CN211785667U - Non-vacuum temperature-changing test probe station for semiconductor device - Google Patents
Non-vacuum temperature-changing test probe station for semiconductor device Download PDFInfo
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- CN211785667U CN211785667U CN202020106804.0U CN202020106804U CN211785667U CN 211785667 U CN211785667 U CN 211785667U CN 202020106804 U CN202020106804 U CN 202020106804U CN 211785667 U CN211785667 U CN 211785667U
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Abstract
The utility model belongs to the technical field of the semiconductor test, especially, relate to a non-vacuum alternating temperature test probe platform for semiconductor device, including needle file platform, airtight cover, perspective cover and objective table, the through-hole is seted up at needle file platform middle part, airtight cover rigid coupling is in the below of needle file platform through-hole, and a non-absolute sealed airtight environment is constituteed to needle file platform, airtight cover, perspective cover, and wherein is arranged in to the objective table, lets the objective table cooling of placing semiconductor device through the circulation of refrigerant on the one hand, and on the other hand lets in the refrigerant in airtight environment through the pipeline of suitable length, and refrigerant gasification in transmission process discharges the air (including the vapor) in the airtight environment, forms a dry environment, avoids the semiconductor device that is surveyed on the objective table to frost under low temperature environment, promotes the stability of semiconductor device test.
Description
Technical Field
The utility model belongs to the technical field of the semiconductor test, especially, relate to a non-vacuum alternating temperature test probe platform for semiconductor device.
Background
The probe station is mainly used for high-precision electrical measurement in the semiconductor industry, the photoelectric industry, integrated circuits and chips. With the development of the industry, the types of the tested devices are more and more, the requirements are more and more complex, and the functions of the probe station must be correspondingly improved. The tested device has more and more requirements on the tested environment, the change of different temperatures is a very important requirement, and on the basis, the testing efficiency is also a non-negligible important factor.
The existing probe station can reach the subzero temperature in a vacuum environment, and frost can be formed after reaching the zero temperature in a non-vacuum environment, so that the test temperature is inaccurate. In a vacuum environment, a long time is needed for the probe station to reach a vacuum state, particularly, a sample is inconvenient to replace, and the sample is put into the vacuum chamber after the vacuum is broken each time and then the long time is needed to reach the vacuum state again, so that the testing efficiency is seriously reduced; and the cost of being able to manufacture a probe station in a vacuum environment is relatively high.
SUMMERY OF THE UTILITY MODEL
To the technical problem, the utility model provides a non-vacuum alternating temperature test probe platform for semiconductor device realizes that the probe platform reaches the temperature that is less than the zero degree in non-vacuum environment to avoid being surveyed the phenomenon that semiconductor device frosted.
The utility model provides a non-vacuum alternating temperature test probe platform for semiconductor device, includes needle file platform, airtight cover, perspective cover and objective table, the through-hole is seted up at needle file platform middle part, airtight cover rigid coupling in the below of needle file platform through-hole, perspective cover rigid coupling in the top of needle file platform through-hole, needle file platform, airtight cover and perspective cover form inclosed space, the objective table is installed in this inclosed space to the objective table sets up refrigerant circulation passageway, and the switching mouth is seted up to airtight cover, and refrigerant is crossed the switching mouth on one road and is directly let in this inclosed space, and another road meets through switching mouth and refrigerant circulation passageway.
As the utility model relates to a further improvement that is used for non-vacuum alternating temperature test probe platform of semiconductor device, refrigerant circulation passageway includes that the refrigerant advances interface and refrigerant play interface, three switching mouth is seted up to airtight cover, and wherein two switching mouths advance interface and refrigerant play interface through circulating pipe and refrigerant and meet, and another switching mouth forms in the inclosed space through the direct leading-in needle file platform of transmission pipe, airtight cover and objective table.
As a further improvement of the non-vacuum temperature-changing test probe station for semiconductor devices, the bottom of the object stage is provided with an object stage mounting seat, and the airtight cover is movably installed on the object stage mounting seat and is provided with a cabinet door.
As a further improvement of the non-vacuum temperature-varying test probe station for semiconductor devices, the center on the object stage is provided with an adsorption hole, and with the adsorption hole is provided with a plurality of rings of adsorption rings as the center.
As a further improvement of the non-vacuum temperature-changing test probe station for semiconductor devices, a plurality of needle seats are arranged on the needle seat platform around the perspective cover, the probe clamp is fixedly connected on the needle seats, and the probe is fixedly connected on the probe clamp.
As the utility model relates to a further improvement that is used for non-vacuum alternating temperature test probe platform of semiconductor device, the probe hole is seted up to the perspective cover, and the probe wears to establish the probe hole and arranges the objective table top in airtight space in.
