CN211792588U - Heat conduction structure, heat dissipation module and electronic equipment - Google Patents
Heat conduction structure, heat dissipation module and electronic equipment Download PDFInfo
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- CN211792588U CN211792588U CN201922190798.1U CN201922190798U CN211792588U CN 211792588 U CN211792588 U CN 211792588U CN 201922190798 U CN201922190798 U CN 201922190798U CN 211792588 U CN211792588 U CN 211792588U
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- transfer medium
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Abstract
The application discloses heat conduction structure, heat dissipation module and electronic equipment, wherein, heat conduction structure includes microscler main part, the inside heat transfer medium runner and the heat accumulation material that is provided with mutual independence of microscler main part hold the chamber, the circulation has heat transfer medium in the heat transfer medium runner, the heat accumulation material holds that the intracavity is filled and is had the heat accumulation material. Because the heat storage material is arranged in the long main body in an isolated mode, the heat storage capacity of the heat conduction structure is improved through the heat storage material, and when the heat storage material is changed from a solid state to a liquid state through heat absorption, the heat storage material cannot overflow and scatter due to the fact that the heat storage material is arranged in the heat storage material accommodating cavity in an isolated mode.
Description
Technical Field
The application relates to the technical field of heat dissipation of electronic equipment, in particular to a heat conduction structure. The application also relates to a heat dissipation module comprising the heat conduction structure. The application also relates to an electronic device comprising the heat dissipation module.
Background
Heat generated by electronic components in electronic equipment needs to be dissipated in time, and is usually dissipated through a heat dissipation module, wherein a heat pipe is a component of the heat dissipation module that mainly transfers heat. The traditional heat pipe is of a flat pipe structure, and a water and water vapor circulation channel is arranged inside the heat pipe. When the heat pipe works, water is heated at the heat source and then changed into water vapor, the water vapor flows to the heat dissipation end of the heat pipe, the water vapor is cooled at the heat dissipation end and is changed into liquid water, and the liquid water flows back to the heat source from the heat dissipation end to finish the heat absorption and heat dissipation processes. The existing method for improving the heat dissipation efficiency of the heat pipe is mainly to stick a phase-change material on the outside of the heat pipe, and the phase-change material generates phase change to store heat and transfer heat, so as to improve the heat storage capacity of the heat pipe.
SUMMERY OF THE UTILITY MODEL
The application provides the following technical scheme:
a heat conduction structure comprises a long main body, wherein a heat transfer medium flow channel and a heat storage material accommodating cavity which are mutually independent are arranged in the long main body, a heat transfer medium flows in the heat transfer medium flow channel, and a heat storage material is filled in the heat storage material accommodating cavity.
Preferably, in the above heat transfer structure, the elongated body has a flat tubular shape.
Preferably, in the above heat transfer structure, the heat transfer medium is a liquid medium that can be evaporated into a gas state.
Preferably, in the above-described heat conduction structure, the heat storage material is a phase change material.
Preferably, in the above-described heat transfer structure, the number of the thermal storage material accommodating chambers is one or more, and the number of the heat transfer medium flow passages is one or more.
Preferably, in the above heat transfer structure, an inner wall of the heat transfer medium flow passage is provided with a capillary structure.
Preferably, in the above-described heat conduction structure, the capillary structure is a groove or a bump.
Preferably, in the above heat transfer structure, the elongated body is formed by combining at least two single tubes; or the long main body is formed by rolling a sheet metal part; or the elongated body includes a single tube and a partition member provided in the single tube for partitioning the single tube into the heat transfer medium flow passage and the thermal storage material accommodating chamber.
The application also provides a heat radiation module, including heat conduction structure, radiating fin and radiator, heat conduction structure's both ends are connected respectively radiating fin with the radiator, heat conduction structure be as above arbitrary any one heat conduction structure.
The application also provides electronic equipment, which comprises a heat dissipation module and a heat source electronic component, wherein the heat dissipation module is in contact with the heat source electronic component for heat transfer, and the heat dissipation module is as above.
