CN211792675U - Circuit board heat abstractor, electrical apparatus box and air conditioner - Google Patents
Circuit board heat abstractor, electrical apparatus box and air conditioner Download PDFInfo
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- CN211792675U CN211792675U CN202020767264.0U CN202020767264U CN211792675U CN 211792675 U CN211792675 U CN 211792675U CN 202020767264 U CN202020767264 U CN 202020767264U CN 211792675 U CN211792675 U CN 211792675U
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- circuit board
- heat
- heat dissipation
- heat exchange
- connecting sheet
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Abstract
The utility model provides a circuit board heat abstractor, electrical apparatus box and air conditioner, circuit board heat abstractor are including installing the heating panel on the circuit board and peg graft the heat exchange tube that is used for circulating heat transfer medium on the heating panel, have seted up heat transfer passageway in the heating panel, heat exchange tube intercommunication heat transfer passageway. The utility model provides a circuit board heat abstractor installs heat abstractor on the circuit board, becomes heating panel and heat exchange tube with heat abstractor design. Circulate the refrigerant in the heat exchange tube, seted up the heat transfer passageway in the heating panel, the refrigerant passes through the heat exchange tube and flows in the heat transfer passageway, has utilized the high-efficient refrigeration characteristic of refrigerant and the effect of heating panel, distributes away the produced heat of components and parts on the circuit board through the refrigerant in the heat exchange tube and heating panel. The problem of the produced heat of circuit board because of long-time work is difficult to distribute away is solved. And the method conforms to humanized and industrialized design.
Description
Technical Field
The utility model belongs to the technical field of the heat dissipation, more specifically say, relate to a circuit board heat abstractor, electrical apparatus box and air conditioner.
Background
With the continuous progress and development of science and technology, the air conditioning technology becomes more and more mature, and people are pursuing high performance and quality of the air conditioner while enjoying the comfort effect brought by the air conditioner. The PCB (at least one) is used as a core control component of the air conditioner, and the performance and the quality of the PCB directly influence the performance and the quality of the whole air conditioner.
A common problem in all current air conditioning products is the high heat generation of the PCB. Because the air conditioner works on the basis of high power and high load, when the air conditioner works, the circuit board can generate extremely high heat, and the overhigh temperature of the circuit board not only can greatly influence the service life of electronic components of the air conditioner, but also greatly reduces the service performance of air conditioner products.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a circuit board heat abstractor, electrical apparatus box and air conditioner to solve the poor problem of circuit board thermal diffusivity that exists among the prior art.
In order to achieve the above object, the utility model adopts the following technical scheme: the circuit board heat dissipation device comprises a heat dissipation plate arranged on a circuit board and a heat exchange tube inserted in the heat dissipation plate and used for circulating a heat exchange medium, wherein a heat exchange channel is formed in the heat dissipation plate, and the heat exchange tube is communicated with the heat exchange channel.
Further, the heat dissipation plate comprises a plurality of detachably connected heat dissipation blocks.
Furthermore, the radiating blocks are connected in a slot splicing mode.
Furthermore, the radiating block comprises a first radiating block and a second radiating block, a first connecting sheet, a second connecting sheet and a third connecting sheet which are sequentially connected are arranged at the edge of the first radiating block, and a fourth connecting sheet, a fifth connecting sheet and a sixth connecting sheet which are sequentially connected are arranged on the second radiating block; the first connecting sheet, the second connecting sheet and the third connecting sheet form slots for the fourth connecting sheet, the fifth connecting sheet and the sixth connecting sheet to be inserted.
Furthermore, the heat dissipation block is provided with a containing groove for containing a choke coil or a capacitor on the circuit board; when the choke coil or the capacitor is placed in the accommodating groove, a gap is formed between the choke coil or the capacitor and the heat dissipation block.
Furthermore, the heat dissipation block is provided with an installation groove for accommodating the chip or the IPM, and the chip or the IPM is in contact with the heat dissipation block when being placed in the installation groove.
Further, the radiating block and/or the heat exchange tube are made of copper or aluminum.
Another object of the present invention is to provide an electrical apparatus box, the electrical apparatus box includes a plurality of mounting panels that are used for the circuit board, above-mentioned circuit board heat abstractor is used for cooperating with the circuit board.
Furthermore, one or more of the two sides of the mounting plate are provided with circuit boards, two of the circuit boards are respectively matched with one or more radiating blocks, and heat exchange tubes are connected between the radiating blocks.
Another object of the present invention is to provide an air conditioner, which includes the above circuit board heat dissipation device and the above electrical box.
The utility model provides a circuit board heat abstractor's beneficial effect lies in: compared with the prior art, the utility model discloses install heat abstractor on the circuit board, become heating panel and heat exchange tube with heat abstractor design. Circulate the refrigerant in the heat exchange tube, seted up the heat transfer passageway in the heating panel, the refrigerant passes through the heat exchange tube and flows in the heat transfer passageway, has utilized the high-efficient refrigeration characteristic of refrigerant and the effect of heating panel, distributes away the produced heat of components and parts on the circuit board through the refrigerant in the heat exchange tube and heating panel. The problem of the produced heat of circuit board because of long-time work is difficult to distribute away is solved. And the method conforms to humanized and industrialized design.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for the embodiments or the prior art descriptions will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without inventive labor.
Fig. 1 is an exploded schematic view of a circuit board heat dissipation device according to an embodiment of the present invention;
fig. 2 is a first schematic view of an installation structure of a circuit board heat dissipation device according to an embodiment of the present invention, and a part of the structure is not shown;
fig. 3 is a schematic view of a mounting structure of a circuit board heat dissipation device according to an embodiment of the present invention, which is partially shown;
fig. 4 is a third schematic view of an installation structure of the circuit board heat dissipation device according to the embodiment of the present invention, and a part of the structure is not shown;
fig. 5 is a schematic structural view of the assembled circuit board heat dissipation device according to an embodiment of the present invention;
fig. 6 is a schematic structural diagram of the mounting panel double-sided mounting circuit board heat dissipation device provided by the present invention, and a partial structure is not shown.
Wherein, in the drawings, the reference numerals are mainly as follows:
1. a heat dissipation plate; 11. a first heat dissipation block; 111. a first connecting piece; 112. a second connecting sheet; 113. a third connecting sheet; 12. a second heat dissipation block; 121. a fourth connecting sheet; 122. a fifth connecting sheet; 123. a sixth connecting sheet;
2. a heat exchange pipe; 3. a slot; 4. a choke coil; 5. a capacitor; 6. a containing groove; 7. a chip; 8. IPM; 9. mounting a plate; 10. a screw; 13. a stop block.
Detailed Description
In order to make the technical problem, technical solution and advantageous effects to be solved by the present invention more clearly understood, the following description is given in conjunction with the accompanying drawings and embodiments to illustrate the present invention in further detail. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
Referring to fig. 1 and fig. 2, a circuit board heat dissipation device according to an embodiment of the present invention will now be described. The circuit board heat dissipation device comprises a heat dissipation plate 1 and a heat exchange tube 2. The heat dissipation plate 1 is used for being installed on a circuit board, the heat exchange tube 2 is connected onto the heat dissipation plate 1 in an inserting mode, a heat exchange channel is formed in the heat dissipation plate 1, and the heat exchange tube 2 is communicated with the heat exchange channel. During the use, lead to the refrigerant in heat exchange tube 2, the refrigerant flows to the heat transfer passageway in the heating panel 1 from heat exchange tube 2, and through the refrigerant at heat exchange tube 2, the interior circulation of the heat transfer passageway of heating panel 1, the heat that produces the components and parts on the circuit board distributes away.
The utility model provides a circuit board heat abstractor compares with prior art, installs heat abstractor on the circuit board, designs into heating panel 1 and heat exchange tube 2 with heat abstractor. The refrigerant flows in the heat exchange tube 2, a heat exchange channel is arranged in the heat dissipation plate 1, the refrigerant flows into the heat exchange channel through the heat exchange tube 2, the high-efficiency refrigeration characteristic of the refrigerant and the effect of the heat dissipation plate 1 are utilized, and the heat generated by the components on the circuit board is dissipated through the refrigerant in the heat exchange tube 2 and the heat dissipation plate 1. The problem of the produced heat of circuit board because of long-time work is difficult to distribute away is solved. And the method conforms to humanized and industrialized design.
