnace, and the transition ring 2 is brazed with the oxygen-free copper shell 1 after being plated with nickel in a pressure sealing mode, so that a sealing structure can be ensured to have good air tightness. In addition, the encapsulation solder layer 5 is adopted, so that the air tightness can be further improved while the strength is ensured, and the glass material is adopted as the insulating material, so that the requirement on the air tightness can be met while the insulating property is ensured, and meanwhile, the glass material has good corrosion resistance.
The above embodiments are only used to illustrate the technical solution of the present invention, and do not limit the protection scope of the present invention. It is to be understood that the embodiments described are only some embodiments of the invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from these embodiments without any inventive step, are within the scope of the present invention. Although the present invention has been described in detail with reference to the above embodiments, those skilled in the art can still make no creative work on the condition of conflict, and make mutual combination, addition and deletion, or other adjustments according to the features in the embodiments of the present invention, thereby obtaining other technical solutions which are different and do not depart from the concept of the present invention, and these technical solutions also belong to the scope to be protected by the present invention.
The above description is only exemplary of the present invention and should not be construed as limiting the present invention, and any modifications, equivalents and improvements made within the spirit and principles of the present invention are intended to be included within the scope of the present invention.
Claims (6)
1. The utility model provides a glass insulator and oxygen-free copper sealing structure, includes pin (4), its characterized in that: pin (4) lateral wall is provided with glass insulator (3), glass insulator (3) lateral wall is provided with transition ring (2), transition ring (2) lateral wall is provided with oxygen-free copper shell (1), be provided with encapsulation solder layer (5) between oxygen-free copper shell (1) and transition ring (2).
2. The sealing structure of the glass insulator and the oxygen-free copper as claimed in claim 1, wherein: the packaging solder layer (5) is an Ag-based packaging solder layer, including but not limited to AgCu solder.
3. The sealing structure of the glass insulator and the oxygen-free copper as claimed in claim 1, wherein: the section of the transition ring (2) is annular.
4. The sealing structure of the glass insulator and the oxygen-free copper as claimed in claim 1, wherein: the packaging solder layer (5) is arranged between the joint of the oxygen-free copper shell (1) and the transition ring (2).
5. The sealing structure of the glass insulator and the oxygen-free copper as claimed in claim 1, wherein: the cross section of the packaging solder layer (5) is annular.
6. The sealing structure of the glass insulator and the oxygen-free copper as claimed in claim 1, wherein: the pin (4) penetrates through the inner cavity of the glass insulator (3).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020734705.7U CN212011580U (en) | 2020-05-07 | 2020-05-07 | Glass insulator and oxygen-free copper sealing structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020734705.7U CN212011580U (en) | 2020-05-07 | 2020-05-07 | Glass insulator and oxygen-free copper sealing structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212011580U true CN212011580U (en) | 2020-11-24 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020734705.7U Active CN212011580U (en) | 2020-05-07 | 2020-05-07 | Glass insulator and oxygen-free copper sealing structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212011580U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114122901A (en) * | 2021-11-13 | 2022-03-01 | 深圳市宏钢机械设备有限公司 | Packaging tube shell for laser television semiconductor laser and production process thereof |
-
2020
- 2020-05-07 CN CN202020734705.7U patent/CN212011580U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114122901A (en) * | 2021-11-13 | 2022-03-01 | 深圳市宏钢机械设备有限公司 | Packaging tube shell for laser television semiconductor laser and production process thereof |
| CN114122901B (en) * | 2021-11-13 | 2022-11-18 | 深圳市宏钢机械设备有限公司 | Packaging tube shell for laser television semiconductor laser and production process thereof |
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| Date | Code | Title | Description |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address | ||
| CP03 | Change of name, title or address |
Address after: Room 101, Unit 1, Building C, No. 6 Juliu Road, Zhukeng Community, Longtian Street, Pingshan District, Shenzhen City, Guangdong Province, China Patentee after: Shenzhen Honggang Optoelectronic Packaging Technology Co.,Ltd. Address before: 518000 1-3 / F, C1 building, long industrial park, JuLongshan No.3 Road, big industrial zone, Longtian street, Pingshan District, Shenzhen City, Guangdong Province Patentee before: SHENZHEN HONGGANG MECHANISM & EQUIPMENT CO.,LTD. |