Compared with the prior art, the beneficial effects of this application are:
the application provides a heat conduction structure includes microscler main part, and microscler main part is inside to be provided with mutually independent heat transfer medium runner and heat accumulation material and to hold the chamber, and the heat transfer medium runner internal flow has heat transfer medium, and the heat accumulation material holds that the intracavity is filled has heat accumulation material. Because the heat storage material is arranged in the long main body in an isolated mode, the heat storage capacity of the heat conduction structure is improved through the heat storage material, and when the heat storage material is changed from a solid state to a liquid state through heat absorption, the heat storage material cannot overflow and scatter due to the fact that the heat storage material is arranged in the heat storage material accommodating cavity in an isolated mode.
The heat dissipation module and the electronic equipment that this application embodiment provided all adopted the heat conduction structure in this application consequently, have improved its radiating efficiency, and when the heat accumulation material becomes liquid by solid-state heat absorption, owing to keep apart to set up in the heat accumulation material holds the chamber, can not overflow and scatter.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly introduced below, it is obvious that the drawings in the following description are only embodiments of the present application, and for those skilled in the art, other drawings can be obtained according to the provided drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a heat conducting structure according to an embodiment of the present disclosure;
fig. 2 is a schematic view illustrating a forming method of a heat conducting structure according to an embodiment of the present disclosure;
fig. 3 is a schematic structural diagram of a heat dissipation module according to an embodiment of the present disclosure;
FIG. 4 is a schematic diagram of a conventional heat conducting structure;
fig. 5 is a schematic heat conduction diagram of a heat conduction structure according to an embodiment of the present application.
Wherein, 1 is a long main body, 11 is a heat transfer medium flow passage, 12 is a heat storage material accommodating cavity, 2 is a radiating fin, 3 is a radiator, 4 is a heat source, and 5 is a water and water vapor circulation channel.
Detailed Description
The core of the application is to provide a heat conduction structure, which can reliably and effectively improve the heat dissipation efficiency.
The application also provides a heat radiation module comprising the heat conduction structure, which can reliably and effectively improve the heat radiation efficiency of the heat radiation module.
The application also provides an electronic device comprising the heat dissipation module, and reliable and effective heat dissipation of the electronic device can be realized.
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
Referring to fig. 1 and 5, an embodiment of the present application provides a heat conducting structure, which includes an elongated main body 1, a heat transfer medium channel 11 and a heat storage material accommodating cavity 12 that are independent from each other are disposed inside the elongated main body 1, a heat transfer medium flows through the heat transfer medium channel 11, a heat storage material is filled in the heat storage material accommodating cavity 12, and both the heat transfer medium channel 11 and the heat storage material accommodating cavity 12 are parallel to a length direction of the elongated main body 1.
By comparing the heat conducting structure of the present application with the existing heat conducting structure, as shown in fig. 4 and 5, when the existing heat pipe of fig. 4 is in contact with the heat source 4 for heat transfer, the heat conducting capacity of the heat pipe is fully occupied by the flow of water and water vapor in the water and water vapor flow channel 5, and when the heat conducting structure of the present application is in contact with the heat source 4 for heat transfer, because the heat storage material is separately disposed in the elongated body 1, as shown in fig. 5, the heat source 4 can be in contact with the heat transfer medium flow channel 11 or the heat storage material accommodating chamber 12 for heat transfer alone, or can be in contact with the heat transfer medium flow channel 11 and the heat storage material accommodating chamber 12 for heat transfer at the same time, although the maximum heat transfer amount of the heat transfer medium flow channel 11 is reduced due to the reduction of its own space under the condition that the cross-sectional size of the elongated body 1 is the same as that of the heat pipe, the heat conduction capacity is the sum of the heat conduction quantity of the heat transfer medium in the heat transfer medium flow channel 11 and the heat conduction quantity of the heat storage material in the heat storage material accommodating cavity 12, the maximum transient power consumption which can be borne by the heat transfer medium can be greatly improved, compared with the existing heat pipe, the heat dissipation efficiency of the heat conduction structure is improved, and when the heat storage material is changed from a solid state to a liquid state, the heat storage material cannot overflow and disperse due to the isolation arrangement in the heat storage material accommodating cavity 12.
Further, in the present embodiment, the elongated body 1 is in a flat tubular shape, so as to facilitate the arrangement and reduce the occupied space. Of course, the elongated body 1 may have other shapes, such as a circular tube shape, an elliptical tube shape, a rectangular tube shape, etc.