As the utility model relates to a further improvement of a non-vacuum alternating temperature test probe platform for semiconductor device, the objective table still sets up heating element and temperature sensor, and heating element and temperature sensor meet with temperature control device.
The utility model discloses a beneficial effect that is used for non-vacuum alternating temperature test probe platform of semiconductor device: a sealed environment of non-absolute seal is constituteed to needle file platform, sealed cover, perspective cover, and the objective table is arranged in wherein, lets the objective table of placing semiconductor device cool down through the circulation of refrigerant on the one hand, and on the other hand lets in the sealed environment with the refrigerant through the pipeline of suitable length, and refrigerant gasification in the transmission course discharges the air (including vapor) in the sealed environment, forms a dry environment, avoids measuring semiconductor spare frosting under low temperature environment on the objective table.
Drawings
Fig. 1 is a schematic structural view of the present invention;
fig. 2 is a top view of the present invention;
fig. 3 is a side view of the present invention;
FIG. 4 is a schematic structural view of the sealing cover of the present invention;
in the figure: 1. the probe comprises a needle seat platform, 2, a sealing cover, 201, an adapter port, 202, a cabinet door, 203, an object stage mounting seat, 3, a perspective cover, 4, an object stage, 401, a refrigerant inlet port, 402, a refrigerant outlet port, 403, an adsorption hole, 404, an adsorption ring, 405, a heating element, 5, a needle seat, 501, a probe clamp, 502 and a probe.
Detailed Description
The present invention will be further explained with reference to the following examples and experimental examples, which are only some examples and experimental examples of the present invention, and these examples and experimental examples are only used to explain the present invention, and do not constitute any limitation to the scope of the present invention.
As shown in the attached drawings of the specification, the probe station for the non-vacuum temperature-changing test of the semiconductor device mainly comprises an object stage 4 for placing the semiconductor device and a needle base platform 1 for installing a needle base 5, wherein a through hole is formed in the middle of the needle base platform 1, a closed cover 2 is fixedly installed below the through hole formed in the middle of the needle base platform 1, and a perspective cover 3 is fixedly installed above the through hole formed in the middle of the needle base platform 1. The needle seat platform 1, the closed cover 2 and the perspective cover 3 form a closed space (not absolutely closed), the objective table 4 is installed in the closed space, the needle seat 5 is fixedly connected with the probe clamp 501, the probe clamp 501 is fixedly connected with the probe 502, the perspective cover 3 is provided with a probe hole, and the probe 502 penetrates through the probe hole and is arranged above the objective table 4 in the closed space.
The object stage 4 is used for providing a temperature-changing environment for the semiconductor device, specifically, a refrigerant circulation channel connected with an external refrigeration device is arranged in the object stage 4, the refrigerant circulation channel comprises a refrigerant inlet 401 and a refrigerant outlet 402, the closed cover 2 is provided with three adapter ports 201, which are called as a first adapter port, a second adapter port and a third adapter port, the refrigerant circulation channel is connected with a circulation pipe, a first section of circulation pipe connected with the refrigerant inlet 401 is called as a first section of circulation pipe, and a second section of circulation pipe connected with the refrigerant outlet 402 is called as a second section of circulation pipe.
A cold source outlet of the refrigerating device is connected with the first section of circulating pipe, then is switched through the first switching port, is connected into the closed space, and then is connected with a refrigerant inlet port 401 of the objective table 4; the refrigerant outlet 402 is connected to the second section of circulation tube and is connected to the outside of the enclosed space through the second adapter, and then the second adapter is connected to the third adapter through a transmission tube, so that the refrigerant is led into the enclosed space again. The refrigerant circulates for a circle in the refrigerant circulating channel of the object stage 4, so that the temperature of the object stage 4 can be quickly reduced, and a low-temperature environment is provided for the semiconductor device; the length of the transmission pipe is proper, so that the refrigerant can be completely gasified in the transmission process, the refrigerant which is re-introduced into the closed space is in a gasified state, air (containing water vapor) in the closed space is discharged, and the closed space is in a dry environment.
The probe 502 is in contact with the semiconductor device for testing the performance of the semiconductor device, and the probe holder 501 is used for connecting the transmission line of the electrical signal for transmitting the performance parameter tested by the probe. Meanwhile, the objective table 4 is also provided with a heating element 405 and a temperature sensor, and the heating element 405 and the temperature sensor are connected with a temperature control device, so that the temperature in the closed space can be stabilized.
Further, for letting the objective table 4 place semiconductor device more stably, the center on the objective table 4 sets up the absorption hole 403 to use the absorption hole 403 to set up a plurality of circles of absorption rings 404 as the center, vacuum adsorption pipeline is all connected with absorption hole 403 and absorption ring 404, and every vacuum adsorption pipeline sets up air valve switch, and the cooperation objective table uses.
