CN211930978U

CN211930978U - Multi-order high density lamination HDI circuit board

Info

Publication number: CN211930978U
Application number: CN202021041425.4U
Authority: CN
Inventors: 李状敏
Original assignee: Jiangxi Huahaoyuan Electronic Technology Co ltd
Current assignee: Jiangxi Huahaoyuan Electronic Technology Co ltd
Priority date: 2020-06-08
Filing date: 2020-06-08
Publication date: 2020-11-13
Anticipated expiration: 2030-06-08

Abstract

The utility model relates to a multistage high density lamination HDI circuit board, which comprises a first circuit board, wherein two sides of the first circuit board are connected with a second circuit board through a limiting component, the limiting component comprises a linking sleeve block, a linking groove and a connecting block, one side of the linking sleeve block is connected with the connecting block through the linking groove, the linking sleeve block is symmetrically arranged at four corners of two sides of the first circuit board, the connecting block is arranged at four corners of one side of the second circuit board, the linking sleeve block and the connecting block are positioned on the same axis, the linking groove is dug at the middle part of one side of the linking sleeve block, a placing groove is dug at the middle part of one side of the connecting block, an inner cavity of the placing groove is communicated with a first heat conduction pipe, one side of the second circuit board is provided with a heat absorption plate, one side of the heat absorption plate is communicated with a plurality of second heat, is convenient for installation and disassembly.

Description

Multi-order high density lamination HDI circuit board

Technical Field

The utility model relates to a multistage high density lamination HDI circuit board belongs to circuit board technical field.

Background

The high-density HDI laminated multilayer circuit board is a printed circuit board with the aperture of less than 6mil, the diameter of a hole ring of less than 0.25mm, the density of a contact point of more than 130 points per square hour and the line width of less than 3mil, can reduce the production cost of the circuit board, increase the line density, and has the advantages of high reliability and good conductivity, so that the high-density HDI laminated multilayer circuit board is widely applied to electronic products, but after the circuit board is used for a long time, a large amount of heat is emitted by internal parts, so that the service cycle is shortened, and therefore the multi-stage high-density laminated HDI circuit board is provided.

SUMMERY OF THE UTILITY MODEL

The utility model discloses the technical problem who solves overcomes current defect, provides multistage high density lamination HDI circuit board, with the heat discharge that the part gived off on the circuit board, the buckle and the installation of being convenient for simultaneously can effectively solve the problem in the background art.

In order to solve the technical problem, the utility model provides a following technical scheme:

multistage high density lamination HDI circuit board, including first circuit board, first circuit board both sides are connected with the second circuit board through spacing subassembly block, spacing subassembly is including linking cover block, linking groove and connecting block, linking cover block one side is connected with the connecting block through linking groove block, just linking groove digs locates linking cover block one side middle part, connecting block one side middle part is dug and is equipped with the standing groove, standing groove inner chamber intercommunication has first heat pipe, second circuit board one side is provided with the absorber plate, absorber plate one side intercommunication has a plurality of second heat pipes, second heat pipe one side intercommunication has the heating panel.

Further, the first heat conduction pipe is communicated between the first circuit board and the second circuit board.

Further, a plurality of second heat conduction pipes are communicated between the heat dissipation plate and the heat absorption plate, and a plurality of heat dissipation holes are dug in one side of the heat dissipation plate.

Further, two adjacent linking grooves are the same as the connecting block in size and are connected in a clamping manner.

Furthermore, the linking sleeve blocks are symmetrically arranged at four corners of two sides of the first circuit board, the connecting blocks are arranged at four corners of one side of the second circuit board, and the linking sleeve blocks and the connecting blocks are located on the same axis.

The utility model discloses beneficial effect:

1. through the absorber plate and the heating panel that set up, cooperate with each heat pipe mutually, first heat pipe transmits the heat to the absorber plate, and rethread second heat pipe transmits to the heating panel to dispel the heat through the louvre, improved the life cycle of circuit board.

2. Through the spacing subassembly that sets up rather than the inside part that includes, the connecting block is through linking up groove block to linking set block inner chamber to this second circuit board and first circuit board looks block are convenient for install and are dismantled.

Drawings

The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention, and together with the description serve to explain the invention and not to limit the invention.

FIG. 1 is a front view of the multi-stage high density build-up HDI circuit board of the present invention;

FIG. 2 is an internal view of the multi-stage high density build-up HDI circuit board of the present invention;

FIG. 3 is a connection diagram of the multi-stage high density build-up HDI circuit board limiting assembly of the present invention;

FIG. 4 is an internal view of the connecting block of the multi-stage high-density build-up HDI circuit board of the present invention;

reference numbers in the figures: 1. a first circuit board; 2. a limiting component; 3. a second circuit board; 4. connecting the sleeve blocks; 5. a joining groove; 6. connecting blocks; 7. a placement groove; 8. a first heat conductive pipe; 9. a heat absorbing plate; 10. a second heat conductive pipe; 11. a heat dissipation plate; 12. and (4) heat dissipation holes.

