CN208956159U - Photosensory assembly, camera module and intelligent terminal - Google Patents
Photosensory assembly, camera module and intelligent terminal Download PDFInfo
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- CN208956159U CN208956159U CN201821556339.XU CN201821556339U CN208956159U CN 208956159 U CN208956159 U CN 208956159U CN 201821556339 U CN201821556339 U CN 201821556339U CN 208956159 U CN208956159 U CN 208956159U
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- sensitive chip
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- circuit board
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Abstract
The utility model relates to a kind of photosensory assembly, camera module and intelligent terminals, the photosensory assembly includes: circuit board, including upper surface and the lower surface opposite with the upper surface, the through-hole for being connected to the upper surface and the lower surface is offered on the circuit board, the quantity of the through-hole is multiple；Curved surface sensitive chip, photosurface are curved surface, and the inside for the figure that the multiple through-hole is enclosed is fixed in the central area of the curved surface sensitive chip, and the curved surface sensitive chip and the circuit board are electrically connected；And packing colloid, the packing colloid are filled in the gap between the curved surface sensitive chip and the circuit board.The curved surface sensitive chip of the utility model is directly molded on circuit board, eliminates the process that curved surface sensitive chip after molding is bonded on circuit boards again, easy to operate.
Description
Technical field
The utility model relates to camera technical fields, eventually more particularly to a kind of photosensory assembly, camera module and intelligence
End.
Background technique
With the smart machine with camera function in life using more more and more universal, user wants camera module
Ask higher and higher.Traditional camera module uses plane sensitive chip, and plane sensitive chip (also known as area image sensor) refers to
Photosurface is that the sensitive chip of plane causes since the marginal portion of plane sensitive chip and the optical path difference of central part are different
Light is easy to appear phenomena such as distortion, corner loss of gloss and acute angle decline in the marginal position of plane sensitive chip, to reduce
The pixel of camera module imaging.To solve the above-mentioned problems, camera module starts using curved surface sensitive chip, the photosensitive core of curved surface
Piece (also known as curved surface imaging sensor) refers to that photosurface is the sensitive chip of curved surface, since its photosurface is curved surface, closer to
It is all the retina of curved surface, therefore imaging effect is closer to human eye, it is considered to be the development trend of the following field of photography.But
It is that in the production process, curved surface sense is generally first fabricated separately in the photosensory assembly in traditional camera module with curved surface sensitive chip
Optical chip, then curved surface sensitive chip after molding is installed on circuit board, production process is complex.
Utility model content
Based on this, it is necessary to for the complex problem of the production process of the photosensory assembly with curved surface sensitive chip,
A kind of photosensory assembly, camera module and intelligent terminal are provided.
A kind of photosensory assembly production method, step include:
A circuit board is provided, the circuit board includes upper surface and the lower surface opposite with the upper surface, described
The through-hole for being connected to the upper surface and the lower surface is opened up on circuit board, the quantity of the through-hole is multiple；
The plane sensitive chip that one photosurface is plane is provided, the central area of the plane sensitive chip is fixed on institute
The inside for the figure that multiple through-holes are enclosed is stated, the neighboring area of the plane sensitive chip covers the through-hole；
Multiple guide posts are provided, by the multiple guide post respectively with the multiple through-hole face, and by the multiple guide post point
The neighboring area of the plane sensitive chip Chuan Guo not be jacked up after the multiple through-hole；
Gap filling packing colloid between the plane sensitive chip and the circuit board, being formed by curing photosurface is
The curved surface sensitive chip of curved surface；And
Separate the guide post and the through-hole.
Above-mentioned photosensory assembly production method, opens up the through-hole of connection upper surface and lower surface on circuit boards, and makes to put down
The central area of face sensitive chip is fixed on the inside for the figure that multiple through-holes are enclosed, and the peripheral region of plane sensitive chip
Domain covers through-hole, so that photosensory assembly as characterized above can jack up plane sensitive chip in guide post after through-hole
Neighboring area, and under the solidification of packing colloid formed curved surface sensitive chip.There is the photosensitive core of curved surface relative to existing
The photosensory assembly manufacturing process of piece, the curved surface sensitive chip in the utility model photosensory assembly can be directly molded on circuit board
On, the process that curved surface sensitive chip after molding is bonded on circuit boards again is eliminated, processing procedure is simple.And it is photosensitive in curved surface
It in the forming process of chip, realizes under the premise of not contacting the imaging surface of sensitive chip, curved surface sensitive chip can be completed
Production, the imaging surface of chip will not be polluted, have better photosensitive effect.
