CN211785628U - Movable heating aging equipment - Google Patents
Movable heating aging equipment Download PDFInfo
- Publication number
- CN211785628U CN211785628U CN202022074770.4U CN202022074770U CN211785628U CN 211785628 U CN211785628 U CN 211785628U CN 202022074770 U CN202022074770 U CN 202022074770U CN 211785628 U CN211785628 U CN 211785628U
- Authority
- CN
- China
- Prior art keywords
- test
- board
- heat
- movable
- aging
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
The application relates to a movable heating ageing equipment belongs to semiconductor aging test equipment technical field, includes: the test unit comprises a movable box body, a test core board and an aging test board, wherein the test core board and the aging test board are arranged in the movable box body; and the temperature control unit comprises a heat-preservation housing and a heater, and when the heat-preservation housing covers the movable box body, at least part of the aging test board is exposed in the heat-preservation housing. The application discloses movable heating ageing equipment makes up the use with test unit and temperature control unit when ageing tests, and this equipment has simple structure, small, light in weight's advantage. The movable box body of the test unit is combined with the heat-insulating housing of the temperature control unit to control the temperature, and the set aging test temperature can be provided for the aging test board. The aging test board is connected with the test core board, so that the test signal loss is reduced, the test signal quality is ensured, and the test signal integrity is improved.
Description
Technical Field
The application relates to the technical field of semiconductor aging test equipment, in particular to movable heating aging equipment.
Background
In order to achieve the yield of semiconductor chips, almost all semiconductor chips are subjected to burn-in test before shipment. The burn-in test is to provide necessary system signals for the semiconductor chip to be tested through a test board, simulate the working state of the semiconductor chip, accelerate the electrical fault of the semiconductor chip under the condition of high temperature or other conditions, acquire the fault rate of the semiconductor chip within a period of time, and enable the semiconductor chip to work under a given load state to enable the defects of the semiconductor chip to appear within a short time, thereby obtaining the approximate fault rate of the semiconductor chip in the life cycle and avoiding the faults occurring in the early stage of use.
In the aging test process of the semiconductor chip, the semiconductor chip to be tested is often required to be placed in a space with adjustable temperature, and the aging test of the semiconductor chip to be tested is completed by utilizing the set time of continuous uninterrupted work of the semiconductor chip to be tested at high temperature, low temperature or normal temperature.
In the related art, in a conventional semiconductor chip burn-in test apparatus, the semiconductor chip burn-in test apparatus generally includes a function test board, a backplane, a through board, a burn-in test board, and the like, and the boards are sequentially connected to each other through a connector and are fixed inside a test cabinet by a support frame. Meanwhile, the heat insulation layers are separated in different temperature area environments, the whole framework can meet the requirement of large-batch testing, but a rack system is heavy, large, complex in structure, high in cost and high in maintenance difficulty.
Disclosure of Invention
The embodiment of the application provides a movable heating aging device, which aims to solve the problems that a rack system of a semiconductor chip aging test device in the related art is heavy, large, complex in structure, high in cost and high in maintenance difficulty.
The embodiment of the application provides a movable heating ageing equipment, includes:
the test unit comprises a movable box body, a test core board and an aging test board, wherein the test core board and the aging test board are arranged in the movable box body;
and the temperature control unit comprises a heat-preservation housing and a heater, and when the heat-preservation housing covers the movable box body, at least part of the aging test board is exposed in the heat-preservation housing.
In some embodiments: the burn-in board is located the top in the mobile box, the burn-in board constitutes confined first warm chamber with the mobile box, test nuclear core plate is located first warm intracavity.
In some embodiments: the mobile box body and the heat-insulating housing form a closed second temperature cavity, the aging test board is provided with a plurality of slots, and the slots are located in the second temperature cavity.
In some embodiments: the movable box body comprises an upper shell and a lower shell, the upper shell is detachably connected with the lower shell, the ageing testing plate is connected with the upper shell, and a plurality of through holes used for extending out of the slots are formed in the upper shell.
In some embodiments: the test core board is connected with the burn-in test board through a high-speed connector.
In some embodiments: the test core plate and the ageing test board are parallel to each other and arranged at intervals, and a heat insulation pad which is insulated from each other is arranged between the test core plate and the ageing test board.
In some embodiments: be equipped with for in the removal box be equipped with for the radiator fan of test nuclear core plate cooling.
In some embodiments: the heat-insulating housing is of a hollow structure with an opening at the bottom and a closed periphery, and the heat-insulating housing covers the movable box body.
In some embodiments: the heater is an electric heater.
In some embodiments: the testing core board is in communication connection with the computer through an Ethernet switch.
