CN210721294U - Computer mainframe base - Google Patents
Computer mainframe base Download PDFInfo
- Publication number
- CN210721294U CN210721294U CN201922299737.9U CN201922299737U CN210721294U CN 210721294 U CN210721294 U CN 210721294U CN 201922299737 U CN201922299737 U CN 201922299737U CN 210721294 U CN210721294 U CN 210721294U
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- damping
- heat dissipation
- base
- supporting
- magnet
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Abstract
The utility model discloses a computer main base, which belongs to the technical field of computers, and comprises a supporting bottom plate, a damping mechanism is arranged below the supporting bottom plate, the damping mechanism comprises a damping base, both ends of the upper surface of the damping base are provided with limiting rods corresponding to the supporting bottom plate, both ends of the damping base are provided with limiting sleeves corresponding to the limiting rods, the bottom end of each limiting sleeve is provided with a damping spring, both ends of the upper surface of the damping base are provided with damping blocks, the top ends of the damping blocks are provided with first damping magnets, the bottom ends of the damping blocks are provided with second damping magnets, and the middle part of the upper surface of the supporting bottom plate is embedded with a semiconductor refrigeration piece; the utility model discloses simple structure, convenient to use has good shock-absorbing function, can fully subtract shock attenuation to the main frame, makes the function of main frame base abundanter, promotes the user and experiences the use of main frame base.
Description
Technical Field
The utility model belongs to the technical field of the computer, concretely relates to computer mainframe base.
Background
Chinese patent (publication number CN 206312048U) discloses a computer mainframe base, comprising a base plate, the top of bottom plate is equipped with carries the thing board, it includes carries the thing board casing to carry the thing board, the inner chamber that carries the thing board casing is equipped with first cardboard, the outside of carrying the thing board casing is equipped with the baffle, first cardboard passes through the connecting plate and links to each other with the baffle, the inner wall that carries the thing board casing is equipped with the dog, the top left and right sides that carries the thing board casing all is equipped with first screw rod.
This computer mainframe base's advantage lies in, through the cooperation of carrying thing board casing, baffle, connecting plate and first cardboard, can satisfy not unidimensional quick-witted case.
However, the computer host base has a simpler structure, so that the damping effect of the computer host base is poorer, the function of the computer host base is single, and the use experience of a user on the computer host base is influenced.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a computer mainframe base to solve the problem that proposes among the above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a computer mainframe base, includes the supporting baseplate, and the below of supporting baseplate is provided with damper, and damper includes vibration damping mount, vibration damping mount's upper surface both ends are provided with the gag lever post corresponding with the supporting baseplate, and vibration damping mount's both ends are provided with the spacing sleeve corresponding with the gag lever post, and spacing sleeve's bottom is provided with damping spring, and vibration damping mount's upper surface both ends are provided with the snubber block, and the top of snubber block is provided with first damping magnet, and the bottom of snubber block is provided with second damping magnet, and the upper surface middle part of supporting baseplate is inlayed and is had the semiconductor refrigeration piece.
As a further aspect of the present invention: first shock attenuation magnet and second shock attenuation magnet are neodymium iron boron magnet, and the magnetic pole of first shock attenuation magnet and second shock attenuation magnet opposite face is the same, and vibration damping mount's lower surface is provided with anti-skidding backing plate, and anti-skidding backing plate is the cuboid structure, and anti-skidding backing plate's material is rubber, and anti-skidding backing plate passes through the glue bonding with vibration damping mount and is connected.
As a further aspect of the present invention: the material of snubber block is rubber, and the top and the supporting baseplate of snubber block pass through glue bonding connection, and the bottom and the vibration damping mount of snubber block pass through glue bonding connection.
As a further aspect of the present invention: the supporting base plate is characterized in that limiting sliding plates are arranged at two ends of the upper surface of the supporting base plate, limiting sliding grooves corresponding to the limiting sliding plates are formed in two ends of the supporting base plate, limiting bolts corresponding to the supporting base plate are arranged at the tops of the limiting sliding plates, and a heat dissipation water tank is arranged at one end of the upper surface of the limiting sliding plate.
As a further aspect of the present invention: one side of the heat dissipation water tank is provided with a heat dissipation fan, the heat dissipation water tank is provided with a heat dissipation through hole corresponding to the heat dissipation fan, and the other side of the heat dissipation water tank is provided with a buffer block.
As a further aspect of the present invention: the lower surface of the supporting base plate is provided with radiating fins corresponding to the semiconductor refrigerating fins, the radiating fins are of cuboid structures, and the radiating fins are fixedly connected with the supporting base plate in a welding mode.
