CN211994720U - Heating substrate for thermal printing head - Google Patents
Heating substrate for thermal printing head Download PDFInfo
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- CN211994720U CN211994720U CN202020405531.XU CN202020405531U CN211994720U CN 211994720 U CN211994720 U CN 211994720U CN 202020405531 U CN202020405531 U CN 202020405531U CN 211994720 U CN211994720 U CN 211994720U
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Abstract
The utility model provides a heating substrate for a thermal printing head, which comprises an insulating substrate, wherein a ground coat is comprehensively arranged on the insulating substrate, a lead electrode layer is arranged on the ground coat, a heating resistor layer is arranged on the lead electrode layer, a first coating and a second coating are respectively arranged on two sides of the heating resistor layer, the two coatings are arranged along the main printing direction, the length of the coatings is more than or equal to that of the heating resistor layer, the thickness of the coatings is less than or equal to that of the heating resistor layer, and the distance between the two coatings is more than or equal to the width of the heating resistor layer; the space between the two coatings and the heating resistor body layer is respectively provided with a first filling layer and a second filling layer, the two filling layers are arranged to enable the top of the heating resistor body layer to be smoothly transited to the two coatings, the thermal conductivity of the first filling layer and the thermal conductivity of the second filling layer are higher than that of the first coating layer and the second coating layer, and the lead electrode layer, the heating resistor body layer, the two coating layers and the two filling layers are covered with protective layers. The heating substrate for the thermal printing head can realize smooth printing under low-voltage driving.
Description
Technical Field
The utility model relates to a thermal printing technical field especially relates to a thermal printing is beaten printer head and is used base plate that generates heat.
Background
As is well known, a heat-generating substrate for a thermal print head includes an insulating substrate made of an insulating heat-resistant material, a ground coat layer provided on the insulating substrate, lead electrodes provided on the ground coat layer and the surface of the insulating substrate, a heat-generating resistor disposed on the lead electrodes, and wear-resistant protective layers covering the lead electrodes and the surface of the heat-generating resistor.
The ground coat layer is formed on the insulating substrate by adopting a screen printing and sintering method (namely a thick film method) and is used for heat accumulation of the heating resistor body; the ground coat layer generally has two basic structures: one is a complete ground coat layer, which has excellent heat accumulation effect and can realize low-voltage and energy-saving printing; one is a local ground coat layer, namely a ground coat layer with a certain width is arranged below the heating resistor body, the size is small, and the heat storage and heat dissipation characteristics can realize quick printing.
In the field of hand-held POS machines and low-voltage thermal printing heads, a full-face ground coat layer is often used, so that low-voltage and energy-saving printing can be realized. However, in the actual printing process, the large curvature radius of the heating resistor part and the low-voltage driving printing result in accumulation of paper scraps, paper sticking and abnormal operation of the thermal printing head.
SUMMERY OF THE UTILITY MODEL
In order to solve the problem that exists among the prior art, the utility model provides a thermal printer head is with base plate that generates heat to realize smooth printing under low voltage drive.
In order to achieve the above object, the present invention provides a heat-generating substrate for a thermal printhead, including an insulating substrate, a ground coat layer is provided on the insulating substrate, a wire electrode layer is provided on the ground coat layer, a heat-generating resistor layer is provided on the wire electrode layer, a first coating and a second coating are provided on both sides of the heat-generating resistor layer, the first coating and the second coating are both provided along a main printing direction, and the length of the first coating and the length of the second coating are greater than or equal to the length of the heat-generating resistor layer, the thickness of the first coating and the thickness of the second coating are less than or equal to the thickness of the heat-generating resistor layer, and the distance between the first coating and the second coating is greater than or equal to the width of the heat-generating resistor layer; a first filling layer is arranged in a space between the first coating layer and the heating resistor layer, a second filling layer is arranged in a space between the second coating layer and the heating resistor layer, the first filling layer and the second filling layer are arranged to enable the top of the heating resistor layer to be smoothly transited to the first coating layer and the second coating layer, the thermal conductivity of the first filling layer is higher than that of the first coating layer, and the thermal conductivity of the second filling layer is higher than that of the second coating layer; and protective layers are covered on the lead electrode layer, the heating resistor layer, the first coating, the second coating, the first filling layer and the second filling layer.
Preferably, the first coating layer and the second coating layer are symmetrically provided on both sides of the heat-generating resistor layer.
Preferably, the first coating and the second coating are doped with SiO2The hollow ball is made of silicate glass.
Preferably, the first filling layer and the second filling layer are made of silicate glass doped with alumina.
The heating substrate for the thermal printing head has the advantages that the curvature radius of the heating resistor body can be reduced by arranging the first coating, the second coating, the first filling layer and the second filling layer, and a flattening structure of the heating resistor body is provided; the thermal conductivity of the first filling layer is higher than that of the first coating layer, and the thermal conductivity of the second filling layer is higher than that of the second coating layer, so that transverse heat transfer can be reduced, and heat can be quickly and effectively transferred to the protective layer and further transferred to the thermal paper. Through foretell structural design, the utility model relates to a thermal printer head is with base plate that generates heat can reduce the radius of curvature of heating resistance somatic part, improves the accumulation of wastepaper, glues the paper problem, realizes smooth, clear printing under low-voltage drive.
Drawings
Fig. 1 is a schematic structural view of a heat-generating substrate for a thermal printhead according to the present invention.
Reference numerals: 1-insulating substrate, 2-ground coat, 3-lead electrode layer, 4-heating resistor layer, 5A-first coating, 5B-second coating, 6A-first filling layer, 6B-second filling layer, 7-protective layer, 8-thermal sensitive paper and 9-rubber roll.
Detailed Description
The following description will further describe embodiments of the present invention with reference to the accompanying drawings.
As shown in fig. 1, the heat-generating substrate for a thermal printhead according to the present invention includes an insulating substrate 1, a ground coat layer 2 provided on the entire surface of the insulating substrate 1, a lead electrode layer 3 provided on the ground coat layer 2, specifically, an individual electrode and a common electrode provided in the lead electrode layer 3, a heat-generating resistor layer 4 provided on the lead electrode layer 3, a plurality of heat-generating resistors provided in the heat-generating resistor layer 4, all of the heat-generating resistors being arranged in a main printing direction, the heat-generating resistors being arranged between the individual electrode and the common electrode, a first coating layer 5A and a second coating layer 5B provided symmetrically on both sides of the heat-generating resistor layer 4, the first coating layer 5A and the second coating layer 5B being provided in the main printing direction, and the first coating layer 5A and the second coating layer 5B having a length equal to or longer than that of the heat-generating resistor layer 4, the thickness of the first coating layer 5A and the second coating layer 5B is equal to or less than the thickness of the heat-generating resistor layer 4, and the distance between the first coating layer 5A and the second coating layer 5B is equal to or greater than the width of the heat-generating resistor layer 4, that is, the heat-generating resistor layer 4 is between the first coating layer 5A and the second coating layer 5B.
A first filling layer 6A is provided in a space between the first coat layer 5A and the heating resistor layer 4, a second filling layer 6B is provided in a space between the second coat layer 5B and the heating resistor layer 4, and the first filling layer 6A and the second filling layer 6B are provided so that the top of the heating resistor layer 4 smoothly transitions to the first coat layer 5A and the second coat layer 5B. The thermal conductivity of the first filler layer 6A is higher than that of the first coating layer 5A, and the thermal conductivity of the second filler layer 6B is higher than that of the second coating layer 5B. The lead electrode layer 3, the heating resistor layer 4, the first coating layer 5A, the second coating layer 5B, the first filling layer 6A and the second filling layer 6B are covered with a protective layer 7, the protective layer 7 can enable the upper surface of the heating substrate to be in smooth transition, and the heating substrate has a wear-resistant protection function.
