JPS6153954B2 - - Google Patents
Info
- Publication number
- JPS6153954B2 JPS6153954B2 JP54087666A JP8766679A JPS6153954B2 JP S6153954 B2 JPS6153954 B2 JP S6153954B2 JP 54087666 A JP54087666 A JP 54087666A JP 8766679 A JP8766679 A JP 8766679A JP S6153954 B2 JPS6153954 B2 JP S6153954B2
- Authority
- JP
- Japan
- Prior art keywords
- layer
- substrate
- thermal head
- main surface
- thermal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000758 substrate Substances 0.000 claims description 20
- 238000010438 heat treatment Methods 0.000 claims description 15
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical group C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 6
- 239000011241 protective layer Substances 0.000 claims description 6
- 239000012212 insulator Substances 0.000 claims 2
- 239000010410 layer Substances 0.000 description 24
- 239000010931 gold Substances 0.000 description 6
- 239000005355 lead glass Substances 0.000 description 5
- 239000000919 ceramic Substances 0.000 description 4
- 239000004020 conductor Substances 0.000 description 4
- 230000004927 fusion Effects 0.000 description 4
- 230000008018 melting Effects 0.000 description 4
- 238000002844 melting Methods 0.000 description 4
- 229910052737 gold Inorganic materials 0.000 description 3
- 230000020169 heat generation Effects 0.000 description 3
- BPUBBGLMJRNUCC-UHFFFAOYSA-N oxygen(2-);tantalum(5+) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ta+5].[Ta+5] BPUBBGLMJRNUCC-UHFFFAOYSA-N 0.000 description 3
- MZLGASXMSKOWSE-UHFFFAOYSA-N tantalum nitride Chemical compound [Ta]#N MZLGASXMSKOWSE-UHFFFAOYSA-N 0.000 description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005299 abrasion Methods 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 229910001936 tantalum oxide Inorganic materials 0.000 description 1
- OEIMLTQPLAGXMX-UHFFFAOYSA-I tantalum(v) chloride Chemical compound Cl[Ta](Cl)(Cl)(Cl)Cl OEIMLTQPLAGXMX-UHFFFAOYSA-I 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
- B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
- B41J2/345—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads characterised by the arrangement of resistors or conductors
Landscapes
- Electronic Switches (AREA)
Description
【発明の詳細な説明】
本発明はサーマルヘツドの構造の改良に関す
る。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to improvements in the structure of thermal heads.
ホームフアツクス等のフアクシミリ装置のサー
マルフリンタ等に使用するサーマルヘツドは、従
来第１図の断面構造図に示すように、アルミナ等
からなるセラミツク基板１上に、基板より熱伝導
率が低く保温効果を有する鉛ガラス等からなるグ
レース層２上に、塩化タンタル（TaN）等からな
る発熱抵抗体層３が形成され、該発熱抵抗体層３
上に発熱ドツト部４を残して、ニクロム−金
（Ni／Cr−Au）等の多層構造の導電体層５が形成
されており、該基板面が耐摩耗性を有する酸化タ
ンタル（Ta2O5）等からなる保護層６で覆われた
構造を有してなつていた。 Thermal heads used in thermal flinters, etc. of facsimile devices such as home fax machines are conventionally manufactured on a ceramic substrate 1 made of alumina, etc., which has a lower thermal conductivity than the substrate and retains heat, as shown in the cross-sectional structure diagram in Figure 1. A heating resistor layer 3 made of tantalum chloride (TaN) or the like is formed on a grace layer 2 made of effective lead glass or the like.
A conductor layer 5 having a multilayer structure such as nichrome-gold (Ni/Cr-Au) is formed on the substrate, leaving the heat-generating dot portion 4, and the substrate surface is made of abrasion-resistant tantalum oxide (Ta 2 O). 5 ), etc., and had a structure covered with a protective layer 6.
然し、該従来構造では、まだ発熱ドツト部で発
生した熱のグレーズ層、基板を通して外部へ逃げ
る量が大きいために、発熱ドツトの発熱効率が充
分でなく、又第１図に示すようにサーマルヘツド
表面が平面に近い状態に形成されているので、発
熱ドツト部上部を感熱紙との接触が不完全で、従
つて感熱紙への熱の伝達効率も悪いために、印字
に際してのサーマルヘツドの消費電力が高くなる
という問題があつた。 However, in this conventional structure, a large amount of heat generated in the heat generating dot portion escapes to the outside through the glaze layer and the substrate, so the heat generation efficiency of the heat generating dot is not sufficient, and as shown in FIG. Since the surface is nearly flat, the upper part of the heating dot part is not fully in contact with the thermal paper, and therefore the heat transfer efficiency to the thermal paper is poor, resulting in less thermal head consumption during printing. There was a problem with the high power consumption.