In addition, the stage mount 203 is provided at the bottom of the enclosure 2, the stage 4 is movably mounted on the stage mount 203, and the enclosure 2 is provided with the cabinet door 202, so that the semiconductor device under test can be quickly placed or replaced.
The above description is only a preferred embodiment of the present invention, and the present invention is not limited to the above embodiments, and although the present invention has been disclosed with the preferred embodiments, it is not limited to the present invention, and any skilled person in the art can make some modifications or equivalent embodiments with equivalent changes by utilizing the above disclosed technical contents without departing from the technical scope of the present invention, but all the technical matters of the present invention do not depart from the technical scope of the present invention.
Claims (7)
1. A non-vacuum temperature-changing test probe station for a semiconductor device is characterized in that: including needle file platform, airtight cover, perspective cover and objective table, the through-hole is seted up at needle file platform middle part, airtight cover rigid coupling in the below of needle file platform through-hole, perspective cover rigid coupling in the top of needle file platform through-hole, needle file platform, airtight cover and perspective cover form inclosed space, the objective table is installed in this inclosed space to the objective table sets up refrigerant circulation passageway, and the switching mouth is seted up to airtight cover, and in the refrigerant was crossed the switching mouth on one road and is directly let in this inclosed space, another road met through switching mouth and refrigerant circulation passageway.
2. The non-vacuum temperature-changing test probe station for semiconductor devices as claimed in claim 1, wherein: the refrigerant circulating channel comprises a refrigerant inlet interface and a refrigerant outlet interface, the closed cover is provided with three adapter ports, two of the adapter ports are connected with the refrigerant inlet interface and the refrigerant outlet interface through circulating pipes, and the other adapter port is directly led into a closed space formed by the needle seat platform, the closed cover and the objective table through a transmission pipe.
3. The non-vacuum temperature-changing test probe station for semiconductor devices as claimed in claim 1, wherein: the bottom of the objective table is provided with an objective table mounting seat, the closed cover is movably mounted on the objective table mounting seat, and the closed cover is provided with a cabinet door.
4. The non-vacuum temperature-changing test probe station for semiconductor devices as claimed in claim 1, wherein: the center on the objective table is provided with an adsorption hole, and a plurality of rings of adsorption rings are arranged by taking the adsorption hole as the center.
5. The non-vacuum temperature-changing test probe station for semiconductor devices as claimed in claim 1, wherein: a plurality of needle seats are arranged on the needle seat platform around the perspective cover, probe clamps are fixedly connected to the needle seats, and probes are fixedly connected to the probe clamps.
6. The non-vacuum temperature-changing test probe station for semiconductor devices as claimed in claim 5, wherein: the perspective cover is provided with a probe hole, and a probe penetrates through the probe hole and is arranged above the objective table in the closed space.
7. The non-vacuum temperature-changing test probe station for semiconductor devices as claimed in claim 1, wherein: the object stage is also provided with a heating element and a temperature sensor, and the heating element and the temperature sensor are connected with a temperature control device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020106804.0U CN211785667U (en) | 2020-01-17 | 2020-01-17 | Non-vacuum temperature-changing test probe station for semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020106804.0U CN211785667U (en) | 2020-01-17 | 2020-01-17 | Non-vacuum temperature-changing test probe station for semiconductor device |
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| Publication Number | Publication Date |
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| CN211785667U true CN211785667U (en) | 2020-10-27 |
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| CN202020106804.0U Active CN211785667U (en) | 2020-01-17 | 2020-01-17 | Non-vacuum temperature-changing test probe station for semiconductor device |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113376498A (en) * | 2021-06-29 | 2021-09-10 | 江苏七维测试技术有限公司 | Wafer-level low-temperature environment simulation testing device |
| CN113484715A (en) * | 2021-09-08 | 2021-10-08 | 南通国为半导体科技有限公司 | Semiconductor automatic test machine |
-
2020
- 2020-01-17 CN CN202020106804.0U patent/CN211785667U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113376498A (en) * | 2021-06-29 | 2021-09-10 | 江苏七维测试技术有限公司 | Wafer-level low-temperature environment simulation testing device |
| CN113376498B (en) * | 2021-06-29 | 2022-09-13 | 江苏七维测试技术有限公司 | Wafer-level low-temperature environment simulation testing device |
| CN113484715A (en) * | 2021-09-08 | 2021-10-08 | 南通国为半导体科技有限公司 | Semiconductor automatic test machine |
| CN113484715B (en) * | 2021-09-08 | 2021-11-05 | 南通国为半导体科技有限公司 | Semiconductor automatic test machine |
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