CN212010937U - Ceramic and oxygen-free copper metal sealing structure - Google Patents
Ceramic and oxygen-free copper metal sealing structure Download PDFInfo
- Publication number
- CN212010937U CN212010937U CN202020734761.0U CN202020734761U CN212010937U CN 212010937 U CN212010937 U CN 212010937U CN 202020734761 U CN202020734761 U CN 202020734761U CN 212010937 U CN212010937 U CN 212010937U
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- Prior art keywords
- oxygen
- free copper
- ceramic
- sealing structure
- metal sealing
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- 239000000919 ceramic Substances 0.000 title claims abstract description 53
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 50
- 239000010949 copper Substances 0.000 title claims abstract description 50
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 48
- 239000002184 metal Substances 0.000 title claims abstract description 25
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 25
- 238000007789 sealing Methods 0.000 title claims abstract description 25
- 230000007704 transition Effects 0.000 claims abstract description 29
- 239000012212 insulator Substances 0.000 claims abstract description 27
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 8
- 239000000956 alloy Substances 0.000 claims abstract description 8
- 239000011521 glass Substances 0.000 claims abstract description 8
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims abstract description 8
- UGKDIUIOSMUOAW-UHFFFAOYSA-N iron nickel Chemical compound [Fe].[Ni] UGKDIUIOSMUOAW-UHFFFAOYSA-N 0.000 claims abstract description 7
- NEIHULKJZQTQKJ-UHFFFAOYSA-N [Cu].[Ag] Chemical compound [Cu].[Ag] NEIHULKJZQTQKJ-UHFFFAOYSA-N 0.000 claims description 6
- 229910000679 solder Inorganic materials 0.000 claims description 6
- 238000011160 research Methods 0.000 abstract description 2
- 238000003754 machining Methods 0.000 abstract 1
- 239000011257 shell material Substances 0.000 description 13
- 239000000463 material Substances 0.000 description 8
- 238000005219 brazing Methods 0.000 description 6
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 4
- 229910052709 silver Inorganic materials 0.000 description 4
- 239000004332 silver Substances 0.000 description 4
- 239000000945 filler Substances 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 230000017525 heat dissipation Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 230000035882 stress Effects 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000012217 deletion Methods 0.000 description 1
- 230000037430 deletion Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
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Abstract
The utility model discloses a pottery and oxygen-free copper metal sealing structure, including the lead wire, the lead wire lateral wall is provided with ceramic insulator, the ceramic insulator lateral wall is provided with the transition ring, the transition ring lateral wall is provided with oxygen-free copper casing. The ceramic and oxygen-free copper metal sealing structure has the advantages of high structural strength, good insulating property, high heat conductivity and the like through the oxygen-free copper shell, the transition ring, the ceramic and the lead structure, the problem of mismatch of expansion coefficients of oxygen-free copper metal and ceramic is solved by adopting an iron-nickel glass seal alloy transition ring structure mode between oxygen-free copper and ceramic, and the air tightness performance meets the requirements of customers. The utility model discloses a pottery and oxygen-free copper metal sealing structure mainly use on laser instrument oxygen-free copper casing and partial TO discrete device, can wide application in fields such as laser beam machining, medical treatment, scientific research, military project.
Description
Technical Field
The utility model relates to the technical field of machinery, specifically be a pottery and oxygen-free copper metal sealing structure.
Background
The oxygen-free copper is used as a shell material for metal packaging of the high-power laser, and has the characteristics of high heat dissipation, sealing property, corrosion resistance and the like. The oxygen-free copper has an expansion coefficient of about 20.9 x 10 at 800 DEG C-6The expansion coefficient of the ceramic at 800 ℃ is about 7.85 x 10-6The expansion coefficients of the two materials differ by a factor of 2.6 per degree centigrade. When two materials of oxygen-free copper and ceramic are brazed together by silver brazing at 800 ℃, because the expansion coefficients of the two materials are greatly different, the ceramic is easy to crack and the metallized layer is torn due to the stress of the ceramic after cooling, finally, poor ceramic welding seams and the like are caused, the indexes of air tightness, insulation performance and the like cannot be ensured after brazing, and the percent of pass is low. Therefore, a sealing structure of ceramic and oxygen-free copper metal is provided.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a pottery and oxygen-free copper metal sealing structure to solve the problem that proposes among the above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a pottery and oxygen-free copper metal sealing structure, includes the lead wire, the lead wire lateral wall is provided with ceramic insulator, the ceramic insulator lateral wall is provided with the transition ring, the transition ring lateral wall is provided with the oxygen-free copper casing.
