CN216491506U - Power IC heat radiation structure - Google Patents
Power IC heat radiation structure Download PDFInfo
- Publication number
- CN216491506U CN216491506U CN202122995178.2U CN202122995178U CN216491506U CN 216491506 U CN216491506 U CN 216491506U CN 202122995178 U CN202122995178 U CN 202122995178U CN 216491506 U CN216491506 U CN 216491506U
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- Prior art keywords
- heat dissipation
- power supply
- mounting box
- cover plate
- springs
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- 230000005855 radiation Effects 0.000 title claims description 5
- 230000017525 heat dissipation Effects 0.000 claims abstract description 41
- 230000000694 effects Effects 0.000 claims abstract description 15
- 230000003139 buffering effect Effects 0.000 claims abstract description 12
- 238000003780 insertion Methods 0.000 claims description 16
- 230000037431 insertion Effects 0.000 claims description 16
- 239000000428 dust Substances 0.000 claims description 14
- 230000002633 protecting effect Effects 0.000 abstract description 2
- 238000009434 installation Methods 0.000 description 34
- 238000001816 cooling Methods 0.000 description 6
- 230000002265 prevention Effects 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 238000003079 width control Methods 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical group [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000004134 energy conservation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000191 radiation effect Effects 0.000 description 1
- 239000011435 rock Substances 0.000 description 1
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Abstract
The utility model relates to the technical field of power supply I C, in particular to a power supply IC heat dissipation structure, which comprises a mounting box, wherein the bottom of the mounting box is provided with a mounting hole, a fixed frame is fixedly connected in the mounting hole, and the upper end of the fixed frame is provided with a heat dissipation fan, the heat dissipation hole and the heat dissipation fins are matched with each other to facilitate the heat dissipation of a power supply I C main body, and the heat dissipation effect is optimized by matching with the heat dissipation fan, the mounting box is buffered and protected through the elastic action of a first spring, so that the power supply I C main body is protected, and when the mounting box and the power supply I C main body are shaken up and down under the action of vibration force, the buffering and protecting action of the power supply I C main body is further optimized through the elastic action of a second spring, so that the problem that the power supply I C main body can be damaged when the mounting box is impacted by the outside is prevented, and the damage to the power supply I C main body is greatly reduced, the practicability is optimized.
Description
Technical Field
The utility model relates to the technical field of power ICs, in particular to a power IC heat dissipation structure.
Background
The power supply IC refers to the pulse width control integration of a switching power supply, the power supply adjusts the stability of output voltage and current by means of the pulse width control integration, and along with the development of electronic technology, particularly the popularization of current portable products, energy conservation and environmental protection, the power supply IC plays an increasingly large role.
The prior art discloses a part of patent documents with a power supply IC, and a Chinese patent with the application number of CN202021459369.6, and discloses a heat dissipation structure of the power supply IC, which comprises a structure main body, wherein the structure main body comprises a shell, a middle cover and a bottom cover; the shell is provided with a mounting groove, the middle cover and the bottom cover are respectively provided with a first connecting lug and a second connecting lug, and the first connecting lug and the second connecting lug correspond to the mounting groove; a PCB is arranged on one side, close to the shell, of the middle cover, and a power supply IC is arranged on one side, close to the shell, of the PCB; a heat dissipation fan is arranged on one side, far away from the shell, of the middle cover; the heat dissipation efficiency of the power supply IC is improved by the arrangement of the heat dissipation fan, the heat dissipation groove and the heat exchange hole; the PCB is arranged between the shell and the middle cover in a hanging manner, and the middle cover is an aluminum heat-conducting plate, so that the heat dissipation and heat conduction performance of the power IC is further improved; the power supply IC heat dissipation structure is beneficial to improving the heat dissipation efficiency and the heat exchange efficiency of the power supply IC, and improving the use stability and the service life of the power supply IC.
Most of the existing heat dissipation structures of the power IC only have the heat dissipation effect, the protection effect on the power IC is poor, and when the heat dissipation structure of the power IC is impacted by the outside, the power IC is very easy to damage, so that the heat dissipation structure of the power IC is provided.
SUMMERY OF THE UTILITY MODEL
The utility model aims to solve the defects in the prior art and provides a heat dissipation structure of a power supply IC.
In order to achieve the above purposes, the technical scheme adopted by the utility model is as follows: a power supply IC heat dissipation structure comprises an installation box, wherein the bottom of the installation box is provided with an installation hole, a fixed frame is fixedly connected in the installation hole, the upper end of the fixed frame is provided with a heat dissipation fan, the heat dissipation fan is positioned in the installation box, a power supply IC main body is arranged in the installation box, and a buffering protection mechanism is arranged in the installation box and is connected with the power supply IC main body to realize the buffering protection effect on the power supply IC main body; the during operation, the setting of mounting hole is for the convenience of fixed mount, and the mount is for the convenience of installation radiator fan, and radiator fan is convenient for dispel the heat to power IC main part, plays the radiating effect to power IC main part, and buffer protection mechanism links to each other in order to realize playing the buffer protection effect to power IC main part with power IC main part.
Preferably, the upper end of the mounting box is provided with two sliding grooves, two sliding rods are fixedly connected in the two sliding grooves, sliding blocks are connected in the two sliding grooves in a sliding manner, each sliding block is connected to the surfaces of the two sliding rods in a sliding manner, a mounting box is fixedly connected between the two sliding blocks, and the power supply IC main body is mounted in the mounting box; when the sliding box works, the sliding grooves are formed to facilitate fixing of the sliding rods and sliding of the sliding blocks, the sliding blocks are used to facilitate fixing of the mounting box, and the mounting box is used to facilitate containing of the power supply IC main body.
Preferably, the buffering protection mechanism comprises a first cover plate, two groups of first springs, two groups of second springs, a second cover plate and screws, the first cover plate is detachably connected to the installation box through the screws, the number of the first springs is two, each group of the first springs is two, the two groups of first springs are fixedly connected to the lower end of the first cover plate, the two groups of first springs are respectively located in the two sliding grooves, the four first springs are sleeved on the surfaces of the four sliding rods, the four first springs are located on the two sliding blocks, the number of the second springs is three, the three second springs are fixedly connected to the lower end of the first cover plate, the second cover plate is fixedly connected to the lower end of which second spring, and the second cover plate is located on the installation box; during operation, first apron is for the convenience and the installation of install bin aggregate erection, and the first apron is convenient for dismantle first apron with mutually supporting of screw, and the mutually supporting of first spring and second spring is for the convenience of buffering protection power IC main part, and the second apron is for the convenience of installing power IC main part in the installation bin.
Preferably, the upper end of the mounting box is fixedly connected with two insertion blocks, the upper end of the second cover plate is provided with two insertion holes, and the two insertion blocks are movably inserted into the two insertion holes respectively; during operation, the insert block is fixed in order to be conveniently inserted into the jack, and the stability of installation of the second cover plate and the installation box is optimized by the insertion of the insert block and the jack.
Preferably, a plurality of heat dissipation holes are formed in the front end and the rear end of the mounting box, and a plurality of heat dissipation fins are fixedly connected to the front end and the rear end of the mounting box; when the radiating fin works, the radiating holes are formed to facilitate radiating, and the radiating effect is optimized by fixedly matching the radiating holes with the radiating fan.
Preferably, two first dust screens are installed in the first cover plate, and a second dust screen is installed in the cooling fan; during operation, the first dustproof net is installed to facilitate dust prevention, and the second dustproof net is installed to facilitate dust prevention.
Compared with the prior art, the utility model has the following beneficial effects:
this scheme is when dispelling the heat to power IC main part, start radiator fan and rotate, through radiator fan with the installation incasement hot gas outwards blow off, the heat dissipation hole and the mutually supporting of fin are convenient for dispel the heat to power IC main part, and cooperation radiator fan optimizes the radiating effect, when the installation case receives outside striking, the shaking force that the installation case received can transmit for the mounting box, at first, the elastic action through first spring plays the buffer protection effect to the mounting box, and then has played the guard action to power IC main part, and when mounting box and power IC main part receive shaking force and rock from top to bottom, the buffer protection effect to the power IC main part has further been optimized through the elastic action of second spring, when having prevented that the mounting box from receiving outside striking, the problem that power IC main part can damage, greatly reduced the damage to power IC main part, the practicality has been optimized.
Drawings
FIG. 1 is a front perspective view of the present invention;
FIG. 2 is a bottom perspective view of the present invention;
FIG. 3 is an overall exploded view of the present invention;
fig. 4 is a schematic view of the buffer protection mechanism of the present invention.
In the figure: 1. installing a box; 2. a chute; 3. a slide bar; 4. mounting a box; 5. a slider; 6. heat dissipation holes; 7. a heat sink; 8. inserting a block; 9. a power supply IC main body; 10. a first cover plate; 11. a first dust screen; 12. a first spring; 13. a second spring; 14. a second cover plate; 15. a jack; 16. a screw; 17. mounting holes; 18. a fixed mount; 19. a heat radiation fan; 20. and a second dust screen.
Detailed Description
The following description is presented to disclose the utility model so as to enable any person skilled in the art to practice the utility model. The preferred embodiments in the following description are given by way of example only, and other obvious variations will occur to those skilled in the art.
As shown in fig. 1-4, the power IC heat dissipation structure includes an installation box 1, a mounting hole 17 is formed at the bottom of the installation box 1, a fixing frame 18 is fixedly connected in the mounting hole 17, a heat dissipation fan 19 is installed at the upper end of the fixing frame 18, the heat dissipation fan 19 is located in the installation box 1, a power IC main body 9 is arranged in the installation box 1, a buffering protection mechanism is arranged in the installation box 1, and the buffering protection mechanism is connected with the power IC main body 9 to achieve a buffering protection effect on the power IC main body 9; during operation, the installation hole 17 is opened to facilitate fixing the fixing frame 18, the fixing frame 18 is used to facilitate installing the cooling fan 19, the cooling fan 19 is used to facilitate cooling the power supply IC main body 9 and achieve a cooling effect on the power supply IC main body 9, and the buffer protection mechanism is connected with the power supply IC main body 9 to achieve a buffer protection effect on the power supply IC main body 9.
Specifically, two sliding grooves 2 are formed in the upper end of the mounting box 1, two sliding rods 3 are fixedly connected in the two sliding grooves 2, sliding blocks 5 are connected in the two sliding grooves 2 in a sliding manner, each sliding block 5 is connected to the surfaces of the two sliding rods 3 in a sliding manner, a mounting box 4 is fixedly connected between the two sliding blocks 5, and a power supply IC main body 9 is mounted in the mounting box 4; during operation, the sliding groove 2 is opened for fixing the sliding rod 3 and for sliding the sliding block 5, the sliding block 5 is used for fixing the mounting box 4, and the mounting box 4 is used for accommodating the power supply IC main body 9.
Specifically, the buffering protection mechanism comprises a first cover plate 10, first springs 12, second springs 13, a second cover plate 14 and screws 16, wherein the first cover plate 10 is detachably connected to the installation box 1 through the screws 16, the first springs 12 are arranged in two groups, each group is arranged in two groups, the two groups of first springs 12 are fixedly connected to the lower end of the first cover plate 10, the two groups of first springs 12 are respectively located in the two sliding grooves 2, the four first springs 12 are sleeved on the surfaces of the four sliding rods 3, the four first springs 12 are located on the two sliding blocks 5, the number of the second springs 13 is three, the three second springs 13 are fixedly connected to the lower end of the first cover plate 10, the second cover plate 14 is fixedly connected to the lower end of which second spring 13, and the second cover plate 14 is located on the installation box 4; in operation, the first cover plate 10 is convenient to assemble with the mounting box 1, the first cover plate 10 and the screws 16 are matched with each other to facilitate the detachment of the first cover plate 10, the first springs 12 and the second springs 13 are matched with each other to facilitate the buffering protection of the power IC main body 9, and the second cover plate 14 is convenient to mount the power IC main body 9 in the mounting box 4.
Specifically, the upper end of the mounting box 4 is fixedly connected with two insertion blocks 8, the upper end of the second cover plate 14 is provided with two insertion holes 15, and the two insertion blocks 8 are movably inserted into the two insertion holes 15 respectively; in operation, the insert block 8 is fixed to be conveniently inserted into the insertion hole 15, and the insertion of the insert block 8 and the insertion hole 15 optimizes the stability of the installation of the second cover plate 14 and the installation box 4.
Specifically, a plurality of heat dissipation holes 6 are formed in the front end and the rear end of the mounting box 4, and a plurality of heat dissipation fins 7 are fixedly connected to the front end and the rear end of the mounting box 4; when the radiator works, the radiating holes 6 are arranged for facilitating heat radiation, and the radiating holes 6 and the radiating fan 19 are fixedly matched with the radiating fins 7 to optimize the heat radiation effect.
Specifically, two first dust screens 11 are installed in the first cover plate 10, and a second dust screen 20 is installed in the cooling fan 19; during operation, the first dust screen 11 is installed for dust prevention, and the second dust screen 20 is also installed for dust prevention.
