CN211909284U - PCB circuit board with heat radiation structure - Google Patents

Abstract

The utility model discloses a PCB circuit board with heat dissipation structure, which comprises an upper end plate and a lower base plate, wherein the upper end of the lower base plate is provided with an upper end plate, one end of a connecting pipe A is provided with a connecting pipe B, the outer surface of a radiating pipe is provided with a heat conduction hole, both ends of the radiating pipe are provided with threaded bolts, the radiating pipe is in threaded connection with a movable block through the threaded bolts, fine sand is arranged inside the radiating pipe, the bottom of a mounting groove is provided with a heat conduction block, the radiating pipe is connected with the heat conduction block through the heat conduction hole, the fine sand has good heat absorption property, when the upper end plate generates heat, the whole heat can be absorbed by the heat conduction block and then transmitted to the radiating pipe, the heat can be absorbed by the fine sand finally, the whole heat dissipation effect is improved, a backing plate is arranged between the upper end plate and the bottom plate, the backing, the pressure that wholly receives is reduced, prevents that whole atress from excessively damaging, reduces working cost.

Description

PCB circuit board with heat radiation structure

Technical Field

The utility model relates to a PCB circuit board technical field specifically is a PCB circuit board with heat radiation structure.

Background

PCB boards are also called printed circuit boards, and since printed circuit boards are not common end products, they are somewhat confusing in the definition of names, such as: the motherboard for a personal computer is called a motherboard and cannot be directly called a circuit board, and although the circuit board exists in the motherboard, the motherboard is different from the motherboard, so that the two aspects cannot be said to be the same when evaluating the industry.

Present PCB circuit board all does not possess good heat dissipation function, leads to it in operating condition, and the temperature constantly risees and probably leads to the PCB circuit board short circuit at last, wholly breaks down, influences work efficiency, and secondly the outside edge of PCB circuit board is comparatively sharp, has certain danger to staff's hand.

To the above problems, the prior device is improved, and the PCB circuit board with the heat dissipation structure is provided.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a PCB circuit board with heat radiation structure adopts this device to work to heat dispersion is relatively poor in having solved above-mentioned background, the higher problem of danger coefficient.

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a PCB circuit board with heat radiation structure, includes upper end plate and infrabasal plate, and the upper end of infrabasal plate is provided with the upper end plate, the upper end plate includes wiring unit, protective sheath, mounting groove and cooling tube, and the last fixed surface of upper end plate installs the wiring unit, and fixed mounting has the protective sheath on the surface of upper end plate, and the upper surface of upper end plate is provided with the mounting groove, and the inside of mounting groove is provided with the cooling tube, and the infrabasal plate includes bottom plate and backing plate, and the upper surface of bottom plate is provided with the backing plate, and the.

Further, the cooling tube includes connecting pipe A and connecting pipe B, and connecting pipe A's one end is provided with connecting pipe B, is provided with the heat conduction hole on the surface of cooling tube, and the both ends of cooling tube all are provided with the screw bolt, and the one end of screw bolt is provided with the movable block, and the cooling tube passes through screw bolt and movable block threaded connection.

Further, the one end of connecting pipe A is provided with the connector, and the one end of connecting pipe B is provided with the spread groove, and connecting pipe A is provided with the draw-in groove on the surface of movable block through connector and spread groove and connecting pipe B swing joint.

Further, be provided with the spout on the inner wall of mounting groove, be provided with the connecting block on the inner wall of spout, the bottom of mounting groove is provided with the heat conduction piece, and the cooling tube passes through movable block and spout swing joint, and the cooling tube is connected with the heat conduction piece through the heat conduction hole.

Further, an external groove is formed in the outer surface of the base plate, a fixing column is arranged inside the external groove, and the base plate is a component made of foam rubber.

Further, fine sand is arranged inside the radiating pipe.

Compared with the prior art, the beneficial effects of the utility model are as follows:

1. the utility model provides a pair of PCB circuit board with heat radiation structure, connecting pipe A's one end is provided with connecting pipe B, be provided with the heat conduction hole on the surface of cooling tube, the both ends of cooling tube all are provided with the screw bolt, the one end that the screw bolt is provided with the movable block, the cooling tube passes through screw bolt and movable block threaded connection, the inside of cooling tube is provided with fine sand, and the bottom of mounting groove is provided with the heat conduction piece, the cooling tube passes through movable block and spout swing joint, the cooling tube is connected with the heat conduction piece through the heat conduction hole, fine sand has good heat absorptivity, when the upper end plate generates heat, the heat conduction piece can absorb holistic heat and pass on for the cooling tube again, fine sand absorbs the heat at last, improve holistic radiating effect, the installation of cooling tube is dismantled comparatively simple simultaneously.