Further, please refer to fig. 1 and 5 together, as a specific embodiment of the circuit board heat dissipating device provided by the present invention, the heat dissipating plate 1 is designed into a plurality of heat dissipating blocks which can be detachably connected, the heat dissipating blocks are made of aluminum, the heat exchanging pipe 2 is made of copper, and aluminum and copper have good heat dissipating effect. Of course, other materials with good heat dissipation effect can be selected according to actual conditions and requirements.
Further, referring to fig. 1 and 5, it is mentioned that the heat dissipation plate 1 is designed as a plurality of detachable heat dissipation blocks, which can be spliced according to the actual composition and design of the circuit board, and the heat dissipation blocks can be connected by fasteners, such as screws 10. In addition, a mode of connecting the slots 3 is also provided, specifically, the radiating blocks are divided into two types, namely a first radiating block 11 and a second radiating block 12. For example, there are three heatsinks, two first heatsinks 11 are connected to both sides of one second heatsinks 12, and if there are a plurality of heatsinks, the first heatsinks 11 and the second heatsinks 12 are connected alternately.
Specifically, according to the above-mentioned manner of connecting the heat dissipation blocks by using the slot 3, each heat dissipation block is designed to be in a rectangular shape, the first connection piece 111, the second connection piece 112 and the third connection piece 113 which are sequentially connected are integrally formed on the edge of the first heat dissipation block 11 along the length direction, and the fourth connection piece 121, the fifth connection piece 122 and the sixth connection piece 123 which are sequentially connected are integrally formed on the edge of the second heat dissipation block 12 along the length direction. The first connecting piece 111, the second connecting piece 112 and the third connecting piece 113 are hooked after being connected and form a slot 3, and the slot 3 is used for inserting the fourth connecting piece 121, the fifth connecting piece 122 and the sixth connecting piece 123. In addition, the first heat dissipation block 11 is further provided with a blocking block 13 for limiting the insertion of the second heat dissipation block 12, or one end of the slot 3 may be kept open and the other end may be kept closed, which may also achieve the above-mentioned effects.
Further, please refer to fig. 1 to 4, which are schematic views of the present invention, the circuit board is usually provided with a choke coil 4 or a capacitor 5, the choke coil 4 and the capacitor 5 generally protrude from the plane of the circuit board, the heat dissipation block is designed to have a rectangular shape, and the heat dissipation block is easily interfered with the aforementioned components such as the choke coil 4 and the capacitor 5 during installation, so that the heat dissipation block is provided with a receiving groove 6, and the receiving groove 6 is used for receiving the choke coil 4 and the capacitor 5. Since the surfaces of the components such as the choke coil 4 and the capacitor 5 are not suitable for providing an insulating material or an insulating medium such as an insulating paste is not provided on the surfaces, these components cannot be brought into contact with the heat dissipating block.
In addition, the heat dissipation block may be provided with a mounting groove (not shown) for accommodating the chip 7, the IPM8, etc., and the mounting groove is in contact with the heat dissipation block when the chip 7 or the IPM8 is placed in the mounting groove. Since the chip 7, IPM8, and other components can be provided with an insulating medium on the surface, the components and the heat dissipation block are kept in contact with each other to increase the contact area between the components and the heat dissipation block. Or, for the component with a relatively flat surface or a relatively small volume, the surface of the heat dissipation block can be directly contacted with the component. The accommodating groove 6, the mounting groove and the like mentioned in the foregoing adopt a half-surrounding coating mode for components on the circuit, so that the heat conduction contact area between each component and the heat dissipation block becomes larger, the heat dissipation speed is accelerated, and the heat dissipation effect is improved.
The utility model also provides an electrical apparatus box, electrical apparatus box include a plurality of mounting panels 9 that are used for the installation circuit board, and the circuit board heat abstractor who mentions in the foregoing is used on this electrical apparatus box, uses with the circuit board cooperation on the mounting panel 9. The electrical box is usually square, two opposite surfaces of the electrical box are hollow, and circuit boards are mounted on the rest four surfaces of the electrical box.