Compared with the prior art, the beneficial effects of the utility model are that: the utility model discloses simple structure, convenient to use has good shock-absorbing function, can carry out abundant shock attenuation to the main frame, makes the function of main frame base richer, promotes the user and experiences the use of main frame base, secondly, the utility model discloses have good heat dissipation function, can fully dispel the heat to the main frame, prevent effectively that the main frame from taking place to damage because the temperature is too high, be worth promoting and using.
Drawings
Fig. 1 is a schematic structural view of the present invention;
fig. 2 is a schematic structural view of a corresponding damping mechanism of the present invention;
fig. 3 is a schematic structural view of a corresponding heat dissipation through hole of the present invention;
in the figure: 1-radiating water tank, 2-buffer block, 3-radiating fan, 4-limiting bolt, 5-limiting chute, 6-damping mechanism, 7-limiting slide plate, 8-supporting base plate, 9-semiconductor refrigerating sheet, 10-radiating fin, 11-radiating through hole, 61-anti-skid pad, 62-damping block, 63-first damping magnet, 64-damping base, 65-second damping magnet, 66-limiting rod, 67-limiting sleeve and 68-damping spring.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Example 1:
referring to fig. 1-3, the present invention provides a technical solution: a computer host base comprises a supporting base plate 8, a damping mechanism 6 is arranged below the supporting base plate 8, the damping mechanism 6 comprises a damping base 64, limiting rods 66 corresponding to the supporting base plate 8 are arranged at two ends of the upper surface of the damping base 64, limiting sleeves 67 corresponding to the limiting rods 66 are arranged at two ends of the damping base 64, damping springs 68 are arranged at the bottom ends of the limiting sleeves 67, damping blocks 62 are arranged at two ends of the upper surface of the damping base 64, first damping magnets 63 are arranged at the top ends of the damping blocks 62, second damping magnets 65 are arranged at the bottom ends of the damping blocks 62, and semiconductor refrigerating sheets 9 are embedded in the middle of the upper surface of the supporting base plate 8;
in order to improve the damping effect of the first damping magnet 63, in this embodiment, preferably, the first damping magnet 63 and the second damping magnet 65 are both neodymium iron boron magnets, the magnetic poles of the opposite surfaces of the first damping magnet 63 and the second damping magnet 65 are the same, the lower surface of the damping base 64 is provided with the anti-skid base plate 61, the anti-skid base plate 61 is of a cuboid structure, the anti-skid base plate 61 is made of rubber, and the anti-skid base plate 61 and the damping base 64 are bonded and connected through glue;
in order to lower the cost of the damper block 62, in this embodiment, it is preferable that the damper block 62 is made of rubber, the top end of the damper block 62 is bonded to the support base 8 by glue, and the bottom end of the damper block 62 is bonded to the damper base 64 by glue.
Example 2:
on the basis of embodiment 1, in order to make the functions of the computer main machine base richer, in this embodiment, preferably, both ends of the upper surface of the supporting base plate 8 are provided with the limiting sliding plates 7, both ends of the supporting base plate 8 are provided with the limiting sliding grooves 5 corresponding to the limiting sliding plates 7, and the limiting sliding plates 7 can slide laterally along the supporting base plate 8 through the limiting sliding grooves 5;
in order to facilitate the fixing of the limiting sliding plate 7 by the user, in this embodiment, preferably, the top of the limiting sliding plate 7 is provided with a limiting bolt 4 corresponding to the supporting bottom plate 8, one end of the upper surface of the limiting sliding plate 7 is provided with a heat radiation water tank 1, when in use, the heat radiation water tank 1 is used for radiating heat of the computer host, and the heat radiation water tank 1 is filled with water;
in order to improve the heat dissipation effect of the heat dissipation water tank 1, in this embodiment, preferably, one side of the heat dissipation water tank 1 is provided with a heat dissipation fan 3, the heat dissipation water tank 1 is provided with a heat dissipation through hole 11 corresponding to the heat dissipation fan 3, the other side of the heat dissipation water tank 1 is provided with a buffer block 2, the heat dissipation fan 3 is electrically connected with a power supply through a switch, when in use, the heat dissipation is performed on the computer host through the mutual matching of the heat dissipation fan 3 and the heat dissipation water tank 1, so that the heat dissipation effect of the computer host by the host base is improved, and the buffer block 2 is arranged so that a certain distance exists between the heat dissipation;
in order to make the supporting base plate 8 have a better cooling effect on the computer host, in this embodiment, it is preferable that the lower surface of the supporting base plate 8 is provided with heat dissipation fins 10 corresponding to the semiconductor chilling plates 9, and the heat dissipation fins 10 are in a rectangular parallelepiped structure;
in order to improve the heat dissipation effect of the heat dissipation fins 10, in this embodiment, preferably, the heat dissipation fins 10 are fixedly connected with the support base plate 8 by welding, and the hot end of the semiconductor chilling plate 9 dissipates heat with the support base plate 8;
The utility model discloses a theory of operation and use flow: when the computer mainframe is used, the computer mainframe is placed in the middle of the supporting bottom plate 8, then the two heat dissipation water tanks 1 are used for fixing the computer mainframe, when vibration occurs, the first damping magnet 63 and the second damping magnet 65 repel each other, so that kinetic energy generated by the vibration is consumed, the height of the computer mainframe is prevented from being rapidly changed, in addition, the damping block 62 and the damping spring 68 can further consume the kinetic energy generated by the vibration, and therefore the damping effect of the mainframe base on the computer mainframe is better;
when needs dispel the heat to the host computer, the power of switch-on heat dissipation fan 3 and semiconductor refrigeration piece 9 to dispel the heat to the host computer through mutually supporting of heat dissipation fan 3 and heat dissipation water tank 1 and semiconductor refrigeration piece 9, thereby prevent effectively that the host computer from taking place to damage because the high temperature, make the function of host computer base abundanter, promote the user and experience the use of host computer base.