2. The utility model provides a pair of PCB circuit board with heat radiation structure is provided with the backing plate between upper end plate and bottom plate, and the backing plate is the component that foam rubber made, and when taking place the extrusion, the partial extrusion force can be cushioned to the backing plate, reduces the pressure that wholly receives, prevents that whole atress is excessively damaged, reduction operating cost.

3. The utility model provides a pair of PCB circuit board with heat radiation structure, fixed mounting has the protective sheath on the surface of upper end plate, prevents that the edge that the upper end plate is sharp from with staff's hand fish tail, reduces the risk nature, is provided with the external groove simultaneously on the surface of backing plate, and the inside in external groove is provided with the fixed column, can hang whole through the fixed column, does benefit to the save more and deposits.

Drawings

Fig. 1 is a schematic view of the overall structure of the PCB with a heat dissipation structure of the present invention;

fig. 2 is a schematic view of a partial structure of the PCB with a heat dissipation structure of the present invention;

fig. 3 is a schematic view of the split structure of the PCB with a heat dissipation structure of the present invention;

FIG. 4 is a schematic view of the structure of the heat dissipation tube of the present invention;

fig. 5 is an enlarged view of fig. 2A according to the present invention.

In the figure: 1. an upper end plate; 11. a wiring unit; 12. a protective sleeve; 13. mounting grooves; 131. a chute; 1311. connecting blocks; 132. a heat conducting block; 14. a radiating pipe; 141. a connecting pipe A; 1411. a connector; 142. a connecting pipe B; 1421. connecting grooves; 143. a heat conduction hole; 144. a threaded bolt; 145. a movable block; 1451. a card slot; 2. a lower substrate; 21. a base plate; 22. a base plate; 221. an external connection groove; 222. and (5) fixing the column.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-3, a PCB circuit board with a heat dissipation structure includes an upper end plate 1 and a lower base plate 2, the upper end of the lower base plate 2 is provided with the upper end plate 1, the upper end plate 1 includes a wiring unit 11, a protective sleeve 12, a mounting groove 13 and a heat dissipation pipe 14, the wiring unit 11 is fixedly mounted on the upper surface of the upper end plate 1, the protective sleeve 12 is fixedly mounted on the outer surface of the upper end plate 1, the mounting groove 13 is formed on the upper surface of the upper end plate 1, the heat dissipation pipe 14 is arranged inside the mounting groove 13, the lower base plate 2 includes a bottom plate 21 and a backing plate 22, the backing plate 22 is arranged on the upper surface of the bottom plate.

Referring to fig. 4, the heat dissipating pipe 14 includes a connection pipe a141 and a connection pipe B142, the connection pipe B142 is disposed at one end of the connection pipe a141, a heat conducting hole 143 is disposed on an outer surface of the heat dissipating pipe 14, threaded bolts 144 are disposed at both ends of the heat dissipating pipe 14, a movable block 145 is disposed at one end of the threaded bolts 144, the heat dissipating pipe 14 is in threaded connection with the movable block 145 through the threaded bolts 144, a connection head 1411 is disposed at one end of the connection pipe a141, a connection groove 1421 is disposed at one end of the connection pipe B142, the connection pipe a141 is movably connected with the connection pipe B142 through the connection head 1411 and the connection groove 1421.

Referring to fig. 3 and 5, the inner wall of the mounting groove 13 is provided with a sliding groove 131, the inner wall of the sliding groove 131 is provided with a connecting block 1311, the bottom of the mounting groove 13 is provided with a heat conducting block 132, the heat radiating pipe 14 is movably connected with the sliding groove 131 through a movable block 145, the heat radiating pipe 14 is connected with the heat conducting block 132 through a heat conducting hole 143, the outer surface of the backing plate 22 is provided with an external groove 221, the internal of the external groove 221 is provided with a fixing column 222, the backing plate 22 is a member made of foam rubber, and the internal of the heat radiating pipe 14 is provided.

In summary, the following steps: the PCB circuit board with the heat dissipation structure is characterized in that an upper end plate 1 is arranged at the upper end of a lower base plate 2, a wiring unit 11 is fixedly arranged on the upper surface of the upper end plate 1, a protective sleeve 12 is fixedly arranged on the outer surface of the upper end plate 1 to prevent the sharp edge of the upper end plate 1 from scratching the hand of a worker and reduce the risk, a mounting groove 13 is arranged on the upper surface of the upper end plate 1, a heat dissipation pipe 14 is arranged inside the mounting groove 13, a connecting pipe B142 is arranged at one end of a connecting pipe A141, a heat conduction hole 143 is arranged on the outer surface of the heat dissipation pipe 14, threaded bolts 144 are arranged at both ends of the heat dissipation pipe 14, a movable block 145 is arranged at one end of each threaded bolt 144, the heat dissipation pipe 14 is in threaded connection with the movable block 145 through the threaded bolts 144, fine sand is arranged inside the heat dissipation pipe 14, a heat conduction block 132 is arranged at, fine sand has good heat absorptivity, when upper plate 1 generates heat, heat conduction piece 132 can absorb holistic heat and pass on for cooling tube 14 again, fine sand absorbs the heat at last, improve holistic radiating effect, cooling tube 14's installation is dismantled comparatively simply simultaneously, time saving, the upper surface of bottom plate 21 is provided with backing plate 22, bottom plate 21 is connected with upper plate 1 through backing plate 22, be provided with external groove 221 on backing plate 22's the surface, the inside of external groove 221 is provided with fixed column 222, can hang whole through fixed column 222, do benefit to the save more and deposit.

It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims (6)

1. The utility model provides a PCB circuit board with heat radiation structure, includes upper end plate (1) and infrabasal plate (2), the upper end of infrabasal plate (2) is provided with upper end plate (1), its characterized in that: the upper end plate (1) comprises a wiring unit (11), a protective sleeve (12), a mounting groove (13) and a radiating pipe (14), the wiring unit (11) is fixedly mounted on the upper surface of the upper end plate (1), the protective sleeve (12) is fixedly mounted on the outer surface of the upper end plate (1), the mounting groove (13) is formed in the upper surface of the upper end plate (1), and the radiating pipe (14) is arranged inside the mounting groove (13);

the lower base plate (2) comprises a base plate (21) and a base plate (22), the base plate (22) is arranged on the upper surface of the base plate (21), and the base plate (21) is connected with the upper end plate (1) through the base plate (22).

2. The PCB provided with the heat dissipation structure of claim 1, wherein: the radiating pipe (14) comprises a connecting pipe A (141) and a connecting pipe B (142), one end of the connecting pipe A (141) is provided with the connecting pipe B (142), the outer surface of the radiating pipe (14) is provided with a heat conducting hole (143), two ends of the radiating pipe (14) are provided with threaded bolts (144), one end of each threaded bolt (144) is provided with a movable block (145), and the radiating pipe (14) is in threaded connection with the movable blocks (145) through the threaded bolts (144).

3. The PCB provided with the heat dissipation structure of claim 2, wherein: one end of the connecting pipe A (141) is provided with a connecting head (1411), one end of the connecting pipe B (142) is provided with a connecting groove (1421), the connecting pipe A (141) is movably connected with the connecting pipe B (142) through the connecting head (1411) and the connecting groove (1421), and the outer surface of the movable block (145) is provided with a clamping groove (1451).

4. The PCB provided with the heat dissipation structure of claim 1, wherein: the heat dissipation pipe is characterized in that a sliding groove (131) is formed in the inner wall of the mounting groove (13), a connecting block (1311) is arranged on the inner wall of the sliding groove (131), a heat conduction block (132) is arranged at the bottom of the mounting groove (13), the heat dissipation pipe (14) is movably connected with the sliding groove (131) through a movable block (145), and the heat dissipation pipe (14) is connected with the heat conduction block (132) through a heat conduction hole (143).

5. The PCB provided with the heat dissipation structure of claim 1, wherein: an external groove (221) is formed in the outer surface of the backing plate (22), a fixing column (222) is arranged inside the external groove (221), and the backing plate (22) is a component made of foam rubber.

6. The PCB provided with the heat dissipation structure of claim 1, wherein: fine sand is arranged inside the radiating pipe (14).

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