The beneficial effect that technical scheme that this application provided brought includes:
the embodiment of the application provides movable heating aging equipment, which is provided with a test unit, wherein the test unit comprises a movable box body, a test core board and an aging test board, and the test core board and the aging test board are arranged in the movable box body and are electrically connected; and the temperature control unit comprises a heat-insulating housing and a heater positioned in the heat-insulating housing, and at least part of the aging test board is exposed in the heat-insulating housing.
Therefore, the movable heating aging equipment combines the test unit and the temperature control unit for use during aging test, has the advantages of simple structure, small size and light weight, and is more convenient and flexible to assemble and maintain. The movable box body of the test unit is combined with the heat-insulating housing of the temperature control unit to control the temperature, and the set aging test temperature can be provided for the aging test board. The aging test board is connected with the test core board, so that the test signal loss is reduced, the test signal quality is ensured, and the test signal integrity is improved. Meanwhile, the types of the burn-in board and the test core board can be flexibly configured as required, and different burn-in boards and test core boards are configured to support burn-in tests of more kinds of products, so that the test cost is reduced.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
FIG. 1 is a schematic structural diagram of an embodiment of the present application;
FIG. 2 is an exploded view of the structure of an embodiment of the present application;
FIG. 3 is a schematic diagram of temperature zones according to an embodiment of the present application.
Reference numerals:
1. a test unit; 2. a temperature control unit; 11. an upper housing; 12. a lower housing; 13. an aging test board; 14. testing the core board; 15. a high-speed connector; 16. a heat radiation fan; 17. a slot; 21. a heat-preserving housing; 22. a heater.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some embodiments of the present application, but not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
The embodiment of the application provides movable heating aging equipment, which can solve the problems that a rack system of semiconductor chip aging test equipment in the related art is heavy and large, the structure is complex, the cost is high and the maintenance difficulty is large.
In the following embodiments of the present application, the application of the semiconductor burn-in test is taken as an example, and the technical solution of the present application is described in detail. However, the embodiments of the present application are not limited thereto, and any semiconductor test apparatus scheme using the inventive concept of the present application is within the scope of the present application.
Referring to fig. 1 and 2, an embodiment of the present application provides a mobile heating and aging apparatus, including:
the test unit 1 comprises a movable box body, a test core board 14 and an aging test board 13, wherein the test core board 14 and the aging test board 13 are installed in the movable box body, and the test core board 13 is electrically connected with the aging test board 14 through a high-speed connector 15. The test core board 13 supplies a power supply signal and a test signal to the burn-in board 14 through the high-speed connector 15 to realize a high-rate burn-in test.
And the temperature control unit 2, the temperature control unit 2 comprises a heat-insulating cover 21 and a heater 22, the heater 22 is preferably an electric heater, and the heater 22 provides heat for the heat-insulating cover 21 and performs high-temperature aging test on the semiconductor element for the test unit 1. The heat-insulating housing 21 is a hollow structure with an opening at the bottom and a closed periphery, and the heat-insulating housing 21 is covered on the movable box body.
When the heat-preserving cover 21 is covered on the mobile box body, at least part of the burn-in board 13 is exposed in the heat-preserving cover 21, and the burn-in board 13 and the semiconductor element positioned on the burn-in board 13 are subjected to high-temperature burn-in test in the heat-preserving cover 21.
The utility model provides a movable heating ageing equipment's test element 1 and temperature control unit 2 adopt split type structure, and use test element 1 and temperature control unit 2 combination when ageing tests, establish the heat preservation housing 21 cover of temperature control unit 2 and form the warm chamber on the mobile box body to make ageing tests board 13 expose and carry out high temperature ageing tests to semiconductor element in heat preservation housing 21.
The movable box body of the test unit 1 is combined with the heat-insulating cover 21 of the temperature control unit 2 to form a temperature cavity, and then the heater 22 is used for heating the heat-insulating cover 21 and providing a set aging test temperature for the aging test board 13. The burn-in board 13 is connected with the test core board 14 through the high-speed connector 15, so that the test signal loss is reduced, the test signal quality is ensured, and the test signal integrity is improved.
Meanwhile, the types of the burn-in board 13 and the test core board 14 can be flexibly configured as required, and different types of burn-in boards 13 and different types of test core boards 14 are configured to support burn-in tests of more kinds of products, so that the test cost is reduced.
In some alternative embodiments: referring to fig. 1 to 3, an embodiment of the present application provides a movable heating burn-in apparatus, where a burn-in board 13 of the burn-in apparatus is located above a moving box and is hermetically connected to the moving box, the burn-in board 13 and the moving box form a first sealed temperature chamber, and a test core board 14 is located in the first sealed temperature chamber formed by the burn-in board 13 and the moving box.
During the aging test, the movable box body and the heat-insulating housing 21 form a closed second temperature cavity, a plurality of slots 17 are arranged on the aging test board 13, the semiconductor element to be tested is inserted in the slots 17, and the semiconductor element to be tested is electrically connected with contacts of the slots 17. The slots 17 extend out of the movable box body and are positioned in a closed second temperature cavity formed by the movable box body and the heat-insulating housing 21.