Preferably, the right end wall of the oxygen-free copper shell is concave.
Preferably, the cross section of the ceramic insulator is annular.
Preferably, the transition ring is annular in cross section.
Preferably, the transition ring material is iron-nickel glass sealing alloy.
Preferably, the left side wall of the oxygen-free copper shell inner ring is tangent to the side wall of the ceramic insulator.
Preferably, the lead and the ceramic insulator are brazed by silver-copper solder, the ceramic insulator and the transition ring are brazed by silver-copper solder, and the transition ring and the oxygen-free copper shell are brazed by silver-copper solder.
Compared with the prior art, the beneficial effects of the utility model are that:
1. by arranging the ceramic insulator and the oxygen-free copper shell for metal sealing, the structure has the advantages of high strength, good insulating property, high heat conductivity and the like;
2. the structure of the iron-nickel glass seal alloy transition ring is adopted between the oxygen-free copper shell and the ceramic insulator, so that the problem of mismatch of expansion coefficients of oxygen-free copper and ceramic is solved, and the air tightness reaches the requirement.
3. The product can be widely applied TO the fields of laser processing, medical treatment, scientific research, military industry and the like, and is particularly suitable for laser shells and partial TO discrete devices.
Drawings
FIG. 1 is a cross-sectional view of a ceramic and oxygen-free copper metal sealing structure of the present invention;
fig. 2 is a cross-sectional view of another sealing structure of ceramic and oxygen-free copper metal of the present invention.
In the figure: 1 oxygen-free copper shell, 2 transition rings, 3 ceramic insulators and 4 lead wires.
Detailed Description
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs; the terminology used in the description of the application herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application; the terms "including" and "having," and any variations thereof, in the description and claims of this application and the description of the above figures are intended to cover non-exclusive inclusions.
Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the application. The appearances of the phrase in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. It is explicitly and implicitly understood by one skilled in the art that the embodiments described herein can be combined with other embodiments.
Referring to fig. 1 and 2, the present invention provides a ceramic and oxygen-free copper metal sealing structure, which includes a lead 4, a ceramic insulator 3 is disposed on the outer side wall of the lead 4, and the cross section of the ceramic insulator 3 is annular. The outer side wall of the ceramic insulator 3 is provided with a transition ring 2, and the section of the transition ring 2 is annular. The outer side wall of the transition ring 2 is provided with an oxygen-free copper shell 1. The left side wall of the inner ring of the oxygen-free copper shell 1 is tangent to the side wall of the ceramic insulator 3. The right end wall of the oxygen-free copper shell 1 is concave, and the transition ring 2 is made of iron-nickel glass seal alloy.
In this embodiment, the lead wire 4 and the ceramic insulator 3 are brazed with silver brazing filler metal, the ceramic insulator 3 and the transition ring 2 are brazed with silver brazing filler metal, and the transition ring 2 and the oxygen-free copper case 1 are brazed with silver brazing filler metal. The lead 4 is made of the following materials: 4J29/4J50/4J29 copper-on-copper/4J 50 copper-on-copper; the ceramic insulator 3 is made of the following materials: AL2O3 (white, 75-99%); the transition ring 2 is made of the following materials: 4J29/4J50/4J 42.
Because the sealing performance of the packaging shell can be influenced by the brazing and the sealing of the two materials with larger difference of expansion coefficients, the service life of the product is shortened, and even the product fails, and the problem of thermal stress caused by the mismatching of the expansion coefficients of the ceramic insulator 3 and the oxygen-free copper shell 1 can be effectively reduced by constructing a proper intermediate transition layer. The glass sealing alloy has an expansion coefficient of (7.85-10.6) × 10 at 800 DEG C-6The ceramic insulator 3 brazed by adding the iron-nickel glass seal alloy transition ring 2 has high mechanical strength, excellent insulating property, high heat conductivity and good heat dissipation of the base, can effectively ensure the air tightness and the insulating property of the oxygen-free copper shell 1 after long-time use, and improves the sealing reliability.
In the actual welding operation, the lead 4, the ceramic insulator 3, the oxygen-free copper case 1 and the transition ring 2 are brazed at 800 ℃, and then the brazed ceramic assembly and the oxygen-free copper case 1 are brazed. The expansion coefficients of the oxygen-free copper and the ceramic are greatly different, the internal stress generated by overlarge expansion coefficient difference is reduced by adopting iron-nickel glass seal alloy transition close to the expansion coefficient of the ceramic, the cracking of the ceramic and the tearing of a metallized layer can be effectively avoided in the processing process, and the processing cost is reduced.
