CN210466260U - Novel computer motherboard is fixed device - Google Patents
Novel computer motherboard is fixed device Download PDFInfo
- Publication number
- CN210466260U CN210466260U CN201921842315.5U CN201921842315U CN210466260U CN 210466260 U CN210466260 U CN 210466260U CN 201921842315 U CN201921842315 U CN 201921842315U CN 210466260 U CN210466260 U CN 210466260U
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- China
- Prior art keywords
- heat dissipation
- base
- computer motherboard
- water tank
- novel computer
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Abstract
The utility model discloses a novel computer mainboard is fixed device belongs to the computer technology field, including the base, the top of base is provided with the apron, and the inside of base is provided with the mainboard main part, is provided with the support piece corresponding with the mainboard main part on the inner wall of base, the upper surface of apron is provided with the heat dissipation fan, and the both ends of base are seted up the heat dissipation through-hole corresponding with the heat dissipation fan, and the both ends of apron are provided with heat dissipation mechanism, and heat dissipation mechanism includes spacing screw, and the below of spacing screw is provided with the heat dissipation water tank, and the upper surface of heat dissipation water tank is provided with the spacing bearing corresponding with spacing screw, and the inside of heat dissipation water tank is provided; the utility model discloses simple structure, convenient to use has good heat dissipation function, can prevent effectively that the computer motherboard from taking place to damage because the high temperature to guarantee the normal use of user to the computer motherboard.
Description
Technical Field
The utility model belongs to the technical field of the computer, concretely relates to novel computer motherboard is fixed device.
Background
Chinese patent (publication No. CN 206003023U) discloses a computer motherboard fixing device, which comprises a bottom plate, a left support plate, a right support plate and a baffle plate, wherein a fan and a battery are arranged inside the bottom plate, the battery is connected with the fan through an electric wire, and the left side of the bottom plate is connected with the left support plate.
The utility model discloses an advantage lies in, baffle, left branch fagging and right branch fagging surface open have the hole, are favorable to the heat dissipation of mainboard during operation, through baffle and left branch fagging and right branch fagging cooperation, are favorable to the fixed of mainboard.
However, the fixing device is relatively simple in heat dissipation structure, so that the computer motherboard is easily damaged due to overhigh temperature when in use, and normal use of the computer motherboard by a user is affected.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a novel computer motherboard is fixed device to solve the problem that proposes among the above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a novel computer motherboard is fixed device, includes the base, and the top of base is provided with the apron, and the inside of base is provided with the mainboard main part, is provided with the support piece that corresponds with the mainboard main part on the inner wall of base, the upper surface of apron is provided with the heat dissipation fan, and the heat dissipation through-hole corresponding with the heat dissipation fan is seted up at the both ends of base, and the both ends of apron are provided with heat dissipation mechanism, and heat dissipation mechanism includes spacing screw, and spacing screw's below is provided with radiator tank, and radiator tank's upper surface is provided with the spacing bearing corresponding with spacing screw, and radiator tank's inside is provided with the radiating fluid, and radiator.
As a further aspect of the present invention: radiating fins are arranged at two ends of the upper surface of the radiating water tank and are of cuboid structures, and the radiating fins and the radiating water tank are of an integrally formed structure.
As a further aspect of the present invention: the mica radiating fin is of a cuboid structure, the mica radiating fin is bonded with the radiating water tank through glue, and the lower surface of the mica radiating fin is provided with a heat-conducting silica gel sheet.
As a further aspect of the present invention: the bottom of base is provided with the supporting shoe corresponding with the mainboard main part, and the supporting shoe is the cuboid structure, and the material of supporting shoe is rubber, and the supporting shoe passes through glue bonding connection with the base.
As a further aspect of the present invention: the shock absorption device is characterized in that a supporting bottom plate is arranged below the base, a shock absorption block corresponding to the base is arranged in the middle of the upper surface of the supporting bottom plate, limiting rods are arranged at two ends of the lower surface of the base, and limiting sleeves corresponding to the limiting rods are arranged at two ends of the upper surface of the supporting bottom plate.
As a further aspect of the present invention: the inside embedding of snubber block has damping magnet, and damping magnet is the cuboid structure, and damping magnet is neodymium iron boron magnet, and damping magnet is provided with two altogether, and the magnetic pole of two damping magnet opposite faces is the same.
As a further aspect of the present invention: the snubber block is the cuboid structure, and the material of snubber block is rubber, and the snubber block passes through glue bonding with the supporting baseplate and is connected.
Compared with the prior art, the beneficial effects of the utility model are that: the utility model discloses simple structure, convenient to use has good heat dissipation function, can prevent effectively that the computer motherboard from taking place to damage because the temperature is too high to guarantee the normal use of user to the computer motherboard, secondly, the utility model discloses have good shock-absorbing function, can prevent effectively that the computer motherboard from taking place to damage because vibrations, make fixing device's function abundanter, be worth promoting and using.