In addition, referring to fig. 6, due to the requirement of some designs, circuit boards are mounted on both the front and back surfaces of one or two mounting plates 9 in the electrical box, so that circuit board heat dissipation devices are mounted on the two circuit boards, each heat dissipation device comprises at least one heat dissipation block, and a heat exchange tube 2 is also communicated between the heat dissipation blocks. Specifically, since the heat exchanger tubes 2 are disposed on both sides of the circuit board, the heat exchanger tubes 2 communicating between the heat dissipating blocks disposed on both sides of the circuit board need to pass through the circuit board. In addition, some components such as hollow cylindrical coils are designed on some circuit boards, in order to reduce the occupied space for installation, the heat exchange tube 2 can penetrate through the hollow part of the coil, and the occupied space for installation of the heat exchange tube 2, the radiating block and the like is effectively solved.
The above description is only exemplary of the present invention and should not be taken as limiting the scope of the present invention, as any modifications, equivalents, improvements and the like made within the spirit and principles of the present invention are intended to be included within the scope of the present invention.
Claims (10)
1. Circuit board heat abstractor, its characterized in that: the heat exchange device comprises a heat dissipation plate arranged on a circuit board and a heat exchange tube inserted on the heat dissipation plate and used for circulating a heat exchange medium, wherein a heat exchange channel is formed in the heat dissipation plate, and the heat exchange tube is communicated with the heat exchange channel.
2. The circuit board heat sink of claim 1, wherein: the heat dissipation plate comprises a plurality of detachably connected heat dissipation blocks.
3. The circuit board heat sink of claim 2, wherein: and the radiating blocks are connected in a slot splicing mode.
4. The circuit board heat sink of claim 3, wherein: the radiating block comprises a first radiating block and a second radiating block, a first connecting sheet, a second connecting sheet and a third connecting sheet which are sequentially connected are arranged at the edge of the first radiating block, and a fourth connecting sheet, a fifth connecting sheet and a sixth connecting sheet which are sequentially connected are arranged on the second radiating block; the first connecting sheet, the second connecting sheet and the third connecting sheet form slots for the fourth connecting sheet, the fifth connecting sheet and the sixth connecting sheet to be inserted.
5. The circuit board heat sink of claim 2, wherein: the heat dissipation block is provided with a containing groove for containing a choke coil or a capacitor on the circuit board; when the choke coil or the capacitor is placed in the accommodating groove, a gap is formed between the choke coil or the capacitor and the heat dissipation block.
6. The circuit board heat sink of claim 2, wherein: the heat dissipation block is provided with an installation groove for accommodating a chip or IPM, and the chip or IPM is in contact with the heat dissipation block when being placed in the installation groove.
7. The circuit board heat sink of claim 2, wherein: the radiating block and/or the heat exchange tube are/is made of copper or aluminum.
8. Electrical apparatus box, its characterized in that: comprising a plurality of mounting plates for circuit boards, the circuit board heat sink according to any of claims 1-7 being adapted to cooperate with a circuit board.
9. The appliance cartridge of claim 8, wherein: one or more of the circuit boards are installed on two sides of the installation plate, one or more radiating blocks are matched with the circuit boards respectively, and heat exchange tubes are connected between the radiating blocks.
10. An air conditioner, characterized in that: comprising the circuit board heat sink of any one of claims 1-7 and the electrical box of claim 8 or 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020767264.0U CN211792675U (en) | 2020-05-11 | 2020-05-11 | Circuit board heat abstractor, electrical apparatus box and air conditioner |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020767264.0U CN211792675U (en) | 2020-05-11 | 2020-05-11 | Circuit board heat abstractor, electrical apparatus box and air conditioner |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211792675U true CN211792675U (en) | 2020-10-27 |
Family
ID=72956736
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020767264.0U Active CN211792675U (en) | 2020-05-11 | 2020-05-11 | Circuit board heat abstractor, electrical apparatus box and air conditioner |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211792675U (en) |
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2020
- 2020-05-11 CN CN202020767264.0U patent/CN211792675U/en active Active
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