The ageing test board 13 and the mobile box body form a first closed temperature cavity, the mobile box body and the heat preservation housing 21 form a second closed temperature cavity, the first temperature cavity and the second temperature cavity are independent from each other and do not interfere with each other, so that the ageing test board 13 and the test core board 14 work in different temperature cavities, and the high temperature in the second temperature cavity is prevented from entering the first temperature cavity to interfere with the test core board. Temperature crosstalk between the first temperature cavity and the second temperature cavity and frosting or water leakage caused by meeting of two air flows with different temperatures are avoided, and the stability of the aging equipment is improved.
In some alternative embodiments: referring to fig. 2, the embodiment of the present application provides a movable type heating burn-in apparatus, a movable box body of the burn-in apparatus includes an upper shell 11 and a lower shell 12, the upper shell 11 and the lower shell 12 are detachably connected and form a cavity for packaging a burn-in test board 13 and a test core board 14. The burn-in board 13 is connected to the upper housing 11 in the movable case, and a plurality of through holes for extending the slots 17 are formed at the top of the upper housing 11.
The slot 17 of the burn-in board 13 is located in the heat-insulating cover 21 after extending out of the through hole of the upper housing 11, and the heater 22 in the heat-insulating cover 21 heats the slot 17 and the semiconductor element inserted into the slot 17. And a heat insulation glue can be arranged between the slot 17 and the upper shell 11 for sealing, so that high-temperature gas is prevented from entering the mobile box body to heat the aging test board 13.
In some alternative embodiments: referring to fig. 2, the present embodiment provides a movable heating burn-in apparatus, in which a test core board 14 and a burn-in board 13 of the burn-in apparatus are arranged in parallel and at an interval, and a heat insulation pad (not shown) is arranged between the test core board 14 and the burn-in board 13. Be equipped with the radiator fan 16 for the cooling of test core plate 14 in moving the box, radiator fan 16 dispels the heat that test core plate 14 produced, can avoid producing the condensation simultaneously.
The heat insulation pad is preferably but not limited to a foam silicone rubber material, and the foam silicone rubber material has high thermal stability, good heat insulation, moisture resistance and shock resistance, so that the heat insulation performance between the semiconductor test board 13 and the test core board 14 can be remarkably improved, and the test core board 14 can be ensured to work under a set temperature condition.
In some alternative embodiments: referring to fig. 2, an embodiment of the present application provides a movable heating aging apparatus, which further includes a computer, the computer is in communication connection with the test core board 14 through an ethernet switch, the ethernet switch may be in communication connection with the plurality of sets of test core boards 14, and the computer controls the plurality of sets of test core boards 14 through the ethernet switch to perform an aging test.
Principle of operation
The embodiment of the application provides movable heating aging equipment, and the movable heating aging equipment is provided with a test unit 1 which comprises a movable box body, a test core board 14 and an aging test board 13, wherein the test core board 14 and the aging test board 13 are installed in the movable box body; and the temperature control unit 2 comprises a heat-preserving cover 21 and a heater 22 positioned in the heat-preserving cover 21, and the aging test board 13 is at least partially exposed in the heat-preserving cover 21.
The utility model provides a movable heating ageing equipment's test element 1 and temperature control unit 2 adopt split type structure, and use test element 1 and temperature control unit 2 combination when ageing tests, establish the heat preservation housing 21 cover of temperature control unit 2 and form the warm chamber on the mobile box body to make ageing tests board 13 expose and carry out high temperature ageing tests to semiconductor element in heat preservation housing 21.
The movable box body of the test unit 1 is combined with the heat-insulating cover 21 of the temperature control unit 2 to form a temperature cavity, and then the heater 22 is used for heating the heat-insulating cover 21 and providing a set aging test temperature for the aging test board 13. The burn-in board 13 is connected with the test core board 14 through the high-speed connector 15, so that the test signal loss is reduced, the test signal quality is ensured, and the test signal integrity is improved.
Meanwhile, the types of the burn-in board 13 and the test core board 14 can be flexibly configured as required, and different types of burn-in boards 13 and different types of test core boards 14 are configured to support burn-in tests of more kinds of products, so that the test cost is reduced.
In the description of the present application, it should be noted that the terms "upper", "lower", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, which are only for convenience in describing the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and operate, and thus, should not be construed as limiting the present application. Unless expressly stated or limited otherwise, the terms "mounted," "connected," and "connected" are intended to be inclusive and mean, for example, that they may be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.