Drawings
Fig. 1 is a schematic structural view of the present invention;
fig. 2 is a schematic structural view of a corresponding heat dissipation mechanism of the present invention;
FIG. 3 is a cross-sectional view of the heat dissipating water tank according to the present invention;
in the figure: 1-damping magnet, 2-damping block, 3-limiting rod, 4-supporting piece, 5-main board body, 6-cover plate, 7-heat dissipation mechanism, 8-heat dissipation fan, 9-base, 10-supporting block, 11-limiting sleeve, 12-supporting bottom plate, 13-heat dissipation through hole, 71-mica heat dissipation sheet, 72-heat dissipation water tank, 73-limiting screw, 74-heat conduction silica gel sheet, 75-heat dissipation liquid, 76-heat dissipation fin and 77-limiting bearing.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Example 1:
referring to fig. 1-3, the present invention provides a technical solution: a novel computer mainboard fixing device comprises a base 9, a cover plate 6 is arranged above the base 9, a mainboard main body 5 is arranged inside the base 9, a supporting piece 4 corresponding to the mainboard main body 5 is welded on the inner wall of the base 9, a heat dissipation fan 8 is arranged on the upper surface of the cover plate 6, heat dissipation through holes 13 corresponding to the heat dissipation fan 8 are formed in two ends of the base 9, heat dissipation mechanisms 7 are arranged at two ends of the cover plate 6, each heat dissipation mechanism 7 comprises a limit screw 73, a heat dissipation water tank 72 is arranged below the limit screw 73, a limit bearing 77 corresponding to the limit screw 73 is welded on the upper surface of the heat dissipation water tank 72, heat dissipation liquid 75 is arranged inside the heat dissipation water tank 72, and mica heat dissipation fins 71 are arranged on the lower surface of;
in order to make the heat radiation effect of the heat radiation water tank 72 better; in this embodiment, preferably, the two ends of the upper surface of the heat dissipation water tank 72 are provided with the heat dissipation fins 76, the heat dissipation fins 76 are of a rectangular structure, the heat dissipation fins 76 and the heat dissipation water tank 72 are of an integrally formed structure, the using principle and the connection mode of the limit bearing 77 are the prior art, and the limit bearing 77 is arranged so that the limit screw 73 can adjust the distance between the heat dissipation water tank 72 and the cover plate 6 without rotating the heat dissipation water tank 72;
in order to make the mica heat sink 71 and the heat sink water tank 72 adhere to each other more tightly, in this embodiment, it is preferable that the mica heat sink 71 is a rectangular parallelepiped structure, the mica heat sink 71 and the heat sink water tank 72 are bonded and connected by glue, and the lower surface of the mica heat sink 71 is provided with a heat-conducting silica gel sheet 74, and in order to make the cost of the heat sink liquid 75 lower, in this embodiment, it is preferable that the heat sink liquid 75 is water;
in order to make the use of the fixing device more reliable, in this embodiment, preferably, the bottom end of the base 9 is provided with a supporting block 10 corresponding to the main board body 5, the supporting block 10 is of a rectangular structure, the supporting block 10 is made of rubber, the supporting block 10 and the base 9 are bonded and connected through glue, and the supporting block 10 plays a role in damping and supporting the main board body 5.
Example 2:
on the basis of embodiment 1, in order to improve the damping effect of the fixing device, in this embodiment, preferably, a supporting bottom plate 12 is arranged below the base 9, a damping block 2 corresponding to the base 9 is arranged in the middle of the upper surface of the supporting bottom plate 12, limiting rods 3 are welded at two ends of the lower surface of the base 9, limiting sleeves 11 corresponding to the limiting rods 3 are welded at two ends of the upper surface of the supporting bottom plate 12, the limiting rods 3 can vertically slide in the limiting sleeves 11, and therefore the base 9 is prevented from inclining when in use through the mutual matching of the limiting rods 3 and the limiting sleeves 11;
in order to improve the damping effect of the damping block 2, in this embodiment, preferably, the damping magnet 1 is embedded in the damping block 2, the damping magnet 1 is of a cuboid structure, the damping magnet 1 is an ndfeb magnet, the damping magnets 1 are totally provided with two, the magnetic poles of the opposite surfaces of the two damping magnets 1 are the same, and the two damping magnets 1 repel each other when in use, so that kinetic energy generated by vibration is consumed, and the main board body 5 is prevented from generating severe vibration when in use;
in order to make the shock attenuation effect of snubber block 2 better, in the embodiment, it is preferred, snubber block 2 is the cuboid structure, snubber block 2's material is rubber, snubber block 2 passes through the glue bonding with bottom plate 12 and is connected, play shock attenuation and supporting role to base 9 through snubber block 2 during the use, when taking place vibrations, snubber block 2 turns into the elastic potential energy of self with received kinetic energy, thereby prevent effectively that the computer mainboard from taking place to damage owing to vibrations, make fixing device's function abundanter, heat dissipation fan 8 is connected with the power electricity through the switch.