本発明は上記問題点に鑑み、サーマルヘツドの
消費電力を低減させるために、発熱ドツトの発熱
効率及び感熱紙への熱の伝達効率を向上せしめる
ような構造のサーマルヘツドを提供する。 In view of the above problems, the present invention provides a thermal head having a structure that improves the heat generation efficiency of the heating dots and the heat transfer efficiency to the thermal paper, in order to reduce the power consumption of the thermal head.
即ち本発明はサーマルヘツドの構造において、
絶縁体基板と、該絶縁基板の主面上に該主面との
間に密閉された空洞部を形成するように固着され
た台状構造体と、該台状構造体の頂部上に配設さ
れた発熱ドツト部とを有し、該発熱ドツト部を有
する主面上が保護層により被覆されてなることを
特徴とする。 That is, in the structure of the thermal head, the present invention has the following features:
an insulating substrate; a pedestal structure fixed to a main surface of the insulating substrate so as to form a sealed cavity between the main surface; and a pedestal structure disposed on the top of the pedestal structure. The main surface having the heating dots is covered with a protective layer.
以下本発明を図示実施例により詳細に説明す
る。 The present invention will be explained in detail below with reference to illustrated embodiments.
第２図Ａは本発明のサーマルヘツドの一実施例
の部分斜視図で、第２図Ｂはその断面構造図であ
る。 FIG. 2A is a partial perspective view of an embodiment of the thermal head of the present invention, and FIG. 2B is a sectional structural view thereof.
例えば本発明のサーマルヘツドは第２図Ａに示
すように、セラミツク基板１の主面上に、その長
手方向に沿つて幅５〜10〔mm〕、高さ0.5〜１
〔mm〕程度の円弧状に形成され且つその長手方向
の両側が閉成されている高融点ガラス板からなる
細長い台状構造体７が伏せられた状態で、内部に
空洞部９を有して載置され、該台状構造体７がそ
の周囲の基板１主面上に形成された低融点鉛ガラ
スからなる融着層８により、該主面との間に密閉
された空洞部９を形成するように基板１に固着さ
れている。 For example, as shown in FIG. 2A, the thermal head of the present invention is mounted on the main surface of a ceramic substrate 1 with a width of 5 to 10 [mm] and a height of 0.5 to 1 mm along the longitudinal direction.
An elongated platform-like structure 7 made of a high melting point glass plate formed into an arc shape of about [mm] and closed on both sides in the longitudinal direction is placed upside down and has a hollow part 9 inside. The table-shaped structure 7 is placed on the main surface of the substrate 1 and forms a sealed cavity 9 between it and the main surface by a fusion layer 8 made of low melting point lead glass formed on the main surface of the substrate 1. It is fixed to the substrate 1 in such a manner.
そして該台状構造体７上からその両側の融着層
８上に延在して、該台状構造体７の長手方向に直
角に、薄膜窒化タンタル（TaN）からなる幅300
〔μｍ〕程度の帯状の発熱抵抗体層３が例えば350
〔μｍ〕適度のピツチで複数条配設され、この発
熱抵抗体層３上には、前記台状構造体７の頂部領
域の長さ400〔μｍ〕程度の部分を除いて、ニク
ロム−金（Ni／Cr−Au）等の多層構造を有する
導電体層５が被着される。 A width 300 layer made of thin film tantalum nitride (TaN) extends from the top of the platform structure 7 to the fusion layer 8 on both sides of the platform structure 7 at right angles to the longitudinal direction of the platform structure 7.
For example, the band-shaped heating resistor layer 3 of about [μm] has a diameter of 350 μm.
[μm] A plurality of strips are arranged at an appropriate pitch, and on this heating resistor layer 3, nichrome-gold ( A conductor layer 5 having a multilayer structure such as Ni/Cr-Au) is deposited.
ここで、導電体層５が被着されていない台状構
造体７頂部上の発熱抵抗体層３の露出部は発熱ド
ツト部４となる。 Here, the exposed portion of the heating resistor layer 3 on the top of the platform structure 7 to which the conductor layer 5 is not attached becomes a heating dot portion 4.
そして更に上記構成体の全表面が、図示しない
酸化タンタル（Ta2O5）等からなり耐摩耗性及び
絶縁性を有する１〜５〔μｍ〕程度の厚さの保護
層で覆われてなつている。 Further, the entire surface of the above-mentioned structure is covered with a protective layer of about 1 to 5 [μm] thick, which is made of tantalum oxide (Ta 2 O 5 ), etc., not shown, and has wear resistance and insulation properties. There is.
