CN211828705U

CN211828705U - Avoid automatic bonding device of IGBT chip of dislocation

Info

Publication number: CN211828705U
Application number: CN202020918500.4U
Authority: CN
Inventors: 许桂林
Original assignee: Jiangxi Quandao Semiconductor Technology Co ltd
Current assignee: Jiangxi Quandao Semiconductor Technology Co ltd
Priority date: 2020-05-26
Filing date: 2020-05-26
Publication date: 2020-10-30
Anticipated expiration: 2030-05-26

Abstract

The utility model relates to a IGBT chip technical field just discloses an avoid automatic bonding device of IGBT chip of dislocation, the on-line screen storage device comprises a base, the upside fixed mounting of base has two support columns, two the equal fixed mounting in one side that the support column is relative has the dead lever, two one side fixed mounting that the dead lever is relative has sliding mechanism, the connecting rod is installed to sliding mechanism's downside, the lower extreme fixed mounting of connecting rod has the material case, the downside fixed mounting of material case has first liter shrink pole. This avoid automatic bonding device of IGBT chip of dislocation, when the slider passes through the connecting rod and drives the bonding mechanism and remove, the second rises the shrinkage pole and takes place to rock when removing, and the second rises the shrinkage pole and strikes buffer gear on, and buffer gear relieves some and shakes power, and on another part passes through buffer gear and transmits spring mechanism, rocks all the other power through spring mechanism and relieves all the other, thereby realizes reducing the effect that equipment rocked the frequency, makes the chip bonding more stable.

Description

Avoid automatic bonding device of IGBT chip of dislocation

Technical Field

The utility model relates to a IGBT chip technical field specifically is an avoid automatic bonding device of IGBT chip of dislocation.

Background

The IGBT is a compound fully-controlled voltage-driven power semiconductor device consisting of BJTs (bipolar transistors) and MOS (insulated gate field effect transistors), has the advantages of high input impedance of the MOSFET and low conduction voltage drop of the GTR, reduces the GTR saturation voltage, has high current-carrying density but large driving current, has small MOSFET driving power, high switching speed but large conduction voltage drop and low current-carrying density, integrates the advantages of the two devices, has small driving power and reduced saturation voltage, and is very suitable for being applied to the fields of current conversion systems with direct current voltage of 600V or more, such as alternating current motors, frequency converters, switching power supplies, lighting circuits, traction transmission and the like.

Along with the development of chip cause, the IGBT chip wide application is in domestic appliance, smart power grids each item field, along with the promotion of theory such as energy-concerving and environment-protective, this type of product will be more and more seen in the market, the demand of user to the IGBT chip of high quality grade is outstanding day by day, when the IGBT chip preparation, need carry out the bonding processing to the IGBT chip, traditional equipment rocks the frequency when the bonding and is big, there is bonding unstable phenomenon, and bonding efficiency is low, because the equipment is the high temperature bonding when bonding, traditional equipment lacks the air-dry function, cooling efficiency is slow, so we have proposed one kind and have avoided the IGBT chip automatic bonding device of dislocation to solve above problem.

SUMMERY OF THE UTILITY MODEL

Technical problem to be solved

Not enough to prior art, the utility model provides an avoid automatic bonding device of IGBT chip of dislocation possesses and reduces and rocks the frequency, air-dries cooling, the efficient advantage of bonding, has solved current equipment and has rocked the frequency big, lack the problem of air-drying cooling, bonding inefficiency.

(II) technical scheme

For realize above-mentioned reduction rock the frequency, air-dry cooling, the efficient purpose of bonding, the utility model provides a following technical scheme: the utility model provides an avoid automatic bonding device of IGBT chip of dislocation, the on-line screen storage device comprises a base, the upside fixed mounting of base has two support columns, two the equal fixed mounting in one side that the support column is relative has the dead lever, two one side fixed mounting that the dead lever is relative has slide mechanism, the connecting rod is installed to slide mechanism's downside, the lower extreme fixed mounting of connecting rod has the material case, the downside fixed mounting of material case has first liter telescopic link, the lower extreme fixed mounting of first liter telescopic link has the second to rise telescopic link, fixed mounting has damper on the second liter telescopic link, the lower extreme fixed mounting of second liter telescopic link has bonding mechanism.

Preferably, the upside fixed mounting of base has air-dry mechanism, air-dry mechanism's inside left end fixed mounting has the fan, air-dry mechanism's inside left end fixed mounting has the wind direction baffle, and after bonding mechanism and chip took place the bonding, the fan produced kinetic energy, produced wind-force, and wind-force blows to chip bonding part through the wind direction baffle for the cooling effect, thereby realize bonding efficiency.

Preferably, the upside fixed mounting of base has the bracing piece, positioning mechanism is installed to the upper end of bracing piece, positioning mechanism's lower extreme fixed mounting has the protection to fill up, and when the chip was placed on table surface, positioning mechanism rotated to relative direction, through the protection fill up with the chip contact, positioning mechanism firmly fixed the chip, prevented that the chip from taking place the skew when the bonding.

Preferably, the positioning mechanism is bent, the protection pad is made of an insulating material, the insulating material is a non-conductive material, the chip is good in heat resistance and moisture resistance, certain mechanical strength is achieved, and the chip is effectively fixed through the protection pad without damaging the performance of the chip.

Preferably, the upside fixed mounting of base has the workstation, the workstation upside is provided with the chip, when the chip needs the bonding, places the chip on the workstation.

Preferably, the inside of slide mechanism is provided with the recess, the inner wall top fixed mounting of recess has positive electromagnetism mechanism, negative electromagnetism mechanism is installed to positive electromagnetism mechanism's downside, negative electromagnetism mechanism's downside fixed mounting has the slider, the downside fixed mounting of slider has the connecting rod, when the chip bonding needs the shift position, produces magnetic force through positive electromagnetism mechanism and negative electromagnetism mechanism, drives the slider and realizes free motion, and the slider passes through the connecting rod and drives the bonding mechanism removal to the practicality of equipment has been promoted.

Preferably, the damping mechanism's inside sets up and installs the installed part, the installed part is located fixed mounting to the axle center relatively, the one end fixed mounting that spring mechanism kept away from the installed part has buffer gear, buffer gear is connected with the second lifting and contracting pole, when the second lifting and contracting pole takes place to rock when removing, the second lifting and contracting pole strikes buffer gear on, buffer gear relieves some and shakes power, and on another part passed through buffer gear and transmitted spring mechanism, slowly releases all the other power that shakes through spring mechanism to realize reducing equipment and rock the frequency, make the chip bonding more stable.

(III) advantageous effects

Compared with the prior art, the utility model provides an avoid automatic bonding device of IGBT chip of dislocation possesses following beneficial effect:

1. this avoid automatic bonding device of IGBT chip of dislocation, when the slider passes through the connecting rod and drives the bonding mechanism and remove, the second rises the shrinkage pole and takes place to rock when removing, and the second rises the shrinkage pole and strikes buffer gear on, and buffer gear relieves some and shakes power, and on another part passes through buffer gear and transmits spring mechanism, rocks all the other power through spring mechanism and relieves all the other, thereby realizes reducing the effect that equipment rocked the frequency, makes the chip bonding more stable.

2. This avoid automatic bonding device of IGBT chip of dislocation, after bonding mechanism took place the bonding with the chip, the fan produced kinetic energy, produced wind-force, and wind-force blows to chip bonding part through the wind direction baffle for the cooling effect improves the bonding efficiency of chip, thereby makes equipment reach air-dry cooling, the efficient effect of bonding.

Drawings

FIG. 1 is a schematic structural view of the present invention;

FIG. 2 is a schematic view of the structure of the damping mechanism of the present invention;

FIG. 3 is a schematic view of the structure of the air drying mechanism of the present invention;

fig. 4 is a schematic structural view of the sliding mechanism of the present invention.

In the figure: 1. a base; 2. a support pillar; 3. a support bar; 4. a positioning mechanism; 5. a protective pad; 6. a chip; 7. fixing the rod; 8. a sliding mechanism; 9. a connecting rod; 10. a material box; 11. a first telescopic rod; 12. a second telescopic rod; 13. a damping mechanism; 14. a bonding mechanism; 15. a groove; 16. a positive electromagnetic mechanism; 17. a negative electromagnetic mechanism; 18. a slider; 19. a mounting member; 20. a spring mechanism; 21. a buffer mechanism; 22. an air drying mechanism; 23. a fan; 24. a wind direction guide plate; 25. a work bench.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-4, an IGBT chip automatic bonding device for avoiding dislocation includes a base 1, two support posts 2 are fixedly mounted on an upper side of the base 1, fixing rods 7 are fixedly mounted on opposite sides of the two support posts 2, a sliding mechanism 8 is fixedly mounted on an opposite side of the two fixing rods 7, a connecting rod 9 is mounted on a lower side of the sliding mechanism 8, a groove 15 is disposed inside the sliding mechanism 8, a positive electromagnetic mechanism 16 is fixedly mounted on an upper portion of an inner wall of the groove 15, a negative electromagnetic mechanism 17 is mounted on a lower side of the positive electromagnetic mechanism 16, a slider 18 is fixedly mounted on a lower side of the negative electromagnetic mechanism 17, the connecting rod 9 is fixedly mounted on a lower side of the slider 18, when a chip 6 needs to be moved during bonding, magnetic force is generated between the positive electromagnetic mechanism 16 and the negative electromagnetic mechanism 17 to drive the slider 18 to move freely, the slider, thereby improving the practicability of the equipment, the lower end of the connecting rod 9 is fixedly provided with the material box 10, the lower side of the material box 10 is fixedly provided with the first lifting and contracting rod 11, the lower end of the first lifting and contracting rod 11 is fixedly provided with the second lifting and contracting rod 12, the second lifting and contracting rod 12 is fixedly provided with the damping mechanism 13, the damping mechanism 13 is internally provided with the mounting part 19, the mounting part 19 is fixedly provided with the spring mechanism 20 opposite to the axle center, one end of the spring mechanism 20 far away from the mounting part 19 is fixedly provided with the buffer mechanism 21, the buffer mechanism 21 is connected with the second lifting and contracting rod 12, when the second lifting and contracting rod 12 shakes during movement, the second lifting and contracting rod 12 impacts the buffer mechanism 21, the buffer mechanism 21 relieves part of shaking force, the other part of shaking force is transmitted to the spring mechanism 20 through the buffer mechanism 21, and other power is relieved by the spring mechanism 20, thereby realizing the reduction of the shaking frequency of the equipment, the bonding of the chip 6 is more stable, the lower end of the second lifting and contracting rod 12 is fixedly provided with the bonding mechanism 14, the upper side of the base 1 is fixedly provided with the workbench 25, the upper side of the workbench 25 is provided with the chip 6, when the chip 6 needs to be bonded, the chip 6 is placed on the workbench 25, the upper side of the base 1 is fixedly provided with the supporting rod 3, the upper end of the supporting rod 3 is provided with the positioning mechanism 4, the lower end of the positioning mechanism 4 is fixedly provided with the protective pad 5, when the chip 6 is placed on the surface of the workbench 25, the positioning mechanism 4 rotates to the opposite direction, the chip 6 is firmly fixed by the positioning mechanism 4 through the contact of the protective pad 5 and the chip 6, the chip 6 is prevented from deviating during the bonding, the positioning mechanism 4 is bent, the protective pad 5 is made of insulating material, the insulating material is a non-conductive material, and has good heat resistance, moisture resistance, effectively fix chip 6 and do not damage chip 6 performance through protection pad 5, the upside fixed mounting of base 1 has air-dry mechanism 22, the inside left end fixed mounting of air-dry mechanism 22 has fan 23, the inside left end fixed mounting of air-dry mechanism 22 has wind direction baffle 24, after bonding mechanism 14 took place the bonding with chip 6, fan 23 produced kinetic energy, produce wind-force, wind-force blows to chip 6 bonded portion through wind direction baffle 24, accelerate the cooling effect, thereby realize bonding efficiency.