It is noted that, in the present application, relational terms such as "first" and "second", and the like, are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
The above description is merely exemplary of the present application and is presented to enable those skilled in the art to understand and practice the present application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the application. Thus, the present application is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (10)
1. A movable heating aging apparatus, characterized by comprising:
the test unit (1) comprises a movable box body, a test core board (14) and an aging test board (13), wherein the test core board (14) and the aging test board (13) are installed in the movable box body, and the test core board (14) is electrically connected with the aging test board (13);
and the temperature control unit (2) comprises a heat-insulating cover shell (21) and a heater (22), and when the heat-insulating cover shell (21) is covered on the movable box body, at least part of the aging test board (13) is exposed in the heat-insulating cover shell (21).
2. A movable heat aging apparatus as set forth in claim 1, wherein:
the aging test board (13) is located above the inside of the movable box body, a first closed temperature cavity is formed by the aging test board (13) and the movable box body, and the test core board (14) is located in the first temperature cavity.
3. A movable heat aging apparatus as set forth in claim 1, wherein:
the mobile box body and the heat-preservation housing (21) form a closed second warm cavity, a plurality of slots (17) are formed in the aging test board (13), and the slots (17) are located in the second warm cavity.
4. A movable heat aging apparatus as set forth in claim 3, wherein:
the movable box body comprises an upper shell (11) and a lower shell (12), the upper shell (11) is detachably connected with the lower shell (12), the ageing testing plate (13) is connected with the upper shell (11), and a plurality of through holes used for extending out of the slots (17) are formed in the upper shell (11).
5. A movable heat aging apparatus as set forth in claim 1, wherein:
the test core board (14) is connected with the burn-in board (13) through a high-speed connector (15).
6. A movable heat aging apparatus as set forth in claim 1, wherein:
the test core board (14) and the aging test board (13) are parallel to each other and arranged at intervals, and a heat insulation pad which is insulated from each other is arranged between the test core board (14) and the aging test board (13).
7. A movable heat aging apparatus as set forth in claim 1, wherein:
a cooling fan (16) for cooling the test core board (14) is arranged in the movable box body.
8. A movable heat aging apparatus as set forth in claim 1, wherein:
the heat-insulation cover casing (21) is of a hollow structure with an opening at the bottom and a closed periphery, and the heat-insulation cover casing (21) is covered on the movable box body.
9. A movable heat aging apparatus as set forth in claim 1, wherein:
the heater (22) is an electric heater.
10. A movable heat aging apparatus as set forth in claim 1, wherein:
the testing device also comprises a computer, and the computer is in communication connection with the testing core board (14) through an Ethernet switch.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022074770.4U CN211785628U (en) | 2020-09-21 | 2020-09-21 | Movable heating aging equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022074770.4U CN211785628U (en) | 2020-09-21 | 2020-09-21 | Movable heating aging equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211785628U true CN211785628U (en) | 2020-10-27 |
Family
ID=72955745
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022074770.4U Active CN211785628U (en) | 2020-09-21 | 2020-09-21 | Movable heating aging equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211785628U (en) |
-
2020
- 2020-09-21 CN CN202022074770.4U patent/CN211785628U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN111289877B (en) | Aging test equipment | |
| CN113917273B (en) | Electrified reliability test system for electronic component | |
| CN108054466A (en) | Lithium-ion-power cell group Power supply system under extremely cold environment | |
| CN111551839B (en) | High-low temperature aging test equipment for semiconductor memory | |
| CN211785628U (en) | Movable heating aging equipment | |
| CN115494376A (en) | Chip thermal testing device | |
| CN109119128A (en) | A kind of high/low temperature burn-in test rack structure | |
| CN107680635B (en) | Large-scale high-temperature test equipment applied to solid state disk reliability test | |
| CN203275591U (en) | Integrated circuit high and low temperature testing device | |
| CN210442469U (en) | Aging device of power transistor | |
| CN205506246U (en) | Aerify cabinet temperature rise testing arrangement | |
| CN209526355U (en) | A kind of switchgear based on passive and wireless thermometry | |
| CN215219074U (en) | Small load analysis device | |
| CN209311524U (en) | Drawer type COC aging equipment | |
| CN211788187U (en) | Solid state hard drives high temperature aging testing equipment | |
| CN208903668U (en) | A kind of high/low temperature burn-in test rack structure | |
| CN114460449A (en) | Low-temperature testing device and method for electromagnetic relay | |
| CN210604463U (en) | Safe type circuit board test box | |
| CN215910596U (en) | PCBA board testing arrangement | |
| CN220603349U (en) | Detection equipment for DMD prepreg | |
| CN220670770U (en) | Be used for battery calorific capacity testing arrangement | |
| CN220136870U (en) | Test equipment of fuse tube body | |
| CN217561670U (en) | Multifunctional compressor/motor locked-rotor testing device | |
| CN109239413A (en) | Drawer type COC aging equipment | |
| CN211979064U (en) | Testing device for resistance aging experiment |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |