CN211827284U

CN211827284U - Packaging structure of fingerprint module under screen

Info

Publication number: CN211827284U
Application number: CN202020717009.5U
Authority: CN
Inventors: 王亚江; 杨超; 马健
Original assignee: Huatian Huichuang Technology Xi'an Co ltd
Current assignee: Huatian Huichuang Technology Xi'an Co ltd
Priority date: 2020-04-30
Filing date: 2020-04-30
Publication date: 2020-10-30
Anticipated expiration: 2030-04-30

Abstract

The utility model discloses a packaging structure of fingerprint module under screen, the utility model discloses a packaging joint is through attached photosensitive chip on the stiffening plate, attached camera lens on photosensitive chip, the holistic ultra-thin thickness of module has been guaranteed, the base is a little higher than the lens height can not the direct contact to the lens surface in order to guarantee pressing down the in-process external object, the both sides of camera lens are directly moulded plastics to the base, and the gold thread is arranged in outside the base, such benefit lies in the production of being convenient for with the direct encapsulation of base and gold thread together, and the base presses in the camera lens both sides, can guarantee that the roughness of lens is higher, the structure of this kind of packaging mode is better, and stability is high.

Description

Packaging structure of fingerprint module under screen

Technical Field

The utility model belongs to the technical field of make a video recording, concretely relates to packaging structure of fingerprint module under screen.

Background

Nowadays, fingerprint identification technology has been widely applied to smart phones, and becomes a standard configuration of smart phones. With the development of the times, all the smart phone manufacturers develop a full-screen, and in order to improve the screen occupation ratio, the fingerprint unlocking has to be arranged on the other parts of the mobile phone except the screen. The fingerprint under the screen becomes an optimal solution, so how to assemble and package the fingerprint under the screen module becomes the most critical problem to be solved at present.

Disclosure of Invention

An object of the utility model is to overcome the aforesaid not enough, provide a packaging structure of fingerprint module under screen, reduced the thickness of fingerprint module under the screen and the holistic stability of fingerprint module under the screen.

In order to achieve the purpose, the utility model discloses a stiffening plate is provided with the base on, and the stiffening plate facing has the sensitization chip, and the sensitization chip facing has the camera lens that has the lens, and the base setting is in the both sides of camera lens, and the gold thread is drawn forth to the sensitization chip and is connected with the FPC board, and outside the base was arranged in to the gold thread, the base was higher than the camera lens height.

The reinforcing plate and the photosensitive chip are fixed through glue or a glue film.

The photosensitive chip and the lens are fixed by transparent glue or transparent film.

Compared with the prior art, the utility model discloses an encapsulation connects through attached photosensitive chip on the stiffening plate, attached camera lens on photosensitive chip, the holistic ultra-thin thickness of module has been guaranteed, the base is a little higher than the lens height can not direct contact to the lens surface in order to guarantee pressing down the in-process external object, the both sides of camera lens are directly moulded plastics to the base, and the gold thread is arranged in outside the base, such benefit lies in the production of being convenient for with base and gold thread direct encapsulation together, and the base is pressed in the camera lens both sides, can guarantee that the roughness of lens is higher, the structure of this kind of packaging method is better, and stability is high.

Further, the utility model discloses a transparent adhesive film or transparent glue link together sensitization chip and camera lens, link together sensitization chip and stiffening plate through glued membrane or glue to the holistic stability of fingerprint module under thickness and the screen of fingerprint module under the screen has greatly reduced the degree ground.

Drawings

Fig. 1 is a schematic structural view of the present invention;

the optical lens comprises a lens body 1, a lens body 2, a base 3, a reinforcing plate 4, glue or a glue film 5, a photosensitive chip 6, transparent glue or a transparent glue film 7, a lens 8 and a gold thread.

Detailed Description

The present invention will be further explained with reference to the accompanying drawings.

Referring to fig. 1, the utility model discloses a stiffening plate 3 is provided with base 2 on the

stiffening plate

3, and 3 posts on the stiffening plate have photosensitive chip 5, and photosensitive chip 5 posts with camera lens 1 that has lens 7, and base 2 sets up in the both sides of camera lens 1, and photosensitive chip 5 draws forth gold thread 8 and is connected with the FPC board, and outside base 2 was arranged in to gold thread 8, base 2 was higher than camera lens 1 height. The reinforcing plate 3 and the photosensitive chip 5 are fixed by glue or a glue film 4. The photosensitive chip 5 and the lens 1 are fixed by transparent glue or transparent film 6.

The utility model discloses a packaging method, including following step:

attaching a photosensitive chip 5 on a reinforcing plate 3, coating glue on the reinforcing plate 3 or sticking a glue film on the bottom of the photosensitive chip 5, so that the reinforcing plate 3 and the photosensitive chip 5 are fixed through glue or the glue film 4;

secondly, leading out a gold wire 8 from the photosensitive chip 5 to be connected with the FPC board;

attaching the lens 1 to the photosensitive chip 5, smearing transparent glue on the surface of the photosensitive chip 5 or sticking a transparent glue film at the bottom of the lens 1, so that the optical chip 5 and the lens 1 are fixed through the transparent glue or the transparent glue film 6;

and fourthly, manufacturing bases 2 on two sides of the lens 1 on the reinforcing plate 3 through a moving process, and enabling gold wires 8 to be arranged outside the bases 2, wherein the bases 2 are higher than the lens 1, so that packaging is completed.

The utility model discloses a sensitization chip is attached on the stiffening plate, with the camera lens attached on sensitization chip, the camera lens both sides preparation base on the stiffening plate makes the gold thread arrange the base in outside, the base is higher than the camera lens height, through the utility model discloses fingerprint module under the screen of making, whole thickness is lower, and is good in structure, and the roughness is high, occupies smallly, and the formation of image is clear, and is not fragile, and fingerprint class module and all can use when the module that the thickness required to be lower under the screen of making.

Claims

1. The utility model provides an encapsulation structure of fingerprint module under screen, a serial communication port, including stiffening plate (3), be provided with base (2) on stiffening plate (3), stiffening plate (3) upper paste has sensitization chip (5), sensitization chip (5) upper paste has camera lens (1) that have lens (7), base (2) set up the both sides in camera lens (1), sensitization chip (5) are drawn forth gold thread (8) and are connected with the FPC board, base (2) are arranged in outside gold thread (8), base (2) are higher than camera lens (1) height.

2. The packaging structure of the fingerprint module under the screen of claim 1, wherein the stiffener (3) and the photo sensor chip (5) are fixed by glue or adhesive film (4).

3. The packaging structure of the fingerprint module under the screen of claim 1, wherein the photosensitive chip (5) and the lens (1) are fixed by transparent glue or transparent film (6).