The working principle is as follows: when the chip bonding device is used, firstly, when the chip 6 needs to be bonded, the chip 6 is placed on the workbench 25, the positioning mechanism 4 rotates to the opposite direction, the chip 6 is contacted with the chip 6 through the protective pad 5, the positioning mechanism 4 firmly fixes the chip 6 during bonding, the chip 6 is prevented from deviating during bonding, the chip 6 is effectively fixed through the protective pad 5 without damaging the performance of the chip 6, when the chip 6 needs to be bonded at a moving position, magnetic force is generated through the positive electromagnetic mechanism 16 and the negative electromagnetic mechanism 17 to drive the slide block 18 to move freely, the slide block 18 drives the bonding mechanism 14 to move through the connecting rod 9, so that the practicability of the device is improved, meanwhile, when the slide block 18 drives the bonding mechanism 14 to move through the connecting rod 9, the second lifting and contracting rod 12 shakes during moving, the second lifting and contracting rod 12 impacts the buffer mechanism 21, the buffer mechanism 21 relieves part of shaking force, and the other part of shaking force is transmitted to the spring mechanism 20 through the buffer mechanism, the rest shaking force is relieved through the spring mechanism 20, so that the effect of reducing the shaking frequency of the equipment is realized, the bonding of the chip 6 is more stable, after the bonding mechanism 14 and the chip 6 are bonded, the fan 23 generates kinetic energy to generate wind power, the wind power blows to the bonding part of the chip 6 through the wind direction guide plate 24, the cooling effect is accelerated, the bonding efficiency of the chip 6 is improved, and the equipment achieves the effects of air drying, cooling and high bonding efficiency; the problem of current equipment rock frequency big, lack air-dry cooling, bonding inefficiency is solved.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides an avoid IGBT chip automatic bonding device of dislocation, includes base (1), its characterized in that: the utility model discloses a material box, including base (1), upside fixed mounting have two support columns (2), two the equal fixed mounting in one side that support column (2) is relative has dead lever (7), two one side fixed mounting that dead lever (7) is relative has slide mechanism (8), connecting rod (9) are installed to the downside of slide mechanism (8), the lower extreme fixed mounting of connecting rod (9) has material box (10), the downside fixed mounting of material box (10) has first liter telescopic link (11), the lower extreme fixed mounting of first liter telescopic link (11) has second liter telescopic link (12), fixed mounting has damper (13) on second liter telescopic link (12), the lower extreme fixed mounting of second liter telescopic link (12) has bonding mechanism (14).

2. The IGBT chip automatic bonding device capable of avoiding dislocation according to claim 1, wherein: the air drying device is characterized in that an air drying mechanism (22) is fixedly mounted on the upper side of the base (1), a fan (23) is fixedly mounted at the left end of the inside of the air drying mechanism (22), and a wind direction guide plate (24) is fixedly mounted at the left end of the inside of the air drying mechanism (22).

3. The IGBT chip automatic bonding device capable of avoiding dislocation according to claim 1, wherein: the upper side fixed mounting of base (1) has bracing piece (3), positioning mechanism (4) are installed to the upper end of bracing piece (3), the lower extreme fixed mounting of positioning mechanism (4) has protection pad (5).

4. The IGBT chip automatic bonding device capable of avoiding dislocation according to claim 3, wherein: the positioning mechanism (4) is bent, and the protective pad (5) is made of insulating materials.

5. The IGBT chip automatic bonding device capable of avoiding dislocation according to claim 1, wherein: the upside fixed mounting of base (1) has workstation (25), workstation (25) upside is provided with chip (6).

6. The IGBT chip automatic bonding device capable of avoiding dislocation according to claim 1, wherein: the inside of slide mechanism (8) is provided with recess (15), the inner wall top fixed mounting of recess (15) has positive electromagnetism mechanism (16), negative electromagnetism mechanism (17) are installed to the downside of positive electromagnetism mechanism (16), the downside fixed mounting who negatively charges electromagnetism mechanism (17) has slider (18), the downside fixed mounting of slider (18) has connecting rod (9).

7. The IGBT chip automatic bonding device capable of avoiding dislocation according to claim 1, wherein: the inside setting of damper (13) installs installed part (19), installed part (19) are located fixed mounting and are had spring mechanism (20) to the axle center relatively, the one end fixed mounting that installed part (19) were kept away from in spring mechanism (20) has buffer gear (21), buffer gear (21) are connected with second liter shrink pole (12).