Detailed Description

The preferred embodiments of the present invention will be described in conjunction with the accompanying drawings, and it will be understood that they are presented herein only to illustrate and explain the present invention, and not to limit the present invention.

In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "front end", "rear end", "both ends", "one end", "the other end" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element to which the reference is made must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

As shown in fig. 1-4, multistage high density lamination HDI circuit board, including first circuit board 1, first circuit board 1 both sides are connected with second circuit board 3 through spacing subassembly 2 block, spacing subassembly 2 is including linking cover block 4, linking groove 5 and connecting block 6, linking cover block 4 one side is connected with connecting block 6 through linking groove 5 block, just linking groove 5 digs and locates linking cover block 4 one side middle part, connecting block 6 one side middle part is dug and is equipped with standing groove 7, standing groove 7 inner chamber intercommunication has first heat pipe 8, second circuit board 3 one side is provided with absorber plate 9, absorber plate 9 one side intercommunication has a plurality of second heat pipe 10, second heat pipe 10 one side intercommunication has heating panel 11, first heat pipe 8 communicates between first circuit board 1 and second circuit board 3.

Specifically, as shown in fig. 2, a plurality of second heat pipes 10 are communicated between the heat dissipation plate 11 and the heat absorption plate 9, a plurality of heat dissipation holes 12 are dug in one side of the heat dissipation plate 11, the first heat pipe 8 transmits heat to the heat absorption plate 9, and then the heat is transmitted to the heat dissipation plate 11 through the second heat pipe 10, and the heat is dissipated through the heat dissipation holes 12.

Specifically, as shown in fig. 2, the linking sleeve block 4 is symmetrically arranged at four corners of two sides of the first circuit board 1, the connecting block 6 is arranged at four corners of one side of the second circuit board 3, the linking sleeve block 4 and the connecting block 6 are positioned on the same axis, and the two adjacent linking grooves 5 are identical to the connecting block 6 in size and are connected in a clamping manner.

The utility model discloses a theory of operation: when the heat-absorbing plate is used, the connecting block 6 is clamped to the connecting sleeve block 4 through the connecting groove 5, the first circuit board 1 and the second circuit board 3 are clamped, meanwhile, the first heat-conducting pipe 8 is communicated with the first circuit board 1 (a through hole is formed in the inner cavity of the connecting groove 5 in an dug mode), heat on the first circuit board 1 is absorbed through the first heat-conducting pipe 8 and is transmitted to the heat-absorbing plate 9, and heat on the heat-absorbing plate 9 is absorbed through the second heat-conducting pipe and is transmitted to the heat-radiating plate 11 and is exhausted through the heat-radiating holes 12.

The above is the preferred embodiment of the present invention, and the technical personnel in the field of the present invention can also change and modify the above embodiment, therefore, the present invention is not limited to the above specific embodiment, and any obvious improvement, replacement or modification made by the technical personnel in the field on the basis of the present invention all belong to the protection scope of the present invention.

Claims

1. Multi-order high density lamination HDI circuit board, including first circuit board (1), its characterized in that: first circuit board (1) both sides are connected with second circuit board (3) through spacing subassembly (2) block, spacing subassembly (2) are including linking cover block (4), linking groove (5) and connecting block (6), linking cover block (4) one side is connected with connecting block (6) through linking groove (5) block, just linking groove (5) are dug and are located linking cover block (4) one side middle part, connecting block (6) one side middle part is dug and is equipped with standing groove (7), standing groove (7) inner chamber intercommunication has first heat pipe (8), second circuit board (3) one side is provided with absorber plate (9), absorber plate (9) one side intercommunication has a plurality of second heat pipe (10), second heat pipe (10) one side intercommunication has heating panel (11).

2. The multi-level high density build-up HDI circuit board of claim 1, wherein: the first heat conduction pipe (8) is communicated between the first circuit board (1) and the second circuit board (3).

3. The multi-level high density build-up HDI circuit board of claim 1, wherein: a plurality of second heat conduction pipes (10) are communicated between the heat dissipation plate (11) and the heat absorption plate (9), and a plurality of heat dissipation holes (12) are formed in one side of the heat dissipation plate (11) in an excavated mode.

4. The multi-level high density build-up HDI circuit board of claim 1, wherein: two adjacent link up groove (5) and connecting block (6) size homogeneous phase the same to be the block connection.

5. The multi-level high density build-up HDI circuit board of claim 1, wherein: link up the collets (4) symmetry and set up in first circuit board (1) both sides four corners, connecting block (6) set up in second circuit board (3) one side four corners, just link up collets (4) and connecting block (6) position and be in same axis.