The central area by the plane sensitive chip is fixed on the multiple through-hole in one of the embodiments,
The inside for the figure being enclosed, specifically includes:
The adhesive layer for being located at the inside of the figure is formed in the upper surface of the circuit board；
The central area of the plane sensitive chip is attached at the adhesive layer.
In this way, under the premise of the central area of plane sensitive chip can be fixed on circuit boards by adhesive layer, just
The neighboring area of plane sensitive chip is jacked up in guide post.
The upper surface in the circuit board forms the inside for being located at the figure in one of the embodiments,
Adhesive layer, specifically:
The adhesive layer for being located at the central area of the figure is formed in the upper surface of the circuit board.
In this way, the week for being applied to plane sensitive chip by guide post can be made in above-mentioned photosensory assembly production method
The power distribution of border region is more uniform, is conducive to the molding of the curve form of curved surface sensitive chip.
In one of the embodiments, it is described by the multiple guide post respectively with the multiple through-hole face, specifically include:
The circuit board is fixed on a jig；
By the multiple through-hole respectively with multiple guide hole faces for being opened up on the jig；
By the guide post respectively with the guide hole face, with enable the multiple guide post respectively with the multiple through-hole face.
In this way, the precise positioning that guide post is arranged in via process may be implemented, while guide post can be increased and jack up plane sense
The stability of the neighboring area process of optical chip.
It is described in one of the embodiments, that the circuit board is fixed on a jig, specifically:
By the vacuum hole of the jig, the circuit board absorption is enabled to be fixed on the jig.
In this way, lower surface and the jig of circuit board can be made before the neighboring area that guide post jacks up plane sensitive chip
It is mutually attracted by vacuum hole, so that circuit board be enabled closely to be bonded with jig, and is unlikely to jacking up plane sensitive chip
When neighboring area, make circuit board as plane sensitive chip moves upwardly together and is detached from jig.
The multiple guide post is each passed through described in one of the embodiments, after the multiple through-hole described in jacking up
Before the neighboring area of plane sensitive chip, the photosensory assembly production method further includes following steps:
Conductor wire is provided, and keeps the both ends of the conductor wire electrical with the plane sensitive chip and the circuit board respectively
Connection.
In this way, in guide post before the neighboring area that through-hole jacks up plane sensitive chip, plane sensitive chip and circuit
The preferential wire bonding of plate avoids wire bonding again after the molding of curved surface sensitive chip, causes out-of-flatness bonding and the key of chip
Close unstable risk.
The multiple guide post is each passed through described in one of the embodiments, after the multiple through-hole described in jacking up
Before the neighboring area of plane sensitive chip, the photosensory assembly production method further includes following steps:
Fixed block is provided, the fixed block is fitted in the upper surface of the circuit board, to assist the guide post top
Play the neighboring area of the plane sensitive chip.
It so, it is possible to promote the stability that guide post jacks up sensitive chip process, prevent circuit board with plane sensitive chip
It moves upwardly together.
In one of the embodiments, after the step of separating the guide post and the through-hole, the photosensory assembly system
Further include following steps as method:
Filling member is provided, the filling member is filled in the multiple through-hole.
In this way, filling member is filled in the through-hole on circuit board, so that curved surface sensitive chip is after shaping, circuit board has
Preferable support strength can support the components such as curved surface sensitive chip, lens assembly.
Meanwhile the utility model also provides a kind of photosensory assembly, which includes:
Circuit board offers connection on the circuit board including upper surface and the lower surface opposite with the upper surface
The through-hole of the upper surface and the lower surface, the quantity of the through-hole are multiple；
Curved surface sensitive chip, photosurface are curved surface, and the central area of the curved surface sensitive chip is fixed on the multiple
The inside for the figure that through-hole is enclosed, and the curved surface sensitive chip and the circuit board are electrically connected；
Packing colloid, the packing colloid are filled in the gap between the curved surface sensitive chip and the circuit board.
Above-mentioned photosensory assembly, curved surface sensitive chip are directly molded on circuit board, eliminate the photosensitive core of curved surface after molding
The process that piece is bonded on circuit boards again, it is easy to operate.
What the multiple through-hole was enclosed be fixed in the central area of curved surface sensitive chip in one of the embodiments,
The mode of the inside of figure is specifically fixed using adhesive layer, and the adhesive layer is formed in the upper table of the circuit board
Face, and it is located at the inside for the figure that the multiple through-hole is enclosed, the central area of the curved surface sensitive chip is attached at institute
It states on adhesive layer, to enable the central area of the curved surface sensitive chip be fixed in the figure that the multiple through-hole is enclosed
Side.
In this way, under the premise of the central area of plane sensitive chip can be fixed on circuit boards by adhesive layer, just
Plane sensitive chip neighboring area is jacked up in guide post.
The mode that the curved surface sensitive chip is electrically connected with the circuit board in one of the embodiments, specifically uses
Conductor wire is electrically connected, and the both ends of the conductor wire electrically connect with the curved surface sensitive chip and the circuit board respectively
It connects, to enable the curved surface sensitive chip and the circuit board be electrically connected.
In this way, electrically conducting convenient for curved surface sensitive chip and circuit board.
The photosensory assembly further includes filling member in one of the embodiments, and the filling member is filled in the multiple
Through-hole.
Above-mentioned photosensory assembly, filling member are filled in the through-hole on circuit board, so that curved surface sensitive chip is after shaping, electricity
Road plate has preferable support strength, can support the components such as curved surface sensitive chip, lens assembly.
The adhesive layer is located at the center for the figure that the multiple through-hole is enclosed in one of the embodiments,
Domain.
In this way, advantageously ensuring that the symmetry of the structure of photosensory assembly.
The packing colloid extends internally in one of the embodiments, and connect with the adhesive layer.
In this way, further increasing the connectivity robustness of curved surface sensitive chip and circuit board.
The packing colloid extends out to the side far from the curved surface sensitive chip in one of the embodiments,
Outside.
In this way, further increasing the connectivity robustness of curved surface sensitive chip and circuit board.
One end that the conductor wire is connect with the circuit board in one of the embodiments, is embedded in the packing colloid
It is interior.
In this way, can expose to outside packing colloid to avoid conductor wire, the risk of conductor wire damage is reduced, extends and uses the longevity
Life.
Meanwhile the utility model also provides a kind of camera module, comprising:
Above-mentioned photosensory assembly；And
Lens assembly, on the photosensitive path of the photosensory assembly.
In this way, the photosensory assembly with curved surface sensitive chip can be installed on lens assembly, to form camera module.
Meanwhile the utility model also provides a kind of intelligent terminal, comprising:
Above-mentioned camera module；And
Terminal body, the camera module are set on the terminal body.
In this way, the available intelligent terminal with above-mentioned camera module.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of the camera module of one embodiment of the utility model；
Fig. 2 is the structural schematic diagram of photosensory assembly in Fig. 1；
Fig. 3 is the structural schematic diagram of circuit board in Fig. 2；
Fig. 4 is that the upper surface of circuit board in Fig. 3 is equipped with the structural schematic diagram of adhesive layer；
Fig. 5 is the structural schematic diagram that adhesive layer is equipped with plane sensitive chip in Fig. 4；
Fig. 6 is the structural schematic diagram that plane sensitive chip and circuit board are connected by conductor wire in Fig. 5；
Fig. 7 is that the upper surface of circuit board in Fig. 6 is equipped with the structural schematic diagram of fixed block；
Fig. 8 is to form curved surface sensitive chip after the neighboring area of the plane sensitive chip in Fig. 7 is jacked up by jacking apparatus
Structural schematic diagram；
Fig. 9 is the structural schematic diagram after the gap filling packing colloid between curved surface sensitive chip and circuit board in fig. 8；
Figure 10 is that the through-hole of photosensory assembly in Fig. 9 fills the schematic diagram of filling member；
Figure 11 is that the through-hole of photosensory assembly in Figure 10 fills the structural schematic diagram after filling member.
Specific embodiment
To keep the above objects, features, and advantages of the utility model more obvious and easy to understand, with reference to the accompanying drawing to this
The specific embodiment of utility model is described in detail.Many details are explained in the following description in order to abundant
Understand the utility model.But the utility model can be implemented with being much different from other way described herein, this field
Technical staff can do similar improvement without prejudice to the utility model connotation, therefore the utility model is not by following public affairs
The limitation for the specific implementation opened.
It should be noted that it can directly on the other element when element is referred to as " being fixed on " another element
Or there may also be elements placed in the middle.When an element is considered as " connection " another element, it, which can be, is directly connected to
To another element or it may be simultaneously present centering elements.
Unless otherwise defined, all technical and scientific terms used herein are led with the technology for belonging to the utility model
The normally understood meaning of the technical staff in domain is identical.Terminology used in the description of the utility model herein only be
The purpose of description specifically embodiment, it is not intended that in limitation the utility model.Term " and or " used herein includes
Any and all combinations of one or more related listed items.
As shown in Figure 1, the camera module 10 of one embodiment of the utility model, is applied on intelligent terminal.Specifically, exist
In present embodiment, intelligent terminal includes terminal body and the camera module 10 on terminal body.More specifically, at this
In embodiment, intelligent terminal is smart phone, laptop, tablet computer, portable telephone, visual telephone, digital quiet
The intelligence such as object camera, electronic book readers, portable multimedia player (PMP), portable medical device, wearable device is eventually
End.
In the present embodiment, which includes photosensory assembly 10a and lens assembly 10b.Lens assembly 10b
On the photosensitive path of photosensory assembly 10a, the light of object side reaches photosensory assembly 10a after lens assembly 10b, from
And realize imaging.
As shown in Fig. 2, in the present embodiment, the photosensory assembly 10a of the utility model includes circuit board 100, adhesive layer
200 (can omit), curved surface sensitive chip 300 and packing colloid 400.Circuit board 100 is for carrying curved surface sensitive chip 300 etc.
Element.Circuit board 100 can be PCB (Printed Circuit Board, printed circuit board), or Rigid Flex,
Or the FPC (Flexible Printed Circuit, flexible circuit board) after reinforcement, wherein Rigid Flex includes
The PCB and FPC being stacked, the flexible circuit board after reinforcement include the FPC and reinforcing chip being stacked, and reinforcing chip can be steel
The good sheet material of the heat dissipation performances such as piece.
Circuit board 100 includes upper surface 110 and the lower surface 120 opposite with upper surface 110, is opened up on circuit board 100
There is the through-hole 101 of connection upper surface 110 and lower surface 120, the quantity of through-hole 101 is multiple.
Adhesive layer 200 is set to upper surface 110, and adhesive layer 200 is located at the inside for the figure that multiple through-holes 101 are enclosed.
Specifically, in the present embodiment, adhesive layer 200 is set to the central area for the figure that multiple through-holes 101 are enclosed.More specifically
Ground, in the present embodiment, the central axes for the figure that multiple through-holes 101 are enclosed are overlapped with the central axes of circuit board 100, are glued
Tie the central area that layer 200 is set to circuit board 100.Wherein, the figure that above-mentioned multiple through-holes 101 are enclosed can with but do not limit
For circle, rectangle, polygon etc..
Curved surface sensitive chip 300 is also known as curved surface imaging sensor, is that one kind converts optical signals to electric signal and photosurface
For the device of curved surface, curved surface sensitive chip 300 can be photosensitive for CCD (Charge-coupled Device, charge coupled cell)
Chip or CMOS (Complementary Metal-Oxide-Semiconductor, complementary metal oxide semiconductor) are photosensitive
Chip.The central area of curved surface sensitive chip 300 is connect with adhesive layer 200, and 100 electricity of curved surface sensitive chip 300 and circuit board
Property connection.It is appreciated that in other embodiments, when curved surface sensitive chip 300 can be fixed on circuit by other means
When on the upper surface 110 of plate 100 (such as: the central area of curved surface sensitive chip and the upper surface of circuit board are equipped with and cooperate
Buckle and card slot, by buckle with cooperation realization curved surface sensitive chip and the circuit board of card slot be fixedly connected or curved surface sense
The central area of optical chip and the upper surface magnetism of circuit board are connected and fixed), adhesive layer 200 can be omitted at this time.
Packing colloid 400 is filled in the gap between curved surface sensitive chip 300 and circuit board 100.It so, it is possible to make curved surface
Sensitive chip 300 is securely fixed on circuit board 100, is maintained the molding effect of curved surface sensitive chip 300, is increased photosensitive group
The structural strength of part 10a entirety.In other embodiments, it can also use and be fixed on the upper surface 110 of circuit board 100
Support column carrys out alternative package colloid 400, and specifically, support column one end is with curved surface sensitive chip 300 close to a table of circuit board 100
Face abuts, and the upper surface 110 of the other end and circuit board 100 is fixed, at this point, support column is shifted to install with through-hole 101, mutually solely
It is vertical.
With reference to Fig. 2, Fig. 8 and Fig. 9, through-hole 101 is offered in foregoing circuit plate 100, is arranged in leading on through-hole 101
Column 21 can (plane sensitive chip 300a be also known as area image sensor, is a kind of by optical signal to plane sensitive chip 300a
Be converted to the device that electric signal and photosurface are plane) neighboring area apply active force so that plane sensitive chip 300a is curved
Song, and then curved surface sensitive chip 300 is formed under the solidification of packing colloid 400, so as to plane sensitive chip
300a is former material to make curved surface sensitive chip 300.In above-mentioned photosensory assembly 10a, the curved surface sensitive chip that is imaged
300, closer to the retina for being all curved surface, the imaging effect compared to plane sensitive chip 300a is more preferably.The embodiment of the present application
Plane sensitive chip 300a can be plane sensitive chip flexible, or rigid plane sensitive chip, the application
With no restriction.
