CN211788180U

CN211788180U - High radiator unit of solid state hard drives

Info

Publication number: CN211788180U
Application number: CN202020360610.3U
Authority: CN
Inventors: 丁骏鹏
Original assignee: Microflash Technology Co ltd
Current assignee: Shenzhen Yinshan Technology Co.,Ltd.
Priority date: 2020-03-20
Filing date: 2020-03-20
Publication date: 2020-10-27
Anticipated expiration: 2030-03-20

Abstract

The utility model discloses a solid state hard disk high heat radiation component, which comprises an upper shell, a lower shell, a fan, a micro gear pump, a heat conduction layer and a hard disk chip, wherein the upper end of the upper shell is provided with a plurality of through holes, the fan is fixedly connected in the through holes, the two sides of the upper shell are provided with tow rod through holes, a filter screen is connected in the through holes, the four corners in the upper shell are connected with limiting blocks, the lower ends of the limiting blocks are connected with a heat conduction layer in a sliding manner, through holes are arranged on the upper shell at the two ends of the heat conduction layer corresponding to the side walls of the oil guide ports of the heat conduction layer, the lower end of the heat conduction layer is connected with a hard disk chip, the hard disk chip is connected with a chip interface connected on the lower shell, the structure of the lower shell is the same as that of the upper shell, the oil guide ports on the same side of the heat conduction layer in the upper shell and the lower shell are connected through, the oil guide ports on the same side of the heat conduction layer in the upper shell and the lower shell are respectively connected with the input end and the output end of the miniature gear pump through hoses.

Description

High radiator unit of solid state hard drives

Technical Field

The utility model relates to a radiator unit specifically is a solid state hard drives high radiator unit.

Background

A Solid State Drive (SSD), commonly called a Solid State Disk, is a hard Disk made of an array of Solid State electronic memory chips, and is named by Solid capacitance in taiwan english. The SSD is composed of a control unit and a storage unit (FLASH chip, DRAM chip). The specification, definition, function and use method of the interface of the solid state disk are completely the same as those of a common hard disk, and the appearance and size of the product are also completely consistent with those of the common hard disk. The method is widely applied to the fields of military affairs, vehicle-mounted, industrial control, video monitoring, network terminals, electric power, medical treatment, aviation, navigation equipment and the like.

If the solid state disk has poor heat dissipation, the efficiency of the solid state disk during working is not affected, and the service life of the solid state disk is also reduced, so that loss is caused.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a solid state hard drives high radiator unit to solve the problem that proposes in the above-mentioned background art.

In order to achieve the above object, the utility model provides a following technical scheme:

a solid hard disk high heat radiation component comprises an upper shell, a lower shell, a fan, a miniature gear pump, a heat conduction layer and a hard disk chip, wherein the upper end of the upper shell is provided with a plurality of through holes, the lower ends of the through holes are connected with a bracket, the lower end of the bracket is fixedly connected with the motor, the output shaft of the motor penetrates through the bracket and is connected with the fan above the bracket, tow rod through holes are arranged at two sides of the upper shell, a filter screen is connected in the through holes, the four corners in the upper shell are connected with limit blocks, the lower ends of the limit blocks are connected with the heat conduction layer in a sliding way, the upper shell at two ends of the heat conduction layer is provided with through holes corresponding to the side walls of oil guide ports of the heat conduction layer, the lower end of the heat conduction layer is connected with the hard disk chip, the hard disk chip is connected with, the oil guide ports on the same side of the heat conduction layer in the upper shell and the lower shell are respectively connected with the input end and the output end of the miniature gear pump through hoses.

As a further aspect of the present invention: the upper end of the heat conduction layer is in a sawtooth shape, and heat conduction silica gel is arranged at the contact position of the sawtooth and the hard disk chip.

As a further aspect of the present invention: the heat conducting layer is hollow and filled with heat conducting oil.

As a further aspect of the present invention: the shell material of the heat conduction layer is red copper, and oil guide ports are formed in two ends of the heat conduction layer.

Compared with the prior art, the beneficial effects of the utility model are that: the solid state disk is cooled by combining air cooling and water cooling, heat is extracted from the chip and sent out to the environment through the fan by utilizing the heat conductivity of red copper and heat conducting oil, the contact area of hot air near the chip is increased by the aid of the serrated heat conducting layer, and meanwhile, the heat transfer efficiency is improved.

Drawings

Fig. 1 is a schematic structural diagram of a solid state disk high heat dissipation assembly.

Fig. 2 is a side view of a solid state disk high heat dissipation assembly.

Fig. 3 is a schematic structural diagram of a fan in a high heat dissipation assembly of a solid state disk.

Fig. 4 is a schematic structural diagram of a heat conducting layer in a high heat dissipation assembly of a solid state disk.