上記本発明のサーマルヘツドを第２図Ｂに示す
第２図Ａのａ−a′矢視断面構造図により更に詳細
に説明する。 The thermal head of the present invention will be explained in more detail with reference to FIG. 2B, which is a cross-sectional structural view taken along the line a-a' in FIG. 2A.
該サーマルヘツドの断面構造の一例は、アルミ
ナ等からなる厚さ0.5〜２〔mm〕程度のセラミツ
ク基板１上に、幅５〜10〔mm〕、高さ0.5〜１
〔mm〕程度の円弧状に形成した0.5〜１〔mm〕程度
の厚さの高融点鉛ガラス等からなる台状構造体７
が伏せられ内部に空洞９を有する状態に載置さ
れ、該台状構造体７の両側の基板上には低融点鉛
ガラス等からなる厚さ0.5〔mm〕程度の融着層８
が形成されており、該融着層８により前記台状構
造体７がその内部に密閉された空洞部９を形成す
るように基板１に固着されている。そして、上記
台状構造体７の上部からその両側の融着層８上に
延在して窒化タンタル（TaN）等よりなる厚さ
500〔Å〕、幅300〔μｍ〕程度の帯状の発熱抵抗
体層３が形成されており、該発熱抵抗体層３の上
面には、該抵抗体層により前記台状構造体７の頂
部に形成させる例えば長さ400〔μｍ〕程度の発
熱ドツト部４を除いて、ニクロム−金（Ni／Cr
−Au）等の二層構造からなる約2000〜5000
〔Å〕程度の厚さの導電体層５が形成されてお
り、該基板面は耐摩耗性を有する酸化タンタル
（Ta2O5）等からなる１〜５〔μｍ〕程度の厚さの
保護層６で覆われた構造を有している。 An example of the cross-sectional structure of the thermal head is a ceramic substrate 1 made of alumina or the like with a thickness of about 0.5 to 2 mm, a width of 5 to 10 mm, and a height of 0.5 to 1 mm.
A platform structure 7 made of high melting point lead glass or the like with a thickness of about 0.5 to 1 [mm] formed into an arc shape of about [mm]
is placed face down and has a cavity 9 inside, and on the substrates on both sides of the platform structure 7 there are bonding layers 8 of about 0.5 mm thick made of low melting point lead glass or the like.
is formed, and the platform structure 7 is fixed to the substrate 1 by the adhesive layer 8 so as to form a sealed cavity 9 therein. A thickness of tantalum nitride (TaN) or the like extends from the top of the platform structure 7 to the fusion layer 8 on both sides thereof.
A band-shaped heat generating resistor layer 3 having a thickness of about 500 [Å] and a width of 300 [μm] is formed on the upper surface of the heat generating resistor layer 3. Nichrome-gold (Ni/Cr
- Approximately 2000 to 5000 consisting of a two-layer structure such as Au)
A conductor layer 5 with a thickness of about [Å] is formed, and the substrate surface is covered with a protective layer made of wear-resistant tantalum oxide (Ta 2 O 5 ) or the like with a thickness of about 1 to 5 [μm]. It has a structure covered with layer 6.
上記構造のサーマルヘツドは第２図Ａ及びＢに
示すように発熱ドツト部４の下に空洞部９を有す
るので、ドツト部で発生した熱が基板に対して逃
げにくいために発熱効率が大幅に向上し、又発熱
ドツト部４は基板１の主面から上方に突出して形
成されるので感熱紙との接触が密になり、感熱紙
への熱の伝達率も向上する。そのため該構造のサ
ーマルヘツドは従来のものにくらべ、消費電力を
1/2〜1/3に低減させることができる。 The thermal head with the above structure has a cavity 9 under the heat generating dot part 4 as shown in FIGS. 2A and B, so the heat generated in the dot part is difficult to escape to the substrate, so the heat generation efficiency is greatly improved. Furthermore, since the heating dot portion 4 is formed to protrude upward from the main surface of the substrate 1, it comes into close contact with the thermal paper, and the rate of heat transfer to the thermal paper is also improved. Therefore, thermal heads with this structure consume less power than conventional ones.
It can be reduced to 1/2 to 1/3.
上記実施例においては鉛ガラスによる台状構造
体を用いて、発熱ドツト下層に円弧状の空洞部を
形成するサーマルヘツドの構造について説明した
が、本発明の構造は空洞の形成材料や形状を種々
に変えることにより、上記以外の構造を有する総
てのサーマルヘツドに対して適用可能である。 In the above embodiment, the structure of the thermal head was explained using a table-like structure made of lead glass and forming an arcuate cavity below the heating dot. By changing to , it can be applied to all thermal heads having structures other than those described above.
以上説明したように本発明はサーマルヘツドの
消費電力を大幅に低減せしめるので、ホームフア
ツクス等各種のフアクシミリ装置のサーマルプリ
ンタの低消費電力化に対して極めて有効である。 As explained above, the present invention significantly reduces the power consumption of the thermal head, and is therefore extremely effective in reducing the power consumption of thermal printers for various facsimile devices such as home fax machines.
第１図は従来のサーマルヘツドの断面構造図、
第２図Ａは本発明のサーマルヘツドの一実施例の
部分斜視図、第２図Ｂは本発明のサーマルヘツド
の一実施例の断面構造図である。
図に於いて、１はセラミツク基板、２はグレー
ズ層、３は発熱抵抗体層、４は発熱ドツト部、５
は導電体層、６は保護層、７は台状構造体、８は
融着層、９は空洞部。
Figure 1 is a cross-sectional structural diagram of a conventional thermal head.
FIG. 2A is a partial perspective view of one embodiment of the thermal head of the present invention, and FIG. 2B is a sectional structural view of one embodiment of the thermal head of the present invention. In the figure, 1 is a ceramic substrate, 2 is a glaze layer, 3 is a heating resistor layer, 4 is a heating dot part, and 5 is a heating resistor layer.
1 is a conductive layer, 6 is a protective layer, 7 is a platform structure, 8 is a fusion layer, and 9 is a cavity.
Claims (1)
面との間に密閉された空洞部を形成するように固
着された台状構造体と、該台状構造体の頂部上に
配設された発熱ドツト部とを有し、該発熱ドツト
部を有する主面上が保護層により被覆されてなる
ことを特徴とするサーマルヘツド。1. An insulator substrate, a pedestal structure fixed to the main surface of the insulator substrate so as to form a sealed cavity between the main surface, and a pedestal structure fixed to the top of the pedestal structure. What is claimed is: 1. A thermal head comprising: a heating dot portion disposed thereon; and a main surface having the heating dot portion is covered with a protective layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8766679A JPS5611281A (en) | 1979-07-11 | 1979-07-11 | Thermal head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8766679A JPS5611281A (en) | 1979-07-11 | 1979-07-11 | Thermal head |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5611281A JPS5611281A (en) | 1981-02-04 |
| JPS6153954B2 true JPS6153954B2 (en) | 1986-11-20 |
Family
ID=13921259
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8766679A Granted JPS5611281A (en) | 1979-07-11 | 1979-07-11 | Thermal head |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5611281A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH028069U (en) * | 1988-06-24 | 1990-01-18 |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5881219A (en) * | 1981-11-06 | 1983-05-16 | Oiles Ind Co Ltd | Solid lubricant embedding bearing and its manufacturing method |
| JPS59177341A (en) * | 1983-03-25 | 1984-10-08 | Daido Metal Kogyo Kk | Double-layered bearing material having layer of phosphor bronze containing graphite |
| JPS61283570A (en) * | 1985-06-10 | 1986-12-13 | Oki Electric Ind Co Ltd | Heat ray radiating head |
| JPS61283572A (en) * | 1985-06-10 | 1986-12-13 | Oki Electric Ind Co Ltd | Heat ray radiating head |
| JPH0667629B2 (en) * | 1985-10-08 | 1994-08-31 | ロ−ム株式会社 | Thermal print head |
| JP3868755B2 (en) * | 2001-04-05 | 2007-01-17 | アルプス電気株式会社 | Thermal head and manufacturing method thereof |
| JP5774342B2 (en) * | 2011-03-29 | 2015-09-09 | 東芝ホクト電子株式会社 | Thermal head and manufacturing method thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS49125041A (en) * | 1973-04-02 | 1974-11-29 | ||
| JPS5057634A (en) * | 1973-09-15 | 1975-05-20 | ||
| JPS5255648A (en) * | 1975-10-06 | 1977-05-07 | Mfe Corp | Thermal printing head of matrix type |
| JPS5234238B2 (en) * | 1971-12-10 | 1977-09-02 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5234238U (en) * | 1976-08-19 | 1977-03-10 |
-
1979
- 1979-07-11 JP JP8766679A patent/JPS5611281A/en active Granted
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5234238B2 (en) * | 1971-12-10 | 1977-09-02 | ||
| JPS49125041A (en) * | 1973-04-02 | 1974-11-29 | ||
| JPS5057634A (en) * | 1973-09-15 | 1975-05-20 | ||
| JPS5255648A (en) * | 1975-10-06 | 1977-05-07 | Mfe Corp | Thermal printing head of matrix type |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH028069U (en) * | 1988-06-24 | 1990-01-18 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5611281A (en) | 1981-02-04 |
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