Further, with continued reference to FIG. 2, in the present embodiment, upper table of the curved surface sensitive chip 300 in circuit board 100
It is projected as rectangle on face 110, and covers through-hole 101, through-hole 101 is located at throwing of the curved surface sensitive chip 300 on upper surface 110
The middle part on the quadrangle of shadow or four sides.In this way, when making curved surface sensitive chip 300 as former material using plane sensitive chip 300a,
The power for being applied to the neighboring area plane sensitive chip 300a by guide post 21 (with reference to Fig. 8) can be made to be distributed more uniform, had
Conducive to the molding of the curve form of curved surface sensitive chip 300.
Further, in the present embodiment, the photosensory assembly 10a of the utility model further includes filling member 500, filling member
500 are filled in multiple through-holes 101.It makes to form curved surface sensitive chip 300 as former material using plane sensitive chip 300a to work as
Afterwards, the filling member 500 being filled in through-hole 101 can make circuit board 100 have preferable support strength, can support song
The components such as face sensitive chip 300, lens assembly 10b.Specifically, in the present embodiment, filling member 500 is buried via hole glue, is buried
Hole glue is in a liquid state or semisolid.After buried via hole adhesive curing in through-hole 101, the filling member 500 of photosensory assembly 10a is formed.
Further, in the present embodiment, packing colloid 400 extends internally, and connect with adhesive layer 200.Specifically, exist
In present embodiment, packing colloid 400 can also be extended out to outside the side far from curved surface sensitive chip 300.In this way, into
The connectivity robustness of one step increase curved surface sensitive chip 300 and circuit board 100.
Further, in the present embodiment, the mode that curved surface sensitive chip 300 is electrically connected with circuit board 100 is specifically adopted
It is electrically connected with conductor wire 600, the both ends of conductor wire 600 are electrical with curved surface sensitive chip 300 and circuit board 100 respectively
Connection, to realize that curved surface sensitive chip 300 and circuit board 100 are electrically connected.Specifically, in the present embodiment, conductor wire 600
The one end connecting with circuit board 100 is embedded in packing colloid 400.In this way, packing colloid can be exposed to avoid conductor wire 600
Outside 400, the risk that conductor wire 600 damages is reduced, is prolonged the service life, and the structure of photosensory assembly 10a entirety can also be increased
Fastness.The material of above-mentioned conductor wire 600 can be it is conductive can metal, alloy, the materials such as nonmetallic.Specifically,
In the present embodiment, conductor wire 600 is gold thread.
In other embodiments, conductor wire 600, specifically, conductive column one end and curved surface can be substituted with conductive column
Sensitive chip 300 is abutted close to a surface of circuit board 100 and is electrically connected, and the upper surface 110 of the other end and circuit board 100 is welded
It connects and is electrically connected, at this point, conductive column is shifted to install with through-hole 101, independently of each other.
Illustrate the photosensory assembly production method of the utility model in conjunction with Fig. 3 to Figure 11 below.
Step S41 provides a circuit board 100.In the present embodiment, as shown in figure 3, Fig. 3 is the structure of circuit board 100
Schematic diagram.Wherein, circuit board 100 includes upper surface 110 and the lower surface 120 opposite with upper surface 110, in circuit board 100
On open up the through-hole 101 of connection upper surface 110 and lower surface 120, the quantity of through-hole 101 is multiple.
Step S42, as shown in figure 4, forming adhesive layer 200 in the upper surface of circuit board 100 110, adhesive layer 200 is located at more
The inside for the figure that a through-hole 101 is enclosed.Specifically, in the present embodiment, adhesive layer 200 is formed in multiple through-holes 101
The central area for the figure being enclosed.More specifically, in the present embodiment, the figure that multiple through-holes 101 are enclosed
Central axes are overlapped with the central axes of circuit board 100, and adhesive layer 200 is formed in the central area of circuit board 100.
Step S43 provides a plane sensitive chip 300a.Wherein, plane sensitive chip 300a is also known as flat image sensing
Device is a kind of to convert optical signals to the device that electric signal and photosurface are plane.Plane sensitive chip 300a can be flexibility
Plane sensitive chip or rigidity plane sensitive chip.As shown in figure 5, the central area of plane sensitive chip 300a is attached
In on adhesive layer 200, and the neighboring area of plane sensitive chip 300a is made to cover through-hole 101.It is appreciated that in other implementations
In mode, it is enclosed when the central area of plane sensitive chip 300a can be fixed on multiple through-holes 101 by other means
Figure inside when (such as: curved surface sensitive chip central area and circuit board upper surface be equipped with mutually matched card
Button and card slot, by buckle with cooperation realization curved surface sensitive chip and the circuit board of card slot be fixedly connected or the photosensitive core of curved surface
The central area of piece and the upper surface magnetism of circuit board are connected and fixed), step S42, namely in the upper surface of circuit board 100 110
The step of forming adhesive layer 200 can be omitted.