As shown in the figure: 1. an upper housing; 2. a motor; 3. a fan; 4. a heat conductive layer; 41. an oil guide port; 42. heat conducting oil; 5. a limiting block; 6. heat conducting silica gel; 7. a hard disk chip; 8. a lower housing; 9. a micro gear pump; 10. a hose; 11. a filter screen; 12. and (4) chip interface.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-4, in the embodiment of the present invention, a solid state hard disk high heat dissipation assembly comprises an upper casing 1, a lower casing 8, a fan 3, a micro gear pump 9, a heat conduction layer 4 and a hard disk chip 7, wherein the upper end of the upper casing 1 is provided with a plurality of through holes, the lower ends of the through holes are connected with a bracket, the lower end of the bracket is fixedly connected with a motor 2, an output shaft of the motor 2 passes through the bracket and is connected with the fan 3 above the bracket, tow rod through holes are formed on both sides of the upper casing 1, a filter screen 11 is connected in the through holes, limit blocks 5 are connected at four corners in the upper casing 1, the lower ends of the limit blocks 5 are connected with the heat conduction layer 4 in a sliding manner, the side walls of the upper casing 1 corresponding to oil guide ports 41 of the heat conduction layer 4 are provided with through holes, the lower end of the heat conduction layer 4, the oil guide ports 41 on the same side of the heat conduction layer 4 in the upper shell 1 and the lower shell 8 are connected through a hose 10, the hose 10 is buried in a groove formed in the outer side of the shell, and the oil guide ports 41 on the same side of the heat conduction layer 4 in the upper shell 1 and the lower shell 8 are respectively connected with the input end and the output end of the micro gear pump 9 through the hose 10.

The upper end of the heat conduction layer 4 is in a sawtooth shape, and heat conduction silica gel 6 is arranged at the contact position of the sawtooth and the hard disk chip 7.

The heat conduction layer 4 is hollow and filled with heat conduction oil 42.

The shell material of heat conduction layer 4 be red copper, the both ends of heat conduction layer 4 have seted up and have led oil mouth 41.

The utility model discloses a theory of operation is: when hard disk chip 7 during operation, send the heat to the surrounding environment, heat-conducting layer 4 directly communicates with hard disk chip 7 contact, the heat is transmitted to heat-conducting layer 4, the heat-conducting layer 4 of cockscomb structure, the area of contact to near hard disk chip 7 hot-air has been increased, heat-conducting efficiency has been increased simultaneously, the heat is transmitted to on the heat-conducting layer 4, firstly, constantly discharge hot-air through fan 3 of casing lower extreme, make ambient temperature reduce, secondly, circulate heat-conducting oil 42 in heat-conducting layer 4 through miniature gear pump 9, and be connected heat-conducting oil 42 with external refrigeration environment or refrigeration plant, thereby make heat-conducting layer 4 cool off as early as possible, continuously carry out the heat conduction to the chip.

In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art through specific situations.

Although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments or portions thereof without departing from the spirit and scope of the invention.

Claims

1. A solid state hard disk high heat dissipation assembly is characterized by comprising an upper shell (1), a lower shell (8), a fan (3), a miniature gear pump (9), a heat conduction layer (4) and hard disk chips (7), wherein a plurality of through holes are formed in the upper end of the upper shell (1), the lower ends of the through holes are connected with a support, the lower end of the support is fixedly connected with a motor (2), an output shaft of the motor (2) penetrates through the support, the fan (3) is connected above the support, tow rod through holes are formed in two sides of the upper shell (1), a filter screen (11) is connected in each through hole, limiting blocks (5) are connected at four corners in the upper shell (1), the lower ends of the limiting blocks (5) are connected with the heat conduction layer (4) in a sliding mode, through holes are formed in the side walls, corresponding to oil guide ports (41) of the heat conduction layer (4), the hard disk chip (7) is connected with a chip interface (12) connected to the lower shell, the structure of the lower shell (8) is the same as that of the upper shell (1), the oil guide ports (41) on the same side of the heat conduction layer (4) in the upper shell (1) and the lower shell (8) are connected through hoses (10), the hoses (10) are buried in grooves formed in the outer side of the shells, and the oil guide ports (41) on the same side of the heat conduction layer (4) in the upper shell (1) and the lower shell (8) are respectively connected with the input end and the output end of the miniature gear pump (9) through the hoses (10).

2. The solid state disk high heat dissipation assembly as recited in claim 1, wherein the upper end of the heat conducting layer (4) is serrated, and the heat conducting silica gel (6) is arranged at the contact position of the serrations and the hard disk chip (7).

3. The solid state disk high heat dissipation assembly of claim 1, wherein the heat conducting layer (4) is hollow and filled with heat conducting oil (42).

4. The solid state disk high heat dissipation assembly of claim 1, wherein the heat conducting layer (4) is made of red copper, and oil guide ports (41) are formed at two ends of the heat conducting layer (4).