The above embodiments are only used to illustrate the technical solution of the present invention, and do not limit the protection scope of the present invention. It is to be understood that the embodiments described are only some embodiments of the invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from these embodiments without any inventive step, are within the scope of the present invention. Although the present invention has been described in detail with reference to the above embodiments, those skilled in the art can still make no creative work on the condition of conflict, and make mutual combination, addition and deletion, or other adjustments according to the features in the embodiments of the present invention, thereby obtaining other technical solutions which are different and do not depart from the concept of the present invention, and these technical solutions also belong to the scope to be protected by the present invention.
The above description is only exemplary of the present invention and should not be construed as limiting the present invention, and any modifications, equivalents and improvements made within the spirit and principles of the present invention are intended to be included within the scope of the present invention.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (7)
1. The utility model provides a pottery and oxygen-free copper metal sealing-in structure, includes lead wire (4), its characterized in that: lead wire (4) lateral wall is provided with ceramic insulator (3), ceramic insulator (3) lateral wall is provided with transition ring (2), transition ring (2) lateral wall is provided with anaerobic copper casing (1).
2. The ceramic and oxygen-free copper metal sealing structure according to claim 1, wherein: the right end wall of the oxygen-free copper shell (1) is concave.
3. The ceramic and oxygen-free copper metal sealing structure according to claim 1, wherein: the section of the ceramic insulator (3) is annular.
4. The ceramic and oxygen-free copper metal sealing structure according to claim 1, wherein: the section of the transition ring (2) is annular.
5. The ceramic and oxygen-free copper metal sealing structure according to claim 1, wherein: the transition ring (2) is made of iron-nickel glass seal alloy.
6. The ceramic and oxygen-free copper metal sealing structure according to claim 1, wherein: the left side wall of the inner ring of the oxygen-free copper shell (1) is tangent to the side wall of the ceramic insulator (3).
7. The ceramic and oxygen-free copper metal sealing structure according to claim 1, wherein: the lead (4) and the ceramic insulator (3) are brazed by silver-copper solder, the ceramic insulator (3) and the transition ring (2) are brazed by silver-copper solder, and the transition ring (2) and the oxygen-free copper shell (1) are brazed by silver-copper solder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020734761.0U CN212010937U (en) | 2020-05-07 | 2020-05-07 | Ceramic and oxygen-free copper metal sealing structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020734761.0U CN212010937U (en) | 2020-05-07 | 2020-05-07 | Ceramic and oxygen-free copper metal sealing structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212010937U true CN212010937U (en) | 2020-11-24 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020734761.0U Active CN212010937U (en) | 2020-05-07 | 2020-05-07 | Ceramic and oxygen-free copper metal sealing structure |
Country Status (1)
| Country | Link |
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| CN (1) | CN212010937U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114204384A (en) * | 2021-12-01 | 2022-03-18 | 深圳市宏钢机械设备有限公司 | High-power laser shell packaging clamp and packaging process |
| CN114213138A (en) * | 2021-11-10 | 2022-03-22 | 西安赛尔电子材料科技有限公司 | Ceramic metal shell and brazing process thereof |
| CN114890807A (en) * | 2022-06-01 | 2022-08-12 | 中国科学院高能物理研究所 | Aluminum oxide ceramic and metal seal welding piece with coaxial structure |
-
2020
- 2020-05-07 CN CN202020734761.0U patent/CN212010937U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114213138A (en) * | 2021-11-10 | 2022-03-22 | 西安赛尔电子材料科技有限公司 | Ceramic metal shell and brazing process thereof |
| CN114204384A (en) * | 2021-12-01 | 2022-03-18 | 深圳市宏钢机械设备有限公司 | High-power laser shell packaging clamp and packaging process |
| CN114204384B (en) * | 2021-12-01 | 2022-09-20 | 深圳市宏钢机械设备有限公司 | High-power laser shell packaging clamp and packaging process |
| CN114890807A (en) * | 2022-06-01 | 2022-08-12 | 中国科学院高能物理研究所 | Aluminum oxide ceramic and metal seal welding piece with coaxial structure |
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Address after: Room 101, Unit 1, Building C, No. 6 Juliu Road, Zhukeng Community, Longtian Street, Pingshan District, Shenzhen City, Guangdong Province, China Patentee after: Shenzhen Honggang Optoelectronic Packaging Technology Co.,Ltd. Address before: 518000 1-3 / F, C1 building, long industrial park, JuLongshan No.3 Road, big industrial zone, Longtian street, Pingshan District, Shenzhen City, Guangdong Province Patentee before: SHENZHEN HONGGANG MECHANISM & EQUIPMENT CO.,LTD. |