In this embodiment, the heat transfer medium in the heat transfer medium flow channel 11 is a liquid medium that can be evaporated into a gaseous state, and through the flow of the liquid medium in the heat transfer medium flow channel 11, the heat is absorbed and evaporated into a gaseous state at the hot end, and the heat is taken away, and the gaseous state releases heat and condenses into a liquid state at the cold end, releases the heat, and realizes heat conduction through the cyclic evaporation and condensation of the heat transfer medium. Optionally, the liquid medium is water, so that the material is convenient to obtain and the cost is low.
In this embodiment, the heat storage material is a phase change material that can be changed from a solid state to a liquid state, such as metallic sodium and metallic magnesium. Phase change material fills in heat storage material holds chamber 12, and the normality is solid-state, and phase change material absorbs heat at the hot junction and becomes liquid, takes away the heat and holds heat, and liquid phase change material is exothermic at the cold junction and solidifies into solid-state, releases the heat, and heat absorption and heat release through phase change material's circulation have realized the heat conduction. And the phase-change material has strong heat storage capacity, so that the heat conduction capacity is improved.
In the present embodiment, the number of the thermal storage material accommodating chambers 12 is one or more, and the number of the heat transfer medium flow channels 11 is one or more. The number of the heat transfer medium channels 11 and the heat storage material accommodating cavities 12 is determined according to the heat conduction requirement, the arrangement form of the heat transfer medium channels 11 and the heat storage material accommodating cavities 12 can be alternately arranged, or a plurality of heat transfer medium channels 11 can be arranged in close proximity, and a plurality of heat storage material accommodating cavities 12 can be arranged in close proximity. The arrangement is not limited to the arrangement form illustrated in the embodiment as long as the improvement of the heat dissipation efficiency can be achieved.
Further, in this embodiment, the inner wall of the heat transfer medium flow channel 11 is provided with a capillary structure, and the capillary structure is arranged to increase the contact area between the inner wall of the heat transfer medium flow channel and the heat transfer medium, thereby improving the heat dissipation efficiency.
Specifically, the capillary structure is a groove or a bump, and is not limited to the form exemplified in the present embodiment as long as the contact area between the inner wall of the heat transfer medium flow passage 11 and the heat transfer medium can be increased.
In this embodiment, as shown in fig. 2, the elongated body 1 is formed by combining at least two single tubes, specifically, at least two single tubes are connected side by side, and at least two round tubes can be connected side by side first and then pressed together to form a flat tube structure. The single tubes can be connected into a whole by welding, bonding or extrusion combination. After the single tube is vacuumized, the two ends of the single tube are sealed, and a heat transfer medium or a heat storage material is filled in the single tube.
Or the long main body 1 is formed by rolling a sheet metal part, for example, only one heat transfer medium flow passage 11 and one heat storage material accommodating cavity 12 are provided, two sides of the sheet metal part are rolled inwards to form two circular tube structures, and the two sides are sealed and fixed with the sheet metal part to form the heat transfer medium flow passage 11 and the heat storage material accommodating cavity 12, and can be further pressed to form a flat tube structure.
Or the elongated body 11 includes a single tube and a partition member provided in the single tube for partitioning the single tube into the heat transfer medium flow path 11 and the thermal storage material accommodating chamber 12. The number of the partition members is determined in accordance with the number of the heat transfer medium flow channels 11 and the thermal storage material accommodating chambers 12. Specifically, the partition member is a metal plate, which is inserted into the single tube and fixedly connected by bonding, welding or compacting. The metal plate is preferably made of copper, and the heat conduction effect is good.
Of course, the elongated body 1 may be formed in other forms, and is not limited to the form exemplified in the embodiment.
Based on the heat conduction structure described in any of the above embodiments, the embodiment of the present application further provides a heat dissipation module, which includes a heat conduction structure, heat dissipation fins 2 and a heat sink 3, where two ends of the heat conduction structure are respectively connected to the heat dissipation fins 2 and the heat sink 3, and the heat conduction structure is the heat conduction structure described in any of the above embodiments, where one end of the heat conduction structure connected to the heat sink 3 is a cold end, and one end of the heat conduction structure connected to the heat dissipation fins 2 is a hot end.