The working principle of the utility model is as follows:
when the power supply IC main body 9 is radiated, the radiating fan 19 is started to rotate, the hot air in the installation box 1 is blown out by the radiating fan 19, the mutual matching of the radiating hole 6 and the radiating fin 7 is convenient for radiating the power supply IC main body 9, and the radiating effect is optimized by matching the radiating fan 19, when the installation box 1 is impacted from the outside, the vibration force borne by the installation box 1 can be transmitted to the installation box 4, firstly, the installation box 4 is buffered and protected by the elastic action of the first spring 12, and then, the power supply IC main body 9 is protected, and when the installation box 4 and the power supply IC main body 9 are shaken up and down by the vibration force, the buffering and protecting action on the power supply IC main body 9 is further optimized by the elastic action of the second spring 13, the problem that the power supply IC main body 9 can be damaged when the installation box 1 is impacted from the outside is prevented, and the damage to the power supply IC main body 9 is greatly reduced, the practicability is optimized.
The foregoing shows and describes the general principles, essential features, and advantages of the utility model. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are merely illustrative of the principles of the utility model, but that various changes and modifications may be made without departing from the spirit and scope of the utility model, which is defined by the appended claims and their equivalents.
Claims (6)
1. The utility model provides a power IC heat radiation structure, includes install bin (1), its characterized in that, mounting hole (17) have been seted up to the bottom of install bin (1), fixedly connected with mount (18) in mounting hole (17), radiator fan (19) are installed to the upper end of mount (18), and radiator fan (19) are located install bin (1), set up power IC main part (9) in install bin (1), be provided with buffer protection mechanism in install bin (1), buffer protection mechanism links to each other with power IC main part (9) in order to realize playing the buffer protection effect to power IC main part (9).
2. The power supply IC heat dissipation structure according to claim 1, wherein two sliding grooves (2) are formed in the upper end of the mounting box (1), two sliding rods (3) are fixedly connected in the two sliding grooves (2), sliding blocks (5) are slidably connected in the two sliding grooves (2), each sliding block (5) is slidably connected to the surfaces of the two sliding rods (3), a mounting box (4) is fixedly connected between the two sliding blocks (5), and the power supply IC main body (9) is mounted in the mounting box (4).
3. The heat dissipation structure of a power supply IC according to claim 2, wherein the buffering protection mechanism comprises a first cover plate (10), first springs (12), second springs (13), a second cover plate (14) and screws (16), the first cover plate (10) is detachably connected to the mounting box (1) through the screws (16), the first springs (12) are arranged in two groups, each group is arranged in two groups, the two groups of the first springs (12) are fixedly connected to the lower end of the first cover plate (10), the two groups of the first springs (12) are respectively located in the two sliding grooves (2), the four first springs (12) are sleeved on the surfaces of the four sliding rods (3), the four first springs (12) are located on the two sliding blocks (5), the three groups of the second springs (13) are arranged in three groups, and the three groups of the second springs (13) are respectively fixedly connected to the lower end of the first cover plate (10), the second cover plate (14) is fixedly connected to the lower end of the second spring (13), and the second cover plate (14) is located on the mounting box (4).
4. The power supply IC heat dissipation structure of claim 3, wherein two insertion blocks (8) are fixedly connected to the upper end of the mounting box (4), two insertion holes (15) are formed in the upper end of the second cover plate (14), and the two insertion blocks (8) are movably inserted into the two insertion holes (15) respectively.
5. The heat dissipation structure of claim 4, wherein the mounting box (4) has a plurality of heat dissipation holes (6) formed at both the front and rear ends thereof, and the mounting box (4) has a plurality of heat dissipation fins (7) fixedly connected to both the front and rear ends thereof.
6. The heat dissipation structure of claim 5, wherein two first dust screens (11) are installed in the first cover plate (10), and a second dust screen (20) is installed in the heat dissipation fan (19).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122995178.2U CN216491506U (en) | 2021-12-01 | 2021-12-01 | Power IC heat radiation structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122995178.2U CN216491506U (en) | 2021-12-01 | 2021-12-01 | Power IC heat radiation structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216491506U true CN216491506U (en) | 2022-05-10 |
Family
ID=81402344
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122995178.2U Expired - Fee Related CN216491506U (en) | 2021-12-01 | 2021-12-01 | Power IC heat radiation structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216491506U (en) |
-
2021
- 2021-12-01 CN CN202122995178.2U patent/CN216491506U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20220510 |