Step S44a provides conductor wire 600.As shown in fig. 6, make the both ends of conductor wire 600 respectively with plane sensitive chip
300a and circuit board 100 are electrically connected.In this way, the peripheral region of plane sensitive chip 300a is jacked up through through-hole 101 in guide post 21
(it see below step S46 and Fig. 8) before domain, plane sensitive chip 300a and the preferential wire bonding of circuit board 100 avoid
Wire bonding again after curved surface sensitive chip 300 forms causes the out-of-flatness of chip to be bonded and be bonded unstable risk.
It is appreciated that in other embodiments, it can also be after the molding of curved surface sensitive chip 300, by the two of conductor wire 600
End is electrically connected with curved surface sensitive chip 300 and circuit board 100 respectively.
Step S44b provides fixed block 30.As shown in fig. 7, fixed block 30 is set on the upper surface 110 of circuit board 100, use
The neighboring area (see below step S46 and Fig. 8) of plane sensitive chip 300a is jacked up with auxiliary guide column 21.Specifically, at this
In embodiment, fixed block 30 can increase the weight of circuit board 100.In this way, jacking up plane sensitive chip 300a in guide post 21
Neighboring area during, can be jacked up together to avoid circuit board 100 with plane sensitive chip 300a, influence curved surface sense
The molding effect of optical chip 300a.
In the present embodiment, after being first attached on adhesive layer 200 by plane sensitive chip 300a and cover through-hole 101, then
Fixed block 30 is set on the upper surface of circuit board 100 110.
In other embodiments, after fixed block 30 first can also being set on the upper surface of circuit board 100 110, then
Adhesive layer 200 is formed on the upper surface 110 of circuit board 100, is then attached at the central area of plane sensitive chip 300a viscous
It ties on layer 200, and the neighboring area of plane sensitive chip 300a is made to cover through-hole 101.
Specifically, in the present embodiment, above-mentioned fixed block 30 can be the hollow structure of both ends open, plane sensitive chip
300a is located at 30 inside of fixed block.In this way, the weight of the surrounding of circuit board 100 increased, circuit board can be further prevented
100 move upwardly together with plane sensitive chip 300a.It is appreciated that in other embodiments, above-mentioned fixed block 30 can
To omit, at this point it is possible to which circuit board 100 is fixed on work top by modes such as vacuum suctions.
It should be noted that above-mentioned steps S44a and step S44b in no particular order sequence.
Step S45 provides jacking apparatus 20.As shown in figure 8, jacking apparatus 20 includes connected guide post 21 and driving
Device 22, the number of guide post 21 are multiple.Wherein, above-mentioned driver 22 can be stepper motor or linear motor.
Step S46, by multiple guide posts 21 respectively with multiple 101 faces of through-hole, the driving guide post 21 of driver 22 is across through-hole
The neighboring area of plane sensitive chip 300a is jacked up after 101.Specifically, in the present embodiment, multiple guide posts 21 are driven by one
Dynamic device 22 drives.It is appreciated that in other embodiments, multiple guide posts 21 can also be driven by multiple drivers 22 respectively.It needs
It is noted that above-mentioned multiple guide posts 21 can also be by Manual-pushing, driver 22 be can be omitted at this time.
Step S47, as shown in figure 9, the gap filling packing colloid between plane sensitive chip 300a and circuit board 100
400, it is formed by curing curved surface sensitive chip 300.Specifically, in the present embodiment, packing colloid 400 is surround adhesive layer 200,
So that packing colloid 400 is extended internally, and connect with adhesive layer 200, extends out to the side far from curved surface sensitive chip 300
Outside.So, it is possible to be securely fixed in curved surface sensitive chip 300 on circuit board 100, maintain curved surface sensitive chip 300 at
Type effect increases the structural strength of photosensory assembly 10a entirety.
Curved surface sensitive chip 300, Er Qie with curved surface effect can be obtained using above-mentioned photosensory assembly production method
In above-mentioned photosensory assembly production method, curved surface sensitive chip 300 is directly molded on circuit board 100, eliminates song after molding
The process that face sensitive chip 300 is bonded on circuit board 100 again, processing procedure are simpler.And in curved surface sensitive chip 300
In forming process, realize under the premise of imaging surface (namely not photosurface of contact chip) of not contact chip, it can be complete
At the production of curved surface sensitive chip, the imaging surface of chip will not be polluted, there is better photosensitive effect.Moreover, guide post 21 is by driving
Dynamic device 22 drives, and automation and precise motion, the curved surface for realizing the jack-up plane sensitive chip 300a process of guide post 21 are photosensitive
The molding effect of chip 300 is more preferably.