It is obvious to a person skilled in the art that the invention is not restricted to details of the above-described exemplary embodiments, but that it can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.
Claims (6)
1. The utility model provides a computer mainframe base, includes supporting baseplate (8), and the below of supporting baseplate (8) is provided with damper (6), and damper (6) include damper (64), its characterized in that: the upper surface both ends of vibration damping mount (64) are provided with gag lever post (66) corresponding with supporting baseplate (8), the both ends of vibration damping mount (64) are provided with spacing sleeve (67) corresponding with gag lever post (66), the bottom of spacing sleeve (67) is provided with damping spring (68), the upper surface both ends of vibration damping mount (64) are provided with snubber block (62), the top of snubber block (62) is provided with first damping magnet (63), the bottom of snubber block (62) is provided with second damping magnet (65), the upper surface middle part of supporting baseplate (8) is inlayed and is had semiconductor refrigeration piece (9).
2. The computer host base of claim 1, wherein: first shock attenuation magnet (63) and second shock attenuation magnet (65) are neodymium iron boron magnet, and the magnetic pole of first shock attenuation magnet (63) and second shock attenuation magnet (65) opposite face is the same, and the lower surface of vibration damping mount (64) is provided with anti-skidding backing plate (61), and anti-skidding backing plate (61) are the cuboid structure, and the material of anti-skidding backing plate (61) is rubber, and anti-skidding backing plate (61) are connected through the glue bonding with vibration damping mount (64).
3. The computer host base of claim 2, wherein: the damping block (62) is made of rubber, the top end of the damping block (62) is connected with the supporting bottom plate (8) through glue in a bonding mode, and the bottom end of the damping block (62) is connected with the damping base (64) through glue in a bonding mode.
4. The computer host base of claim 1, wherein: the supporting device is characterized in that limiting sliding plates (7) are arranged at two ends of the upper surface of the supporting base plate (8), limiting sliding grooves (5) corresponding to the limiting sliding plates (7) are formed in two ends of the supporting base plate (8), limiting bolts (4) corresponding to the supporting base plate (8) are arranged at the top of the limiting sliding plates (7), and a heat dissipation water tank (1) is arranged at one end of the upper surface of each limiting sliding plate (7).
5. The computer host base of claim 4, wherein: one side of the heat dissipation water tank (1) is provided with a heat dissipation fan (3), the heat dissipation water tank (1) is provided with a heat dissipation through hole (11) corresponding to the heat dissipation fan (3), and the other side of the heat dissipation water tank (1) is provided with a buffer block (2).
6. The computer main frame according to any one of claims 1 to 5, wherein: the lower surface of the supporting base plate (8) is provided with heat radiating fins (10) corresponding to the semiconductor refrigerating fins (9), the heat radiating fins (10) are of cuboid structures, and the heat radiating fins (10) are fixedly connected with the supporting base plate (8) in a welding mode.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201922299737.9U CN210721294U (en) | 2019-12-19 | 2019-12-19 | Computer mainframe base |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201922299737.9U CN210721294U (en) | 2019-12-19 | 2019-12-19 | Computer mainframe base |
Publications (1)
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CN210721294U true CN210721294U (en) | 2020-06-09 |
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Family Applications (1)
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CN201922299737.9U Expired - Fee Related CN210721294U (en) | 2019-12-19 | 2019-12-19 | Computer mainframe base |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111313340A (en) * | 2020-03-04 | 2020-06-19 | 吉林工程技术师范学院 | Power cable binding device for computer network system |
-
2019
- 2019-12-19 CN CN201922299737.9U patent/CN210721294U/en not_active Expired - Fee Related
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111313340A (en) * | 2020-03-04 | 2020-06-19 | 吉林工程技术师范学院 | Power cable binding device for computer network system |
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Date | Code | Title | Description |
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GR01 | Patent grant | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200609 Termination date: 20201219 |