In order to reduce the thermal conductivity of the first and second coating layers 5A, 5B, the first and second coating layers 5A, 5B may be doped with SiO2Hollow spheres or silicate glass of other foaming materials. In order to improve the thermal conductivity of the first and second filler layers 6A and 6B, the first and second filler layers 6A and 6B may be made of silicate glass doped with alumina.
The insulating substrate 1 has heat resistance and insulating property, for example, an alumina ceramic substrate can be used, and the ground coat layer 2 mainly plays a heat storage role; the first coating layer 5A, the second coating layer 5B, the first filling layer 6A and the second filling layer 6B are provided to reduce the radius of curvature of the heating resistor part and provide a flattening structure of the heating resistor part; the thermal conductivity of the first filling layer 6A is higher than that of the first coating layer 5A, and the thermal conductivity of the second filling layer 6B is higher than that of the second coating layer 5B, so that the transverse heat transfer can be reduced, the heat can be quickly and effectively transferred to the protective layer 7 and further transferred to the thermal paper 8, and clear printing can be realized.
The utility model relates to a heating substrate for a thermosensitive printing head, which is provided with a first coating, a second coating, a first filling layer and a second filling layer, can reduce the curvature radius of a heating resistor part and provide a flattening structure of the heating resistor part; the thermal conductivity of the first filling layer is higher than that of the first coating layer, and the thermal conductivity of the second filling layer is higher than that of the second coating layer, so that transverse heat transfer can be reduced, and heat can be quickly and effectively transferred to the protective layer and further transferred to the thermal paper. Through foretell structural design, the utility model relates to a thermal printer head is with base plate that generates heat can reduce the radius of curvature of heating resistance somatic part, improves the accumulation of wastepaper, glues the paper problem, realizes smooth, clear printing under low-voltage drive.
Claims (4)
1. The utility model provides a thermal printhead is with base plate that generates heat, includes insulating substrate be equipped with the ground coat on the insulating substrate comprehensively, be equipped with wire electrode layer on the ground coat be equipped with the resistance layer that generates heat on the wire electrode layer, its characterized in that: a first coating and a second coating are respectively arranged on two sides of the heating resistor layer, the first coating and the second coating are arranged along the main printing direction, the length of the first coating and the length of the second coating are greater than or equal to that of the heating resistor layer, the thickness of the first coating and the thickness of the second coating are less than or equal to that of the heating resistor layer, and the distance between the first coating and the second coating is greater than or equal to that of the heating resistor layer; a first filling layer is arranged in a space between the first coating layer and the heating resistor layer, a second filling layer is arranged in a space between the second coating layer and the heating resistor layer, the first filling layer and the second filling layer are arranged to enable the top of the heating resistor layer to be smoothly transited to the first coating layer and the second coating layer, the thermal conductivity of the first filling layer is higher than that of the first coating layer, and the thermal conductivity of the second filling layer is higher than that of the second coating layer; and protective layers are covered on the lead electrode layer, the heating resistor layer, the first coating, the second coating, the first filling layer and the second filling layer.
2. A heat generating substrate for a thermal head according to claim 1, wherein: and a first coating and a second coating are symmetrically arranged on two sides of the heating resistor layer.
3. A heat generating substrate for a thermal head according to claim 1, wherein: the first coating and the second coating are doped with SiO2The hollow ball is made of silicate glass.
4. A heat generating substrate for a thermal head according to claim 1, wherein: the first filling layer and the second filling layer are prepared from silicate glass doped with aluminum oxide.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020405531.XU CN211994720U (en) | 2020-03-26 | 2020-03-26 | Heating substrate for thermal printing head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020405531.XU CN211994720U (en) | 2020-03-26 | 2020-03-26 | Heating substrate for thermal printing head |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211994720U true CN211994720U (en) | 2020-11-24 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020405531.XU Active CN211994720U (en) | 2020-03-26 | 2020-03-26 | Heating substrate for thermal printing head |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211994720U (en) |
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2020
- 2020-03-26 CN CN202020405531.XU patent/CN211994720U/en active Active
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