Further, it with continued reference to FIG. 8, in the present embodiment, jacking apparatus 20 further includes jig 23, is opened on jig 23
Equipped with multiple guide holes 231.Before step S46, namely before driver 22 drives guide post 21 to pass through through-hole 101, by circuit
Plate 100 is fixed on jig 23, make multiple through-holes 101 respectively with multiple 231 faces of guide hole, then by multiple guide posts respectively with it is multiple
Guide hole face, with enable multiple guide posts respectively with multiple through-hole faces, so as to guide post 21 pass through guide hole 231.In this way, may be implemented to lead
Column 21 is arranged in the precise positioning of 101 process of through-hole, while can increase the stability that guide post 21 jacks up chip processes.
Further, with continued reference to FIG. 8, the center of jig 23 offers vacuum hole 232, vacuum hole 232 and guide hole 231
Independently of each other.Circuit board 100 is being fixed in the step on jig 23, so that vacuum hole 232 is connected to air extractor, when
When air extractor works, circuit board 100 is firmly fixed on jig 23 because of vacuum suction.Specifically, in present embodiment
In, the quantity of vacuum hole 232 is one and is located at the inside of multiple guide holes 231.In this way, driving guide post 21 to jack up in driver 22
During plane sensitive chip 300a, circuit board 100 can be made mutually to be attracted by vacuum hole 232 and jig 23, thus electric
Road plate 100 is closely bonded with jig 23, and is unlikely to transport circuit board 100 upwards together with chip when jacking up chip
It moves and is detached from jig 23.
Further, after step S47, namely after forming curved surface sensitive chip 300, photosensory assembly production method is also
Include the following steps:
Step S48a, separation guide post 21 and through-hole 101 and guide hole 231.Specifically, driver 22 drive guide post 21 towards
Side far from curved surface sensitive chip 300 moves, so that guide post 21 is exited from through-hole 101 and guide hole 231.
Step S48b, separate circuit boards 100 and jig 23.Specifically, after air extractor stops working, by circuit board 100
It is removed from jig 23.
Step S48c, separation fixed block 30 and circuit board 100.
In this way, the available photosensory assembly 10a with curved surface sensitive chip 300, photosensory assembly 10a can proceed with
Subsequent encapsulation procedure.Wherein, above-mentioned steps S48c respectively with step S48a and step S48b in no particular order.
Further, after step S48b, photosensory assembly production method further includes following steps:
Step S49 provides filling member 500.In conjunction with Figure 10 and Figure 11, filling member 500 is filled in multiple through-holes 101.
Specifically, which is buried via hole glue, and buried via hole glue is in a liquid state or semisolid.After buried via hole adhesive curing in through-hole 101, formed
The filling member 500 of photosensory assembly 10a.
In this way, can make circuit board 100 that there is preferable support strength, curved surface sensitive chip 300, mirror can be supported
The components such as head assembly 10b.
Specifically, in the present embodiment, the step of filling filling member 500 include:
Step S49a as shown in Figure 10 will be obtained after separation with curved surface sense with jacking apparatus 20 and fixed block 30
The photosensory assembly 10a of optical chip 300 stands upside down, even if also circuit board 100 is in the surface of curved surface sensitive chip 300.
Step S49b fills filling member 500 into each through-hole 101, forms state as shown in figure 11.
Each technical characteristic of embodiment described above can be combined arbitrarily, for simplicity of description, not to above-mentioned reality
It applies all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, all should be considered as described in this specification.
Above-described embodiments merely represent several embodiments of the utility model, the description thereof is more specific and detailed,
But it cannot be understood as the limitations to utility model patent range.It should be pointed out that for the common skill of this field
For art personnel, without departing from the concept of the premise utility, various modifications and improvements can be made, these are belonged to
The protection scope of the utility model.Therefore, the scope of protection shall be subject to the appended claims for the utility model patent.
Claims (10)
1. a kind of photosensory assembly characterized by comprising
Circuit board offers described in connection on the circuit board including upper surface and the lower surface opposite with the upper surface
The through-hole of upper surface and the lower surface, the quantity of the through-hole are multiple；
Curved surface sensitive chip, photosurface are curved surface, and the multiple through-hole is fixed in the central area of the curved surface sensitive chip
The inside for the figure being enclosed, and the curved surface sensitive chip and the circuit board are electrically connected；And
Packing colloid, the packing colloid are filled in the gap between the curved surface sensitive chip and the circuit board.