During operation, the cold end of the heat conduction structure absorbs heat from the radiator 3, the heat transfer medium and the heat storage material of the heat conduction structure circulate to the hot end from the cold end in the heat transfer medium flow channel 11 and the heat storage material accommodating cavity 12 respectively, and the heat is transferred to the radiating fins 2 at the hot end of the heat conduction structure, so that heat dissipation is realized.
Because the heat radiation module has adopted the heat conduction structure in this application, consequently, the separation is provided with heat accumulation material in microscler main part 1, though under the unchangeable condition of size of microscler main part 1, the maximum heat transfer volume of heat transfer medium runner 11 can reduce some because self space reduces, nevertheless because heat accumulation material holds and has a large amount of heat accumulation material can heat accumulation in the chamber 12, the biggest transient state consumption that wholly can bear can promote by a wide margin, heat radiation efficiency of heat conduction structure has been improved, and when heat accumulation material changed into liquid by solid state heat absorption, because the separation sets up in heat accumulation material holds chamber 12, can not overflow and scatter.
The embodiment of the application also provides electronic equipment, which comprises a heat dissipation module and a heat source electronic component, wherein the heat dissipation module is in contact with the heat source electronic component for heat transfer, and the heat dissipation module is the heat dissipation module described in the above embodiment.
Because the electronic equipment adopts the heat dissipation module in the embodiment of the application, the heat dissipation efficiency of the heat dissipation module is improved, and therefore reliable and effective heat dissipation of the electronic equipment can be realized. And when the heat storage material is changed from a solid state to a liquid state by absorbing heat, the heat storage material cannot overflow and scatter because the heat storage material is arranged in the heat storage material accommodating cavity in an isolated manner, so that the electronic equipment is protected from being polluted and damaged.
The embodiments in the present description are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments are referred to each other.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the application. Thus, the present application is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (10)
1. The heat conduction structure is characterized by comprising a long main body, wherein a heat transfer medium flow channel and a heat storage material accommodating cavity which are mutually independent are arranged in the long main body, a heat transfer medium flows in the heat transfer medium flow channel, and a heat storage material is filled in the heat storage material accommodating cavity.
2. The structure of claim 1, wherein the elongate body is flat tubular.
3. The heat transfer structure of claim 1, wherein the heat transfer medium is a liquid medium that is vaporizable to a gaseous state.
4. The heat conductive structure according to claim 1, wherein the heat storage material is a phase change material.
5. The heat conductive structure according to claim 1, wherein the number of the thermal storage material accommodating chambers is one or more, and the number of the heat transfer medium flow passages is one or more.
6. The heat transfer structure of claim 1, wherein an inner wall of the heat transfer medium flow passage is provided with a capillary structure.
7. The heat transfer structure of claim 6, wherein the capillary structure is a groove or a bump.
8. A thermally conductive structure according to any one of claims 1 to 6, wherein the elongate body is formed from a combination of at least two single tubes; or the long main body is formed by rolling a sheet metal part; or the elongated body includes a single tube and a partition member provided in the single tube for partitioning the single tube into the heat transfer medium flow passage and the thermal storage material accommodating chamber.
9. A heat dissipation module is characterized by comprising a heat conduction structure, heat dissipation fins and a heat sink, wherein two ends of the heat conduction structure are respectively connected with the heat dissipation fins and the heat sink, and the heat conduction structure is as claimed in any one of claims 1 to 8.
10. An electronic apparatus comprising a heat dissipation module and a heat source electronic part, wherein the heat dissipation module is in contact with the heat source electronic part for heat transfer, and the heat dissipation module is the heat dissipation module according to claim 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922190798.1U CN211792588U (en) | 2019-12-06 | 2019-12-06 | Heat conduction structure, heat dissipation module and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922190798.1U CN211792588U (en) | 2019-12-06 | 2019-12-06 | Heat conduction structure, heat dissipation module and electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211792588U true CN211792588U (en) | 2020-10-27 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201922190798.1U Active CN211792588U (en) | 2019-12-06 | 2019-12-06 | Heat conduction structure, heat dissipation module and electronic equipment |
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| Country | Link |
|---|---|
| CN (1) | CN211792588U (en) |
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- 2019-12-06 CN CN201922190798.1U patent/CN211792588U/en active Active
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