The utility model discloses a theory of operation and use flow: when in use, the supporting bottom plate 12 is fixed, the main board body 5 is fixed in the base 9 through screws, and then the limit screws 73 are screwed to lower the height of the heat dissipation water tank 72, so that the heat conduction silica gel sheet 74 is tightly attached to the upper surface of the main board body 5, and the mica radiating fins 71 and the heat conduction silica gel sheet 74 play roles of insulation and heat conduction;
when the mainboard main body 5 needs to be cooled, the power supply of the cooling fan 8 is switched on, the cooling fan 8 blows air into the base 9 at the moment, so that the mainboard main body 5 is cooled, the heat dissipation water tank 72 and the cooling fins 76 are arranged to effectively increase the loss of heat, the heat dissipation effect of the fixing device is better, the computer mainboard is effectively prevented from being damaged due to overhigh temperature, and the normal use of the computer mainboard by a user is ensured.
It is obvious to a person skilled in the art that the invention is not restricted to details of the above-described exemplary embodiments, but that it can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.
Claims (7)
1. The utility model provides a novel computer motherboard is fixed device, includes base (9), and the top of base (9) is provided with apron (6), and the inside of base (9) is provided with mainboard main part (5), is provided with support piece (4) corresponding with mainboard main part (5) on the inner wall of base (9), its characterized in that: the upper surface of apron (6) is provided with heat dissipation fan (8), heat dissipation through-hole (13) corresponding with heat dissipation fan (8) are seted up at the both ends of base (9), the both ends of apron (6) are provided with heat dissipation mechanism (7), heat dissipation mechanism (7) include stop screw (73), the below of stop screw (73) is provided with radiator tank (72), radiator tank's (72) upper surface is provided with spacing bearing (77) corresponding with stop screw (73), radiator tank's (72) inside is provided with radiating fluid (75), radiator tank's (72) lower surface is provided with mica fin (71).
2. The novel computer motherboard fixing device of claim 1, wherein: the heat dissipation water tank is characterized in that heat dissipation fins (76) are arranged at two ends of the upper surface of the heat dissipation water tank (72), the heat dissipation fins (76) are of cuboid structures, and the heat dissipation fins (76) and the heat dissipation water tank (72) are of an integrally formed structure.
3. The novel computer motherboard fixing device of claim 2, wherein: the mica radiating fin (71) is of a cuboid structure, the mica radiating fin (71) is connected with the radiating water tank (72) in a bonding mode through glue, and the lower surface of the mica radiating fin (71) is provided with a heat conduction silica gel sheet (74).
4. The novel computer motherboard fixing device of claim 3, wherein: the bottom of base (9) is provided with supporting shoe (10) corresponding with mainboard main part (5), and supporting shoe (10) are the cuboid structure, and the material of supporting shoe (10) is rubber, and supporting shoe (10) passes through glue bonding connection with base (9).
5. The novel computer motherboard fixing device according to any one of claims 1 to 4, wherein: the shock absorber is characterized in that a supporting base plate (12) is arranged below the base (9), shock absorbing blocks (2) corresponding to the base (9) are arranged in the middle of the upper surface of the supporting base plate (12), limiting rods (3) are arranged at two ends of the lower surface of the base (9), and limiting sleeves (11) corresponding to the limiting rods (3) are arranged at two ends of the upper surface of the supporting base plate (12).
6. The novel computer motherboard fixing device of claim 5, wherein: the inside embedding of snubber block (2) has damping magnet (1), and damping magnet (1) is the cuboid structure, and damping magnet (1) is neodymium iron boron magnet, and damping magnet (1) is provided with two altogether, and the magnetic pole of two damping magnet (1) opposite faces is the same.
7. The novel computer motherboard fixing device of claim 6, wherein: the damping block (2) is of a cuboid structure, the damping block (2) is made of rubber, and the damping block (2) is connected with the supporting base plate (12) through glue in a bonding mode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921842315.5U CN210466260U (en) | 2019-10-30 | 2019-10-30 | Novel computer motherboard is fixed device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921842315.5U CN210466260U (en) | 2019-10-30 | 2019-10-30 | Novel computer motherboard is fixed device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210466260U true CN210466260U (en) | 2020-05-05 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921842315.5U Expired - Fee Related CN210466260U (en) | 2019-10-30 | 2019-10-30 | Novel computer motherboard is fixed device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210466260U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113176816A (en) * | 2021-05-19 | 2021-07-27 | 荆楚理工学院 | Protector for internal element of computer |
-
2019
- 2019-10-30 CN CN201921842315.5U patent/CN210466260U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113176816A (en) * | 2021-05-19 | 2021-07-27 | 荆楚理工学院 | Protector for internal element of computer |
| CN113176816B (en) * | 2021-05-19 | 2022-04-15 | 荆楚理工学院 | Protector for internal element of computer |
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| Date | Code | Title | Description |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200505 Termination date: 20201030 |
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| CF01 | Termination of patent right due to non-payment of annual fee |