2. photosensory assembly according to claim 1, which is characterized in that the central area of the curved surface sensitive chip is fixed on
The mode of the inside for the figure that the multiple through-hole is enclosed specifically is fixed using adhesive layer, and the adhesive layer is formed in
The upper surface of the circuit board, and it is located at the inside for the figure that the multiple through-hole is enclosed, the photosensitive core of curved surface
The central area of piece is attached on the adhesive layer, to enable the central area of the curved surface sensitive chip be set to the multiple through-hole
The inside for the figure being enclosed.
3. photosensory assembly according to claim 1, which is characterized in that the curved surface sensitive chip and the circuit board are electrical
The mode of connection specifically uses conductor wire to be electrically connected, the both ends of the conductor wire respectively with the curved surface sensitive chip and
The circuit board is electrically connected, to enable the curved surface sensitive chip and the circuit board be electrically connected.
4. photosensory assembly according to claim 1, which is characterized in that the photosensory assembly further includes filling member, described to fill out
Part is filled to be filled in the multiple through-hole.
5. photosensory assembly according to claim 2, which is characterized in that the adhesive layer is located at the multiple through-hole and encloses shape
At figure central area.
6. photosensory assembly according to claim 2, which is characterized in that the packing colloid extends internally, and glues with described
Tie layer connection.
7. photosensory assembly according to claim 2, which is characterized in that the packing colloid is extended out to far from the song
Outside the side of face sensitive chip.
8. photosensory assembly according to claim 3, which is characterized in that one end that the conductor wire is connect with the circuit board
It is embedded in the packing colloid.
9. a kind of camera module characterized by comprising
Photosensory assembly as claimed in any of claims 1 to 8 in one of claims；And
Lens assembly, on the photosensitive path of the photosensory assembly.
10. a kind of intelligent terminal characterized by comprising
Terminal body；And
Camera module as claimed in claim 9, the camera module are set on the terminal body.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821556339.XU CN208956159U (en) | 2018-09-21 | 2018-09-21 | Photosensory assembly, camera module and intelligent terminal |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821556339.XU CN208956159U (en) | 2018-09-21 | 2018-09-21 | Photosensory assembly, camera module and intelligent terminal |
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| CN208956159U true CN208956159U (en) | 2019-06-07 |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020057334A1 (en) * | 2018-09-21 | 2020-03-26 | 南昌欧菲光电技术有限公司 | Method for manufacturing photosensitive assembly, photosensitive assembly, image capturing module, and smart terminal |
| WO2020057473A1 (en) * | 2018-09-21 | 2020-03-26 | 南昌欧菲光电技术有限公司 | Manufacturing method for photosensitive assembly, and photosensitive assembly, camera module and intelligent terminal |
| WO2021018230A1 (en) * | 2019-08-01 | 2021-02-04 | 宁波舜宇光电信息有限公司 | Camera module, and photosensitive assembly and manufacturing method therefor |
| CN112399037A (en) * | 2019-08-15 | 2021-02-23 | 宁波舜宇光电信息有限公司 | Photosensitive assembly, camera module and manufacturing method thereof |
| WO2021233114A1 (en) * | 2020-05-21 | 2021-11-25 | 宁波舜宇光电信息有限公司 | Photosensitive chip assembly, camera module, and terminal device |
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2018
- 2018-09-21 CN CN201821556339.XU patent/CN208956159U/en active Active
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020057334A1 (en) * | 2018-09-21 | 2020-03-26 | 南昌欧菲光电技术有限公司 | Method for manufacturing photosensitive assembly, photosensitive assembly, image capturing module, and smart terminal |
| WO2020057473A1 (en) * | 2018-09-21 | 2020-03-26 | 南昌欧菲光电技术有限公司 | Manufacturing method for photosensitive assembly, and photosensitive assembly, camera module and intelligent terminal |
| WO2021018230A1 (en) * | 2019-08-01 | 2021-02-04 | 宁波舜宇光电信息有限公司 | Camera module, and photosensitive assembly and manufacturing method therefor |
| CN112399037A (en) * | 2019-08-15 | 2021-02-23 | 宁波舜宇光电信息有限公司 | Photosensitive assembly, camera module and manufacturing method thereof |
| CN112399037B (en) * | 2019-08-15 | 2022-04-05 | 宁波舜宇光电信息有限公司 | Photosensitive assembly, camera module and manufacturing method thereof |
| WO2021233114A1 (en) * | 2020-05-21 | 2021-11-25 | 宁波舜宇光电信息有限公司 | Photosensitive chip assembly, camera module, and terminal device |
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